Rev. 0.7 4/11 Copyright © 2011 by Silicon Laboratories Si2493/57/34/15/04-EVB

Si2493/57/34/15/04Global ISOmodem-EVB

Evaluation Board Rev 5.0 for the Si2493/57/34/15/04ISOmodem with UART and SPI Interfaces

Description

The global Si2493/57/34/15/04-EVB evaluation boardRev 5.0 provides the system designer an easy way ofevaluating the Si2493/57/34/15/04 ISOmodem®. TheSi2493/57/34/15/04-EVB consists of a motherboardwith a power supply, an RS-232 and USB interface,other ease-of-use features, and a complete removablemodem module on a daughter card. (A functional blockdiagram of the Si2493/57/34/15/04-EVB is shownbelow.) The Si2493/57/34/15/04 ISOmodem is acomplete controller-based modem chipset with anintegrated and programmable direct accessarrangement (DAA) that meets global telephone linerequirements. Available as a combination of one 16-pinsmall line-side device and one 24-pin or 16-pin system-side device, the Si2493/57/34/15/04 ISOmodemeliminates the need for a separate DSP data pump,modem controller, memories, codec, isolationtransformer, relays, opto-isolators, and a 2- to 4-wirehybrid. The Si2493/57/34/15/04 is ideal for embeddedmodem applications due to its small board area,controller-based architecture, low power consumption,and global compliance. The Si2493/57/34/15/04-EVBprovides an RJ-11 jack (for interfacing the Si2493/57/34/15/04-EVB to the phone line), and USB and RS232serial ports for interfacing to a PC or data terminal. Thisallows the ISOmodem to operate as a serial modem forstraightforward evaluation of the Si2493/57/34/15/04. Toevaluate the Si2493/57/34/15/04 ISOmodem in anembedded system, the daughter card can be usedindependently of or with the motherboard.

A direct access header (J103) is available on themotherboard to bypass the RS-232 transceivers andconnect the Si2493/57/34/15/04 ISOmodem directly toa target system.

An on-board rectifier, filter, and voltage regulator allowthe power input to be 7.5–13 V ac or dc (either polarity)supplied through a screw terminal (J8) or a standard2 mm power jack (J9). Alternatively, power can besupplied through the USB interface (whether the USB orRS232 interface is used). The evaluation board candrive an external speaker for call monitoring or thespeaker mounted directly on the board. Please note thatthe PCM interface, parallel interface, and EEPROM areavailable on the 24-pin FT only. See "1.7.EVB PartNumbers" on page 8 for ISOmodem EVB options.

Features

The Si2493/57/34/15/04-EVB includes the following:

Dual RJ-11 connection to phone line RS-232 and USB interface to PC Speaker for call monitoring Direct access to Si2493/57/34/15/04 for embedded

application evaluation Easy power connection to common 7.5 V–13.5 V

power supplies or USB port. 9 V ac adaptor Simple installation and operation EEPROM (24-pin FT only) RS232 lines status display on LEDs.

Functional Block Diagram

Si2493/57/34/15/04

Push Button Reset

RESET XTALIXTALO

Si3018*Interface Circuit RJ-11

Phone line

Audio Amplifier

AOUT

Audio Out

Direct Access HDR

Daughter Board Boundary

Power-On Reset

Rectifier Filter

RS-232 Transceivers

UARTDB9

Interface Selection Jumpers

Voltage Regulator 3.3 V

5 V

7.5-13.5 V dc or peak ac Adaptor

USB Connector USB I/F

*Si3010 for Si2404

Si2493/57/34/15/04

2 Rev. 0.7

1. Si2493/57/34/15/04-EVB Setup and Evaluation

This section explains how to set up the Si2493/57/34/15/04-EVB for evaluation as an RS-232 or USBinterface modem. Jumper settings, power connection,PC/terminal connections, and terminal programconfiguration settings are given. The initial modemsetup after power is applied as well as a basic tutorialon modem operation are provided. Si2493/57/34/15/04-EVB configurations for evaluating additional featuresare discussed separately. See the Si2493/57/34/15 orSi2404 data sheets and “AN93: Si2493/57/34/15/04/04Modem Designer’s Guide” for complete details.

1.1. Si2493/57/34/15/04-EVB Quick Start—RS-232 Interface

1. Set jumpers according to Figure 1, but change J6 to the arrangement shown in Figure 3 if an FS ISOmodem package is used.

2. Connect:

DB-9 to PC COM 1 (with a pass-through cable).RJ-11 to phone line or CO simulator.9 V ac adaptor (or USB cable).

3. Bring up:

Turn on power to modem.Autobaud automatically adjusts modem DTE speed and protocol.

4. Type “AT” followed by a carriage return.

Should echo “AT” and then an “OK”.

1.2. Si2493/57/34/15/04-EVB Quick Start—USB Interface

1. Set jumpers according to Figure 3, but change J6 to the arrangement shown in Figure 3 if an FS ISOmodem package is used.

