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• Mixed-Signal ASICs • Digital ASICs Standard ICs (ASSPs) Custom IC Design The ASIC Company

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Page 1: The ASIC Company · PDF fileProcess Foundry Process Node Core Supply I/O Supply HV ... XP/XH018 XFAB 0.18 μm CMOS 1.8 V 1.8 / 3.3 / 5 V CL018G2 TSMC 0.18 μm BCD 1.8 V 1.8 / 3.3

• Mixed-Signal ASICs

• Digital ASICs

• Standard ICs (ASSPs)

• Custom IC Design

The ASIC Company

Page 2: The ASIC Company · PDF fileProcess Foundry Process Node Core Supply I/O Supply HV ... XP/XH018 XFAB 0.18 μm CMOS 1.8 V 1.8 / 3.3 / 5 V CL018G2 TSMC 0.18 μm BCD 1.8 V 1.8 / 3.3

Foundry Partners

Leading Edge Silicon Proven IP

Reference Examples

CONTENT

Page 3: The ASIC Company · PDF fileProcess Foundry Process Node Core Supply I/O Supply HV ... XP/XH018 XFAB 0.18 μm CMOS 1.8 V 1.8 / 3.3 / 5 V CL018G2 TSMC 0.18 μm BCD 1.8 V 1.8 / 3.3

Contact

Standard ICs (ASSPs)

Key Facts ASIC CCE4170

History

Page 4: The ASIC Company · PDF fileProcess Foundry Process Node Core Supply I/O Supply HV ... XP/XH018 XFAB 0.18 μm CMOS 1.8 V 1.8 / 3.3 / 5 V CL018G2 TSMC 0.18 μm BCD 1.8 V 1.8 / 3.3

Leading Edge Silicon Proven IP

IndustrIal | automotIve medIcal | consumer

Digital• 8/16/32-Bit Microcontroller Cores (ARM, ARC,

MSP430, 8051)• NVM solutions (OTP, MTP, EEPROM , FLASH)• Industrial Ethernet, 3 DES Crypto Core,

DSRC Communication Core

Mixed-Signal• 167 MS/s 10-Bit Pipeline ADC • 1 MS/s 12-Bit SAR ADC• 500 MS/s 6 Bit Flash ADC (time continuous & SC type)• Ultra Low Power 32 kHz XTAL• High CMRR LVDS Interface, RS485 Interface• Fast Settling 12 MHz DCO, 1GHz CMOS PLL

Page 5: The ASIC Company · PDF fileProcess Foundry Process Node Core Supply I/O Supply HV ... XP/XH018 XFAB 0.18 μm CMOS 1.8 V 1.8 / 3.3 / 5 V CL018G2 TSMC 0.18 μm BCD 1.8 V 1.8 / 3.3

Foundry PartnersProcess Foundry Process Node Core

SupplyI/O

SupplyHV

Option

CLN65LP TSMC 65 nm CMOS 1.0 V 1.8 / 3.3 V

CLN90LP TSMC 90 nm CMOS 1.0 V / 1.2 V 1.8 / 3.3 / 5 V

CEN90FS TSMC 90 nm CMOS 1.0 V / 1.2 V 1.8 / 3.3 / 5 V

XP/XH018 XFAB 0.18 μm CMOS 1.8 V 1.8 / 3.3 / 5 V

CL018G2 TSMC 0.18 μm BCD 1.8 V 1.8 / 3.3 / 5 V

MM25 SMIC 0.25 μm CMOS 2.5 V 3.3 / 5 V

HL18GFL MagnaChip 0.18 μm CMOS 1.8 V 1.8 / 3.3 / 5 V

XH035 XFAB 0.35 μm CMOS 3.3 V 3.3 / 5 V

XO035 XFAB 0.35 μm CMOS 3.3 V 3.3 / 5 V

C05/T05 TSMC 0.5 μm CMOS 5 V 3.3 / 5 V

XB06 XFAB 0.6 μm BiCMOS 5 V 3.3 / 5 V

C036 EPISIL 1.2 μm Bipolar 0.7 V 36 V

Analog• Low Noise TIA 3 GHz GBW, R2R Low Power OPA,

Fast Comparator• Voltage Controlled Amplifier 60 dB / 40 MHz• Bandgap References < 10 ppm / K• Switching DC / DC Converters (Boost & Buck Type)• 1.8 V / 2.5 V / 3.3 V CMOS Linear Low Drop Regulators• Embedded Sensors (Opto, Hall and others)

Content

Page 6: The ASIC Company · PDF fileProcess Foundry Process Node Core Supply I/O Supply HV ... XP/XH018 XFAB 0.18 μm CMOS 1.8 V 1.8 / 3.3 / 5 V CL018G2 TSMC 0.18 μm BCD 1.8 V 1.8 / 3.3

reference examples

Consumer ASICs • Motor driver • Intelligent battery charging • LED drivers

Medical ASICs • Hearing aid controller • Wireless charging

Multimedia / LCD ASICs • Dot Matrix LED Driver • Broadband optical data transmission system (IR) • ComCoil inductive coupled Power/Data link

Industrial ASICs • Fast bus interface controller with embedded μC • Opto ICs • IO-Link ICs

