seminar on surface mount technology

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SEMINAR ON SURFACE MOUNT TECHNOLOGY By- MARODE DNYANESHWAR D. B.E.(E&C)

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SEMINAR ON SURFACE MOUNT TECHNOLOGY. By- MARODE DNYANESHWAR D. B.E.(E&C). OUTLINE. Surface Mount Technology Role of SMT Benefits Surface Mount Devices Advantages Challenges. Surface Mount Technology. - PowerPoint PPT Presentation

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Page 1: SEMINAR ON  SURFACE  MOUNT TECHNOLOGY

SEMINAR ON

SURFACE MOUNT TECHNOLOGY

By-MARODE DNYANESHWAR D.

B.E.(E&C)

Page 2: SEMINAR ON  SURFACE  MOUNT TECHNOLOGY

OUTLINE Surface Mount Technology Role of SMT Benefits Surface Mount Devices Advantages Challenges

Page 3: SEMINAR ON  SURFACE  MOUNT TECHNOLOGY

Surface Mount Technology

SMT is a Technology that uses surface mount devices, which are often leadless and require small space.

Allows high-speed component mounting

and reduces PCB size. Supports Advance consumer products

( LCD color TV, video cameras & so on). Has the great advantage in portable

stereos, CD players.

Page 4: SEMINAR ON  SURFACE  MOUNT TECHNOLOGY

ROLE OF SMT IN ELECTRONIC WORLD

Play a predominant role to increase area efficiency & the corresponding to the system volume.

Electrical and Mechanical features are only achievable with SMT.

Small light weight portable components are mount only by using SMT.

SMT entails making reliable interconnections on the board at great speed, in the smallest possible area.

Page 5: SEMINAR ON  SURFACE  MOUNT TECHNOLOGY

BENEFITS OF SMT

• Reduction in package size.• Reduction in weight of product.• Noise Reduction.• Higher operating speed due to shorter

interconnections.

Page 6: SEMINAR ON  SURFACE  MOUNT TECHNOLOGY

COMPONENT PLACEMENT SMD’s on both sides.

SMD’s on one side & discrete components on other sides.

Randomly distributed on either sides.

Page 7: SEMINAR ON  SURFACE  MOUNT TECHNOLOGY

Processes used for placement of components

Screen Printing Method.

Glue Method.

Page 8: SEMINAR ON  SURFACE  MOUNT TECHNOLOGY

SCREEN PRINTING METHODPaste Application on

PCB by SCREEN PRINTING

Pick & Place of components by HP-180 & SP-120

Visual Inspection Manually

Reflow Process

Page 9: SEMINAR ON  SURFACE  MOUNT TECHNOLOGY

GLUE METHOD•Glue Application on PCB by HS-180•Pick & place of components by HP-180 & SP-120.•Visual Inspection Manually.•Reflow Process to cure Glue.•Wave Soldering Process.

Page 10: SEMINAR ON  SURFACE  MOUNT TECHNOLOGY

MACHINES USED

SP 120 Manufactured by SiemensIt is multi headed machinePlacement speed is 7200 components/ hourEasy to used Window based Software

Page 11: SEMINAR ON  SURFACE  MOUNT TECHNOLOGY

HS 180Manufactured by SiemensIt is single headed machinePlacement speed is 4200 components/hour

Page 12: SEMINAR ON  SURFACE  MOUNT TECHNOLOGY

CHALLENGS

Need latest TechnologyRequires well trained workerComplications

Page 13: SEMINAR ON  SURFACE  MOUNT TECHNOLOGY

Thank you