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ELECTRONICS PACKAGING REVIEW

John L. Evans, Ph.D.INSY 4700

PACKAGING TECHNOLOGY&

DEFECTS

PACKAGING TRENDS SURFACE MOUNT PACKAGING

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IC PACKAGE & WIRE BONDING WIRE BONDING FANOUT

WIRE BONDING – LARGE FINE PITCH PROCESS

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PACKAGING VARIETY BGA PACKAGING VARIETY

BGA PACKAGING BALL GRID ARRAY - BGA

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HIGH I/O BGA PACKAGE MULTICHIP BGA

MULTI-CHIP PACKAGE - PGA LOW PASTE - PASSIVES

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COMPONENT FAILURE GOOD COMPONENT PLACEMENT

PLACEMENT OFFSET SO16 SKEWED

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GOOD QFP PLACEMENT SKEWED QFP PLACEMENT

GULL WING DEFECT J-LEAD DEFECT

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BGA OFFSET BGA – ROBUST PROCESS

FLIP-CHIP WITH UNDERFILL LAMINENT SUBSTRATE

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FLEX SUBSTRATE CERAMIC SUBSTRATE