ww37 2014 iotg 5q cnda roadmap

Intel Confidential - NDA Platform Roadmap. All dates and plans are subject to change without notice. Intel Confidential - NDA Platform Roadmap. All dates and plans are subject to change without notice.

Internet Of Things Group (IOTG) Platform Roadmap Sept 2014

IOTG Platform Marketing, Enablement & Insight

Sept 2014

Expires November 12, 2014

2 Intel Confidential - NDA Platform Roadmap. All dates and plans are subject to change without notice.


2

Legal Disclaimer

Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights.

The Intel products) referred to in this document is intended for standard commercial use only. Customer are solely responsible for assessing the suitability of the product for use in particular applications. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications.

Performance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of Intel® products as measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. Buyers should consult other sources of information to evaluate the performance of systems or components they are considering purchasing. For more information on performance tests and on the performance of Intel products, visit http://www.intel.com/performance/resources/limits.htm or call (U.S.) 1-800-628-8686 or 1-916-356-3104.

All information provided related to future Intel products and plans is preliminary and subject to change at any time, without notice. All dates provided are subject to change without notice. Intel may make changes to specifications and product descriptions at any time, without notice.

Celeron, Intel, Intel logo, Intel Core, Intel Inside, Intel Inside logo, Intel. Leap ahead., Intel. Leap ahead. logo, Intel NetBurst, Intel SpeedStep, Intel XScale, Itanium, Pentium, Pentium Inside, VTune, Xeon, and Xeon Inside are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.

* Other names and brands may be claimed as the property of others.

Other vendors are listed by Intel as a convenience to Intel's general customer base, but Intel does not make any representations or warranties whatsoever regarding quality, reliability, functionality, or compatibility of these devices. This list and/or these devices may be subject to change without notice.

Copyright © 2009, Intel Corporation. All rights reserved.



3

Table of Contents • What has Changed

• IOTG Markets and Summary

• CSIG Update

• Workstation & Desktop: High level processor roadmaps & Reference Tables, Chipset tables, Software

• Mobile Processors: High level processor roadmaps & Reference Tables, Chipset tables, Software

• Key Features and O/S Capabilities by Platform

• Pricing Information



4

IOTG Roadmap: What Has Changed

General: o Added commercial and extended temperature clarifications in the use condition

table for the Communications and Industrial business sectors.

Product Specific:

• CID Roadmap: o Added Broadwell-DE placeholder to platform roadmap. o Added Communications commercial and extended temp clarification in the use condition tables.

• Desktop/Workstation Roadmap o None

• Mobile Roadmap: o Added Industrial commercial and extended temp clarification in the use condition tables. o Added the X1020D and X1021D SKUs to the Quark product line. o Removed Dublin Bay o Added Intel® Atom™ Processor E3805 to SKU lineup



5

IOTG Long Life Silicon Roadmap Support

IOTG is dedicated to providing long life manufacturing support for the embedded market

IOTG product availability commitment for embedded IA roadmap products is 7 years as defined by:

7 year life cycle spans from Intel introduction of component to last shipments

Component introduction dates are available from your Intel Sales Representative

7 year life cycle includes an End of Life (EOL) period which is typically 18 months

Product Discontinuance Notifications (PDNs) typically issued after 66 months of production followed by

12 month last time order period followed by

6 month last time ship period

PDNs are published at https://qdms.intel.com/

Long Life Cycle

0 1 2 3 4 5 6 7

Intel may support this extended manufacturing using reasonably feasible means deemed by Intel to be appropriate. Future business, manufacturing, or market conditions may change, which may cause Intel to revisit the EOL / PDN timing. Intel may make changes to dates and schedule at any time without notice

Customer NDA Slide



6

Internet of Things Group Focus

User

Experiences Data

Analytics Security &

Trust Workload

Consolidation

COMMS

RETAIL

AUTOMOTIVE

Print

Indu DSS Energy

Medical MAG

Sector Solutions and Scaling IA Globally

Cloud Connectivity



7

SECTOR Focus

Complete solutions to increase TTM and build eco-systems

Accelerate industry transitions

Enable productivity and efficiency to unleash CapEx and OpEx improvements

Intelligent system to cloud services models

We optimize the platform (hardware and software for the application

User experience focused Automotive

Communication

Retail



8

IOTG Platform Roadmap Overview – WW37’14

Atom Platforms Atom Mainstream

Core Platforms

Desktop/WKS PCCG

Mobile (M /H Series) PCCG

Comm’s Platforms

Comms Performance

Comms Entry

2014 2015

Braswell SoC

Braswell SoC

4C, 2C 12 – 4W

Broadwell-H Mobile (QM87)

Broadwell (BGA) / ECC

4+3e, 4+2 47/37W

Sky Lake

Sky Lake

TBD TBD

Broadwell-DE

Broadwell-DE

TBD TBD

Server EP/EN DCG

Mobile (U Series) PCCG

Broadwell ULT (QM87 MCP)

Broadwell Mobile ULT

2+3, 2+2 15W

Comms Mid Range

Next Generation

Next Generation

TBD TBD

Launched In Planning

Bay Trail (SoC)

Bay Trail SoC

4C, 2C, 1C 12 - 4W

Haswell Mobile (QM87)

Haswell (BGA) / ECC

4+2, 2+2, 2+1 47/37, 25W

Haswell ULT (QM87 MCP)

HSW (BGA – MCP)

2+3, 2+2, 2+1 15W

Rangeley

Rangeley

8C, 4C, 2C 20-7W

Quark Platforms Quark

Quark SoC

TBD

TBD TBD

Glen Forest (89xx Series Chipsets)

Haswell Mobile Comms (BGA)

4C, 2C TBD

Haswell Refresh Desktop / Workstation (Q87 / C226)

Haswell Refresh

4+2, 2+2 65, 45/35W

Quark SoC

Quark X1000 SoC

1C <2W

River Forest (89xx Series Chipsets)

Haswell EN (LGA)

12C, 10C, 8C, 6C TBD

Grantley (Wellsburg)

Haswell EN (LGA)

12C, 10C, 8C, 6C TBD

River Forest (89xx Series Chipsets)

Haswell EP (LGA)

12C, 10C, 8C, 6C 120-52W

Grantley (C612)

Haswell EP (LGA)

12C, 10C, 8C, 6C 120-52W


IOTG-New Platform Overview



10

2014 Comms. Grantley Platform Highlights Haswell “Tock” CPU and next generation Memory

New microarchitecture and New Instructions

4 channels/ 3 DPC; 1.2V DDR4 support

Integrated Voltage regulator

Improved Performance and Bandwidth

Higher core counts - Up to 12 cores for CID

Larger LLC - Up to 30 MB

Higher DDR speed with 2133 DDR4

Higher QPI bandwidth through 9.6 GT/s

Configurable I/Os through PCH

Solutions for Demanding Workloads

Optimized instructions for comms. workloads - AVX 2.0, Cache QoS, etc

New debug capabilities

Enhanced packet processing capabilities via DPDK Kit and AVX2.0

CPU Efficiency and Power management

Per core P-states ( 1 P0, N-1 in Pn) for additional turbo boost performance

Independent uncore frequency scaling via internal algorithm

Lock step energy efficient Turbo with freq increasing in lock-steps

Manageability Serviceability

Optimized Solutions

Performance

Energy Efficiency

Security

HSW-EP

HSW-EP

QPI 2 Channels

DDR4

DDR4

DDR4

DDR4

DDR4

DDR4 DDR4

WBG

LAN Up to

4x10GbE

PCIe 40 lanes (G3)

DDR4



11

Intel® Xeon® Processor E5-2x00v3 Overview

Intel® Hyper-Threading Technology (2 threads/core)

Intel® QuickPath Technology Interface (x2)

Intel® AVX 2.0 / Haswell New Instruction (HNI)

~2.5 MB Last Level Cache/Core Up to 30 MB total LLC

Power Management:

Per Core P-State (PCPS) Uncore Frequency Scaling (UFS) Energy Efficient Turbo (EFT)

22nm Process

Socket B3 3xDDR3L /DDR3 channels 800, 1067, 1333, 1600 MTS

PCI Express 3.0 EP: 40 Lanes; EN: 24 Lanes

Intel® Turbo Boost Technology Core LLC

Core LLC

Core LLC

Core LLC

System Agent

DMI

IMC

Integrated Voltage Regulator

Intel® QuickPath Technology Interface

Up to 12 Cores for Comms.

PCIe3.0

.

.

.

.

.

. Core LLC Core LLC

Memory Technology:

Socket R3

4xDDR4 channels DDR4: 1333, 1600, 1866, 2133

New HSX Feature

Existing Feature



12

Intel® C610 Series Chipset (Wellsburg) Feature Summary

Significant I/O enhancements vs. prior generation

Wellsburg Single

Standard SKU

Features Patsburg

Total SATA Ports 12 SATA 2 (3 Gb/s) 2 SATA 3 (6 Gb/s)

Up to 10 SATA 3 (6 Gb/s)

Clocking Discrete Discrete, Integrated, Hybrid

USB Ports 14 USB 2.0 8 USB 2.0 + Up to 6 USB 3.0

PCI Express 8 PCIe* 2.0 (5 GT/s)

x1 supported Up to 8 PCIe* 2.0 (5 GT/s)

x1, x2, x4 supported

Firmware vPRO, AMT, NM 2.0, DCM 3.0 vPro™, AMT, NM 3.0;

DCM 4.0; MCTP; Thermal/Airflow Telemetry; CUPS

Advanced RAS N/A Dengate

Software RAID support Intel® RSTe 3.0 Intel® RSTe 4.0

Longer Trace Length Support Yes Yes

SMBus 6 6



13

Max Capability Cave Creek Coleto Creek*

RSA 1024/2048 28K 200K/40K

IPSec/SSL 20G/20G 45G/50G

Wireless Crypto Yes Yes

Security Crypto Yes Yes

Compression 8G 24G

TDP 12W 25W

PCH Yes Yes

x1GbE 4 No

PCIe Gen2 Gen2

Samples 2Q2012 2Q2013

Production 4Q2012 4Q2013

*Pre-silicon estimates

Range of SKUs with and without Intel® QuickAssist Virtualization Technologies PCH with I/O

•PCIe Gen2 Endpoint (Processor connect x8/x16)

•PCIe Gen1 Root (External 1x4, 2x2, 4x1)

•x6 USB 2.0, x2 SATA 2.0, x50 GPIO

•x2 UART, SMBus, LPC, SPI (Boot Interface)

•Package: FCBGA -27mm x 27mm @ 0.7mm Variable Pitch

• Intel® QuickAssist Technology Software Driver: Linux, FreeBSD, VxWorks

• Intel Data Plane SDK

Cave Creek & Coleto Creek Summary Cave Creek

4x1G MAC

Intel Quick Assist Technology

PCH COMPRESSION

CRYPTO

Coleto Creek Intel Quick Assist Technology

PCH COMPRESSION

CRYPTO



14

Broadwell U-Series Processor Overview

• Up to 10% CPU and Up to 30% graphics performance improvement** vs. HSW 15W

• Enhanced Intel® Quick Sync Video performance with BDW graphics

• PCI Express* storage support for faster responsiveness

Performance and Responsiveness

Power Efficiency

• Up to 30%1 lower power than Haswell U-Processor

• PCH I/O throttling intelligently optimizes for the best user experiences

Broadwell U-Series Processor 2+3 / 2+2 BGA, 15W TDP

• Package Size: MCP BGA 40x24x1.3(mm)

• 15W GT2 & GT3 • Support for PCIe Gen 2 • Support both Type 3 and Type 4

motherboard, pin compatible to Shark Bay motherboard

•DDR3L (SO-DIMM and motherboard down)

•Firmware Support: 1.5MB & 5MB • OS: Windows* 8.1, Windows* 7,

Linux* (Kernel.Org), Windows* 8

• Mainstream performance with 15W TDP

• High res display for immersive visual experiences

• Intel® Smart Sound Technology with Wake on Voice enhances user interaction

Mainstream Sleek and New Experiences

* Projection only – not based on measured data

Industrial Portable

Computing

Digital

Healthcare

Retail Solutions

Note**: 2+3 refers to Dual Core and GT3; 2+2 refers to Dual Core GT2.



15

Broadwell H-Processor - Overview

•Leading 14nm process technology drives IA performance up to 15% faster on multi-threaded applications

•Stunning Mainstream Discrete Level Gfx Performance and Faster Intel Quick Sync Video1

Performance and Responsiveness

Power Efficiency • Improved power efficiency with on-package cache

memory.

Broadwell H-Processor line provides leading performance and stunning visual experiences with lower power

1 Upto 30% 3D performance of BDW 4+3e compared to Client HSW 4+3e at same TDP and Upto 50% 3D performance of BDW 4+3e compared to HSW 4+2 at same TDP. Projections now consider measured performance on HSW. Projections have +/- 15% error.

Broadwell H 2-chip 4C GT3e and 4C GT2 BGA 47W TDP External QM 87, HM 86 LPT-H PCH

• Package Size: 37.5mm x 32mm x 1.84mm

• Cache size up to 6MB + up to 128MB

eDRAM

• Type 3 or Type 4

• DDR3L support (up to 1600) • Firmware Support: 1.5MB & 5MB • OS: Windows* 8.1, Windows* 7,

Linux* (Kernel.Org), Windows* 8

Digital Signage

Digital Surveillance

Medical Imaging Gaming

Media processing



16

Intel® Celeron® /

Intel® Pentium®

processor

Family

Knowing the Braswell** Family of Product Lines

Intel® Atom™

processor

Family

Designed

primarily with PC

usage in mind

2 SKUs targeted

for Intel IOT

Solutions

roadmap

All products, computer systems, dates and figures specified are preliminary based on current expectations, and are subject to change without notice. *Other names and brands may be claimed as the property of others.

Not all hardware features may be supported on all targeted operating systems.

