tida-01473 pcb (rev. a) - analog | embedded processing

24
ART FILM - 111609-01_smt ART FILM - 111609-01_smt XX of 131881 XX JOB NUMBER: SHEET NUMBER: 17745 MAR-27-2018 KSID: RELEASE DATE: SOLDERMASK TOP B X LAYER DESCRIPTION: BOARD REV: Lynn Witter PCB DESIGNER: CUSTOMER: TEXAS INSTRUMENTS BOARD NAME: DLPDLCR2000EVM ENGINEER: Philippe Dollo 13 7 SOLDERMASK - PRIMARY SIDE TIDLP-111609-01 16-MAR-2017 E2 TEXAS INSTRUMENTS 2515210 nHD EVM

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Page 1: TIDA-01473 PCB (Rev. A) - Analog | Embedded processing

ART FILM - 111609-01_smt

ART FILM - 111609-01_smt

XXof

131881

XX

JOB NUMBER:

SHEET NUMBER:

17745

MAR-27-2018

KSID:

RELEASE DATE:

SOLDERMASK TOP

B

XLAYER DESCRIPTION:

BOARD REV:

Lynn WitterPCB DESIGNER:

CUSTOMER:

TEXAS INSTRUMENTSBOARD NAME:

DLPDLCR2000EVMENGINEER:

Philippe Dollo137

SOLDERMASK - PRIMARY SIDE

TIDLP-111609-0116-MAR-2017E2

TEXAS INSTRUMENTS

2515210

nHD EVM

Page 2: TIDA-01473 PCB (Rev. A) - Analog | Embedded processing

ART FILM - 111609-01_spt

ART FILM - 111609-01_spt

XXof

131881

XX

JOB NUMBER:

SHEET NUMBER:

17745

MAR-27-2018

KSID:

RELEASE DATE:

SOLDERPASTE TOP

B

XLAYER DESCRIPTION:

BOARD REV:

Lynn WitterPCB DESIGNER:

CUSTOMER:

TEXAS INSTRUMENTSBOARD NAME:

DLPDLCR2000EVMENGINEER:

Philippe Dollo1311

SOLDERPASTE - PRIMARY SIDE

TIDLP-111609-0116-MAR-2017E2

TEXAS INSTRUMENTS

2515210

nHD EVM

Page 3: TIDA-01473 PCB (Rev. A) - Analog | Embedded processing

ART FILM - 111609-01_ly5

ART FILM - 111609-01_ly5

XXof

131881

XX

JOB NUMBER:

SHEET NUMBER:

17745

MAR-27-2018

KSID:

RELEASE DATE:

LAYER 5 - GND PLANE

B

XLAYER DESCRIPTION:

BOARD REV:

Lynn WitterPCB DESIGNER:

CUSTOMER:

TEXAS INSTRUMENTSBOARD NAME:

DLPDLCR2000EVMENGINEER:

Philippe Dollo135

LAYER 5 - GND PLANE

TIDLP-111609-0116-MAR-2017E2

TEXAS INSTRUMENTS

2515210

nHD EVM

Page 4: TIDA-01473 PCB (Rev. A) - Analog | Embedded processing

ART FILM - 111609-01_assyt

ART FILM - 111609-01_assyt

SILKSCREEN TOP

139

DLP003B

C9C12

C19

C21

DLPDLCR2000EVM

C28C29C30C31

C42

D1

C41

L4

R93

TPGND2

R97

46

45

L3

7

1AU5

C40

C39

C38

46

45

C27

G

R92

U11

TP34 **

SILKSCREEN - PRIMARY SIDE

TP14

C8

C7

C11

C18U13

C20C17

K

TP32

RT1

R89

TP33C36

C37R90

U10R91

*

TIDLP-111609-01

C6

R67

C26

C35C34

C25

R85

C33R87

R86

U9

R96

C4 C5

C16

U8

C39

C10

C15A

1

U3

TP24

TP29

TP28

TP30

TP31

C44

R33

R46R45

R48

R60R49

R47

R52R51R50R35

R54R53

R66R65

TP20

R95

U7

R34

R32

R29

R31

R30

R62

R64R63

R61

R82

R94

TP13

R26

R24

R27

R25

R40R28

R42R41

R55R56

R43R44

R58

R80R79

R57

R59

TP19

R81

TP23

*D3

U6

16-MAR-2017

TP12

R23

R

U12

A1

R78

R77R75

C24

TP27

TP26

JLEDFLEX

R21

R76

R71

U2

L2R74

R84

TP25

D2

E2

R19

R15

R13

R17

R38R11R10R9R8

C14

R39

15R72R70

*

R83

R3

R22

R18

R20

R16

R7

C13

TP16

TP22

C23

U4

J5

P1

R5

R12

R14

R37R36

R6

*

TP15

R107

TP21

J4

TEXAS INSTRUMENTS

TP2

C32

C43

P2

C2

L1

J1

R2

C126

TP17

J2

J3

* U1

R1

R68TP18

R69

TPGND1

2

TP11

C1

2

1

2515210

nHD EVM

Page 5: TIDA-01473 PCB (Rev. A) - Analog | Embedded processing

ART FILM - 111609-01_top

ART FILM - 111609-01_top

XXof

131881

XX

JOB NUMBER:

