katsuro nakamura (kek) - cern indico

KEK HighEnergyAcceleratorResearchOrganiza6on

KatsuroNakamura(KEK)onbehalfoftheBelleIISVDgroup

VERTEX2016Sep.26,20169/26/16VERTEX2016 1

KEK(HighEnergyAcceleratorResearchOrganiza6on)

n  SuperKEKBcollideratKEK–  e+-e-colliderwith√sof11GeV(=MΥ(4S))

n  Asymmetricbeam:e+4GeV,e-7GeV–  World-highestdesignedluminosity:

L=8.0×1035cm-2s-1n  BelleIIexperiment

–  IntensityfronTerexperimentatSuperKEKBtodiscoverandunderstandphysicsbeyondtheSM(BSM).

–  PrecisedeterminaTonofthedecayverTcesandlow-momentumtrackingareessenTaltoperformtheBSMsearch.

n  Thedetectorsandacceleratorarebeingdevelopedtowardstartofphysicsexperimentat2018.

9/26/16 VERTEX2016 2

BelleIIdetector

KEKinbird’s-eyeview

SuperKEKBcolliderring

e-7GeVe+4GeV

BelleII

diameter~1km


n  BelleIIvertexdetermina6onisperformedby2Sidetectors.

n  PiXelDetector(PXD)–  Innermost2layers–  BasedonDEPFETpixels

n  SiliconVertexDetector(SVD)–  Outer4layers–  Double-sidedSistripdetectors

(DSSDs)

• Fast–tooperateinhighbackgroundenvironment• Be_erresoluTonatIP–tocompensatereducTonofboostwrt.BelleI• RadiaTonhard(upto100kGy)• Self-trackingcapable–totrackparTclesdownto50MeVinpT

VXDrequirements

39/26/16 VERTEX2016

seeprevioustalk

PXD

SVD

BelleIIVertexDetectors(VXD)


n  4SVDlayers(Layer-3to-6)consistofladders.

n  TheladdersarecomposedofseveralDSSDmodules.

n  SlantshapesinFWDregionforthematerialbudgetreduc6on.

n  Averagematerialbudget:0.7%X0perlayer9/26/16 VERTEX2016 4

Layer-3Layer-4

Layer-5Layer-6 SVD

PXD

Angularacceptance:17°–150°935mm

collisionpoint

PXD+SVDcrosssecJondrawing

RL3=39mmRL4=80mm

RL5=115mmRL6=140mm

SVDmodel

FWD

BWD

SimulatedresoluJonfortrackimpactparameter(IP)

BelleonlySVD(BelleII)

PXD+SVD(BelleII)

Z-direcJon radial-direcJon

Improvedresolu6onsfrompreviousBelleexperimentareexpected.

BelleonlySVD(BelleII)

PXD+SVD(BelleII)

σIP~20umatpT=2GeV/c


n  3typesofDSSDsensors

9/26/16 VERTEX2016 5

Sensorth

ickness

=300-320μ

m

Sensors Rectangular(Large)

Rectangular(Small) Trapezoidal

#ofp-strips 768 768 768

p-strippitch 75μm 50μm 50…75μm

#ofn-strips 512 768 512

n-strippitch 240μm 160μm 240μm

DSSD(Double-sidedSistripdetector)

P+ stop

readout Al

readout Al

SiP+ P+ P+

N+

N+

SiO2

SiO2N+

Rectangularsensor(HPK)

41mm

Trapezoidalsensor(Micron)

61mm

n-sidestrip

thickness:320μm

thickness:300μm

Stripnumbersandpitches


BWDSSD

FWDSSD

9/26/16 VERTEX2016 6

Layer Ladders(spares)

DSSDs/ladder

6 16(4) 5

5 12(3) 4

4 10(2) 3

3 7(2) 2FW/BWDSSDs:38(9)

Layer-6

Layer-5

Layer-4

Layer-3

FWDSSD

BWDSSD

BWDSSD

BWDSSD

FWDSSD

FWDSSD

Trapezoidal

Trapezoidal

Trapezoidal

RectangularLarge,Small

Trapezoidal

3typesofDSSDsensors


9/26/16 VERTEX2016 7

APV25 APV25 APV25

APV25

APV25chipsinladder

APV25chip n  APV25chip–  AhighbackgroundinBelleII

requiresshortsignalshapingTmeandagoodradiaTonhardness.

–  APV25chipisasuitablesoluTonforSVD.

n  OriginallydevelopedforCMS.

n  APV25Specifica6on–  #ofinputchannels:128ch.–  ShapingTme:50nsec–  RadiaTonhardness:>1MGy

n  Chip-on-Sensor(seenextslide)–  Thinnedto100µmthicknessfor

thematerialbudgetreducTon.–  Max.heatdissipaTon:0.4W

n  àNecessityofcooling


n  Flexcircuit(ORIGAMIflex)isgluedonsensorn-stripsurfacewithanelectrical/thermal-isola6onfoam.

n  APV25areplacedontheORIGAMIflextominimizetheanalogpathlength(capaci6venoise).n  SensorstripsandORIGAMIflexareconnectedwithAl

wire-bonding(φ25µm).