† Mobile and Desktop

Cherry Trail**

NOT targeted on

embedded roadmap

Off-roadmap offering

for significant

opportunities

Designed primarily

with consumer

tablet usage in

mind

Braswell**

Selected SKU on

embedded roadmap

Braswell** (M/D) † Cherry Trail** (T)

Package 25 mm x 27 mm 17 mm x 17 mm

Pin Out Type-3 Type-4 HDI

Usages Notebook, Smart Display,

Embedded Tablet

Memory DDR3L LPDDR3, DDR3L

TDP targets ~ 4/6/10W (prelim.) ~ 2W SDP

(TDP Not Published)

Display-MIPI DSI √

Display-HDMI/DP/eDP √

PCI Express* √

Windows* Support Non-Connected Standby Connected Standby

Firmware UEFI, FSP (CoreBoot) Intel® Architecture

Firmware

IOTG adopted and supported SKU target includes • 2 Mobile SKUs (Dual and/or Quad Core CPUs based)

• TDP Targets: 4 - 6 Watts

• Targeted Brand: Intel® Celeron®

SKU details will be shared at a later time

Targeted SKU set for IOT (Internet of Things) solutions roadmap



17

Braswell Market Enabling Solution Ingredients - Targets

17

Software Ingredients Hardware Reference Platform

Target IOTG Reference System: Code named - Cherry Hill**

Form Factor: Mini-ITX

Main Purpose: Early engagements, developer use

Category Operating System Delivery Support

Microsoft* Windows* 8.1 non-Connected

Standby (including WEI 8.1) –

64b

Microsoft* Intel/Microsoft*

Windows* 7 (Including WES 7)

– 32b/64b Microsoft* Intel/Microsoft*

Linux* Open Linux* Distribution‡ – 64b Yocto* Project community, Wind River*, Timesys*

Android* (Version TBA) – 64b Wind River*, Insyde*, Timesys*, ArcherMind*

RTOS Wind River* VxWorks* Wind River*

Category Components Delivery Support

Firmware UEFI-based Firmware Independent BIOS Vendors

FSP-based Firmware

Intel, Independent Boot

Loader Vendors, Open

source

Independent Boot Loader

Vendors

Media Intel® Media SDK Intel

Target Independent BIOS vendors:

• AMI*, Insyde*, Nanjing Byosoft*, Phoenix*

Target Independent Boot Loader vendors:

• AMI*, Insyde*, Sage*, Waris*, Wind River* Systems (as a System Integrator)

‡ Targeted with Open-source Graphics Drivers (https://01.org/linuxgraphics/), embedded graphics features not targeted

All products, computer systems, dates and figures specified are preliminary based on current expectations, and are subject to change without notice. *Other names and brands may be claimed as the property of others.

Not all hardware features may be supported on all targeted operating systems.

† Mobile and Desktop

†

https://01.org/linuxgraphics/

https://01.org/linuxgraphics/



18

IOTG Use Condition Roadmap

Problem Statement: The current IOTG Roadmap does not enable customers to identify SKUs that meet their required use conditions.

• Customers are selecting SKUs that may not meet their application use condition requirements.

• IOTG may be seen as encouraging or implying support for use of our products in applications outside of the published datasheet specifications.

Objective: Create an IOTG product roadmap that designates the SKUs to their intended Use Conditions. Impact/Benefit: Provides clear guidance to the IOTG product use conditions.

• Enables customers to easily distinguish which roadmap SKUs align to which use conditions.

• Provides additional full disclosure from Intel of the intended use conditions for each of our roadmap SKUs.

• Enables the FSE to easily articulate the differences in use conditions to customers.



19

Business Sector Attributes: REL, Time in State, DPM, Temp range, Max Tj.

AUTOMOTIVE (IVI)

Extended Temp -40 to 85 oC

12Y Reliability at 11% Active, Tj-max 110 oC , DPM <50

INDUSTRIAL ET (Extended Temp) CT (Commercial Temp)

ET - Extended Temp -40 to 85 oC CT – Commercial Temp 0 to 70 oC

10Y Reliability at 100% active all cores*, Tj-max 100 - 110 oC, DPM <500 * Established ranges are based on Base Frequency only - No core or graphics turbo

COMMUNICATIONS ET (Extended Temp) CT (Commercial Temp)

ET - Extended Temp -40 to 85 oC CT – Commercial Temp 0 to 70 oC

10Y Reliability at 80% active all cores, Tj-max 100 – 105 oC, DPM <500

EMBEDDED Commercial Temp 0 to 70 oC

5Y Reliability at 80% Active, Tj-max 100 - 105 oC, DPM <500

SERVER / ENTERPRISE Commercial Temp 0 to 70 oC

5Y Reliability at 50% Active, Tj-max sku dependent, DPM <500

PC / Client Commercial Temp Mobile 0 to 70 oC , Desktop 5 to 45oC

Mobile: 5Y Reliability at 20% Active, Desk Top: 5Y Reliability at 30% Active, Tj-max sku dependent, DPM <500

NOTES: • Spec Temperature ranges provided are based on Tla . See definitions foil for descriptions. • The most stringent use conditions can support lesser use condition requirements in many but not all cases. • Specific product tested use conditions and thermal ranges can be found in the Product PRQ report in QCDB. • Product EDS and Thermal Design Guides once product is launched can be found on EDC.Intel.Com. • Rel Failure Rate represents the calculated maximum failure rate over the life cycle within the Use Condition application.

IOTG Use Conditions: Added Extended and Commercial Temp designations to Industrial and Communications Sectors



20

Definitions (For Further Details, Please Reference PRQ Report)

Tj Max: As measured and provided as part of the integrated Temp Sensor on the die. % Active: Percent Active refers to the total percentage of the device lifetime it is expected to be actively executing instructions. For multi-core products, equal core usage is assumed. The balance of time will be spent in Inactive Operation (idle and/or standby states) or Non-Operating (powered down). Reliability Lifetime (Rel): The Reliability Lifetime equates to the timeframe over which reliability is assessed under reference use conditions; products must demonstrate the ability to meet a defined failure rate goal over this time period. Use Condition: The defined “Use Condition” values are intended to represent the integration over time of reliability related conditions seen over the life of the product in typical use, and are not the same as product datasheet limits. Sustained exposure to extreme use environments that significantly deviate from the use environment described in the Product Qualification Report may affect long-term component reliability. DPM: Are established as the Defects Per Million units shipped; This represents initial quality or “As Shipped from Intel” target.



21

Temperature Locations

TAIR

System

Airflow

(cfm)

TJ-MAX

C1

TLA

C2C3

TCASE

Simplified System • The local air temperature (TLA) is a temperature monitor ~1 in. (25mm) upstream of the component. If components C1, C2 & C3 dissipate significant power there will be upstream heating (DTRISE) and TLA > TAIR.

• For Reliability Analyses (Q&R 25-0032): TLA = TAIR + DTRISE + TUSER_OFFSET • For thermal design, TLA is not a design constraint but can be determined from modeling and test.


CSIG – CID Roadmap



23

Focus on Communications Maximum Performance Density, Top to Bottom Scalability

Comms Mid Range • Solutions for AMC, compact PCI & dense applications • Exceptional value, unmatched performance density • Data integrity, balance I/O and memory bandwidth • Comms oriented chipset with Quick Assist acceleration

Comms Performance • Multi-core embedded Intel® Xeon® processors for DP/UP blades • Industry leading performance and performance / watt • DP and UP, high I/O bandwidth, high memory capacity & data integrity • Comms oriented chipset with Quick Assist acceleration

Performance • Featuring multi-core embedded Intel® Xeon processors for comms • Industry leading performance and performance / watt • Multi-socket, high I/O bandwidth, high memory capacity & data Integrity • Server chipset with rich I/O capabilities

Entry Comms • High volume, control, compute & communications • Power & space efficiency, fully integrated SOC, fan-ess capability • Data integrity, balance I/O and memory bandwidth • Integrated Quick Assist acceleration

PE

RF

OR

MA

NC

E

PO

WE

R

CPU + Server Chipset

CPU + Comms Chipset

CPU + Comms Chipset

SOC w/ integrated Comms acceleration

CID Roadmap Strategy building blocks

Intel AtomTM



24

2015

Rangeley {Silvermont Core} SOC (BGA)

Leading edge of box indicates production availability date. All products, platforms, dates, features, and figures specified are preliminary based on current expectations, and are subject to change without notice.

2014

CID Platform Roadmap – September 2014

Comms Performance

Comms Mid-Range

Comms Entry

Ivy Bridge EP/EN (LGA)

Patsburg

Romley Refresh Performance

Gladden {IVB} 1C-4C (BGA)

Cave Creek

Crystal Forest Gladden Refresh Glen Forest Haswell Mobile (BGA)

Ivy Bridge EP/EN (LGA)

Haswell EP/EN (LGA)

Wellsburg

Grantley

Coleto Creek

Haswell EP/EN (LGA) Highland Forest River Forest

Intel® AtomTM

Added Broadwell-DE Placeholder

Broadwell-DE



25

Extreme CID Xeon E5/E3 Processor Roadmap September 2014

Q3’14 Q3’15 Q4’14 Q1’15 Q2’15

Xeon E5

Xeon E3 E3-1125C v2

E3-1105C v2

E3-1125C v2

i3-2115C

E3-1125C v2

E3-1105C v2

E5-2640 v3

Haswell-EP4S

E5-2658 v3

E5-2680 v3

E5-2648L v3

E5-2628L v3

E5-2620 v3

E5-2618L v3

E5-2448L v2

E5-2430 v2

E5-2428L v2

E5-2418L v2

E5-2448L v2

E5-2430 v2

E5-2428L v2

E5-2418L v2

E5-2448L v2

E5-2430 v2

E5-2428L v2

E5-2418L v2

Intel® Xeon™ Processors v2 (Ivy Bridge)

Intel® Xeon® Processors v3 (Haswell)

Roadmap not reflective of exact launch granularity and timing – please refer to ILU guidance.

Use Condition

Server/ Enterprise Communications

CT ET

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

SERVER / ENTERPRISE, Commercial Temp 0 to 70oC

COMMUNICATIONS Commercial Temp (CT) 0 to 70oC, Extended Temp (ET) -40 to 85oC

See Foil 19 for additional details on Use Condition.

E3-1125C v2

E3-1105C v2

E5-2448L v2

E5-2430 v2

E5-2428L v2

E5-2418L v2

E5-2609 v3

E5-2608L v3

√

√ √

E5-2640 v3

Haswell-EP4S

E5-2658 v3

E5-2680 v3

E5-2648L v3

E5-2628L v3

E5-2620 v3

E5-2618L v3

E5-2609 v3

E5-2608L v3

E5-2640 v3

Haswell-EP4S

E5-2658 v3

E5-2680 v3

E5-2648L v3

E5-2628L v3

E5-2620 v3

E5-2618L v3

E5-2609 v3

E5-2608L v3

E5-2640 v3

Haswell-EP4S

E5-2658 v3

E5-2680 v3

E5-2648L v3

E5-2628L v3

E5-2620 v3

E5-2618L v3

E5-2609 v3

E5-2608L v3

√

E3-1125C v2

E3-1105C v2

E5-2448L v2

E5-2430 v2

E5-2428L v2

E5-2418L v2

E5-2640 v3

Haswell-EP4S

E5-2658 v3

E5-2680 v3

E5-2648L v3

E5-2628L v3

E5-2620 v3

E5-2618L v3

E5-2609 v3

E5-2608L v3

Added Comms CT and ET



26

Extreme

CID Core/Atom Processor Roadmap September 2014


Q3’14 Q3’15 Q4’14 Q1’14 Q2’14

i3-3115C Core i3 B925C Pentium

i3-3115C

B925C

i3-3115C

B925C

Atom

3rd Gen Intel® Core ™ Processors (Ivy Bridge)

Intel® Atom™ Processors (Rangeley)

C2758

C2738

C2718

C2558

C2538

C2518

C2358

C2338

C2758

C2738

C2718

C2558

C2538

C2518

C2358

C2338

C2758

C2738

C2718

C2558

C2538

C2518

C2358

C2338

C2758

C2738

C2718

C2558

C2538

C2518

C2358

C2338

Use Condition Server/Enterprise Communications

CT ET

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

√

i7-4700EC i7-4700EC Core i7

i5-4402EC i5-4402EC Core i5

i7-4700EC

i5-4402EC

i7-4700EC

i5-4402EC

√

√

√

√

i7-4702EC i7-4702EC i7-4702EC i7-4702EC √ √

4thnd Gen Intel® Core™ Processors (Haswell)

i3-3115C

B925C

C2758

C2738

C2718

C2558

C2538

C2518

C2358

C2338

i7-4700EC

i5-4402EC

i7-4702EC

i3-3115C

B925C

SERVER / ENTERPRISE, Commercial Temp 0 to 70oC COMMUNICATIONS Commercial Temp (CT) 0 to 70

oC, Extended Temp (ET) -40

oC to 85

oC

See Foil 19 for additional Detail

C2508

C2308

C2508

C2308

C2508

C2308

C2508

C2308

√

√

√

√

√

√

C2508

C2308

Added Comms CT and ET



27

CSIG-CID Xeon®/Atom™ Processor Reference Table September 2014

Processor

Generation Process Socket Cores

Intel® TXT & AES-

NI

Intel®

VT HT

Enhanced

Intel

SpeedStep

®

Intel®

64

Execute

Disable

Bit

Intel® Xeon® Processor E5 Series - 22nm Haswell

E5-46xx v3 Haswell-EP 22nm LGA2011 TBD 9.6 30MB √ 105W 12 √ √ √ √ √ √

E5-2680 v3 Haswell-EP 22nm LGA2011 2.5 9.6 30MB 120W 12 √ √ √ √ √ √

E5-2658 v3 Haswell-EP 22nm LGA2011 2.2 9.6 30MB √ 105W 12 √ √ √ √ √ √

E5-2648L v3 Haswell-EP 22nm LGA2011 1.8 9.6 30MB √ 75W 12 √ √ √ √ √ √

E5-2640 v3 Haswell-EP 22nm LGA2011 2.6 8 20MB 90W 8 √ √ √ √ √ √

E5-2620 v3 Haswell-EP 22nm LGA2011 2.4 8 15MB 85W 6 √ √ √ √ √ √

E5-2628L v3 Haswell-EP 22nm LGA2011 2 8 25MB √ 75W 10 √ √ √ √ √ √

E5-2618L v3 Haswell-EP 22nm LGA2011 2.3 8 20MB √ 75W 8 √ √ √ √ √ √

E5-2609 v3 Haswell-EP 22nm LGA2011 1.8 6.4 15MB 85W 6 √ √ √ √ √ √

E5-2608L v3 Haswell-EP 22nm LGA2011 2 6.4 15MB √ 50W 6 √ √ √ √ √ √

Intel® Atom™ Processor C2000 Series - 22nm Rangeley

C2758 Rangeley 22nm FCBGA 2.4 N/A 4MB √ 20W 8 √ √ √


C2718 Rangeley 22nm FCBGA 2 N/A 4MB √ 18W 8 √ √ √






C2508 Rangeley 22nm FCBGA 1.25 N/A 2MB √ 9.5W 4 √ √ √


Intel® Xeon® Processor E5 Series - 22nm Ivy Bridge

E5-4624L v2 Ivy Bridge-EP 22nm LGA2011 1.9 8 25MB √ 70W 10 √ √ √ √ √ √

E5-2680 v2 Ivy Bridge-EP 22nm LGA2011 2.8 8 25MB 115W 10 √ √ √ √ √ √

E5-2658 v2 Ivy Bridge-EP 22nm LGA2011 2.4 8 25MB √ 95W 10 √ √ √ √ √ √

E5-2648L v2 Ivy Bridge-EP 22nm LGA2011 1.9 8 25MB √ 70W 10 √ √ √ √ √ √

E5-2640 v2 Ivy Bridge-EP 22nm LGA2011 2 7.2 20MB 95W 8 √ √ √ √ √ √

E5-2628L v2 Ivy Bridge-EP 22nm LGA2011 1.9 7.2 20MB √ 70W 8 √ √ √ √ √ √

E5-2630 v2 Ivy Bridge-EP 22nm LGA2011 2.6 7.2 15MB 80W 6 √ √ √ √ √ √

E5-2618L v2 Ivy Bridge-EP 22nm LGA2011 2 6.4 15MB √ 50W 6 √ √ √ √ √ √

E5-2448L v2 Ivy Bridge-EN 22nm LGA1356 1.8 8 25MB √ 70W 10 √ √ √ √ √ √

E5-2428L v2 Ivy Bridge-EN 22nm LGA1356 1.8 7.2 20MB √ 60W 8 √ √ √ √ √ √

E5-2430 v2 Ivy Bridge-EN 22nm LGA1356 2.5 7.2 20MB 80W 6 √ √ √ √ √ √

E5-2418L v2 Ivy Bridge-EN 22nm LGA1356 2 6.4 15MB √ 50W 6 √ √ √ √ √ √

Intel® Xeon® Processor - Ivy Bridge Gladden, Sandy Bridge Gladden

E3-1125C v2 IVB Gladden 22 nm BGA1284 2.5 N/A 8MB √ 65W 4 √ √ √ √ √ √

E3-1105C v2 IVB Gladden 22 nm BGA1284 1.8 N/A 6MB √ 30W 4 √ √ √ √ √ √

Intel® Core® , Pentium® and Celeron® Processors - Haswell Mobile, Ivy Bridge Gladden and Sandy Bridge Gladden