SHEET NUMBER:

17745

MAR-27-2018

KSID:

RELEASE DATE:

LAYER 1 - TOP

B

XLAYER DESCRIPTION:

BOARD REV:

Lynn WitterPCB DESIGNER:

CUSTOMER:

TEXAS INSTRUMENTSBOARD NAME:

DLPDLCR2000EVMENGINEER:

Philippe Dollo131

C42

C9

C12

C19

C21

C28C29C30C31

D1

C41

L4

R93

TPGND2

46

45

L3

7

1A

U5

C40

C39

C38

46

R97

45

LAYER 1 - PRIMARY SIDE

C8

C11

C18

C20

C27

G

TP33

R92

U11

TP34 *

TP14

C7C17

K

C26C34

TP32

C35C36R90C37R91

RT1R89

U10

*R96

TIDLP-111609-01

C6

R67

C25R85

C33R87

R86

U9

C4 C5

U13

C16

C3

9

C10

C15A

1

U3

TP24

TP29

TP28

TP30

TP31

C44

U8

R52R51R50R35

R54R53

R66R65

TP20

R95

U7

R34R29

R31R30

R32R33

R46R45

R47

R48

R60R49

R61R62

R82R64R63

JLEDFLEX

R94U6

R26R24

R27R25

R40R28

R42R41

R55R56

R43R44

R58

R80R79

R57

R59

TP19

R81

*P2

16-MAR-2017

R23

TP12

TP13

R

A1

R78

L2

C24

R77

TP23

TP27

TP26

D3

P1

TP11

TP4TP5

TP7 TP9

TP6TP3

TP8

TP10

R22R21

U12

R72

R76

R71

R75

R74

R84

TP25

D2

E2

R19R15R13R12

R14R18

R17 R20R16

C14 15

R70

*

U2

C23

R83

R9R8

R39R38R11R10

TP15

C13

TP22

U4

J5

TP2R3R5

R37R36R7R6

*

TP16

R107

TP21

J4

TEXAS INSTRUMENTS

C2

J1

C32

C43

L1

R2

C126

J3

*

U1

R1

R68

TP17

TP18

R69

TPGND1

2

TP1

1

C1

J2

2

1

2515210

nHD EVM

Page 6: TIDA-01473 PCB (Rev. A) - Analog | Embedded processing

ART FILM - 111609-01_bot

ART FILM - 111609-01_bot

XXof

131881

XX

JOB NUMBER:

SHEET NUMBER:

17745

MAR-27-2018

KSID:

RELEASE DATE:

LAYER 6 - BOTTOM

B

XLAYER DESCRIPTION:

BOARD REV:

Lynn WitterPCB DESIGNER:

CUSTOMER:

TEXAS INSTRUMENTSBOARD NAME:

DLPDLCR2000EVMENGINEER:

Philippe Dollo136

C129

R116

C130

LAYER 6 - SECONDARY SIDE

R117

TIDLP-111609-01

R100

R110

R103

C123

R111

R125

R112

C132

R104

C133

R128

C134

16-MAR-2017

C100C101

C114C113C112

R126

R129

C102C104

C103

C116C117

C115

C120

C118

E2

C105

C106

C108

C110

C107

C109

C121

C119

R118

R119

R121

R101

F100 C111

F101

C131

R120

R122

R123

XD100

*R108

R115R114

TEXAS INSTRUMENTS

R102C122

R109

C127

C128

C124

R105R106R113

C125

R124

2515210

nHD EVM

Page 7: TIDA-01473 PCB (Rev. A) - Analog | Embedded processing

ART FILM - 111609-01_smb

ART FILM - 111609-01_smb

XXof

131881

XX

JOB NUMBER:

SHEET NUMBER:

17745

MAR-27-2018

KSID:

RELEASE DATE:

SOLDERMASK BOTTOM

B

XLAYER DESCRIPTION:

BOARD REV:

Lynn WitterPCB DESIGNER:

CUSTOMER:

TEXAS INSTRUMENTSBOARD NAME:

DLPDLCR2000EVMENGINEER:

Philippe Dollo138

SOLDERMASK - SECONDARY SIDE

TIDLP-111609-0116-MAR-2017E2

TEXAS INSTRUMENTS

2515210

nHD EVM

Page 8: TIDA-01473 PCB (Rev. A) - Analog | Embedded processing

ART FILM - 111609-01_sst

ART FILM - 111609-01_sst

XXof

131881

XX

JOB NUMBER:

SHEET NUMBER:

17745

MAR-27-2018

KSID:

RELEASE DATE:

SILKSCREEN TOP

B

XLAYER DESCRIPTION:

BOARD REV:

Lynn WitterPCB DESIGNER:

CUSTOMER:

TEXAS INSTRUMENTSBOARD NAME:

DLPDLCR2000EVMENGINEER:

Philippe Dollo139

DLP003B

C9C12

C19

C21

DLPDLCR2000EVM

C28C29C30C31

C42

D1

C41

L4

R93

TPGND2

R97

46

45

L3

7

1AU5

C40

C39

C38

46

45

C27

G

R92

U11

TP34 *

SILKSCREEN - PRIMARY SIDE

TP14

C8

C7

C11

C18U13

C20C17

K

TP32

RT1

R89

TP33C36

C37R90

U10R91

*

TIDLP-111609-01

C6

R67

C26

C35C34

C25

R85

C33R87

R86

U9

R96

C4 C5

C16

U8

C39

C10

1

C15A

* U3

TP24

TP29

TP28

TP30

TP31

C44

R33

R46R45

R48

R60R49

R47

R52R51R50R35

R54R53

R66R65

TP20

R95

U7

R34

R32

R29

R31

R30

R62

R64R63

R61

R82

R94

TP13

R26

R24

R27

R25

R40R28

R42R41

R55R56

R43R44

R58

R80R79

R57

R59

TP19

R81

TP23

*D3

U6

16-MAR-2017

TP12

R23

R

U12

A1

R78

R77R75

C24

TP27

TP26

JLEDFLEX

R21

R76

R71

U2

L2R74

R84

TP25

D2

E2

R19

R15

R13

R17

R38R11R10R9R8

C14

R39

15 R72R70

*

R83

R3

R22

R18

R20

R16

R7

C13

TP16

TP22

C23

*

U4

**

J5

P1

R5

R12

R14

* R37R36

R6

TP15

R107

TP21

J4

TEXAS INSTRUMENTS

TP2

C32

C43

P2

C2

L1

J1

R2

C126

TP17

J2

*

J3

U1*

R1

R68TP18

R69

TPGND1

2

TP11

C1

2

1

2515210

nHD EVM

Page 9: TIDA-01473 PCB (Rev. A) - Analog | Embedded processing

ART FILM - 111609-01_ssb

ART FILM - 111609-01_ssb

XXof

131881

XX

JOB NUMBER:

SHEET NUMBER:

17745

MAR-27-2018

KSID:

RELEASE DATE:

SILKSCREEN BOTTOM

B

XLAYER DESCRIPTION:

BOARD REV:

Lynn WitterPCB DESIGNER:

CUSTOMER:

TEXAS INSTRUMENTSBOARD NAME:

DLPDLCR2000EVMENGINEER:

Philippe Dollo1310

FOR EVALUATION ONLY : NOT FCC APPROVED FOR RESALE

C129

C130R116

R117

R110

SILKSCREEN - SECONDARY SIDE

TIDLP-111609-01

R100

R103

C123R111

R125

R104

C132

R112

C133

R128

CCA 2515211

ESD 2515209

C100

C114C113C112C101

C134

16-MAR-2017

C102

C116C117

C115C103

TEXAS INSTRUMENTS

PCB 2515210 REV A

R126R129

C104C105

C106C120

C118C119

E2

C108C110

C107C109

C121

R118R119R121

R101C111

F100

F101

C131

R120R122

R123

*

R109

C127

R108

R115R114

TEXAS INSTRUMENTS

XD100

R102

C122

C128

C124

C125

R105R106R113

R124

2515210

nHD EVM

Page 10: TIDA-01473 PCB (Rev. A) - Analog | Embedded processing

ART FILM - 111609-01_ly2

ART FILM - 111609-01_ly2

XXof

131881

XX

JOB NUMBER:

SHEET NUMBER:

17745

MAR-27-2018

KSID:

RELEASE DATE:

LAYER 2 - GND PLANE

B

XLAYER DESCRIPTION:

BOARD REV:

Lynn WitterPCB DESIGNER:

CUSTOMER:

TEXAS INSTRUMENTSBOARD NAME:

DLPDLCR2000EVMENGINEER:

Philippe Dollo132

LAYER 2 - GND PLANE

TIDLP-111609-0116-MAR-2017E2

TEXAS INSTRUMENTS

2515210

nHD EVM

Page 11: TIDA-01473 PCB (Rev. A) - Analog | Embedded processing

ART FILM - 111609-01_ly3

ART FILM - 111609-01_ly3

XXof

131881

XX

JOB NUMBER:

SHEET NUMBER:

17745

MAR-27-2018

KSID:

RELEASE DATE:

LAYER 3 - SIGNAL

B

XLAYER DESCRIPTION:

BOARD REV:

Lynn WitterPCB DESIGNER:

CUSTOMER:

TEXAS INSTRUMENTSBOARD NAME:

DLPDLCR2000EVMENGINEER:

Philippe Dollo133

LAYER 3 - SIGNAL

TIDLP-111609-0116-MAR-2017E2

TEXAS INSTRUMENTS

2515210

nHD EVM

Page 12: TIDA-01473 PCB (Rev. A) - Analog | Embedded processing

ART FILM - 111609-01_ly4

ART FILM - 111609-01_ly4

XXof

131881

XX

JOB NUMBER:

SHEET NUMBER:

17745

MAR-27-2018

KSID:

RELEASE DATE:

LAYER 4 - GND PLANE

B

XLAYER DESCRIPTION:

BOARD REV:

Lynn WitterPCB DESIGNER:

CUSTOMER:

TEXAS INSTRUMENTSBOARD NAME:

DLPDLCR2000EVMENGINEER:

Philippe Dollo134

LAYER 4 - PWR PLANE

TIDLP-111609-0116-MAR-2017E2

TEXAS INSTRUMENTS

2515210

nHD EVM

Page 13: TIDA-01473 PCB (Rev. A) - Analog | Embedded processing

ART FILM - 111609-01_assyb

ART FILM - 111609-01_assyb

SILKSCREEN BOTTOM

1310

FOR EVALUATION ONLY : NOT FCC APPROVED FOR RESALE

C129

R116

C130

R117

SILKSCREEN - SECONDARY SIDE

TIDLP-111609-01

R100

R110

R103

C123

R111

R125

R112

C132

R104

C133

R128

CCA 2515211

ESD 2515209

C134

16-MAR-2017

C100C101

C114C113C112

TEXAS INSTRUMENTS

PCB 2515210 REV A

R126

R129

C102C104

C103

C116C117

C115

C120

C118

E2

C105

C106

C108

C110

C107

C109

C121

C119

R118

R119

R121

R101

F100 C111

F101

C131

R120

R122

R123

XD100

*

R108

R115R114

TEXAS INSTRUMENTS

R102C122

R109

C127

C128

C124

R105R106R113

C125

R124

2515210

nHD EVM

Page 14: TIDA-01473 PCB (Rev. A) - Analog | Embedded processing

ART FILM - 111609-01_fab

ART FILM - 111609-01_fab

XXof

131881

XX

JOB NUMBER:

SHEET NUMBER:

17745

MAR-27-2018

KSID:

RELEASE DATE:

B

XLAYER DESCRIPTION:

BOARD REV:

Lynn WitterPCB DESIGNER:

CUSTOMER:

TEXAS INSTRUMENTSBOARD NAME:

DLPDLCR2000EVMENGINEER:

Philippe Dollo

50 OHMS SE - 0.0052100 OHMS DIFF 0.004 WIDTH/0.007 SPACE

50 OHMS SE - 0.0052

50 OHMS SE - 0.0052

LAYER 1 - TOP SIDE, 3/8oz Cu START

LAYER 2 - GND PLANE, 3/8oz CuLAYER 3 - SIGNAL, 1/2oz Cu

LAYER 4 - PWR PLANE, 1/2oz CuLAYER 5 - GND PLANE, 3/8oz CuLAYER 6 - BOTTOM SIDE, 3/8oz Cu START

13

FAB NOTES:1. ALL DIMENSIONS ARE IN INCHES, UNLESS OTHERWISE NOTED.2. THE PWB SHALL BE FABRICATED TO IPC-6012, CLASS 2 AND WORKMANSHIP SHALL CONFORM TO IPC-A-600, CLASS 2. CURRENT REVISIONS.3. BOARD MATERIAL SHALL BE 180 Tg/350 Td ISOLA FR-370HR OR EQUIVALENT, RoHS COMPLIANT AND LEAD FREE ASSEMBLY CAPABLE. BOARD MATERIAL SHALL MEET OR EXCEED IPC-4101B. COLOR: NATURAL.4. BOARD MATERIAL & CONSTRUCTION MUST MEET OR EXCEED UL94V-0.PCB MUST HAVE UL REGISTERED MATERIAL ID ON THE PCB.5. MINIMUM COPPER WALL THICKNESS OF PLATED-THRU HOLES TO BE .001 INCH, WITH A MINIMUM ANNULAR RING OF .002 INCH.6. OVERALL BOARD THICKNESS TO BE .062 +/- 10% AND APPLIES AFTER ALL LAMINATION AND PLATING PROCESSES, MEASURED FROM COPPER TO COPPER.7. MAX. WARP & TWIST TO BE .0075 INCHES PER INCH.8. BOARD MUST BE ELECTRICALLY TESTED USING SUPPLIED IPC-D-356 NETLIST.9. VIAS CAN CONFORM TO CLASS 2 REQUIREMENTS AND SHOULD BE TEARDROPPED BY FAB VENDOR.

10. MICRO VIAS TO BE FILLED AND PLANARIZED PRIOR TO PLATING, VENDOR TO DETERMINE METHOD.

PROCESS NOTES:1. PLATE ALL EXPOSED AREAS WITH ELECTROLESS IMMERSION GOLD, NICKEL 100 MICROINCHES THK GOLD 2-10 MICROINCHES THK MIN.2. APPLY LPI SOLDERMASK OVER BARE COPPER (SMOBC), COLOR: RED. SOLDERMASK SHALL CONFORM TO IPC-SM-840, CLASS H. CURRENT REV.3. SOLDERMASK ARTWORK HAS ZERO (0) OVERSIZED PADS. FABRICATION VENDOR IS ALLOWED TO ADJUST THE COMPONENT SOLDERMASK PADS TO MEET THEIR TOOLING REQUIREMENTS.4. APPLY LPI SILKSCREEN OR EQUIVALENT PER THE ARTWORK. COLOR: WHITE.

