surface mount technology · surface mount technology 2015 editorial calendar month special issue...
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SURFACE MOUNT TECHNOLOGY
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SM
T he only technical magazine that specializes in SMT and
PCB, it delivers the latest information on market trends
and core technology.
2015 CONTENTSUltra-thin and compact technology, market analysis
There are increasing the demand of small board assembly in the field of electronic. We introduce
to focus the case studies and field experts for the latest technologies to relate components and
miniaturized board.
Reporting for high-density technology
The major issue of surface technology is inspection techniques and PCB cleaning development for
reducing cost and high-density , highly integrated electronic devices to maximize efficiency. In this way, we
can delivering to report to the interest of the industry quickly.
Spotlight on Eco-friendly products and companies
There are the movement of fast development about Low-carbon products and product development
lead-free and halogen-free for eco-friendly products in the industry. In this way, we provide the information
of new products and their movement through interview and gathered information.
SURFACE MOUNT TECHNOLOGY
2015 EDITORIAL CALENDAR
Month Special Issue Exhibition
Jan The trend of inspector, mount, screen printer industry Outlook of SMT / PCB industry in 2015
Feb Review Nepcon Japan 2015 Review Nepcon Japan 2015
Mar Solder paste, a low melting point solder The trend of Reflow, PSA, soldering Industry
Apr AOI, AXI, SPI inspector market The trend of 2D / 3D AOI, SPI Checker industry
May Review Nepcon Japan 2015 Review Nepcon Korea 2015
Jun Review KPCA 2015 The trend of Mounter industry
Jul Mounter equipment, high-speed mounter market The trend of screen printer industry
Aug Ink-jet printing process and the latest printing technology The trend of material industry
Sep Flexible, Wearable Display The trend of display market
Oct Pick & Place, the case of Process Automation The trend of SMT between the automated process
Nov 3D Image, reflow oven, multi packages The trend of Electronic packaging technology
Dec Summary 2015 Summary for SMT/PCB industry in 2015
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※ The above information contained in this editorial calendar is subject to change without notice.
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Standing Order
Cover eco-friendly SMT technology projectWe predict the present and the future of eco-friendly materials
such as mounting technology, solder ·detergents·PCB that can
reduce energy usage.
Introduce technology that deals with the futureWe intensively analyze and introduce technologies regarding
components, half height PCB technology to construct grand half
height which is the big flows of the latest mobile devices and
electric equipment and deliver technology trend that can resolve
reliability problems related to half height and maximize safety.
Local example and review with exportsBased on local examples and exports researches, we introduce
the latest effective technology that can reduce manufacturing cost.
Various structure of reading markets in advance• Special: We select major item which are focused in business
every month and provide related products’ industry and
technology trend, introduction of related products and interviews
with exports.
• Technical report: With article alliance with 「SMT」 and 「Journal of
Japan Institute of Electronics Packaging」 and contributions from
exports, we rapidly deliver live local technologies in the nation
and all over the world.
• Intensive analysis: Through intensive analysis regarding focused
technology in surface mounting, we suggest solutions for
technical engineers with useful local technology to subscribers.
• Series: From the foundation of process to mandatory technology
in location, we provide.
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Main Equipment chip mounter, reflow, screen printer, vision inspection equip, Nitrogen a Generator
Components & Materials solder cream, flux, underfill repair, bar solder/wire solder, metal mask, chip components
Peripheral Devicesconveyor system, rework system, cleansing device, repair equip, manual printer
Router, drill machine, printer, probe system, etching, plating, lead-frame, UV curing machine
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