2. Connect:

USB cable to PCRJ-11 to phone line or CO simulator

3. Download USB driver for your operating system from the CD supplied with the evaluation board.

4. Install driver.

5. Bring up.

Reset the modem.Autobaud automatically adjusts modem DTE speed and protocol.

6. Type “AT” followed by a carriage return.

Should echo “AT” and then an “OK”.

1.3. Motherboard and Daughter Card Configuration

The EVB consist of a motherboard that takes a plug indaughter card. The motherboard can be configured in avariety of ways that are explained below and aremanaged via jumpers. The daughter card contains boththe modem system side and the isolated line interface(DAA).

The daughter card comes preconfigured and functionalalthough the user may decide to change someoperating options such as the type of crystal used withthe modem chip or the type of control signals used, i.e.UART vs parallel. These features must be managed bychanging strapping resistors soldered down to thedaughter card and by changing parts associated withthe crystal. These possible changes are explainedbelow.

1.3.1. Motherboard Configuration

Check all the jumper setting on the S2493/57/34/15/04-EVB before applying power. The standard factorysetting for the modem in a 24-pin FT package areshown in the figure below. This setup configures themodem for RS232 serial operation with autobaudenabled. Any standard terminal program configured tocommunicate through a PC com port can be used tocommunicate with the EVB.

Figure 1 shows the default motherboard setup for theFT package daughter card as well as the functions ofconnectors and jumpers.

Si2493/57/34/15/04

Rev. 0.7 3

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Si2493/57/34/15/04

4 Rev. 0.7

1.3.1.1. RS232 vs USB vs User Provided IO Selection

To change to USB operation simply move the RS232selection jumper on JP23 to the USB position asmarked on the PCB and shown in Figure 1. When theUSB vs UART settings are changed the appropriateindicator LED will light up on the EVB.

If neither jumper is in place then neither serial port willbe activated and the user must provide I/O signals viathe pins on J103. This IO can be in ASYNCH SERIAL,SPI SERIAL and Parallel Bus mode.

1.3.1.2. Autobaud Control

Autobaud is enabled with no jumper at the JP34position. When a jumper is in place, autobaud isdisabled and the user must setup the host to run 19k2baud in order to use the modem.

1.3.1.3. EEPROM Control

To enable the EEPROM (U5) both jumpers JP34 andJP35 must be in place and the modem reset.

JP35 physically connects the EEPROM chips selectline to the modem and allows the EEPROM to functionwhen addressed by the modem, while JP34 connects astrapping option to the correct modem pin which issensed during reset and instructs the modem firmwareto use the EEPROM.

1.3.1.4. Call Progress Configuration

The modem call establishment can be heard byenabling the call progress feature via software (seeAN93) and Hardware. The hardware componentsinclude installing JP12 which enabled the audio poweramplifier and installing JP14 to connect the on boardspeaker to the power amplifier output. If an offboardspeaker is to be used then JP14 can be removed andthe alternate speaker can be connected to pins 1 and 4of JP11. Note the this audio output is 8 anddifferential so that neither output pin should begrounded.

1.3.1.5. Control Line Configuration

Various modem control lines can be rearrangeddepending on the user preferences and the specificmodem chips used. This is done using JP6. The basictwo JP6 configurations are shown in the followingfigures.

Figure 2. Default J6 Setup for 24-Pin Modem Chips

Figure 3. Default J6 Setup for 16-Pin Modem Chips

The specific details of what the jumpers connect areshown in Table 1, which is also found printed on theunderside of the EVB.

J6

1

4

7

10

13

3

6

9

12

15

J6

1

4

7

10

13

3

6

9

12

15

Table 1. Routing of Control Signals with Jumper Position on J6

RS232 Signal

Si24xx 24-Pin Si24xx 16-Pin Si2401

Left Right Left Right Left Right

DCD DCD SDI/EESD DCD NC DCD NC

RI RI FSYNCH NC RI NC RI

DTR ESC RI ESC NC ESC NC

RTS RTS SDO/EECLK

NC RTS NC GPIO1

DSR INT AOUT/INT NC INT NC AOUT/INT

Si2493/57/34/15/04

Rev. 0.7 5

1.3.2. Daughter Card Configuration

The daughter card comes configured with either a 24-pin FT or 16-pin FS system side part and either 32 kHzor 4.9152 MHz operation, and UART operation. Thedaughter card can also be setup to operate with a thirdclock frequency, an on board 27 MHz oscillator. Tochange between these options requires componentchanges on the daughter card.

The daughter card can also operate in three possibleinterface modes: parallel bus mode, in SPI mode as wellas the default UART mode.

There are six small (0402) strapping resistors (R101 toR106) that are on the daughter card and are configureddifferently depending on the combination of chippackage, clock frequency chosen, and interface mode.See Figures 5 and 6 for details.