i7-4700EC Haswell Mobile 22 nm BGA1364 2.7 N/A 8MB √ 43W 4 √ √ √ √ √ √

i7-4702EC Haswell Mobile 22 nm BGA1364 2 N/A 8MB √ 27W 4 √ √ √ √ √ √

i5-4402EC Haswell Mobile 22 nm BGA1364 2.5 N/A 4MB √ 27W 2 √ √ √ √ √ √

i3-3115C IVB Gladden 22 nm BGA1284 2.5 N/A 4MB √ 25W 2 √ √ √ √ √ √

Pentium B925C IVB Gladden 22 nm BGA1284 2 N/A 4MB √ 15W 2 √ √ √ √ √ √

Processor

Number

Architecture

Clock

Speed

(GHz)

QPI

(GT/s)

Last

Level

Cache

Ideal for

ATCA /

NEBS

(Tcase) TDP

Intel Technologies

*Intel® Celeron Processor

** Note "High Tcase" sku's provide robust thermals for ATCA* and or NEBS* solutions (higher Tcases)



28

CSIG-CID Chipset Compatibility Matrix September 2014

CSIG-CID Chipset Compatability MatrixProcessor Generation

Code NamePatsburg-B Chipset

Cave Creek

Chipset

Wellsbur

g ChipsetColeto Creek Chipset

Twelve Core Intel® Xeon® Processor E5-46xx v3, E5-2680 v3, E5-2658 v3,

E5-2648L v3Haswell EP Grantley River Forest

Ten Core Intel® Xeon® Processor E5-2628L v3 Haswell EP Grantley River Forest

Eight Core Intel® Xeon® Processor E5-2640 v3, E5-2618L v3 Haswell EP Grantley River Forest

Six Core Intel® Xeon® Processor E5-2620 v3, E5-2609 v3, E5-2608L v3 Haswell EP Grantley River Forest

Four Core Intel® Core® Processor i7-4700EC, i7-4702EC Haswell Mobile Glen Forest

Dual Core Intel® Core® Processor i5-4402EC Haswell Mobile Glen Forest

Ten Core Intel® Xeon® Processor E5-4624L v2, E5-2680 v2, E5-2658L v2,

E5-2648L v2, E5-2448L v2Ivy Bridge EP/EN Romley Refresh

Crystal Forest

RefreshHighland Forest

Eight Core Intel® Xeon® Processor E5-2640 v2, E5-2628L v2, E5-2428L v2 Ivy Bridge EP/EN Romley RefreshCrystal Forest


Six Core Intel® Xeon® Processor E5-2630 v2, E5-2618L v2, E5-2430 v2, E5-

2418L v2Ivy Bridge EP/EN Romley Refresh

Crystal Forest


Four Core Intel® Xeon® Processor E3-1125C v2, E3-1105C v2 Ivy Bridge GladdenCrystal Forest

Gladden Refresh

Dual Core Intel® Core® Processor i3-3115C Ivy Bridge GladdenCrystal Forest

Gladden Refresh

Dual Core Intel® Pentium® Processor B925C Ivy Bridge GladdenCrystal Forest

Gladden Refresh

Eight Core Intel® Xeon® Processor E5-2658, E5-2648L & E5-2448L Sandy Bridge EP/EN Romley Crystal Forest

Six Core Intel® Xeon® Processor E5-2620, E5-2430 & E5-2428L Sandy Bridge EP/EN Romley Crystal Forest

Quad Core Intel® Xeon® Processor E5-2418L Sandy Bridge EP/EN Romley Crystal Forest

Four Core Intel® Xeon® Processor E3-1125C, E3-1105C Sandy Bridge GladdenCrystal Forest

Gladden

Dual Core Intel® Core® Processor i3-2115C Sandy Bridge GladdenCrystal Forest

Gladden

Dual Core Intel® Pentium® Processor B915C Sandy Bridge GladdenCrystal Forest

Gladden

Intel® Celeron® Processor 725C Sandy Bridge GladdenCrystal Forest

Gladden


IOTG Workstation and Desktop Processor Roadmap



30

2015


2014

IOTG Desktop Platform Roadmap – September 2014

4th gen Intel® Xeon and Dual Core Processors (LGA) C226 Chipset

Haswell Workstation Platform

4th gen Intel® Pentium® and Celeron Processors H81 Chipset

Haswell Value Platform

In Planning

Haswell Desktop Platform

Q87 Chipset Haswell Refresh Core i7/i5/i3 Processors

Haswell Refresh Desktop 4th generation Intel® i7/i5/i3 Processors

Intel® Celeron™ Processor J1900 Bay Trail Platform

I/O Intensive

Premium Performance Mainstream

Value

Value SoC Braswell Platform Braswell SoC



31

Extreme IOTG Workstation/Desktop Processor Roadmap September 2014

Q3’14 Q3’15 Q4’14 Q1’15 Q2’15

Xeon E3

4th Gen Intel ® Core ™ Processors (Haswell)


Use Condition PC/Client Embedded

√

√

√

√

√

√

√

√

√

√

G1820TE

G1820

Core i7

Core i5

Core i3

Pentium

Celeron

E3-1225 v3

E3-1275 v3

E3-1268L v3

G3320TE

G3420

i7-4790S

E3-1225 v3

E3-1275 v3

E3-1268L v3

i3-4350T

i5-4590T

i5-4590S

i3-4360

G3320TE

G3420

i7-4790S

E3-1225 v3 E3-1275 v3

E3-1268L v3

i3-4350T

i5-4590T

i5-4590S

i3-4360

G3320TE G3420

i7-4790S

E3-1225 v3

E3-1275 v3

E3-1268L v3

i3-4350T

i5-4590T

i5-4590S

i3-4360

G3320TE

G3420

G1820TE

G1820

G1820TE

G1820

J1900 J1900 Braswell √

Intel® Celeron ® Processor (Bay Trail-D)

PC / CLIENT: Commercial Temp Desktop 5 to 45oC EMBEDDED: Commercial Temp 0 to 70oC

See Foil 19 for additional detail.

√

√

√

√

√

√

√

√ G1820TE

G1820

i7-4790S

i3-4350T

i5-4590T

i5-4590S

i3-4360

√

i7-4770S i7-4770S i7-4770S i7-4770S √ √

i3-4340TE i3-4340TE i3-4340TE i3-4340TE √ √

E3-1225 v3

E3-1275 v3

E3-1268L v3

G3320TE

G3420

J1900

G1820TE

G1820

i7-4790S

i3-4350T

i5-4590T

i5-4590S

i3-4360

i7-4770S

i3-4340TE

Braswell

i5-4570S i5-4570S i5-4570S √ √ i5-4570S i5-4570S

√ √

i5-4570TE i5-4570TE i5-4570TE √ √ i5-4570TE i5-4570TE

Updated i7, i5 and i3 SKUs

i3-4330 i3-4330 i3-4330 √ √ i3-4330

i3-4330TE i3-4330TE i3-4330TE i3-4330TE √ √

i3-4330

i3-4330TE

i7-4770TE i7-4770TE i7-4770TE i7-4770TE √ √ i7-4770TE



32 3rd Gen Intel ® Core ™ Processors (Ivy Bridge)

Intel® Celeron® Processor (Bay-Trail D) 4th Gen Intel ® Core ™ Processors (Haswell)

IOTG-Workstation and Desktop Reference Table September 2014

Updates/New Additions

Intel® AMT

Intel

®

TXT

Intel

®

VT-x

Intel

®

VT-d

Intel® Xeon® Processor E3 Family (Workstation) - 22nm Haswell Platform

LGA1150 3.5 3.9 8M 4/8 1600 √1 95W GT2 -P4600 350-1250 3 Gen 3.0 √ √ √ AMT 9.0 √ √ √ SSE4.1 /4.2, AVX2.0

LGA1150 3.2 3.6 8M 4/4 1600 √1 95W GT2-P4600 350-1250 3 Gen 3.0 √ √ √ AMT 9.0 √ √ √ SSE4.1 /4.2, AVX2.0

LGA1150 2.3 3.3 8M 4/8 1600 √1 45W GT2 - P4600 350-1000 3 Gen 3.0 √ √ √ AMT 9.0 √ √ √ SSE4.1 /4.2, AVX2.0

Intel® Xeon® Processor E3 Family (Workstation) - 22nm Ivy Bridge Platform

E3-1275v2 LGA1155 3.5 3.9 8M 4/8 1600 √1 77W GT2-P4000 650-1250 3 Gen 3.0 √ √ √ AMT 8.0 √ √ √ SSE4.1 /4.2

E3-1225v2 LGA1155 3.2 3.6 8M 4/4 1600 √1 77W GT2-P4000 650-1250 3 Gen 3.0 √ √ √ AMT 8.0 √ √ √ SSE4.1 /4.2

LGA1150 3.2 4.0 8M 4/8 1600 N/A 65W GT2 -4600 350-1200 3 Gen 3.0 √ √ √ AMT 9.0 √ √ √ SSE4.1 /4.2, AVX2.0






LGA1150 2.7 3.3 4M 2/4 1600 √1 35W GT2 -4600 350-1000 3 Gen 3.0 √ √ √ AMT 9.0 √ √ √ SSE4.1 /4.2, AVX2.0

LGA1150 3.7 N/A 4M 2/4 1600 √1 54W GT2 -4600 350-1150 3 Gen 3.0 √ √ Standard Manageability √ SSE4.1 /4.2, AVX2.0


LGA1150 3.1 N/A 4M 2/4 1600 N/A 35W GT2 -4600 200-1150 3 Gen 3.0 √ √ Standard Manageability √ SSE4.1 /4.2, AVX2.0


LGA1150 2.4 N/A 4M 2/4 1600 √1 35W GT2 -4600 350-1000 3 Gen 3.0 √ Standard Manageability √ SSE4.1 /4.2, AVX2.0

i7-3770 LGA1155 3.4 3.9 8M 4/8 1600 N/A 77W GT2-4000 650-1150 3 Gen 3.0 √ √ √ AMT 8.0 √ √ √ SSE4.1 /4.2

i5-3550S LGA1155 3.0 3.7 6M 4/4 1600 N/A 65W GT1-2500 650-1150 3 Gen 3.0 √ √ √ AMT 8.0 √ √ √ SSE4.1 /4.2

i3-3220 LGA1155 3.3 N/A 3M 2/4 1600 √1 55W GT1-2500 650-1050 3 Gen 2.0 √ Standard Manageability √ SSE4.1 /4.2

G2120 LGA1150 3.2 N/A 3M 2/2 1600 √1 53W GT1- HD Graphcis 350-1150 3 Gen 3.0 Standard Manageability √ SSE4.1 /4.2



G2120 LGA1150 2.7 N/A 2M 2/2 1333 √1 53W GT1- HD Graphcis 350-1000 3 Gen 3.0 N/A √ SSE4.1 /4.2

G2120 LGA1150 2.2 N/A 2M 2/2 1333 √1 35W GT1- HD Graphcis 350-1000 3 Gen 3.0 N/A √ SSE4.1 /4.2

TBD LGA1155 2.7 N/A 2M 2/2 1333 √1 55W GT1- HD Graphcis 650-1050 3 Gen 2.0 N/A √ SSE4.1 /4.2

BGA1170 2 2.42 2M 4/4 1333 N/A 10W Intel® HD Graphics 688-854 2 Gen 2.0 N/A √ 64-bit

1: ECC supported on this SKU when paired with the Intel® C206 (SNB) or C216(IVB), or C226 (HSW) Chipset

2: Support Intel® Intelligent Systems Framework capabilities

∆ Processor can not be branded as Intel® vPro™ technology enabled when pairing with C206 (SNB) or C216 (IVB) or C226 (HSW) Chipset

4th Generation Intel® Core™ Processors - 22nm Haswell Platform (Blue = Haswell Refresh)

3rd Generation Intel® Core™ Processors - 22nm or Ivy Bridge Platform

Intel® Pentium® Processors - 22nm Haswell Platform

Last

Level

Cache

TDP

Intel® Turbo

Boost

Technology -

max single core

turbo freq (GHz)

SocketPCIe

Version

Intel®

AES-NI

Intel®

AVX

Intel®

vProTM

Intel Technologies2

Instruction

Set

Intel Integrated

Graphics

Memory

Speed

Support

(DDR3)

Integrated

Graphics

Frequency

(Mhz)

ECC

Memory

Supported

Cores /

Threads

Number of

Independ

DIsplays

Processor

Number

Base Freq

(GHz)

Intel® Celeron® Processors (Value BGA) - 22nm or Bay Trail SoC Platform

Intel® Pentium® Processors - 22nm or Ivy Bridge Platform

Intel® Celeron® Processors - 22nm Haswell Platform

Intel® Celeron® Processors - 22nm or Ivy Bridge Platform

E3-1275 v2

E3-1225 v2

i5-3550s

i3-3220

i7-2600

D2550

E3-1275 v3

E3-1225 v3

E3-1268L v3

i7-4770S

i5-4570S

i5-4570TE

i3-4330

i3-4330TE

G3320TE

i7-4770TE

G1820TE

i7-4790S

i5-4590S

i5-4590T

i3-4360

i3-4350T

E3-1275 v2

E3-1225 v2

i7-3770

i5-3550s

i3-3220

G2120

G1620

G850

J1900

E3-1275 v3

E3-1225 v3

E3-1268L v3

i7-4770S

i5-4570S

i5-4570TE

i3-4330

i3-4330TE

G3320TE

G3420

i7-4770TE

G1820

G1820TE

i7-4790S

i5-4590S

i5-4590T

i3-4360

i3-4340TE

i3-4350T



33

C – Compatible: CPU and chipset can be paired together, validation done by owning division on windows environment, but not on all the embedded OS systems. Embedded software is by platform, please check embedded software roadmap.