9/26/16 VERTEX2016 8

ORIGAMIflex(Sisensorisundertheflex)

SensorunderORIGAMI(n-strips)

Sensorfromotherside(p-strips)

p-stripsignals p-stripsignalsn-stripsignals

n-stripsignals

p-stripsignals

WirebondingwithAlwires.

APV25 APV25 APV25 flip


n  Necessityofcooling–  SVDtotalheatdissipaTonfromallAPV25chipscanbe700Winmax.

n  2-phase(liquidandgasmixture)CO2coolingsystem–  Efficientandlowmasscooling–  Simplecontrolofcoolanttemperature(onlywithpressure)–  Smallpressurelossintubes

n  Thinstainlesstube(OD:1.6mm,thickness:0.1mm)isemployed.–  Lessmaterialbudget

9/26/16 VERTEX2016 9

coolingpipe

Somtherm

APV25chips

So[therm86/125

Coolingpipesa`achedonladders.

CO2coolingpipeinfinalsetup(CAD)

thermal-conducTvedielectricpad.


Sensorfixedonajig Sensorplacement

DSSDsarehandledwithprecisionassemblyjigs(O(50μm)),onwhichthesensorsarefixedbyvacuumchucking.

Sensorsarealignedin

O(10μm)byaposi6ontuningjigwithmonitoringthroughaCMM.

1.PrecisionDSSDalignment

9/26/16 VERTEX2016 10

DSSD


11

LaddersarefabricatedbygluingthecomponentsbyAraldite®2011.

Gluespreadbelowbondingpadsaffectstothebondingyieldandpullstrength→glueamountandglue

liningarecontrolledbyagluingrobot.

2.Ladderfabrica6on:gluing

Appropriatespreadofgluetotheflexedge

Wirebondingpads

Posi6ononthegluingline[mm]Glue

thickn

ess[μm

]

t=55+10μm

Theflex↔DSSDstripsandflex↔APV25sareelectricallyconnectedbythewirebonding

Bondingmachineparametersaresotunedtorealizeyield>99%andpull

strengthf:μf>5gw,σf/f<20%.

withAℓ(99%)wire(φ=25μm).Numberoftotalbonds=450k.

Pullstrength[gw]

Entries/

0.5gw

μf=10.7gwσf=0.6gw(97samples)

11PleaseseemoredetailsinHyebinJeon’sposterpresenta6on.

3.Electricalconnec6on:wirebonding

9/26/16 VERTEX2016


9/26/16 VERTEX2016 12

@KEK(Japan):•  SVDassembly•  SVDinstallaTon

@KavliIPMU(Japan):•  Layer-6assembly•  Layer-4assemblybyTIFR

TIFR(India)

@Univ.ofMelbourne(Australia):•  Layer-3assembly

@INFN-Univ.ofPisa(Italy):•  FWandBWDSSDassembly

@HEPHY(Austria):•  Layer-5assembly

FW/BWDSSDs

toHEPHY

FW/BWDSSDstoIPMU

AssembledLayer-5ladderstoKEK

Assembled

Layer-3ladd

ers

toKEK

n  Laddersassembledinalltheassemblysitesarereviewedbyeachothers,inordertocontroltheuniformityoftheassemblyqualityamongthesites.

n  Thenumbersandloca6onsofallthepartsaremanagedwithacommondatabase.


9/26/16 VERTEX2016 13

Weperformthefollowingqualityassurancetestsforeveryassembledladder.n  1.MechanicalprecisionmeasurementwithCMM

–  MeasureshimsofDSSDsensorsinXYZdirecTons.Typicallylessthan150um.

n  2.I-Vcurvemeasurement–  ConfirmthesensorfuncTonality

forbiasing.

n  3.Electricalqualifica6onlaser/β-source(Sr90)measurement–  CheckdefectstripsandDSSDperformanceforparTcles.

Hitmap Noisemap ClustersizedistribuJon S/NraJodistribuJon

I-Vcurve


n  Nowalltheladderassemblysitesareinmass-produc6onstage.–  Laddermass-producTonwasstartedfrom

early2016.n  FW/BWDSSD

–  BW:100%completed–  FW:94%completed

n  Layer-3Ladder–  5outof7+2ladders(56%)completed




(atthemidofSep.,2016)n  Comple6onoftheladderproduc6onby

Nov.2017isexpected.