LAYER STACK:

13

DRILL DRAWING

R.5002 PLCS

TIDLP-111609-01

61

48

16-MAR-2017

QTY

QTY221

QTY

2.910

E2

PLATEDPLATED

PLATEDPLATED

PLATEDPLATED

TEXAS INSTRUMENTS

TOLERANCE+0.0/-4.0

TOLERANCE+0.0/-4.0

+0.0/-4.0TOLERANCE

.087

DRILL CHART: TOP to LY2

ALL UNITS ARE IN MILS

DRILL CHART: TOP to LY3

ALL UNITS ARE IN MILS

DRILL CHART: LY2 to LY3

4.0

ALL UNITS ARE IN MILS

4.0

2515210

SIZE4.0

SIZE

SIZE

nHD EVM

FIGURE

FIGURE

FIGURE

.125

.472

.090

QTY

320

1

12

17

10

2

3

95

2

5

1

1

1

.783

PLATED

PLATED

PLATED

PLATED

PLATED

PLATED

PLATED

PLATED

PLATED

NON-PLATED

NON-PLATED

PLATED

PLATED

PLATED

1.566

2.150

TOLERANCE

+0.0/-8.0

+3.0/-8.0

+0.0/-0.0

+0.0/-10.0

+3.0/-12.0

+0.0/-0.0

+0.0/-0.0

+3.0/-3.0

+1.969/-0.0

+0.0/-0.0

+3.0/-3.0

+3.0/-3.0

+3.0/-3.0

ALL UNITS ARE IN MILS

DRILL CHART: TOP to BOTTOM

SIZE

8.0

8.0

9.0

10.0

12.0

24.0

40.0

40.0

125.0

23.622

120.0x40.0

120.0x40.0

140.0x40.0

FIGURE

* SURFACE - AIR 0 MIL

L1: TOP CONDUCTOR - COPPER_1/2OZ_PLATED 1.4 MIL * DIELECTRIC - SOLDERMASK-0.8MIL 0.8 MIL

* DIELECTRIC - FILL_0.075 2.8 MIL

L2: LY2 PLANE - COPPER_1.0OZ 1.4 MIL

* DIELECTRIC - FILL_0.075 3 MIL

L3: LY3 CONDUCTOR - COPPER_1/2OZ 0.6 MIL

* DIELECTRIC - CORE_1.10 42.2 MIL

L4: LY4 CONDUCTOR - COPPER_1/2OZ 0.6 MIL * DIELECTRIC - FILL_0.075 3 MIL

L5: LY5 PLANE - COPPER_1.0OZ 1.4 MIL

* DIELECTRIC - FILL_0.075 2.8 MIL

* DIELECTRIC - SOLDERMASK-0.8MIL 0.8 MIL L6: BOTTOM CONDUCTOR - COPPER_1/2OZ_PLATED 1.4 MIL

* SURFACE - AIR 0 MIL

2-3

1-2

1-3

1-6

___________________________DESIGN CROSS SECTION CHARTTOTAL THICKNESS 62.2 MIL

Page 15: TIDA-01473 PCB (Rev. A) - Analog | Embedded processing

ART FILM - 111609-01_spb

ART FILM - 111609-01_spb

XXof

131881

XX

JOB NUMBER:

SHEET NUMBER:

17745

MAR-27-2018

KSID:

RELEASE DATE:

B

XLAYER DESCRIPTION:

BOARD REV:

Lynn WitterPCB DESIGNER:

CUSTOMER:

TEXAS INSTRUMENTSBOARD NAME:

DLPDLCR2000EVMENGINEER:

Philippe Dollo1312

SOLDERPASTE - SECONDARY SIDE

TIDLP-111609-0116-MAR-2017E2

TEXAS INSTRUMENTS

2515210

nHD EVM

Page 16: TIDA-01473 PCB (Rev. A) - Analog | Embedded processing

ART FILM - PLACE_BOTH

ART FILM - PLACE_BOTH

13

C42

C9

C12

C19

C21

C28C29

C129

C30C31

D1

C41

R116

C130

L4

R93

TPGND2

46

45

L3

7

1A

U5

C40

C39

C38

46

R97

45

C8

C11

C18

C20

C27

G

TP33

R92

U11

TP34 *

606022

TP14

C7C17

K

C26C34

TP32

C35C36R117

R90C37R91

RT1R89

U10

*R96

TIDLP-111609-01

C6

R100

R67

R110

C25R85

C33R87

R86

U9

C4 C5

U13

C16

R103

C123

R111

R1255959

1 1

C3

9

C10

C15A

1

U3R112

TP24

TP29

TP28

TP30

TP31

C44

C132

U8

R52R51R50R35

R54R53

R66R65

TP20 R104

R95

C133

R128U7

R34R29

R31R30

R32R33

R46R45

R47

R48

R60R49

R61R62

R82R64R63

JLEDFLEX

R94U6

R26R24

R27R25

R40R28

R42R41

R55R56

R43R44

R58

R80R79

R57

R59

TP19

R81

*

C134

P2

16-MAR-2017

R23

TP12

TP13

C100C101

C114C113C112

R

A1

R78

L2

C24

R77

TP23

TP27

TP26

D3R126

R129

P1

TP11

TP4TP5

TP7 TP9

TP6TP3

TP8

TP10 C102C104

C103

R22R21

C116C117

C115

C120

U12

C118

R72

R76

R71

R75

R74

R84

TP25

D2

E2

C105

C106

C108

C110

C107

C109 R19

R15R13R12

R14R18

R17 R20R16

C121

C14

C11915

R70

*

U2

C23

R118

R119

R83

R121

R9R8

R39R38R11R10

TP15

R101

F100 C111

C13

F101

TP22

C131

R120

U4

R122

R123

J5

TP2R3R5

R37R36R7R6

XD100

*

*

TP16

R108

R115R114

R107

TP21

J4

TEXAS INSTRUMENTS

C2

R102C122

R109

J1

C127

C128

C32

C43

*

L1

R2

C126

C124

R105R106R113

C125

J3

131

*

U1

R1

R68

TP17

TP18

R69

TPGND1

1226214

2

TP1

1

C1

J2

R124

2

1

2515210

2515

nHD EVM

Page 17: TIDA-01473 PCB (Rev. A) - Analog | Embedded processing

ART FILM - PLACE_TOP

ART FILM - PLACE_TOP

13

C42

C9

C12

C19

C21

C28C29C30C31

D1

C41

L4

R93

TPGND2

46

45

L3

7

1A

U5

C40

C39

C38

46

R97

45

C8

C11

C18

C20

C27

G

TP33

R92

U11

TP34 *

TP14

C7C17

K

C26C34

TP32

C35C36R90C37R91

RT1R89

U10

*R96

TIDLP-111609-01

C6

R67

C25R85

C33R87

R86

U9

C4 C5

U13

C16

C3

9

C10

C15A

1

U3

TP24

TP29

TP28

TP30

TP31

C44

U8

R52R51R50R35

R54R53

R66R65

TP20

R95

U7

R34R29

R31R30

R32R33

R46R45

R47

R48

R60R49

R61R62

R82R64R63

JLEDFLEX

R94U6

R26R24

R27R25

R40R28

R42R41

R55R56

R43R44

R58

R80R79

R57

R59

TP19

R81

*P2

16-MAR-2017

R23

TP12

TP13

R

A1

R78

L2

C24

R77

TP23

TP27

TP26

D3

P1

TP11

TP4TP5

TP7 TP9

TP6TP3

TP8

TP10

R22R21

U12

R72

R76

R71

R75

R74

R84

TP25

D2

E2

R19R15R13R12

R14R18

R17 R20R16

C14 15

R70

*

U2

C23

R83

R9R8

R39R38R11R10

TP15

C13

TP22

U4

J5

TP2R3R5

R37R36R7R6

*

TP16

R107

TP21

J4

TEXAS INSTRUMENTS

C2

J1

C32

C43

L1

R2

C126

J3

*

U1

R1

R68

TP17

TP18

R69

TPGND1

2

TP1

1

C1

J2

2

1

2515210

nHD EVM

Page 18: TIDA-01473 PCB (Rev. A) - Analog | Embedded processing

ART FILM - PLACE_BOT

ART FILM - PLACE_BOT

13

C129

R116

C130

R117

TIDLP-111609-01

R100

R110

R103

C123

R111

R125

R112

C132

R104

C133

R128

C134

16-MAR-2017

C100C101

C114C113C112

R126

R129

C102C104

C103

C116C117

C115

C120

C118

E2

C105

C106

C108

C110

C107

C109

C121

C119

R118

R119

R121

R101

F100 C111

F101

C131

R120

R122

R123

XD100

*R108

R115R114

TEXAS INSTRUMENTS

R102C122

R109

C127

C128

C124

R105R106R113

C125

R124

2515210

nHD EVM

Page 19: TIDA-01473 PCB (Rev. A) - Analog | Embedded processing

ART FILM - ROUTING

ART FILM - ROUTING

LAYER 1 - TOPLAYER 6 - BOTTOM

1361

C42

C9

C12

C19

C21

C28C29

C129

C30C31

D1

C41

R116

C130

L4

R93

TPGND2

46

45

L3

7

1A

U5

C40

C39

C38

46

R97

45