V – Validated: CPU and chipset can be paired together, validation done on all the embedded OS systems. Embedded software is by platform, please check embedded software roadmap.

Note: See 2012 IOTG Platforms Feature Cross Compatibility Summary to identify which features may not be enabled in a situation where a CPU and Chipsets across different generations are paired.

2nd Gen Intel ® Core ™ Processors (Sandy Bridge)

IOTG-Scalable Chipset/Processor Matrix September 2014

3rd Gen Intel ® Core ™ Processors (Ivy Bridge)


Intel® B65

Express Chipset

Intel® H61

Express Chipset

Intel® Q67

Express Chipset

Intel® C206

Express Chipset

Intel® B75

Express Chipset

Intel® Q77

Express Chipset

Intel® C216

Express Chipset

V

V

V

Intel® Xeon® E3-1275v2 Processor V V

Intel® Xeon® E3-1225v2 Processor V V

V V

V V

V V

V V

V V

V V

V V V

V V V

V V V

V V V

V V

V V

V V V

V V

V V V

V V V

V V V

V V V

V V V V V

V V V V V

V V V V V V V

V V V V V

V V V V V

V V V V V V V

V V V V V V V

V V V V V V V

V V V

V V V V V V V

4th Generation Intel® Core™ Processors - 22nm or Haswell Platform (Blue = Haswell Refresh)

Intel® 6 Series Chipsets (Cougar Point) Intel® 7 Series Chipsets (Panther Point)

Intel® Xeon® Processor E3 Family (Workstation) - 22nm or Hawell Platform

Intel ® Pentium ® Processors - 22nm or Ivy Bridge Platform

Intel ® Pentium ® Processors - 32nm or Sandy Bridge Platform

Intel ® Celeron ® Processors - 22nm or Ivy Bridge Platform

Intel ® Celeron ® Processors - 32nm or Sandy Bridge Platform

Intel® Xeon® Processor E3 Family (Workstation) - 22nm or Ivy Bridge Platform

Intel® Xeon® Processor E3 Family (Workstation) - 32nm or Sandy Bridge Platform

3rd Generation Intel® Core™ Processors - 22nm or Ivy Bridge Platform

4th Generation Intel® Core™ Processors - 22nm or Haswell Platform (Blue = Haswell Refresh)

2nd Generation Intel® Core ™ Processors - 32nm or Sandy Bridge Platform

E3-1275 v2E3-1225 v2

i7-3770i5-3550si3-3220

G2120

E3-1275 E3-1225

i7-2600

i3-2120i5-2400

G850

G540

Intel® 7 Series Chipsets (Panther Point)Intel® - 6 Series Chipsets (Cougar Point)

Intel® B65Express Chipset

Intel® H61Express Chipset

Intel® Q67Express Chipset

Intel® C206Express Chipset

Intel® B75Express


Intel® C216Express Chipset

G1620

Intel® 8 Series Chipsets (Lynx Point)

Intel® C226Express


E3-1275 v3E3-1225 v3

E3-1268L v3

Intel® H81Express Chipset

i7-4770S

i5-4570S

G1820

i3-4350T

G1820TE

i5-4570TE

i7-4790T

G3420

G3320TE

i7-4790S

i5-4590S

i3-4360

i7-4770TEi5-4590T

i3-4340TEi3-4330TE

i3-4330


IOTG-Intel® Mobile Processor Roadmap



35

IOTG Mobile Processor Line Naming Processor Lines represent a differentiated feature set targeted to meet specific market segment requirements

Processor Number Suffix is aligned to identify Processor Lines

IMPORTANT: Intel will continue to market Mobile PC processors with Core™ i7, Core™ i5, Core™ i3, Pentium® , and Celeron® brands. Broadwell Y brand will be communicated at a later time

Processor Line Name1 (NDA Only, NOT END CUSTOMER

NAME)

Package

Thermal Design Power2

Scenario Design

Power3

5th Gen Intel Core™ Processor Family (“Broadwell”)

H-Processor Line1 BGA 47W N/A

U-Processor Line1 BGA 15W N/A

1 Processor line names are not official processor names and should not be used in ANY end-customer communication. Use official brand names for all end-customer communication

Processor Line Name1 (NDA Only, NOT END CUSTOMER

NAME)

Package

Thermal Design Power2

Scenario Design

Power3

4th Gen Intel Core™ Processor Family (“Haswell”)

U-Processor Line1 BGA 28W,15W N/A

H-Processor Line1 BGA 47W, 37W

N/A

M-Processor Line1 PGA 57W, 47W, 37W N/A

(Bay Trail-M) N-Processor Line1 BGA 7.5W, 4.3W 4.5W,2.5W

2Thermal Design Power(TDP) definition represents a near-worst case workload and thermal conditions for a Notebook-first experience 3 Scenario Design Power(SDP) is an additional thermal reference point that is meant to represent workloads for specific usages *Signifies CPU SDP only



36

2015


2014

IOTG Mobile Platform Roadmap – September 2014

4th gen Intel® Celeron® Processors (H-Series)

HM86 Chipset

Haswell H-Series Mobile Value Platform

In Planning

Haswell H-Series Mobile Platform

QM87 Chipset

4th Generation Intel® Core™ i5/i3 Processors (H-Series)

Haswell Refresh Mobile

4th generation Intel® Core™ i7/i5/i3 Processors (H-Series)

Intel® Celeron™ Processor N2930, N2807

Bay Trail-M Value Platform

Premium Performance Mainstream

Value

Value SoC Bay Trail-I Value Platform

Haswell U-Series Mobile Platform

5th Generation Intel® Core™ i7/i5/i3 Processors (U-Series)

Broadwell U-Series Mobile Platform

4th generation Intel® i7/i5/i3 Processors (U-Series)

Haswell U-Series Mobile Value Platform

4th gen Intel® Celeron® Processors (U-Series)

Intel® Atom™ Processor E38xx Series

Intel® Quark Platform

Intel® Quark™ Processor X1000 Series IoT

Braswell Platform Braswell SoC

5th Generation Intel® Core™ i7 Processors (H-Series)

Broadwell H-Series MBL Platform

5th Generation Intel® Celeron® Processors (U-Series)

Broadwell U-Series Mobile Platform



37

Extreme

IOTG Mobile Processor Roadmap (H Series) September 2014

Q3’14 Q3’15 Q4’14 Q1’15 Q2’15

4th Gen Intel ® Core™ Processors (Haswell)


Use Condition PC/Client Embedded

√

√

√

√

√

√

2002E

2000E

Core i7

Core i5

Core i3

Celeron

i7-4700EQ

i5-4400E

i7-4700EQ

i3-4112E

i5-4422E

i5-4400E

i3-4110E

i7-4700EQ

i3-4112E

i5-4422E

i5-4400E

i3-4110E

i7-4700EQ

i3-4112E

i5-4422E

i5-4400E

i3-4110E

2002E

2000E

2002E

2000E

√

√ √ 2002E

2000E

√

√ √

√ √ i3-4112E

i3-4110E

i5-4422E i5-4410E i5-4410E i5-4410E i5-4410E √ √

Broadwell-H

i7-4700EQ

i5-4400E

2002E

2000E

i3-4112E

i3-4110E

i5-4422E i5-4410E

Industrial

(CT)

PC / CLIENT: Commercial Temp (CT) Mobile 0 to 70oC EMBEDDED, Commercial Temp (CT) 0 to 70oC INDUSTRIAL: Commercial Temp (CT) 0 to 70oC, Extended Temp (ET) -40oC to 85oC See Foil 19 for additional detail.

√

√

√

√

√

√

√

√

Added CT column for Industrial UC Updated i5 and i3 SKUs

TBD TBD TBD

i3-4100E

i3-4102E

i3-4100E

i3-4102E

i3-4100E

i3-4102E √ √

√ √ i3-4100E

i3-4102E

i3-4100E

i3-4102E √

√

√ i5-4402E i5-4402E i5-4402E √ i5-4402E i5-4402E √

5th Gen Intel® Core™ Processors (Broadwell)



38

IOTG Mobile Processor Roadmap (U Series and Atom) September 2014

Intel® Celeron®/Atom™ Processors (Bay Trail)

5th Gen Intel® Core™ Processors (Broadwell)


√

√

√

√

√

i7-4650U

N2930

2980U 2980U 2980U

Core i7

Core i5

Core i3

Celeron

i7-4650U

i5-4300U

i7-4650U

i5-4300U

i7-4650U

i5-4300U

i7-4650U

i5-4300U

2980U

Braswell

2980U √

√

i5-4300U

i3-4010U i3-4010U i3-4010U i3-4010U i3-4010U

N2930

E3845 Atom E3845 E3845 E3845

E3827 E3827 E3827 E3827

E3826 E3826 E3826 E3826

E3825 E3825 E3825 E3825

E3815 E3815 E3815 E3815

√

√

√

√

√

√

√

√

√

√

√

√

N2930

E3845

E3827

E3826

E3825

E3815

√

√

√

N2807 N2807

** Evaluation under way, results will be published when available

N2807

Broadwell-U Broadwell-U




PC / CLIENT: Commercial Temp (CT) Mobile 0 to 70oC , EMBEDDED: Commercial Temp (CT) 0 to 70oC INDUSTRIAL: Commercial Temp (CT) 0 to 70oC, Extended Temp -40oC to 85oC AUTOMOTIVE: Extended Temp (ET) -40oC to 85oC See Foil 19 for additional Detail.

√

√

√

√

√

Q3’14 Q3’15 Q4’14 Q1’15 Q2’15 Use Condition

PC/Client Embedded Industrial

(CT) (ET)

Automotive

(ET)

√

4th Gen Intel® Core™ Processors (Haswell)

Braswell

Broadwell-U

Broadwell-U

Broadwell-U

Broadwell-U

√

√

√

--

Added CT and ET columns for Industrial UC Added E3805

√

TBD

√

TBD

TBD TBD

TBD TBD

TBD TBD TBD

TBD

TBD

TBD

E3805 E3805 E3805 E3805 √ √ √ E3805 √



39

Extreme

IOTG Mobile Processor Roadmap (Quark) September 2014 Q3’14 Q3’15 Q4’14 Q1’15 Q2’15


Use Condition PC/Client Embedded Industrial

(ET) √ X1000 X1000 X1000 X1000

X1010 X1010 X1010 X1010

X1020 X1020 X1020 X1020

√

√

X1000

X1010

X1020 Quark

√

√

√

√

X1020D X1020D X1020D X1020D

X1001 X1001 X1001 X1001

X1011 X1011 X1011 X1011 √

√

X1020D

X1001

X1011

√

√

√

√

√

√

Automotive

PC / CLIENT: Commercial Temp (CT) Mobile 0 to 70oC , EMBEDDED: Commercial Temp (CT) 0 to 70oC INDUSTRIAL: Commercial Temp (CT) 0 to 70oC, Extended Temp (ET) -40oC to 85oC AUTOMOTIVE: Extended Temp -40oC to 85oC See Foil 19 for additional detail

Added X1020D and X1021D

X1021 X1021 X1021 X1021

X1021D X1021D X1021D X1021D

X1021

X1021D √ √ √

√ √



40

IOTG – Mobile Processor Reference Table (M/H Series) September 2014




Socket Intel® AMTIntel®

TXT

Intel

VT-x

Intel

VT-d

4th Gneration Intel® Core™Processors (Mobile) - 22nm or Haswell Platform

BGA 2.4/1.7 3.4 6M 4/8 1600 √ 47W/37W GT2-4600 400-1000 3 PCIe Gen 3 √ √ √ √ √ AMT 9.01 √ √ √ SSE4.1 /4.2, AVX2.0

BGA 2.7 3.3 3M 2/4 1600 √ 37W GT2-4600 400-1000 3 PCIe Gen 3 √ √ √ √ √ AMT 9.01 √ √ √ SSE4.1 /4.2, AVX2.0

BGA 2.9 N/A 4 3M 2/4 1600 √ 37W GT2-4600 400-1000 3 PCIe Gen 3 √ √ √ √ √ AMT 9.0

1 √ √ √ SSE4.1 /4.2, AVX2.0



BGA 2.6 N/A 3M 2/4 1600 √ 37W GT2-4600 400-900 3 PCIe Gen 3 √ √ √ √ √ SSE4.1 /4.2, AVX2.0

BGA 2.4 N/A 3M 2/4 1600 √ 37W GT2-4600 400-900 3 PCIe Gen 3 √ √ √ √ SSE4.1 /4.2, AVX2.0

BGA 1.8 N/A 3M 2/4 1600 √ 25W GT2-4600 400-900 3 PCIe Gen 3 √ √ √ √ √ SSE4.1 /4.2, AVX2.0

BGA 1.6 N/A 3M 2/4 1600 √ 25W GT2-4600 400-900 3 PCIe Gen 3 √ √ √ √ SSE4.1 /4.2, AVX2.0

3rd Gneration Intel® Core™ i7 Processors (Mobile) - 22nm or Ivy Bridge Platform

i7-3610QE PGA 2.3 3.3 6M 4/8 1600 45W GT2-4000 650-1000 3 PCIe Gen 3 √ √ √ √ √ AMT 8.01 √ √ √ SSE4.1 /4.2

i7-3612QE BGA 2.1 3.1 6M 4/8 1600 √ 35W GT2-4000 650-1000 3 PCIe Gen 3 √ √ √ √ √ AMT 8.01 √ √ √ SSE4.1 /4.2

i7-3615QE BGA 2.3 3.3 6M 4/8 1600 √ 45W GT2-4000 650-1000 3 PCIe Gen 3 √ √ √ √ √ AMT 8.01 √ √ √ SSE4.1 /4.2

i7-3555LE BGA 2.5 3.2 4M 2/4 1600 √ 25W GT2-4000 550-1000 3 PCIe Gen 3 √ √ √ √ √ AMT 8.01 √ √ √ SSE4.1 /4.2


i5-3610ME PGA 2.7 3.3 3M 2/4 1600 35W GT2-4000 650-950 3 PCIe Gen 3 √ √ √ √ √ AMT 8.01 √ √ √ SSE4.1 /4.2

i5-3610ME BGA 2.7 3.3 3M 2/4 1600 √ 35W GT2-4000 650-1100 3 PCIe Gen 3 √ √ √ √ √ AMT 8.01 √ √ √ SSE4.1 /4.2


i3-3120ME PGA 2.4 N/A 3M 2/4 1600 35W GT2-4000 650-900 3 PCIe Gen 2 √ √ √ √ SSE4.1 /4.2

i3-3120ME BGA 2.4 N/A 3M 2/4 1600 √ 35W GT2-4000 650-900 3 PCIe Gen 2 √ √ √ √ SSE4.1 /4.2

Intel® Celeron® Processors (Mobile ) -22nm or Haswell Platform

1020E BGA 2.2 N/A 2M 2/2 1600 √ 37W HD Graphics 400-900 3 PCIe Gen 3 √ √ SSE4.1 /4.2

