vendor opportunities facilitties required for vendorecad/cadence bare pcb fabrication pcb assembly,...
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Head, TTID/PPG SPACE APPLICATIONS CENTRE (ISRO) 3322, PLANNING AND PROJECTS GROUP JODHPUR TEKRA, AMBAWADI VISTAR AHMEDABAD - 380015
Email: [email protected] Web: www.sac.gov.in Phone: +91 - 79 – 26913355 Fax: +91 - 79 - 26915817
VENDOR OPPORTUNITIES Looking for End to End Solution: 1. From Circuit Diagram to Assembled Packages 2. From Design Specification to Tested Packages
Layout Design ECAD/Cadence
Bare PCB Fabrication
PCB Assembly, Harnessing &
Cabling
FACILITTIES REQUIRED FOR VENDOR
ESD PROTECTION
CERTIFIED MANPOWER
CLEAN ROOM HI-REL TOOLS, MAGNIFICATION AIDS FROM STANDARD/ WORLD
CLASS COMPANIES.
ESD PROTECTION
CERTIFIED MANPOWER
CLEAN ROOM TOOLS
Ground Hardware Yes Trained Manpower No, only Clean Area Yes
Space Grade Hardware Yes Yes Yes Yes
LAYOUT DESIGN
PCB WIRING AND ASSEMBLY
CLEAN ROOM in SAC CLEAN ROOM in INDUSTRY
Ground Use PCB wiring: 600 Nos.
Connectors/Harness: 1000/2000 m
Coils/Transformers etc.: 400
Cost utilized: Rs. 50 – 60 lacs p.a.
Offloading to industry: 90%
GROUND PCB CURRENT DEMAND
Qualification Standards: ISRO PAX-300
• SMD, TH, Fine Pitch Component Assembly
• Ceramic Grid Array
• Packaging Activities (Conformal Coating, Potting, Encapsulation)
• Connector Harnessing
• Semi rigid (SR), MultiFlex-141 Cable processing
THRUST AREAS
• 3D Packaging
• Component Assembly on Flex rigid PCBs
• Assembly on Hybrid PCB for DC & RF Applications
FUTURE
Qualification Standards: ISRO PAX-301-DSB ISRO PAX-303-MLB
• Schematic Circuit Diagram
- Electrical Rule Check (ERC)
- Signal Delay, Noise Budget, Impedance, Coupling
• PCB Layout and Design
- Impedance Controlled, High Speed Routing
- PCB Parasitic, Placement Optimization
- Signal Integrity, Power Integrity, Timing, EMC and
Thermal Analysis
THRUST AREAS
BARE PCB FABRICATION
PCB Type: Rigid PCB, Flex PCB, Rigid Flex PCB, Hybrid PCB (Glass epoxy/PTFE) etc. Features: HDI, blind vias, buried vias, through hole vias upto 8:1 aspect ratio, thermal layer etc. Laminate Material: FR4 glass epoxy meeting IPC 4101/24 with Tg. ≥ 170C PTFE Laminate – RT duroid 5880, 6002, 6010, TMM, CLTE-XT Surface Finish: Solder coated Hot air levelled (Sn 63 : Pb37) meeting QQ-S-571 SMOBC with solder coated Hot air level (Sn63 : Pb37) ENIG finish (3-5µ Nickel, 0.03-0.1µ Gold) Solder Coating Thickness: 4 to 30 microns, <10 µ thickness variation for SMD pads, PCB layers: upto 16 Track width/spacing: 3 / 3 mil minimum, Hole diameter: 0.2mm finish minimum Pad annular ring: Internal 0.12 mm min, External 0.13 mm min., Controlled impedance: 10%
THRUST AREAS
Qualification Standards: ISRO PAX-302-DSB ISRO PAX-304-MLB
DSB
MLB Offloading to Industry: 86% DSB 100% MLB Cost: Apprx. Rs. 60 lacs Area Fabricated: 11.79 Lakh Sq.cms.
Normal Microscope Advanced stereo microscope Computer attached 3D- Microscope 3D X-ray
Advancements in Inspection Technology
Space Use PCB wiring: 400 Nos.
Connectors/Harness: 1000/2000 m
Coils/Transformers etc.: 400
Cost utilized: Rs. 150 lacs p.a.
Offloading to industry: 80%
ONBOARD PCB CURRENT DEMAND