9/26/16 VERTEX2016 14

FWBW

Layer-3

Layer-4

Layer-5

Layer-6


n  SVDassemblyatKEKisourfinalsteptocompletetheconstruc6onofSVD.–  SVDassemblyproceduremustbesafeandwellestablished,otherwiseanymistakecan

destroyallmountedladdersatonce.NowtoolsforthesafeSVDassemblyarebeingdeveloped.

n  Prototypesofallnecessaryassemblytoolshavebeenproduced.Thepreliminaryprocedurewasreviewedbyareview-commizeeincludingexternalmembers.

n  WewillfinalizethetoolbyFeb.2017andconsequentlywillstarttheSVDassembly.

9/26/16 VERTEX2016 15

Laddermounttool CO2pipea`achmenttool So[therma`achmenttool


n  Hadronbeam(120GeV/c)atCERN-SPSinJun.2015–  TestforaLayer-5ladder.

n  e-beam(2-5GeV/c)atDESYinApr.2016–  Testforladdersinall4layers(Layer-3–6).–  SVD+PXDcombinedsetup

9/26/16 VERTEX2016 16

SolenoidmagnetSVD+PXDwere

containedinthebox.

insertSVD+PXD

intomagnete-beam

Beamtestsetup(@DESYT24/1hall)

SVDladders

PXD

SVD+PXDdetectorsetuponApr.2016


n  SNRsinbothp-andn-stripsarewellhigherthan10.

9/26/16 VERTEX2016 17

p-strips n-strips

Signal-to-noiseraJo(SNR)ofatestedDSSD(O-Z)CW:ClusterWidth CW:ClusterWidth

CW=1 w/ocooling w/cooling

p-strips 18.1 21.1n-strips 30.9 35.1

CO2coolingimprovestheSNR

SNRbeforeanda[erCO2cooling(-20°C)


-directionφstrip number r-250 300 350 400 450 500 550 600 650

[%]

∈ e

ffici

ency

98

98.2

98.4

98.6

98.8

99

99.2

99.4

99.6

99.8

100

5_1_3 u

strip number z-direction 200 250 300 350 400

[%]

∈ e

ffici

ency

98

98.2

98.4

98.6

98.8

99

99.2

99.4

99.6

99.8

100

5_1_3 v

m ]µres iduals v [-200 -150 -100 -50 0 50 100 150 200

nu

mb

er o

f h

its

0

50

100

150

200

250

300

350

E ntries 4458R M S 25.87

/ nd f 2� 66.94 / 41C onstan t 6 .3±347.7 M ean 0 .3765±0.2164 S igm a 0 .25±24.87

9/26/16 VERTEX2016 18

n  ExcellentSVDperformancewasconfirmedfrombeamtestdata.–  Seemoredetailsin

ThomasLück’sposterpresenta6on.

SVDladders

Trackingeventdisplay ResidualdistribuJon

m ]µres iduals u [-60 -40 -20 0 20 40 60

nu

mb

er o

f h

its

0

50

100

150

200

250

300

350

E ntries 4458R M S 11.23

/ nd f 2� 92.07 / 54C onstan t 6 .1±309.2 M ean 0 .1579±0.3776 S igm a 0 .13±10.43

residual layer 4 in u-direction

Layer-3p-strips

Layer-3n-strips

Observedgoodposi6onresolu6ons.Theyareconsistentwithourexpecta6on.

preliminary preliminary

DSSDhitefficiency

preliminary preliminaryLayer-5p-strips Layer-5n-strips

Excellenthitefficienciesmorethan99%.SVDanalysissomwaredevelopmentwillbepresentedinpostersessionbyGiacomoCaria.

σ=10um σ=24um


SVD

PXD

n  SingleCrystalDiamonds,scCVD4.5x4.5x0.5mm3–  HighradiaTontolerance–  Smalltemperaturedep.–  Simpleandcompactdetector

structuren  Currentmeasurementwith

longhigh-qualitycabling

9/26/16 VERTEX2016 19

6 + 6 diamond sensorsSVD Layer-3 and -4

4 + 4 diamond sensorsPXD-beam pipe

Prototypesensorsareproduced.TheyweretestedinSuperKEKBbeams.

InstallaJonlocaJons

scCVD

]-1mµLE R Inverse B eam s ize (X -ray M on ito r) [0 0 .005 0.01 0.015 0.02 0.025 0.03 0.035 0.04 0.045

BW

_0 c

urre

nt [n

A]

0

0 .2

0 .4

0 .6

0 .8

1

1.2

/ nd f 2� 0.2297 / 1345

p0 0 .00125±0.1294

p1 0 .05941±2.065

/ nd f 2� 0.2297 / 1345

p0 0 .00125±0.1294

p1 0 .05941±2.065

/ nd f 2� 0.8598 / 1344

p0 0 .002416±0.3225

p1 0 .1124±6.167

/ nd f 2� 0.8598 / 1344

p0 0 .002416±0.3225

p1 0 .1124±6.167

/ nd f 2� 2.183 / 1304

p0 0 .005658±0.568

p1 0 .353±19.36

/ nd f 2� 2.183 / 1304

p0 0 .005658±0.568

p1 0 .353±19.36

run 3006

run 3007

run 3008

Hitcountsvs.Beamsize

BGenhancementduetoTouschekeffectwasdetected.