1020E BGA 1.5 N/A 2M 2/2 1600 √ 25W HD Graphics 400-900 3 PCIe Gen 3 √ √ SSE4.1 /4.2

Intel® Celeron® Processors (Mobile ) -22nm or Ivy Bridge Platform

1020E PGA 2.2 N/A 2M 2/2 1600 35W HD Graphics 650-1000 3 PCIe Gen 2 √ √ 64-bit

1020E BGA 2.2 N/A 2M 2/2 1600 √ 35W HD Graphics 650-1000 3 PCIe Gen 2 √ √ 64-bit

Note: IDA = Intel Dynamic Acceleration Technology now referred to as Turbo mode

1: Supported on Mobile Intel® QM77 (IVB) or QM87 (HSW) Express Chipsets2: Supported on Mobile Intel® QM67 Express Chipset3: Supports Intel® Intelligent Systems Framework capabilities4: Non-turbo SKU, targeted for 10yr Reliability

Cores/

Threads

Intel® Turbo

Boost

Technology

2.0 Max

Single Core

Turbo

Frequency

Processor

Number

Base

Freq

(GHz)

Last

Level

Cache

Instruction Set

Integrated

Graphics

Frequency

(Mhz)

ECC

SupportedTDP

GT Type

(GT1, GT1-

2000, GT2-

3000)

Intel®

HD

Boost

EISTIntel®

AES-NI

Intel®

AVX

Intel®

vProTM

Intel Technologies3

N/A

PCIe Version

Memory

Speed

Support

(DDR3)

Number of

Independe

nt

Displays

N/A

N/A

N/A

N/A

N/A

i7-4700EQ

i7-3555LE

i7-3612QE

i7-3615QE

i5-4400E

i5-4402E

i3-4100E

i3-4112E

2002E

i3-4102E

i7-2655LE

i5-3610ME

i5-2515E

i3-3120ME

i3-2310E

1020E

i7-3610QE

i7-3555LE

i7-3612QE

i7-3615QE

i5-4400E

i3-4100E

i3-4112E

2002E

2000E

i5-4422E

i3-4110E

i3-4102E

i5-4410E4



41

IOTG- Low Voltage Mobile Processor Reference Table (U Series and Atom) September

2014




Intel® Celeron®/Atom™ Processors (Bay Trail)

Instruction Set

Memory

Speed

Support

(DDR3)

Intel® AMTIntel®

TXT

Intel

VT-x

Intel

VT-d

4th Generation Intel® Core™ Processors - 22nm or Haswell Platform (U-Series)

BGA 1.7 3.30 4M 2/4 1600 N/A15W

(11.5W)GT3 - 5000 200-1000 3 PCIe Gen2

4 √ √ √ √ √2AMT 9.5

5 √ √ √ SSE4.1 /4.2, AVX 2.0

BGA 1.9 2.90 3M 2/4 1600 N/A15W

(11.5W)GT2- 4400 200-1100 3 PCIe Gen2

4 √ √ √ √ √2AMT 9.5

5 √ √ √ SSE4.1 /4.2, AVX 2.0

BGA 1.7 N/A 3M 2/4 1600 N/A 15W GT2- 4400 200-1000 3 PCIe Gen24 √ √ √ √ √ √ SSE4.1 /4.2, AVX 2.0

BGA 1.6 N/A 2M 2/2 1600 N/A 15W HD Graphics 200-1000 3 PCIe Gen24 √ √ √ SSE4.1 /4.2

3rd Generation Intel® Core™ i7 Processors (Mobile) - 22nm or Ivy Bridge Platform

i7-3517UE BGA 1.7 2.80 4M 2/4 1600 √ 17W GT2-4000 350-1000 3 PCIe Gen 3 √ √ √ √ √ AMT 8.01 √ √ √ SSE4.1 /4.2


i3-3217UE BGA 1.6 N/A 3M 2/4 1600 √ 17W GT2-4000 350-900 3 PCIe Gen 2 √ √ √ √ SSE4.1 /4.2


1047UE BGA 1.4 N/A 2M 2/2 1600 √ 17W HD Graphics 350-900 3 PCIe Gen 2 √ √ SSE4.1 /4.2

927UE BGA 1.5 N/A 1M 1/1 1600 √ 17W HD Graphics 350-900 3 NA √ √ SSE4.1 /4.2

BGA 1.83 2.16 2M 4/4 1333 N/A 7.5W HD Graphics 313-854 2 PCIe Gen 2 √ √ 64-bit

BGA 1.58 2.16 2M 2/2 1333 N/A 4.5W HD Graphics 313-750 2 PCIe Gen 2 √ √ 64-bit

BGA 1.91 N/A 2M 4/4 1333 √ 10W HD Graphics 542-792 2 PCIe Gen 2 √ √ 64-bit



BGA 1.33 N/A 1M 2/2 1066 √ 6W HD Graphics 533 2 PCIe Gen 2 √ √ 64-bit

BGA 1.46 NA 0.5M 1/1 1066 √ 5W HD Graphics 400 2 PCIe Gen 2 √ √ 64-bit

BGA 1.33 NA 1M 2/2 1066 √ 3W N/A N/A N/A PCIe Gen 2 √ √ 64-bit

Note: IDA = Intel Dynamic Acceleration Technology now referred to as Turbo mode

1: Supported on Mobile Intel® QM77 Express Chipset2: Supported on Mobile Intel® QM67 Express Chipset3: Supports Intel® Intelligent Systems Framework capabilities4: Note - PCIe on U-series only include lanes off the integrated PCH5: Intel® vPRO supported 5MB firmware available in Sept-Oct’13

N/A

Intel® Celeron® Processor -22nm or Bay Trail SoC Platform

PCIe VersionIntel

® AVX

Intel®

vProTM

N/A

N/A

N/A

Intel®

HD

Boost

EISTIntel®

AES-NI

Processor

Number

Intel® Turbo

Boost

Technology 2.0

Max Single Core

Turbo Frequency

(Ghz)

SocketCores/

Threads

ECC

Memory

Supported

Number of

Independ

Displays

Base

Freq

(GHz)

Last Level

Cache

TDP

(cTPD)

GT Type

(GT1, GT1-

2000, GT2-

3000)

Integrated

Graphics

Frequency

(Mhz)

Intel Technologies3

N/A

N/A

N/A

N/A

N/A

Intel® Atom® Processors -22nm or Bay Trail SoC Platform

N/A

N/A

i7-3517UE

i3-2340UEi3-3217UE

1047UE

927UE

E3815

i7-4650U

i5-4300U

2980U

i5-4300U

i3-4010U

N2930

E3845

E3827

E3826

E3825

N2807

E3805



42

IOTG Mobile M/H Series Chipset/Processor Compatibility Matrix September 2014







Cougar Point

Package Type

Mobile Intel®

HM65 Express

Chipset

Mobile Intel®

QM67

Express

Chipset

Mobile Intel®

HM76 Express

Chipset

Mobile Intel®

QM77 Express

Chipset

Intel® Core™ i7-

3610QE BGA V V

Intel® Core™ i7-

3610QE

Processor(SV)

BGA V V

Intel® Core™ i7-

3610QE

Processor(SV)

BGA V V

Intel® Core™ i7-

3610QE BGA V V

Intel® Core™ i7-

3610QE

Processor(SV)

PGA V V V V

Intel® Core™ i7-

3615QE

Processor(SV)

BGA V V V V

Intel® Core™ i7-

3612QE BGA V V V V

Intel® Core™ i7-

3555LE Processor(LV)BGA V V V V

Intel® Core™ i7-

2710QE Processor

(SV)

PGA V V V V

Intel® Core™ i7-

2715QE Processor

(SV)

BGA V V V V

Intel® Core™ i7-

2655LE Processor (LV)BGA V V V V

Intel® Core™ i5-

3610ME

Processor(SV)

PGA V V V V

Intel® Core™ i5-

3610ME BGA V V V V

Intel® Core™ i5-

2510E Processor (SV)PGA V V V V

Intel® Core™ i5-

2515E Processor (SV)BGA V V V V

Intel® Core™ i3-

3120ME

Processor(SV)

PGA V V V V

Intel® Core™ i3-

3120ME

Processor(SV)

BGA V V V V

Intel® Core™ i3-


Intel® Core™ i3-


Intel ® Celeron ™




Intel® Celeron® B810

Processor (SV)PGA V V V V

Intel® Celeron®

B810E Processor (SV)BGA V V V V

4th Generation Intel® Core™ i7 Processors (Mobile) - 22nm or Haswell Platform

3rd Generation Intel® Core™ i7 Processors (Mobile) - 22nm or Ivy Bridge Platform

2nd Generation Intel® Core™ i7 Processors (Mobile) - 32nm or Sandy Bridge Platform






Intel® Celeron® Processors (Mobile ) -32nm or Sandy Bridge Platform

i7-3612QE

i7-3555LE

i7-3615QE

i7-3610QE

i7-2710QE

i7-2715QE

i7-2655LE

i5-3610ME

i3-3120ME

1020E

i5-2510E

i5-2515E

i3-2330E

i3-2310E

B810

B810E

Intel® 7 Series Chipsets Intel® - 6 Series

Intel® HM65

Express

Intel® HM76Express

Intel® QM77

Express Intel® QM67

Express

Intel® 8 Series

Intel® QM87

Express Chipset

Intel® 8 Series Chipsets

Intel® HM86Express Chipset

i7-4700EQ

i5-4400E / 4402E

i3-4110E / 4112E

2000E / 2002E

i5-4422E

i3-4100E / 4102E

4th Gen Intel ® Core ™ Processors (Haswell-Refresh)



43

IOTG Mobile U Series Chipset/Processor Compatibility Matrix September 2014







Package Type

Mobile Intel®

HM65 Express

Chipset

Mobile Intel®

QM67 Express

Chipset

Mobile Intel®

HM76 Express

Chipset

Mobile Intel®

QM77 Express

Chipset

BGAIntegrated PCH

(w/ vPro FW)

BGAIntegrated PCH

(w/ vPro FW)

BGA Integrated PCH

BGA Integrated PCH

Intel® Core™ i7-

3517UE BGA V V V V

Intel® Core™ i7-

2610UE Processor BGA V V V V

3rd Gneration Intel® Core™ i3 Processors (Mobile) - 22nm or Ivy Bridge PlatformIntel® Core™ i3-

3217UE BGA V V V V

Intel® Core™ i3-










4th Generation Intel® Core™ Processors - 22nm or Haswell Platform (U-Series)

Intel® 7 Series Chipsets Intel® - 6 Series Chipsets



Intel® QM77Express Chipset

Intel® QM67Express Chipset

i7-3517UE

i7-2610UE

i3-2340UE

i3-3217UE

1047UE

927UE

Intel® 8 SeriesChipset

i7-4650U

2980U

i3-4010U

i5-4300U


Intel® Quark™ SoC Roadmap Update – NDA July 2014



45

Intel® Quark™ SoC Roadmap Changes

• Intel® Quark™ SoC X1000 continues to ramp with OEMs coming online for Moon Island gateways and ODMs filling the channel today

• Dublin Bay is removed from the roadmap due to overwhelming Liffy Island feature set demand.

• Liffy Island will be the focus of development in the next year

• The New “Seal Beach” will add 3D Graphics per customer feedback in 2016

45 Intel Confidential



46

2015 2014

X1000 – Baseline Sku

Quark SOC

General Embedded

2017

Intel® Quark™ General IoT

Intel® Quark™ 5 Qtr SoC Roadmap for IoT

2016

Power on

PRQ

Liffy Island

LMT3 core, GbE w AVB, Secure Key storage

Transportation Focus

Intel® Quark™ Industrial/ Transportation

Current 32nm SoCs in production and/or development

Seal Beach

LMT3+SSE2, Display, Crypto Acceleration

General embedded

In planning In Development

In Development

In Development

In Production

In Production

In Production

In Planning

In Planning

In Planning





47

- Processor UnCore - DDR3 memory controller

- Up to 2GB @ 800MTs - ECC-On-Chip Option

- Embedded 512KB SRAM - Legacy Block

- PC compatible IO, APICs,RTC, etc. - 20MHz Legacy SPI for boot code

- Low cost 5-pin JTAG Port - Industry Standard I/O Hardware

- 2 - x1 PCIe Gen 2* - 2 - 10/100Mb Ethernet MACs - 2 - USB2 host ports (EHCI, OHCI) - 2 - HS UART controller - 2 – 25MHz SPI ports for peripherals - 1 – USB2 HS Device port - 1 - SD/SDIO/eMMC interface - 1 – I2C/GPIO Host controller - 16 - GPIOs w prog interrupts

- Industry Standard Software Support - Standard Compiler Support - Pentium ISA Compatibility (.586) - Runs unmodified Linux Kernels (v3.8+) - Yocto based distribution - Validated w WR IDP 2.0 (Linux & VxWorks) - Open Source UEFI EDK II - GRUB boot loader support - Open OCD Debugging support - Compliant with PCIe, USB, ACPI standards

- Thermals - TDP = 1.9W Extended temp (-40 to +85 C) - TDP = 2.2W Commercial Temp: 0 – 70°C - Programmable Thermal sensor

- Electricals: - Single xtal for internal/external clocks - Enabled Single std external VR solution

Intel® Quark™ SoC X1000 – For Sale Today

*PCIe Gen1 speed to save power

- Physical - Package size 15x15mm - 393 Pin, FC BGA bare die - 0.593 Ball Pitch - Enables FR4 SFF Board

- Security - Secure Boot Technology Option - Supervisory Mode Execution Protection - Secure Recovery for UEFI FW - Secure Remote Upgrade w/ WR IDP 2.0

- Intel® Quark™ Processor Core - Single Quark CPU Core, Single Thread - 32 bit, x86, @ 400MHz - 16KB L1 - 1.25 DMIPs/MHz