LAYER 6 - SECONDARY SIDELAYER 1 - PRIMARY SIDE

C8

C11

C18

C20

C27

G

TP33

R92

U11

TP34 *

TP14

C7C17

K

C26C34

TP32

C35C36R117

R90C37R91

RT1R89

U10

*R96

TIDLP-111609-01

C6

R100

R67

R110

C25R85

C33R87

R86

U9

C4 C5

U13

C16

R103

C123

R111

R125

C3

9

C10

C15A

1

U3R112

TP24

TP29

TP28

TP30

TP31

C44

C132

U8

R52R51R50R35

R54R53

R66R65

TP20 R104

R95

C133

R128U7

R34R29

R31R30

R32R33

R46R45

R47

R48

R60R49

R61R62

R82R64R63

JLEDFLEX

R94U6

R26R24

R27R25

R40R28

R42R41

R55R56

R43R44

R58

R80R79

R57

R59

TP19

R81

*

C134

P2

16-MAR-2017

R23

TP12

TP13

C100C101

C114C113C112

R

A1

R78

L2

C24

R77

TP23

TP27

TP26

D3R126

R129

P1

TP11

TP4TP5

TP7 TP9

TP6TP3

TP8

TP10 C102C104

C103

R22R21

C116C117

C115

C120

U12

C118

R72

R76

R71

R75

R74

R84

TP25

D2

E2

C105

C106

C108

C110

C107

C109 R19

R15R13R12

R14R18

R17 R20R16

C121

C14

C11915

R70

*

U2

C23

R118

R119

R83

R121

R9R8

R39R38R11R10

TP15

R101

F100 C111

C13

F101

TP22

C131

R120

U4R122

R123

J5

TP2R3R5

R37R36R7R6

XD100

*

*

TP16

R108

R115R114

R107

TP21

J4

TEXAS INSTRUMENTS

C2

R102C122

R109

J1

C127

C128

C32

C43

L1

R2

C126

C124

R105R106R113

C125

J3

*

U1

R1

R68

TP17

TP18

R69

TPGND1

2

TP1

1

C1

J2

R124

2

1

2515210

nHD EVM

Page 20: TIDA-01473 PCB (Rev. A) - Analog | Embedded processing

ART FILM - outline

ART FILM - outline

Page 21: TIDA-01473 PCB (Rev. A) - Analog | Embedded processing

ART FILM - TSS_NO_PLOT

ART FILM - TSS_NO_PLOT

SILKSCREEN TOP

139

DLP003B

C9C12

C19

C21

DLPDLCR2000EVM

C28C29C30C31

C42

D1

C41

L4

R93

TPGND2

R97

46

45

L3

7

1AU5

C40

C39

C38

46

45

C27

G

R92

U11

TP34 *

SILKSCREEN - PRIMARY SIDE

TP14

C8

C7

C11

C18U13

C20C17

K

TP32

RT1

R89

TP33C36

C37R90

U10R91

*

TIDLP-111609-01

C6

R67

C26

C35C34

C25

R85

C33R87

R86

U9

R96

C4 C5

C16

U8

C39

C10

1

C15A

* U3

TP24

TP29

TP28

TP30

TP31

C44

R33

R46R45

R48

R60R49

R47

R52R51R50R35

R54R53

R66R65

TP20

R95

U7

R34

R32

R29

R31

R30

R62

R64R63

R61

R82

R94

TP13

R26

R24

R27

R25

R40R28

R42R41

R55R56

R43R44

R58

R80R79

R57

R59

TP19

R81

TP23

*D3

U6

16-MAR-2017

TP12

R23

R

U12

A1

R78

R77R75

C24

TP27

TP26

JLEDFLEX

R21

R76

R71

U2

L2R74

R84

TP25

D2

E2

R19

R15

R13

R17

R38R11R10R9R8

C14

R39

15 R72R70

*

R83

R3

R22

R18

R20

R16

R7

C13

TP16

TP22

C23

*

U4

**

J5

P1

R5

R12

R14

* R37R36

R6

TP15

R107

TP21

J4

TEXAS INSTRUMENTS

TP2

C32

C43

P2

C2

L1

J1

R2

C126

TP17

J2

*

J3

U1*

R1

R68TP18

R69

TPGND1

2

TP11

C1

2

1

2515210

nHD EVM

Page 22: TIDA-01473 PCB (Rev. A) - Analog | Embedded processing

ART FILM - BSS_NO_PLOT

ART FILM - BSS_NO_PLOT

SILKSCREEN BOTTOM

1310

FOR EVALUATION ONLY : NOT FCC APPROVED FOR RESALE

C129

C130R116

R117

R110

SILKSCREEN - SECONDARY SIDE

TIDLP-111609-01

R100

R103

C123R111

R125

R104

C132

R112

C133

R128

CCA 2515211

ESD 2515209

C100

C114C113C112C101

C134

16-MAR-2017

C102

C116C117

C115C103

TEXAS INSTRUMENTS

PCB 2515210 REV A

R126R129

C104C105

C106C120

C118C119

E2

C108C110

C107C109

C121

R118R119R121

R101C111

F100

F101

C131

R120R122

R123

*

R109

C127

R108

R115R114

TEXAS INSTRUMENTSXD100

R102

C122

C128

C124

C125

R105R106R113

R124

2515210

nHD EVM

Page 23: TIDA-01473 PCB (Rev. A) - Analog | Embedded processing

ART FILM - FABRICATION

ART FILM - FABRICATION

XXof

131881

XX

JOB NUMBER:

SHEET NUMBER:

17745

MAR-27-2018

KSID:

RELEASE DATE:

B

XLAYER DESCRIPTION:

BOARD REV:

Lynn WitterPCB DESIGNER:

CUSTOMER:

TEXAS INSTRUMENTSBOARD NAME:

DLPDLCR2000EVMENGINEER:

Philippe Dollo

50 OHMS SE - 0.0052100 OHMS DIFF 0.004 WIDTH/0.007 SPACE

50 OHMS SE - 0.0052

50 OHMS SE - 0.0052

LAYER 1 - TOP SIDE, 3/8oz Cu START

LAYER 2 - GND PLANE, 3/8oz CuLAYER 3 - SIGNAL, 1/2oz Cu

LAYER 4 - PWR PLANE, 1/2oz CuLAYER 5 - GND PLANE, 3/8oz CuLAYER 6 - BOTTOM SIDE, 3/8oz Cu START

FAB NOTES:1. ALL DIMENSIONS ARE IN INCHES, UNLESS OTHERWISE NOTED.2. THE PWB SHALL BE FABRICATED TO IPC-6012, CLASS 2 AND WORKMANSHIP SHALL CONFORM TO IPC-A-600, CLASS 2. CURRENT REVISIONS.3. BOARD MATERIAL SHALL BE 180 Tg/350 Td ISOLA FR-370HR OR EQUIVALENT, RoHS COMPLIANT AND LEAD FREE ASSEMBLY CAPABLE. BOARD MATERIAL SHALL MEET OR EXCEED IPC-4101B. COLOR: NATURAL.4. BOARD MATERIAL & CONSTRUCTION MUST MEET OR EXCEED UL94V-0.PCB MUST HAVE UL REGISTERED MATERIAL ID ON THE PCB.5. MINIMUM COPPER WALL THICKNESS OF PLATED-THRU HOLES TO BE .001 INCH, WITH A MINIMUM ANNULAR RING OF .002 INCH.6. OVERALL BOARD THICKNESS TO BE .062 +/- 10% AND APPLIES AFTER ALL LAMINATION AND PLATING PROCESSES, MEASURED FROM COPPER TO COPPER.7. MAX. WARP & TWIST TO BE .0075 INCHES PER INCH.8. BOARD MUST BE ELECTRICALLY TESTED USING SUPPLIED IPC-D-356 NETLIST.9. VIAS CAN CONFORM TO CLASS 2 REQUIREMENTS AND SHOULD BE TEARDROPPED BY FAB VENDOR.

10. MICRO VIAS TO BE FILLED AND PLANARIZED PRIOR TO PLATING, VENDOR TO DETERMINE METHOD.

PROCESS NOTES:1. PLATE ALL EXPOSED AREAS WITH ELECTROLESS IMMERSION GOLD, NICKEL 100 MICROINCHES THK GOLD 2-10 MICROINCHES THK MIN.2. APPLY LPI SOLDERMASK OVER BARE COPPER (SMOBC), COLOR: RED. SOLDERMASK SHALL CONFORM TO IPC-SM-840, CLASS H. CURRENT REV.3. SOLDERMASK ARTWORK HAS ZERO (0) OVERSIZED PADS. FABRICATION VENDOR IS ALLOWED TO ADJUST THE COMPONENT SOLDERMASK PADS TO MEET THEIR TOOLING REQUIREMENTS.4. APPLY LPI SILKSCREEN OR EQUIVALENT PER THE ARTWORK. COLOR: WHITE.

LAYER STACK:

13

DRILL DRAWING

R.5002 PLCS

61

48

QTY

QTY221

QTY

2.910

PLATEDPLATED

PLATEDPLATED

PLATEDPLATED

TOLERANCE+0.0/-4.0

TOLERANCE+0.0/-4.0

+0.0/-4.0TOLERANCE

.087

DRILL CHART: TOP to LY2

ALL UNITS ARE IN MILS

DRILL CHART: TOP to LY3

ALL UNITS ARE IN MILS

DRILL CHART: LY2 to LY3

4.0

ALL UNITS ARE IN MILS

4.0

SIZE4.0

SIZE

SIZE

FIGURE

FIGURE

FIGURE

.125

.472

.090

QTY

320

1

12

17

10

2

3

95

2

5

1

1

1

.783

PLATED

PLATED

PLATED

PLATED

PLATED

PLATED

PLATED

PLATED

PLATED

NON-PLATED

NON-PLATED

PLATED

PLATED

PLATED

1.566

2.150

TOLERANCE

+0.0/-8.0

+3.0/-8.0

+0.0/-0.0

+0.0/-10.0

+3.0/-12.0

+0.0/-0.0

+0.0/-0.0

+3.0/-3.0

+1.969/-0.0

+0.0/-0.0

+3.0/-3.0

+3.0/-3.0

+3.0/-3.0

ALL UNITS ARE IN MILS

DRILL CHART: TOP to BOTTOM

SIZE

8.0

8.0

9.0

10.0

12.0

24.0

40.0

40.0

125.0

23.622

120.0x40.0

120.0x40.0

140.0x40.0

FIGURE

* SURFACE - AIR 0 MIL

L1: TOP CONDUCTOR - COPPER_1/2OZ_PLATED 1.4 MIL * DIELECTRIC - SOLDERMASK-0.8MIL 0.8 MIL

* DIELECTRIC - FILL_0.075 2.8 MIL

L2: LY2 PLANE - COPPER_1.0OZ 1.4 MIL

* DIELECTRIC - FILL_0.075 3 MIL

L3: LY3 CONDUCTOR - COPPER_1/2OZ 0.6 MIL

* DIELECTRIC - CORE_1.10 42.2 MIL

L4: LY4 CONDUCTOR - COPPER_1/2OZ 0.6 MIL * DIELECTRIC - FILL_0.075 3 MIL

L5: LY5 PLANE - COPPER_1.0OZ 1.4 MIL

* DIELECTRIC - FILL_0.075 2.8 MIL

* DIELECTRIC - SOLDERMASK-0.8MIL 0.8 MIL L6: BOTTOM CONDUCTOR - COPPER_1/2OZ_PLATED 1.4 MIL

* SURFACE - AIR 0 MIL

2-3

1-2

1-3

1-6

___________________________DESIGN CROSS SECTION CHARTTOTAL THICKNESS 62.2 MIL

Page 24: TIDA-01473 PCB (Rev. A) - Analog | Embedded processing

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