IHER=540mA

IHER=360mA

IHER=160mA


9/26/16 VERTEX2016 20

HighLevelMilestones DateLaddermass-produc6on ONGOINGStartofSVDassemblyatKEK Feb.2017SVDreadinessatKEK Dec.2017StartofPXD+SVDintegra6on Dec.2017StartofVXDinstalla6on Jun.2018Startofphysicsrun 4Q2018


n  SVD,whichisessen6alfortheBelleIIexperiment,consistsof4-layerDSSDladders.

n  SVDladderproduc6on–  Theladdermass-producTonatallassemblysitesisongoing.

n  SVDassemblyatKEK–  Allprototypetoolswereproducedandreviewed.–  ThiswillbefinalizedbyFeb.2017tostarttheSVDassemblyatKEK.–  TheSVDassemblywillbecompletedbyDec.2017.

n  Performancestudyinbeamtest–  Weobtainedsuccessfulperformancesofthetracking,posiTon

resoluTon,andhitefficiencyforfinalSVDladders.

9/26/16 VERTEX2016 21


9/26/16 VERTEX2016 22


23

CsI(Tl)EMcalorimeter:waveformsamplingelectronics,pureCsIforendcaps

RPCμ&KLcounter:scinTllator+Si-PMforend-caps

Time-of-Flight,AerogelCherenkovCounter→Time-of-PropagaTon(barrel),prox.focusingAerogelRICH(forward)

4layersDSSivertexdetector→2layersPXD(DEPFET)+4layersDSSD

CentralDrimChamber:smallercellsize,longleverarm


24

n  SmallDSSDs–  Deliveryof24pcs.scheduledforend

ofSeptember–  Twomechanicalsamplesavailable

n  LargeDSSDs:–  ProducTonfinished–  150pcsinhand

LaserdicingSawdicing

Prototypes

BadstripraTo=5%

P-implantopen

ClassificaTonofbadstrips(ID>26)


Thermalinsulator

Flexcircuithybrid

APV25Thermalinsulator

DSSDarray

APV25

Flexcircuits

Supportribs

APV25

25

Layer Ins6tute

3 Melbourne(AUS)

4 TIFRIndia@IPMU

5 HEPHYVienna

6 IPMUTokyoU

FW&BW INFNPisa


controlsignals

FADCx48

FTBx48

flashADCzero-sup.dataform

at

dataform

at

B2LAurora

COPPERHSLB

DAQ

PXDsystem

PXDRoI

dataflowBelleIISVD

Bufferx4FADC-Ctrl

B2TTdecoder

APVTrig.Gen.

coppercables

FADCcontrol

VMEbackplane

clock,trigger,reset…


belle2z

1748APV25’s

~2mcoppercables

Junc6onboards(signal

repeater)

~10mcoppercables

26


SVDreadoutsystem

APV25chips

DATCON

FTSW

SVDreadoutsystemisdrivenby32MHzclock.

basf2

InteracJonRegion DockArea TopoftheBelleIIdetector E-hat2F

9/14/16 10th VXD workshop


§  SupplyHVandLVtoDSSDandAPV25.§  DC/DCconverter

§  JointsignalsbetweenAPV25andFADCboard.

27

2prototypesforp-andn-sides

DC/DCconverters


n  Highsignaldensity–  readout48APV25outputs

n  APV25signalprocessingonFADC–  analoglevelconversion(AC

coupling)–  10-bitADC–  FPGA(StraTxIV)data

processingn  FIRfiltern  Common-ModeCorrecTonn  Zero-Suppression

–  datatransmissiontoFTB

28

prototypeFADCboard

signalsfrom

48xAP

V25

FTBbo

ard

VME9U


n  Wewillhave4crateswithFADCmodulesn  OnehassingleFADC-Controller

–  ReceivesFTSWsignals–  Distributesclock,triggerandothercontrolstoallBuffer

n  EachcratehassingleBuffermodule–  ReceivesFADC-Controllersignals–  DistributessignalstoFADCsthroughbackplanebus

1stprototypeofFADC-Controllerboard Bufferboard

FTSW

4Bu

fferb

oard

FPGASTRATIXIV

FPGACYCLONII

buffers

GbEinterface

FADC

-Con

trollerb

oard

AllFAD

Cbo

ardsinacrate

buffers

29

katsuro nakamura (kek) - cern indico

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