Power on WW21’13, PRQ WW13’14




48

- Processor UnCore - 2GB DDR3/DDR3L @ 1066MTs

- ECC-On-Chip - 1MB Embedded SRAM - Legacy Block

- PC compatible IO ports, APICs, etc. - 50MHz Quad Legacy SPI for boot code

- Low cost 5-pin JTAG Port

- Industry Standard Software Support - Standard Compiler Support - Pentium ISA Compatibility (.586) - Runs unmodified Linux Kernels - Yocto based distribution - Validated w Moon Island and VxWorks - Open Source UEFI EDK II - GRUB boot loader support - Open OCD Debugging support - Compliant with PCIe, USB, ACPI standards

- Electricals: - Single xtal for internal/external clocks - Enabled Single std external VR solution

Intel® Quark™ “Liffy Island” (LFI) SoC – The Right Stuff

*PCIe Gen 2 features, Gen1 speed to save power

- Physical - NEW Package - FC BGA bare die - 0.593 Ball Pitch - Enables FR4 SFF Board

- Security - Secure Boot Technology - Supervisory Mode Execution Protection - Secure Recovery for UEFI FW - Secure Remote Upgrade w/ WR IDP - Custom Keys (Field Programmable Fuses) - Secure Attestation updates

- Intel® Quark™ Processor Core - Single Quark CPU Core, Single Thread - 32 bit, 533MHz - 64KB L1 with ECC - ~1.5 DMIPs/MHz

- Thermals - TDP = ~2W with LP skus available <1.5W - Extended temp -40 to +85°C - Programmable Thermal sensor

Power on WW18’15, PRQ WW44’15

- Industry Standard I/O Hardware - 2 - x1 PCIe* with Root and End Point - 2 – GbE w AVB Switch option - 2 - USB2 host ports (EHCI, OHCI) - 4 - HS UART controller - 4 – 25 MHz SPI ports for peripherals - 1 – USB2 HS Device port - 1 - SD/SDIO/eMMC interface - 3 – I2C Host controller - 1 - 8 Channel ADC - 2 – CAN bus ports - 1 – I2S support for Audio - 40+ - GPIOs w prog interrupts - Up to 24 PWM




49

Liffy Island for Transportation & Industrial Applications • Intel® Quark™ 1C/1T, 533MHz, 64KB L1 Cache w ECC

•2GB of DDR3 w ECC

•1MB of Embedded SDRAM

•Quad Pump 50MHz SPI

+50%

DMIPS

•Moon Island Ready with Wind River Linux support

•Wind River VxWorks 7.0

•Other Linux distributions (Debian)

Multiple OS Support

•Field Programmable fuses,,

•One Time Programmable (OTP) Unique ID set by customer SW Licenses, Anti-Rollback, Anti piracy, etc.

•OTP Per-unit secure boot keys, Physical Tamper resistance

•On chip private key storage For secure attestation

Customized Security

•More UART, SPI, I2C

•PCIe End Point capable

•Dual GbE AVB switch

• Integrated CAN, ADC, PWM, i2S

Up to $10 BOM Savings with Integrated I/O

•Offset additional IO/CPU power to keep <2W

Dynamic Clock Gating and Low Power SKUs




50

- Processor UnCore - DDR3 memory controller - Up to 2GB @ 800MTs / 1066MTs

- ECC-On-Chip Option

- Embedded 512KB SRAM - Legacy Block

- PC compatible IO ports, APICs, etc. - 20MHz Legacy SPI for boot code

- Low cost 5-pin JTAG Port - Industry Standard I/O Hardware

- 2 - SD/SDIO/eMMC interface * - 1 – 10/100 Ethernet ** - 2 – CAN (optional) - 2 - USB2 host ports (EHCI, OHCI) - 4 - HS UART controller - 4 – 25 MHz SPI ports for peripherals - 1 – USB2 HS Device port - 3 – I2C controller - 1 - 8 Channel ADC - 1 – I2S support for Audio - 40+ - GPIOs w prog interrupts - Up to 8 PWM

- Industry Standard Software Support - Standard Compiler Support - Pentium ISA plus (SSE2, FXSAVE, CMOV) - Linux OS plus Moon Island Gateway and Devices - VxWorks support - Windows OS Support - Open Source UEFI EDK II - GRUB boot loader support - Open OCD Debugging support - Compliant with PCIe, USB, ACPI standards

- Thermals - TDP = ~2W - Extended temp -40 to +85°C - Programmable Thermal sensor

Intel® Quark™ “Seal Beach” SoC – Feedback welcome

- Physical - NEW Package - FC BGA bare die - 0.593 Ball Pitch - Enables FR4 SFF Board

- Security - Secure Boot Technology Option (X1020) - Supervisory Mode Execution Protection - Secure Recovery for UEFI FW - Secure Remote Upgrade w/ WR IDP - Custom Keys (Field Programmable Fuses) - Secure Attestation updates - HW Accelerated Crypto

- Intel® Quark™ Processor Core - Single Core, Single Thread at 533MHz

- 64KB L1 with ECC - 2.0 DMIPs/MHz

Power on Q4’15, PRQ Q1’16

- Graphics and Display - Display Controller w 2D/3D Gfx Engine - MIPI DSI Interface - LVDS interface (24bpps) - MPEG2 Video Decode. - Touch Controller TBD

- Differentiation from Liffy Island

• - No PCIe Root or End Point support

** - No GbE or AVB switch




51

Seal Beach (SLB) is for Broad Usage in IoT




52

Design In recommendations

• Intel® Quark™ SoC X1000 – 2014 – Fast Time to Market

• Ready for market and shipping for headless applications

• Good for Moon Island Gateways and bolt on!

• Intel® Quark™ SoC X1000 - 2015 1H

• Design for BOM sensitive telematics applications

• Moon Island SW based Devices design-in – ReUse SW acceleration w validated software stack fpr non gateways

• Liffy Island – 2015 2H

A fantastic IoT Gateway solution!

Good for typical long lead design in of Deeply embedded applications.

Potential IVI companion chip to Broxton solution for Transportation Solution Division

Great for Indu w GbE capabilities and hardware switch.

• Seal Beach – 2016

• A fantastic IoT Gateway solution!

• SSE2 instructions for additional performance, features, and OS support

• Adding Graphics capabilities for general market with right low-cost interfaces to connect to panels and touch screens



53

IOTG WS/DT Technologies & Solutions

Package type Memory Graphics Media Microsoft* Windows* Linux Boot Loader Firmware

HW

Acc

ele

rate

d

WIN

7

LG

A 1

15

5

Pla

tfo

rms

OG

L 1

.5

OG

L 3

.2

OG

L 3

.1

OC

L 1

.1

Subject to change without notification * External names or brands ** Internal Code names popularly used for technical communication

DD

R3

-13

33

DX

-11

.1

DX

-11

D

X-1

0

WIN

8

Ke

rne

l 3.0

Shark Bay/Denlow DT/WS** Platform

Maho Bay/Carlow DT/WS** Platform

Sugar Bay/Bromolow DT/WS** Platform

XP

32

GB

(M

ax

)

ME

9

.5 /

A

MT

9

ME

8

.0 /

A

MT

8

ME

7

.0 /

A

MT

7

BLDK = Intel® Boot Loader Development Kit

FSP = Intel® Firmware Support Package

BL = CRB Reference Boot Loader from Intel

Coreboot = Ecosystem supplied open-source boot loader

EC

C (1

)

OC

L 1

.2

LG

A 1

15

0

DD

R3

/L-1

60

0

(1) ECC available on limited SKUs . Requires pairing ECC capable SKU with C2XX series Server Chipsets to enable ECC.

DD

R3

/L-@

1.5

v 1

60

0

WIN

8.1



54

IOTG Mobile (M/H Series) Technologies & Solutions

Package type Memory Graphics Media Microsoft* Windows* Linux Boot Loader Firmware

HW

Acc

ele

rate

d

WIN

7

FC

PG

A 9

88

Pla

tfo

rms

OG

L 1

.5

OG

L 3

.2

OG

L 3

.1

OC

L 1

.1


DD

R3

-13

33

DX

-11

.1

DX

-11

D

X-1

0

WIN

8

Ke

rne

l 3.0

Shark Bay M/H Series** Platform

Chief River** Platform

Huron RIver** Platform

XP

16

GB

(M

ax

)

FS

P +

Co

reb

oo

t ME

9

.5 /

A

MT

9

ME

8

.0 /

A

MT

8

ME

7

.0 /

A

MT

7





EC

C (1

)

OC

L 1

.2

BG

A T

BD

DD

R3

/L-1

60

0

(1) ECC available on BGA SKUs only. Requires pairing ECC capable SKU with QM series chipsets to enable ECC. QC PGA has 32 GB Max. All other Mobile SKUs (BGA and PGA) have 16 GB Max.

DD

R3

/L-@

1.5

v 1

60

0

FC

BG

A 1

02

3

16

GB

(2)

(M

ax

)



55

IOTG Mobile (U Series and Atom) Technologies & Solutions

Package type

Memory Graphics Media Microsoft* Windows* Linux Android Boot Loader

Firmware

DD

R2

DD

R3

DX

-9

OG

L 1

.5

HW

Acc

ele

rate

d

HW

Acc

el.

XP

WIN

7

Ke

rne

l 2.6

FC

BG

A

Ty

pe

3 B

P

Pla

tfo

rms

FC

BG

A

Ty

pe

4 B

P

OG

L 3

.0

OG

L E

S 2

.0

OG

L 2

.1

OG

L 1

.5

OG

L E

S

1.1

/2.0

OG

L 3

.2

OG

L 3

.1

OC

L 1

.1

Ex

t T

em

p


DX

-11

Ex

t T

em

p

OG

L 3

.x

OG

L E

S

1.1

/2.0

DD

R3

DX

-11

.1

DX

-11

D

X-1

0 WIN

8

Ke

rne

l 3.x

Cedar Trail** Platform

Luna Pier** Platform

Shark Bay ULT ** Platform


Huron River** Platform

Queens Bay** Platform

Bay Trail** Platform

XP

2G

B

4G

B

8G

B

ME

9

.5 /

A

MT

9

ME

8

.0 /

A

MT

8

ME

7

.0 /

A

MT

7





Win

CE

6

WE

C 7

W

EC

7

EC

C

OC

L 1

.2

FS

P +

Co

reb

oo

t F

SP

+ B

L

BL

DK

B

LD

K

BL

BL

DK

Ke

rne

l 4

.2 J

B

4.4

Kit

Ka

t



56

Features & Capabilities Supported Operating Systems

Pla

tfo

rms



Shark Bay** Platform





Microsoft* Linux* Android RTOS

WinCE* 6 WEC*7 XP* / e Win7 / e Win8/ e Win8.1 / WEI 8.1

Yocto based Kernel.org 4.2 Jelly Bean 4.4 Kit Kat

VxWorks* QNX*

Q1 ’15 Alpha Q3 ‘15 Gold

H-Series H-Series H-Series

H-Series

U-Series U-Series U-Series U-Series

Q3 ’14 Alpha Q1 ‘15 Gold

H-Series H-Series H-Series H-Series H-Series H-Series

U-Series U-Series U-Series U-Series U-Series U-Series

Jul’14 Gold Jul’14 Gold Feb’14 Gold Aug ’14 Gold 4.4 KK

Launched

Planning (Pre-POR)

Not Plan of Record


In Development (POR)

Updated + added Broadwell

Broadwell** Platform



57

Features & Capabilities Graphics Driver

HW Acceleration DISPLAY

2D GFX 3D GFX MEDIA DEC MEDIA ENC MIPI-DSI DP/eDP HDMI VGA LVDS SDVO

Thru 3D GFX ‡ SW acceleration thru

SSE

SW acceleration thru SSE



OS Dependent

Support Expectations • 7 years of docs and configuration assistance only • 2 years of Active feature adds and bug fixes • 3rd year of Critical feature adds and bug fixes

‡ Not supported on Windows XP



Haswell ULT ** Platform





Pla

tfo

rms


Launched (Post SRA)

Planning (Pre-POPL3)

Not Plan of Record

In Development (Post-POPL3)

Updated



58

Feature Windows* 8/ 7 /e Windows* XP / e

Linux* OTC

Graphics

DirectX* v10.1 / v11 / x11.1 (new for HSW) No (DX9.0c) No

OpenGL v3.0 - v4.0 V 3.1 TBD

OpenCL v1.2 (new for HSW) No No

GLSL v1.3 / v1.4 /1.5 (new for HSW) V1.4 TBD

Stereoscopic 3D Yes (HDMI 1.4)

w/Stereoscopic 3D for Blu-ray

No TBD

Media

Intel® Media SDK support Yes No No

HW Accelerated Decode Yes (MPEG2, H.264/AVC, VC-1,

H.264/SVC (partial), H.264/MVC, MJPEG)

Yes (MPEG2) Yes (MPEG2, H.264/AVC, VC-1)

HW Accelerated Encode Yes - MPEG2 (partial), H.264,

H.264/SVC (partial)

No Yes (H.264, MPEG2)

Intel® Quick Sync Video for media processing Yes No Yes

Gamut Color Conversion w/ compression & expansion

Yes (new for HSW) No TBD

Spatial Noise Reduction Yes (new for HSW) No TBD

Video Stabilization Yes (new for HSW) No TBD

Frame Rate Conversion w/ 24p frame interpolation Yes (new for HSW) No TBD

12bcp Precision Processing Pipeline Yes (new for HSW) No TBD

Sharpness-adaptive Scaling Yes (new for HSW) No TBD

Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. Copyright © 2013, Intel Corporation. All rights reserved.

4th Generation Intel® Core Processor Graphics Driver Features by OS



59

4th Generation Core™ Graphics Driver Features by OS (cont)

Feature Windows* 8/ 7 /e Windows* XP / e Linux* OTC

Display

Integrated LVDS Port No No No

Dual LVDS (DPLVDS + DP/eDPLVDS converters)

Yes (requires additional h/w) Yes (requires additional h/w) Yes (requires additional h/w)

Hybrid Multi Monitor (2 displays on processor graphics + 1 display on discrete graphics)

Yes Yes

Yes

3 Displays support Yes (improved for HSW) No TBD

4k Collage Display support Yes (improved for HSW) No No

SDVO to DVI/CRT/LVDS support Yes No – SDVO not supported Yes

Intel® Wireless Display (Long Life support not available for this feature)

Yes No No

Power

Intel® Turbo Boost Technology support Yes Yes Yes

Intel® Display Power Saving Technology support (Intel® DPST)– mobile only

Yes Yes No

eDP Panel Self Refresh (PSR) Yes (new for HSW) No TBD

Low Power Single Pipe (LPSP) Yes (new for HSW) No TBD

Display Refresh Rate Switching (40Hz up to 120Hz on eDP)

Yes (new for HSW) No TBD

Platform Noise Mitigation (adaptive clocking) Yes (new for HSW) No TBD

Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. Copyright © 2013, Intel Corporation. All rights reserved.