Automotive ASICs • Water-in-diesel sensor • Glow plug controller • CAN transceiver • Toll collection IC (DSRC)

Content

Page 7: The ASIC Company · PDF fileProcess Foundry Process Node Core Supply I/O Supply HV ... XP/XH018 XFAB 0.18 μm CMOS 1.8 V 1.8 / 3.3 / 5 V CL018G2 TSMC 0.18 μm BCD 1.8 V 1.8 / 3.3

standard Ics (assPs)

Sensor ASICs CCG 1401 Transimpedance Amplifier

for photo diodes

LED/LCD Drivers CLC 2622 LCD Matrix Driver CCE 7000 White LED Driver CCA 4100 LED Flasher IC

Power Converters CCF 7000 Buck-Boost Converter CCF 7010 600 mA Synchronous Buck Converter

IO-Link ICs CCE 4502 IO-Link System IC Device CCE 4510 IO-Link System IC Master

Receiver | Transceiver CCA 1224 Automotive Bus Interface CCA 9100 Double CAN Transceiver CCG 6001 433 MHz ASK Receiver

Motor Drivers CCU 2350 PWM Speed Control for

permanent excited DC MotorsCCA 1200 Hall Motor Driver

Content

Page 8: The ASIC Company · PDF fileProcess Foundry Process Node Core Supply I/O Supply HV ... XP/XH018 XFAB 0.18 μm CMOS 1.8 V 1.8 / 3.3 / 5 V CL018G2 TSMC 0.18 μm BCD 1.8 V 1.8 / 3.3

Innovation & QualityKey Facts asIc cce4170

• Inductive position sensor ASIC designed for Bernstein AG

• 36 V IO-Link compliant switching unit for resistive and inductive loads

• Integrated 16-bit microcontroller running fully featured IO-Link device stack

• Temperature compensation of detection point• Reverse polarity protection• Short circuit protected• Measurement principle configurable (ping mode or

oscillator mode)

CCE4170 typical application circuit | With integrated μC & IO-Link

Page 9: The ASIC Company · PDF fileProcess Foundry Process Node Core Supply I/O Supply HV ... XP/XH018 XFAB 0.18 μm CMOS 1.8 V 1.8 / 3.3 / 5 V CL018G2 TSMC 0.18 μm BCD 1.8 V 1.8 / 3.3

Content

• ASIC Turnkey Solutions

• CMOS, BiCMOS, Bipolar and BCD Wafer Production

• Off-the-Shelf ICs (assPs)

• End-of-Life IC Replacements

• IC Packaging Service

• Inhouse Wafer Probing (cP) and Final Test (Ft)

Page 10: The ASIC Company · PDF fileProcess Foundry Process Node Core Supply I/O Supply HV ... XP/XH018 XFAB 0.18 μm CMOS 1.8 V 1.8 / 3.3 / 5 V CL018G2 TSMC 0.18 μm BCD 1.8 V 1.8 / 3.3

History

2016 Opening of new office CREATIVE CHIPS Japan Branch and representative office in USA and Korea 52 employees by the end of the year

2014 Host of 1. CCASIC Symposium Honoured with the ISB Success Technology Award 41 employees by the end of the year

2013 Foundation of CREATIVE CHIPS Dresden GmbH Opening of new office CREATIVE CHIPS Asia Moving into the company‘s new headquarters building in Bingen am Rhein

2012 Laying of the foundation stone for a new building with 14,000 sqf office and 8,000 sqf testing area 35 employees by the end of the year Portfolio of more than 60 finished ASIC/ASSP designs

Page 11: The ASIC Company · PDF fileProcess Foundry Process Node Core Supply I/O Supply HV ... XP/XH018 XFAB 0.18 μm CMOS 1.8 V 1.8 / 3.3 / 5 V CL018G2 TSMC 0.18 μm BCD 1.8 V 1.8 / 3.3

2008 20 employees by the end of the year Portfolio of more than 40 finished ASIC/ASSP designs

2004 Start of series production for first automotive project Expansion of test and office capacity

2001 Start of series production for first customer project1999 Foundation of CREATIVE CHIPS GmbH in

Bingen am Rhein 7 employees by the end of the year

Content

Page 12: The ASIC Company · PDF fileProcess Foundry Process Node Core Supply I/O Supply HV ... XP/XH018 XFAB 0.18 μm CMOS 1.8 V 1.8 / 3.3 / 5 V CL018G2 TSMC 0.18 μm BCD 1.8 V 1.8 / 3.3

Company headquarters in Bingen, Germany

CREATIVE CHIPS GmbH Im Bubenstück 1 55411 Bingen am Rhein Germany Phone: +49 (0) 6721 98722-0 [email protected] www.creativechips.com

CREATIVE CHIPS Dresden GmbH Altstrehlen 4 01219 Dresden Germany Phone: +49 (0) 351 479 4940 - 0

Semisource Corporation 1116 Arthur‘s Court, Pinckney, MI 48169, USA Phone: +1 734 474 2562 [email protected]

CREATIVE CHIPS Japan Branch 5F Roppongi Mikawadai Building 4-8-7 Roppongi, Minato-ku Tokyo, 106-0032 Japan Phone: +81 (0)3 6890 1478 [email protected]

www.creativechips.com

Content