template hta general assembly november 12 – 13, 2013
DESCRIPTION
Template HTA General Assembly November 12 – 13, 2013. Contact : Fraunhofer ENAS [email protected] Phone: +49-371-45001 412 / 220. Project Idea: Reliability Assessment with Qualified Material Data Sets EU Call: e.g. ICT Calls in LEIT ( e.g . ICT1-3), photonics KETs. - PowerPoint PPT PresentationTRANSCRIPT
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HeterogeneousTechnology
Alliance
TemplateHTA General AssemblyNovember 12 – 13, 2013
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The Heterogeneous Technology Alliance HTA Project Idea: Reliability Assessmentwith Qualified Material Data Sets
EU Call: e.g. ICT Calls in LEIT (e.g. ICT1-3),photonics KETs
Project Idea short description:Reliability aligned technology development for highly miniaturized products (MEMS, ICs, photonics, )
Short Description (ref. to the reliability part): Challenging reliability assessment (manufacturing process & endurance) by physics of failure approaches (main obstacle for micro / nano scale components - used input data sets for FEA) measurement of material properties from components as manufactured (new techniques, e.g. FIB based) advanced validation strategies for complex material behavior and/or data sets of material property demonstration of improved failure avoidance strategies by accompanying process/product developm.IP situation and commercial viability:- Finite Element Analysis (FEA) is increasingly substantial part of process and device development- most limiting factor for FEA reliability assessment – quality of input data set (material properties, stress)Potential Applications:
-devices / systems with thin films / film stacks / micro&nano scale structures (e.g. BEoL stacked IC, 3D integration systems, sensors, smart systems, photonics systems)Potential Consortium/Competences needed:Firm 1: manufacturers of systems with dedicated need for accompanying failure avoidance analysisFirm 2: testing tool manufacturerRTO: material characterization (mechanical properties), device and system testing
Contact: Fraunhofer [email protected]: +49-371-45001 412 / 220
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The Heterogeneous Technology Alliance HTA
HMT solder
PI layer
Soldermask
Boardpad
Underfill
LJT solder
Ni layerBEoL stack region
gap
Failure avoidanceby appropriate design rules Local residual stress
measurementby FIB milling
0 20 40 60 80 100 1200
20406080
100120140160
E [G
Pa]
h[nm]
Area influenced by the Si substrate
Berkevitch indenter
Local material properties