60

3rd Generation Core™ Graphics, Media, Display Features Feature Windows* 7 /e Windows* XP / e

WEPOS 2009 Linux* OTC

Graphics

DirectX v10.1 / v11 (new for IVB) No No

OpenGL v3.0 / v3.x (new for IVB) v3.0 TBD

OpenCL v1.1 (new for IVB) No No

GLSL v1.3 / v1.4 (new for IVB) v1.3 / v1.4 (new for IVB) TBD



No TBD

Media

Intel® Media SDK support Yes No No

HW Accelerated Decode Yes (MPEG2, H.264/AVC, VC-1) Yes (MPEG2) Yes (MPEG2, H.264/AVC, VC-1)

HW Accelerated Encode Yes (H.264, MPEG2) No Yes (H.264, MPEG2)

Intel® Quick Sync Video for media processing Yes No Yes

Display

Dual LVDS (integrated LVDS +SDVO –LVDS)

Yes Yes Yes


Yes Yes

Yes

3 Displays support Yes (new for IVB) No TBD

4k Collage Display support Yes (new for IVB) No No

SDVO to DVI/CRT/LVDS support Yes Yes TBD

Intel® Wireless Display (Long Life support not available for this feature)

Yes No No

Power

Intel® Turbo Boost Technology support Yes Yes Yes


Yes Yes No




61

2nd Generation Core™ Graphics, Media, Display Features

Feature Windows* 7 /e Windows* XP / e WEPOS 2009

Linux* OTC

Graphics

DirectX v10.1 No No

OpenGL v2.1/ v2.2/ v3.0 v2.1/ v2.2/ v3.0 v2.1

OpenGL ES No No V2.0

OpenCL No No No

GLSL v1.3 v1.3 TBD



No TBD

Media

VA-API No No Yes

PAVP-API Yes No No

DXVA API v2.0 No No

HW Accelerated Decode MPEG2 , H.264, VC-1 MPEG2 MPEG2 , H.264, VC-1

HW Accelerated Decode supported in all rotated modes

Yes (MPEG2 , H.264, VC-1) No Yes (MPEG2 , H.264, VC-1)

Flash 10.1 decode support Yes (H.264) No Yes (H.264)

HW Accelerated Encode Yes (MPEG2, H.264) No Yes (MPEG2, ?H.264?)

Accelerated Transcode Yes No TBD

Skin Tone Enhancement Total Color Control

Adaptive Contrast Enhancement (New Post Processing)

Yes No No

De-interlacing Render to text

Scaling (New Post Processing)

Yes

Yes

Yes




62

2nd Generation Core™ Display Features

Feature Windows* 7 /e Windows* XP / e WEPOS 2009

Linux* OTC

Display

Dual LVDS Yes Yes Yes


Yes ( 4 concurrent /independent) Yes ( 4 concurrent /independent)

Yes ( 4 concurrent /independent)

Hotplug support Yes Yes Yes

EDID-less displays support Yes Yes Yes

DisplayID support Yes Yes TBD

Intel® Wireless Display (Long Life support not available for this feature,

Mobile only)

Yes No No

Support for external digital displays Yes (DVI, HDMI, DP) Yes (DVI, HDMI, DP) Yes (DVI, HDMI, DP)

Power

Intel® Turbo Boost Technology support (Intel® Dynamic Power Performance Management )

Yes (DPPM v5.0) Yes (DPPM v5.0) Yes (DPPM v5.0)


Yes Yes No




63

2nd Generation Core™ - Technology Features Platform Feature Windows* 1 Linux* OTC VxWorks* RTOS3

Base feature/Preformance

Intel® Hyper-Threading Technology Yes Yes Yes Yes

Intel® Advanced Vector Extensions (Intel ® AVX)2 Yes Yes Yes Yes

Chipset Information/Patches Yes Yes Yes Yes

Manageability

Intel® Active Management Technology 7.0 Yes Yes No No

PC-Initiated Secure Connection over LAN Yes Yes No No

Security & Virtualization

AES-NI Yes Yes Yes Yes

PAVP v2.02 Yes No No No

Intel® Virtualization Technology (Intel® VT) for Directed I/O (Intel® VT-d), Intel® Virtualization Technology (Intel® VT) for IA-32, Intel® 64 and Intel®

Architecture (Intel® VT-x)

Yes Yes Yes Yes

Intel® Trusted Execution Technology (Intel® TXT) Yes Yes Yes Yes

Firmware

5MB (Fully Featured PCH) Yes Yes Yes Yes

I1.5MB (Value PCH) Yes Yes Yes Yes

Power Management

Integrated Power Sharing support Yes No No No

Dynamic Power Performance Management (Camarillo) Yes No No No

Intel Turbo Boost Technology Yes Yes No No

1 Supported Operating Systems include Windows 7, WES 7, Windows XP, WES 2009, WE POSReady. 2 Windows 7 and WES 7 only 3 RTOS Vendors: Greenhill, LynuxWorks, QNX, Tenasys. Please contact individual vendor for release details.



64

2nd Generation Core™ - Technology Features

Platform Feature Windows* 1 Linux* OTC VxWorks* RTOS3

Networking

Wi-Fi (Mobile Only) Yes Yes Yes Yes

LAN (Lewisville) Yes Yes Yes Yes

IPv6 Support Yes Yes Yes Yes

IO

SATA 2 Yes Yes Yes Yes

SATA 3 Yes Yes Yes Yes

USB 2 Yes Yes Yes Yes

RAID (Rapid Storage Technology) Yes Yes No No

Tools

Integrated Performance Primitives Yes Yes

Intel Cluster Toolkit Compiler Edition 3.2 (ICC) Yes Yes

Intel Cluster Toolkit 3.2 Yes Yes

Intel Trace Analyzer and Collector 7.2 Yes Yes

Intel MPI Library 3.2 Yes Yes

Math Kernel Library Yes Yes

Vtune Performance Analyzer Yes Yes

Threading Building Blocks 2.2 Yes Yes

1 Supported Operating Systems include Windows 7, WES 7, Windows XP, WES 2009, WE POSReady. 2 RTOS Vendors: Greenhill, LynuxWorks, QNX, Tenasys. Please contact individual vendor for release details.

For VxWorks and RTOS vendors,

please contact the supporting OS vendor

for tool support.



65

Bay Trail Graphics, Media, Display Features


Feature Win8 Win7/ WES7 WEC7 Linux†

(Fedora 18 Remix/ Yocto)

Linux∆

(Tizen)

Android 4.2 Jelly Bean (32-

bit)

Android 4.4 Kit Kat

(64-bit)

Max Display Resolution HDMI/ DVI (1920x1080), DP1.1a (2560x1600), eDP (2560x1600), VGA (2560x1600) HDMI (1920x1200), eDP (2560x1600)

Dual Independent Display Yes

2D HW acceleration DirectDraw* X Server Wayland Compositor OpenGLRenderer

3D HW acceleration OGL4.0, DirectX 11.1/10/9 OGL4.0, DirectX 11.1/10/9 OGLES 2.0 OGL3.2/OGLES2.0 OGL3.2/OGLES2.0 OGL ES 1.1/OGL ES 2.0 OGLES 1.1/OGLES

2.0/OGLES 3.0

HW Media Acceleration DXVA 2 DirectShow VAAPI VAAPI OpenMax OpenMax

HW Video Decode H.264, MPEG2, VC1, VP8 H.264, MPEG2, VC1 H.264, MPEG2, VC1

VP8¥

H.264, MPEG2, VC1

VP8¥

H.264, H263, VC1/WMV9,

VP8, MPEG4-part2 H.264, VC1

HW Video Encode H.264, MPEG2 H.264, MPEG2 N.A. H.264, MPEG2 H.264, MPEG2 H.264 H.264

Blu-ray* V 2.0 N.A. N.A. N.A. N.A. N.A. N.A.

Display Interfaces # HDMI 1.4a; DP 1.1a, eDP 1.3; VGA HDMI 1.4a; eDP 1.3

Media players PowerDVD*

Windows* Media Player CEPlayer GStreamer* - VAAPI GStreamer* - VAAPI Gallery Gallery

Content Protection PAVP HDCP None None None Widevine L1 Widevine L1

# Supported spec dependent on OS † Linux Kernel version 3.8.0, X Server: 1.13 ∆ Linux Kernel version 3.10.0, Wayland: 1.2.1 ¥ Later than GOLD availability



66

Bay Trail IO Features


Platform Feature

Interface Win8/WES8 Win 7/WES 7 WEC7 Tizen3

I SKUs

Linux (Fedora 18/Yocto) Android J 4.2 Android K 4.4

M/D SKUs I SKUs M/D SKUs I SKUs M/D SKUs I SKUs M/D SKUs I SKUs M/D/I M/D/I

I/O

SATA √ √ √ √ √ √ √ √ √ √ I

√

USB 3.0 (xHCI) driver

Host Mode √ √ √ √ √ √ √ √ √ √ √

Device Mode † √ √ X X X X TBD √ √ X X

USB 2.0 (xHCI/eHCI) driver √ √ √ √ √ √ √ √ √ √ √

ULPI † √ √ X X X X TBD √ √ X √

Storage eMMC X √2 X TBD X √ √ X √ X X

SD X √2 X TBD X √ √ X √ √ √

PCIE √ √ √ √ √ √ √ √ √ √ √

SIO: HSUART (1,2) X √2 X √ X √ √ X √ X X

SIO: SPI X √2 X √ X √ √ X √ X X

SIO: I2C (0-6) X √2 X √ X √ √ X √ X X

SIO: PWM X X X X X X √ X √ X X

SPI √ √ √ √ √ √ √ √ √ √ √

SMBUS Chipset INF Chipset INF Chipset INF Chipset INF X X √ X √ X X

Intel Legacy Block (iLB)

RTC √ √ √ √ √ √ √ √ √ √ √

GPIO √ √ √ √ √ √ √ √ √ √ √

LPC √ √ √ √ √ √ √ √ √ √ √

Camera – GPIOs √ √ √ √ √ √ √ √ √ √ √

LPE Audio X X X X X X √ X √ X X

PMC √ √ √ √ √ √ √ √ √ √ √

MIPI-CSI (0,1,2) ‡ X X X X X X √ X √ X X

NIC X X X X X X X X X X X

Notes: • † Under Planning, Available post-SRA, Refer to USB Device Mode Implementation • ‡ Under planning, Available post-SRA, Refer to MIPI CSI Implementation

Notes 2: IOTG creates driver 3: Targeted for selected IVI customers only



67

Graphics, Media, Display Features Intel® Atom™ N2000 and D2000 (Cedar-Trail** Platform)

Feature Windows* 7 /e Windows* XP / e

Windows* Embedded Compact 7

Linux* Yocto/Timesys Fedora Remix

Graphics

Driver Software name/version GMA 3600/MR2 1086 EMGD/1.15 EMGD/1.15 Linux PVR Graphics/1.0.3

DirectX v9.0 v9.0 (no fixed function) No No

OpenGL v3.0 No No No

OpenGL ES No No No v2.0 + HTML5/WebGL

2D Acceleration Yes (DirectDraw) Yes (DirectDraw) No EXA and XRandR

GLSL No No No TBD

Stereoscopic 3D No No No No

Media

Intel® Media SDK support No No No No

VA-APIV No No No Yes

DXVA-API v2.0 No No No

HW Accelerated Decode Yes (MPEG2, H.264, VC-1) SW-only SW-only Yes (MPEG2, H.264)

HW Accelerated Encode No No No No

Blu-ray support v2.0 No No No

Intel® Quick Sync Video for media processing No No No No

Display

Dual Display Support (two of LVDS + VGA + HDMI + DP/eDP)

Yes Yes Yes Yes


No No

No No

Chrontel* CH7511support Yes Yes Yes Yes

Intel® Wireless Display (Long Life support not available for this feature, Mobile only)

No No No No




68

Graphics, Media, Display Features Intel® Atom™ E6xx (Queens Bay** Platform)

Feature Windows* 7 /e Windows* XP / e

Windows* Embedded Compact 7

Linux* MeeGo*/Fedora*

Graphics

Driver Software name/version EMGD/1.16 EMGD/1.16 EMGD/1.16 EMGD/1.16

DirectX v9.0 v9.0 No No

OpenGL v2.0 v2.0 v2.0 v2.1

OpenGL ES No v1.1/2.0 v1.1/v2.0 v1.1/v2.0 + OpenVG1.1

2D Acceleration Yes (DirectDraw) Yes (DirectDraw) Yes (GDI) EXA and XRandR

GLSL v1.2 v1.2 v1.2 V1.2

Stereoscopic 3D No No No No

Media

Intel® Media SDK support v2.0 No No Yes

VA-APIV No No No Yes

DXVA-API v2.0 v1.0 Directshow filters No

HW Accelerated Decode Yes (MPEG2, H.264 AVC, VC-1,

WMV9)

Yes (MPEG2, H.264 AVC, VC-1) Yes (MPEG2, MPEG4, H.264) Yes (MPEG2, MPEG4, H.264, VC-1)

HW Accelerated Encode Yes (H.264) No No Yes (MPEG4/H.264)

Blu-ray support No No No No

Intel® Quick Sync Video for media processing No No No No

Display

Dual Display Support (LVDS + SDVO)

Yes Yes Yes Yes

Multi-GPU , Multi-Monitor (1 displays on integrated Gfx+ 1 display on discrete Gfx)

Yes Yes No No

Chrontel* CH7307, CH7308, CH7315, CH7317B, CH7319, CH7320, CH7022, CH7036 support

Yes Yes Yes Yes

Subject to change without notification

* External names or brands

** Internal Code names popularly used for technical communication



69

Latest Manageability Feature Summary

Proactive Platform Hardening

Partial Firmware Update

ME Firmware rollback

Host Based Configuration (HBC)

KVM 3 Screen Redirection

PC Alarm Clock Enhancement

IPv6 Support

Intel® Core™ with vPro™

AMT 6.0 (2010)

2nd Gen Intel® Core™ with vPro™

AMT 7.0 (2011)

3rd Gen Intel® Core™ with vPro™

AMT 8.0 (2012)

4th Gen Intel® Core™ with vPro™

AMT 9.0 (2013)

AMT Graceful Shutdown KVM Enhancements



70

Feature Description DASH STD MGBLY

Intel AMT Technology

6.0 7.0 8.0 9.0 1.0 1.1

Hardware Inventory

Allows IT to remotely collect information about the hardware on the network, such as manufacturer and model information for components. This information is automatically updated each time the system goes through POST.

● ● ● ● ● ● ●

Software Inventory

Allows IT to remotely collect information about each system’s software, such as software version information, .DAT file information, pointers to databases, and other data stored by third-party vendors in the non-volatile memory provided by Intel vPro technology.

