recent enhancements in bsim6 and bsim-cmg model enhancements in bsim6 and bsim-cmg model yogesh s....
TRANSCRIPT
Recent Enhancements in BSIM6 and BSIM-CMG model
Yogesh S. Chauhan*, Juan P. Duarte, Harshit Agarwal*, Sourabh Khandelwal, Chenming Hu
*IIT Kanpur, IndiaUniversity of California, Berkeley
MOS-AK Berkeley
Outline
BSIM6 Updates Flicker Noise Model for Halo Implanted FETs Double Hump Modeling
BSIM-CMG Updates Modeling FinFETs with complex cross-sections (on SOI and
Bulk substrates) Improved speed and robustness New body-bias effect model Modeling InGaAs FinFETs Modeling Ge FinFETs
MOS-AK Berkeley UC Berkeley - 2
Flicker (1/f) Noise Flicker noise: the fluctuation of drain current due to
trapping/detrapping of charge carriers. There are two main theories to explain origin of flicker noise:
McWhorter model: fluctuation in the number of carriers due to trapping.
Hooge’s model: fluctuation in mobility due to phonon scattering Unified model: Trapped charges give rise to a fluctuation in
the number of carriers as well as alter mobility.Gate
Oxide
Source Drain
Donor typeAcceptor type
MOS-AK BerkeleySource: C. Sanabria, PhD Dissertation, UCSB, 2006 UC Berkeley - 3
Double Hump Modeling
MOS-AK Berkeley UC Berkeley - 4
Problem Statement
• Double Hump in device characteristics
• What is the source of double hump?
• How to model this effect in BSIM6?
• In most accurate and efficient way
MOS-AK Berkeley UC Berkeley - 5
Double Hump TCAD Analysis
Cut along
Channel Length
Cut along Width
Cut along Length
Source
Gate
S D
G
STI
G
MOS-AK Berkeley UC Berkeley - 6
Model Testing Results
Model Passes Gummel Symmetry Tests
Continuous and Smooth Derivatives
ID Vs VxGM Vs Vx
GM’ Vs Vx GM’’ Vs Vx
MOS-AK Berkeley UC Berkeley - 7
Outline
BSIM6 Updates Flicker Noise Model for Halo Implanted FETs Double Hump Modeling
BSIM-CMG Updates Modeling FinFETs with complex cross-sections (on SOI and
Bulk substrates) Improved speed and robustness New body-bias effect model Modeling InGaAs FinFETs Modeling Ge FinFETs
MOS-AK Berkeley UC Berkeley - 8
FinFET’s Various Complex Cross-SectionsSTMicroelectronics, VLSI 2012
TSMC, IEDM 2010
IBM, VLSI 2012
Toshiba, VLSI 2012
MOS-AK Berkeley9
1. Double-Gate FinFET:
2. Cylindrical FinFET:
Charge Equation :
Charge Equation:
MOS-AK Berkeley10
Prior Models Available for Two Simple Cross-Sections Only—Deductive model
various Fin shapes SEM or imagined
Model Parameters: Unified Model forFin Area: AchChannel Doping:NchChannel Width: WInsulator Cap: Cins
11
New Unified Model for Complex FinFET Cross-Sections – Inductive model
( )
−−
+−+−=−− − 1lnln
2
tq
tmmCHOG qe
qqqvvvt
−−=
chinsT
chidepFBO NCv
Aqnqvv22ln ( ) 2W
CAqqqch
inschdepmt ε
+=
MOS-AK Berkeley
Modeling InGaAs FinFETs
MOS-AK Berkeley UC Berkeley - 12
InGaAs FinFET Modeling BSIM-CMG with the new Quantum Effects
model used to model InGaAs FinFETs
Data from: J. J. Gu et al. IEDM 2012
MOS-AK Berkeley UC Berkeley - 13
L = 20 nm, H = 30 nm, W = 20 nm, Nfin = 4.
S. Khandelwal et. al., WCM 2014
InGaAs FinFET Modeling
Data from: J. J. Gu et al. IEDM 2012
MOS-AK Berkeley UC Berkeley - 14
L = 20 nm, H = 30 nm, W = 20 nm, Nfin = 4.
S. Khandelwal et. al., WCM 2014
InGaAs FinFETs with Triangular Cross-section
T. Irisawa et al. IEDM 2013Importance of accurate modeling of Quantum Effects
MOS-AK Berkeley UC Berkeley - 15S. Khandelwal et. al., WCM 2014
Modeling Germanium FinFETs
MOS-AK Berkeley UC Berkeley - 16
Modeling Germanium FinFETs with BSIM-CMG
User selectable MOD to model Ge FinFETs Material Mode “MTRLMOD” = Si (Default) or Ge
“MTRLMOD”=Ge invokes new mobility model for Ge MTRLMOD = Ge sets key parameters for Ge
Band-Gap, Mobility … MTRLMOD=Ge model verified with experimental data
Excellent Model Calibration Results Scalable Ge FinFET Model
MOS-AK Berkeley UC Berkeley - 17
BSIM-CMG Model Results for Ge pFinFETs
L = 130 nm
MOS-AK Berkeley UC Berkeley - 18S. Khandelwal et. al., IEEE EDL 2014
Germanium Mobility Model
Surface Roughness affects Ge mobility at a higher Eeff
Accurate Modeling of Non-linearity needs improved mobility model
MOS-AK Berkeley UC Berkeley - 19S. Khandelwal et. al., IEEE EDL 2014
Summary BSIM6
Updated with new noise model Double hump modeled using Edge-FET Receiving continuous updates with industry feedback
BSIM-CMG Demonstrated excellent results for complex Fin
shapes A new FinFET body-bias effect model A new Quantum Effect model Modeling of InGaAs and Germanium channel material Model speed improvement ~ 30%
MOS-AK Berkeley UC Berkeley - 20