● ● ● ● ● ● ●

Remote Power

Control Remotely power-on or off a system even when the operating system is hung or inoperable. ● ● ● ● ● ● ●

Remote

Configuration

Configure systems to be able to use Intel® AMT remotely. The Intel® Setup and Configuration Service (Intel® SCS) describes options. ● ● ● ● ● ● ●

Remote Diagnosis

and Repair

Tools that aide technicians to diagnose, maintain and repair remotely, in some cases, when the operating system is not running. Depending on availability tools may include Serial Over LAN (SOL) , IDE Redirect (IDE-R) and HW-based KVM to remotely control.

● ● ● ● ● ●

Remote Encryption

Management Remotely unlock and update systems protected with full-drive data encryption. ● ● ● ● ●

Network Filters A set of configurable hardware filters that inspect network traffic and that block traffic that can do harm to other PCs on the network. ● ● ● ● ●

Endpoint Access

Control

A feature that enhances network security by validating a systems compliance with an organization’s policies. The feature can be configured to restrict network access to systems that do not comply. ● ● ● ● ●

Agent Presence A feature that continuously monitors systems to ensure that the correct software agents are present and running. The absence of a regular confirmation of the presence of required agents will trigger an alert. ● ● ● ● ●

Manageability Features and Details



71

Feature Description DASH STD MGBLY


6.0 7.0 8.0 9.0 1.0 1.1

HW-based KVM Keyboard Video Mouse (KVM) allows technicians to see and control remote PCs even if the operating system is unavailable. ● ● ● ●

Remote Access over WLAN

Remotely manage PCs in an enterprise wireless network ● ● ● ●

Fast Call for Help

Fast Call for Help, also known as Client Initiated Remote Access (CIRA) provides a secure VPN-like method for a system to connect to a management console server for maintenance or repair. ● ● ● ●

Access Monitor Logs

A feature that provides historical information about the PC. Each PC can securely store a secure log of actions executed by IT personnel. This is a power tool for IT audit and monitor unauthorized access to PCs within a network

● ● ● ●

Wireless Management in Sleep Mode

Power up wireless notebook systems, when plugged into AC power, to collect asset inventory information, remotely diagnose and repair problems, and ensure agent presence ● ● ● ●

Serial Over LAN A hardware-based solution that allows IT to remotely control text-based environments in a pre-boot OS state, even if the PC's operating system is unavailable. ● ● ● ●

Remote Boot Redirection

Also known as Integrated Device Electronics-Redirect (IDE-R). Remotely boot the system from an alternative hard drive even if the alternative drive is in another location. ● ● ● ●

PC Alarm Clock

Remotely schedule systems to wake up and perform tasks autonomously without need for a network connection at the time of the wake. The primary usage model is to schedule client systems to power up and perform maintenance tasks during downtime hours.

● ● ● ●




72

Feature Description DASH STD

MGBLY


6.0 7.0 8.0 9.0 1.0 1.1

Host Based Configuration

(HBC)

Allows local software to configure the system, making it much easier to activate systems to use AMT. The software can be sent to the remote system and then run locally with a script. (a.k.a. Intel® SCS 7.0)

● ● ●

IPv6 Support for Internet Protocol Version 6 for increased speed and compatibility with latest network requirements. ● ● ●

ME Firmware Rollback ● ● ●

Proactive Platform Hardening

Advanced protection for ME internal working data through use of real-time encryption. Also proactively reduces risk from one of the most common attack vectors, the buffer overflow, by checking for stack violations in the ME execution environment.

● ●

KVM 3 Screen Redirection

Supports 3 display configurations. Switch between two graphical modes – landscape and portrait. ● ●

Partial Firmware Update

Dynamically loading partial firmware code into a dedicated partition. WLAN uCode – keep one instance in flash instead of 4-6 instance. Secure Output Localization Language – keep one instance in flash instead of 27 instances.

● ●




73

Intel® AMT Driver Support

Linux

Windows 8

Windows 7

Windows XP

Intel® Core™ with vPro™

AMT 6.0 (2010)

2nd Gen Intel® Core™ with vPro™

AMT 7.0 (2011)

3rd Gen Intel® Core™ with vPro™

AMT 8.0 (2012)

4th Gen Intel® Core™ with vPro™

AMT 9.0 (2013)



74

Feature Sandy Bridge & Cougar Point2

Sandy Bridge & Panther Point

Ivy Bridge & Cougar Point1

Ivy Bridge & Panther Point

Integrated USB3.0 No Yes No Yes

DX11 No No Yes Yes

Intel® vPro™ Technology Yes3 No No Yes3

Intel® Standard Manageability Yes Pentium, Core i3 No Pentium, Core i3

Intel Firmware Recovery No Yes No Yes

Intel ® Identity Protection Technology Yes4 No No Yes5

Intel® Anti-Theft Technology Yes6 Yes7 No Yes7

Intel® OS Guard (Windows* 8) No No Yes Yes

Intel® Secure Key No No Yes8 Yes8

Intel® Smart Response Technology Yes9 Yes9 Yes9 Yes9

Intel® Smart Connect No Yes No Yes

Intel® Rapid Start Technology No Yes No Yes

Number of Independent Displays 2 2 3 3

Switchable Graphics (Dynamic Muxless Solution) Yes Yes Yes Yes

1. Ivy Bridge with Cougar Point (6-series chipsets) will require firmware (ME8), BIOS, and graphics driver updates. 2. When platform is updated to ME8 the feature set is unchanged from the 2011 Sugar Bay Platform. Manageability Engine (ME) is not field and

end-user upgradable. 3. vPro requires a vPro capable i7/i5 Processor paired with respective Q series (DT) or QM series (MBL) chipset from the same product

generation. SNB and 6 Series or IVB and 7 Series. 4. Requires 2nd gen Intel Core i3 processor or above and Q67 or QM67 series chipsets. 5. Supported on the Q77 and QM77 series chipsets, vPro based platform only. 6. Supported on Intel Q and QM series chipsets only with 2nd gen Intel Core i3 processor or above. 7. Requires Intel Core i3 processor or above. 8. Requires Intel Core i5 processor or above. 9. Supported on Q and QM series chipsets only.

2012 IOTG Platforms Feature Cross Compatibility Summary (Yes = Supported, No = Not supported)

General Note: Listed features are not enabled on all PCs and optimized software may be required. Check with your system manufacturer. *Other names and brands may be

claimed as the property of others.



75

WW29’14 IOTG Product Pricing

IOTG Product Pricing is available to all Intel Field Sales at: http://price.intel.com/Default.aspx?page=PricingGuidelines&target Please select the file titled “Embedded/IOTG RCP WWxx.pdf” where xx is the most current work week available. Customers should check with your local distributor or Intel Field Sales rep for pricing guidance.

http://price.intel.com/Default.aspx?page=PricingGuidelines&target

http://price.intel.com/Default.aspx?page=PricingGuidelines&target



76

Other Open Source Projects

76 *Other names and brands may be claimed as the property of others. All products, computer systems, dates, and figures specified are preliminary based on current expectations and are subject to change without notice.



77

What is the Yocto Project?

The Yocto Project is an open source collaboration project that provides templates, tools, configuration data, and methods to help you create custom Linux*-based systems for embedded products, regardless of the hardware architecture.

*Other names and brands may be claimed as the property of others. All products, computer systems, dates, and figures specified are preliminary based on current expectations and are subject to change without notice.

It’s Not an Embedded Linux Distribution, it Creates a Custom One for You; Learn More at www.yoctoproject.org

Simple Electronics M2M Networking & Storage

Point of Sale Industrial

• For “roll your own” OS developers as well as companies with multiple embedded product lines

• Quickly growing user base and industry leader participation

• Enables easy transition from proof of concept (POC) to supported commercial Linux (Wind River)

• Provides common format/repository for Linux* Board Support Packages (BSPs) for easy porting

• Generates a custom designed application development kit for each specific device

• Enabled additional packages with ptest to allow for more automated testing of packages.

• Uses the MinnowBoard-MAX* for an enabling vehicle.

77

http://www.yoctoproject.org/



78

Yocto Project Open Source Roadmap

2 Code name. 3Code name for 3rd party board. Commercially supported Yocto project based OS distributions come from OSVs. Commercial distribution based on Yocto Project for Intel platforms available from Wind River. For more details, please contact your Wind River Sales Rep. All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. *Other names and brands may be claimed as the property of others.

Intel® Xeon™ Processor Based Platforms1

1 See SSG Roadmap companion guide for platform overview and features for the above BSPs and older platform/processor support 2 Code name. Commercially supported Yocto project based OS distributions come from OSVs. Commercial distribution based on Yocto Project for Intel platforms available from Wind River. For more details, please contact your Wind River Sales Rep. All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. * Other names and brands may be claimed as the property of others.

Release window

Crystal Forest2 (Ivy Bridge Server2): Intel® Xeon™ E5-2600v2 /E5-2400v2 and Intel® Communications Chipset 89xx (Cave Creek)

Romley2 (Sandy Bridge2) Intel® Xeon™ E5-2600/E5-2400 and Intel® C602J/C604 (Patsburg) Chipset

Romley2 (Ivy Bridge2): Intel® Xeon™ E5-2600v2/E5-2400v2 and Intel® C602J/C604 (Patsburg) Chipset

Crystal Forest2 (Sandy Bridge Server2: Intel® Xeon™ E5-2600 /E5-2400 and Intel® Communications Chipset 89xx (Cave Creek)

Yocto Project BSPs for Intel® Platforms

Highland Forest2 (Ivy Bridge 2): Intel® Xeon™ E5-2600Cv2 /E5-2400v2 and Intel® Communications Chipset 89xx (Coleto Creek)

WW29’14 5Q Q3 ’14 Q1 ’15 Q4 ’14 Q2 ’15 Q3 ’15

Embedded Yocto Project 1.5

Yocto Project 1.6

Yocto Project 1.7

Yocto Project 1.8



79


Intel® Core™ Processor Based Platforms1


Haswell: 4th generation Intel® Core and QM87 or HM86 chipset (Lynx Point)

79

Release window

Crystal Forest Gladden2 (Sandy Bridge Gladden2): Intel® Xeon™ E3-1125C /E3-1105C and Intel® Communications Chipset 89xx (Cave Creek) Crystal Forest Gladden2 (Ivy Bridge Gladden2): Intel® Xeon™ E3-1125Cv2 /E3-1105Cv2 and Intel® Communications Chipset 89xx (Cave Creek)

1 See SSG Roadmap companion guide for platform overview and features for the above BSPs and older platform/processor support 2 Code name. Commercially supported Yocto project based OS distributions come from OSVs. Commercial distribution based on Yocto Project for Intel platforms available from Wind River. For more details, please contact your Wind River Sales Rep. All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. * Other names and brands may be claimed as the property of others.

WW29’14 5Q Q3 ’14 Q1 ’15 Q4 ’14 Q2 ’15 Q3 ’15


Yocto Project 1.6

Yocto Project 1.7

Yocto Project 1.8



80



Intel® Atom ® Processor Based Platforms1

Baytrail2: Intel Atom™ Processor E3800 product family

80

Release window 1 See SSG Roadmap companion guide for platform overview and features for the above BSPs and older platform/processor support 2 Code name. 3 Code Name for 3rd Party Board. Commercially supported Yocto project based OS distributions come from OSVs. Commercial distribution based on Yocto Project for Intel platforms available from Wind River. For more details, please contact your Wind River Sales Rep. All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. * Other names and brands may be claimed as the property of others.

Rangeley2: Intel Atom™ Processor C2000 product family (Currently on YP1.4, will be upgraded to YP1.5)

WW29’14 5Q Q3 ’14 Q1 ’15 Q4 ’14 Q2 ’15 Q3 ’15


Yocto Project 1.6

Yocto Project 1.7

Yocto Project 1.8



81

Yocto Project 1.6 Features (Released on April 25, 2014)


• Consolidation of Intel BSPs

• Build failure reporting server

• Toaster web UI (stage 1 - build output analysis)

• Wayland/Weston 1.4

• Wildcard bbappend files

• eglibc 2.19

• binutils 2.24

• gcc 4.8.2

• Linux 3.14 kernel (+ LTSI 3.10)

• Python 3 (recipes for building it)

• piglit OpenGL test suite

• Image construction refactoring in Python

• New unfs3 to correctly handle 64-bit ext3/ext4 file systems when using QEMU + NFS

• Scale to the user's available cores for builds by default

• Check for and warn about unrecognized configure script arguments

• oe-selftest framework for build system regression tests

• Basic ability to run automated runtime tests on real hardware

81

Documentation enhancements:

• New section "Writing a New Recipe"

• Documented all classes

• Enhanced and integrated BitBake manual



82

Yocto Project 1.7 Features (Released planned for Oct. 31, 2014)


• A number of new features are in development at: https://wiki.yoctoproject.org/wiki/Yocto_1.7_Features

• These center around:

• Developer Experience and Workflows of the Project

• Automation of steps (ptest, hardware, package upgrade)

• Performance improvements

82

https://wiki.yoctoproject.org/wiki/Yocto_1.7_Features

https://wiki.yoctoproject.org/wiki/Yocto_1.7_Features



83

Yocto Project Compliance Program


Yocto Project Registered YP Compatible

Yocto Project Registered YP Participants

These products or layers comply with specific guidelines in order to qualify for YP Compatible status. This status is available only to members and other open source projects (or non-profits). There are over 30 YP Compatible products or BSPs as of April 2014.

The Arago Project

The Angstrom Distribution

Enea* Linux*

Cyassl – embedded SSL library

EGLIBC

Yocto Project GENIVI Baseline

Fish River Island 2 Board

Intel Architecture BSPs (meta-intel)

Texas Instruments Architecture BSPs (meta-ti)

Freescale Architecture BSPs (meta-fsl-*)

BeagleBoard

Intel® System Studio for Linux* 2013

Mentor Graphics* Embedded Linux

Mentor Graphics ATP 2013

MinnowBoard

Wind River Linux

These organizations qualify by participating visibly in the project. All of the YP member organizations are here, plus many other organizations and open source projects that rely on YP for their business. Three are over 40 YP Participants as of April 2014.

AMD

The Angstrom Distribution

The Arago Project

BEC Systems

Boundary Devices

chargestorm

CIO Informatique Industrielle

CircuitCo

cloud os

crashcourse

denx

Dynamic Devices

Ellexus

Enea Linux

Eukrea

Gilt Layers

Gumstix

Huawei

i-Get

Intel

koan

LSI

Long Term Support Initiative (LTSI)

Mentor Graphics

Monkey Project

Move Innov

nCore HPC

NetModule AG

OpenEmbedded

OpenSDR

OS Systems

Pansenti

Phi Innovations

qtechnology

Sakoman

SDG Systems

Sidebranch

Silica

sleep(5)

TI

Timesys

Wandboard

Wind River

Xilinx PetaLinux/OSL

83

ww37 2014 iotg 5q cnda roadmap

Documents