The card and its options are shown in Figure 4, whichshows the Modem Daughter card Rev 2.0 top andbottom views with the critical parts that may be changedto select another command mode (i.e. SPI) or analternate crystal frequency, such as 4.9152 MHz.

Si2493/57/34/15/04

6 Rev. 0.7

Figure 4. Modem Daughter Card Rev 2.0 Top and Bottom Views

Figure 5. R101–R106 Setup for Clock and Mode Configuration on the DC with the 16-Pin FS Package

These option strapping resistors select modem command mode UART, SPI or Parallel and crystal clock frequency.

Three possible crystals or ext oscillator.

Crystal loading caps (C40 & C41) specific to the crystal type used.

TOP VIEW

BOTTOM VIEW

 

Si2493/57/34/15/04

Rev. 0.7 7

Figure 6. R106 Setup for Clock and Mode Configuration on DC with 24-Pin FT Package

1.3.2.1. 32 kHz Setup

For 32 kHz, populate Y1 with the 32 kHZ crystal shownin the BOM and use 18 pF capacitors for the C40/C41values. Also remove Y3 and Y1b if present and strapR101 to R106 as shown in Figure 5.

The modem should then work as expected; no changesare needed on the motherboard

1.3.2.2. 4.9152 MHz

For 4.9152 MHz, populate Y1b with the 4.9152 MHzcrystal shown in the BOM and use 33 pF capacitors forthe C40 and C41 values. Also remove Y3 and Y1 ifpresent and strap R101 to R106 as shown in Figures 5or 6 above.The modem should then work as expected;no changes are needed on the motherboard

1.3.2.3. 27 MHz

For 27 MHz, populate Y3 with the small surface mountoscillator shown in the BOM and remove Y3 and Y1b ifpresent. Also remove any capacitors at the C40 andC41 positions.

Strap R101 to R106 as shown in Figures 5 or 6 above.

The modem should then work as expected; no changesare needed on the motherboard

1.3.2.4. SPI Mode Setup

To change to SPI mode setup it is necessary toconfigure the R101 straps as shown in Figure 5 orFigure 6, according to the package and clock used.Then setup the daughter card with neither UART norUSB operation selected, i.e. with no jumper on JP23.The SPI signals can then be obtained on J103, thesystem connector and connected to the host. Signalusage is described in Table 2.

1.3.3. Parallel Bus Mode Setup

To change to parallel bus mode setup it is necessary toconfigure the R101 straps as shown in Figure 5 orFigure 6, according to the package and clock used.Then setup the daughter card with neither UART norUSB operation selected, i.e. with no jumper on JP23.The SPI signals can then be obtained on J103, thesystem connector and connected to the host. See thedata sheet and schematic for signal and pin usage.

1.4. Power RequirementsThe Si2493/57/34/15/04-EVB has an on-board diodebridge, filter capacitor, and voltage regulator (U10 andU18). Power can be supplied from any source capableof providing 7.5 V–13 V dc or 7.5 V–13 V peak ac andat least 100 mA. (Additional current may be required if aspeaker is connected for monitoring call progresstones.) Power may be applied to the Si2493/57/34/15/04-EVB through the screw terminals (J8), the 2 mmpower jack (J9), or the USB cable (even if the modem isconfigured for RS-232 operation). The onboard full-wave rectifier and filter ensure the correct polarity isapplied to the Si2493/57/34/15/04-EVB. Daughter cardcurrent can be measured by connecting a DVM acrossR59, a 1 resistor using the supplied test points on

Table 2. Signal Usage

SPI Function JP23 Pin Number Legacy Pin Function

SPI_CSb 5 RTSb

SPI_MISO 7 RXD

SPI_MOSI 9 TXD

SPI_SCLK 11 CTSb

Si2493/57/34/15/04

8 Rev. 0.7

either side.

1.5. Terminal and Line ConnectionsThe Si2493/57/34/15/04 can be tested as a standardserial data modem by connecting the Si2493/57/34/15/04-EVB to a personal computer or other data terminalequipment (DTE), phone line, and power. Connect a PCserial port to the DB9 connector on the Si2493/57/34/15/04-EVB with a pass-through cable. The RS-232transceivers on the EVB can communicate with the DTEat rates up to 1 Mbps. Any standard terminal program,such as HyperTerminal or ProComm, running on a PCcommunicates with the Si2493/57/34/15/04-EVB. Thestandard factory jumper configuration has autobaudenabled. Autobaud detects the DTE speed, data length,parity, and number of stop bits.

If JP33 is installed, autobaud is disabled. Configure theterminal emulation program to 19200 bps, eight databits, no parity, one stop bit, and hardware (CTS)handshaking. Connect the RJ-11 jack on the Si2493/57/34/15/04-EVB to an analog phone line or telephone linesimulator, such as a Teltone TLS 5.

1.6. Making ConnectionsWith the terminal program properly configured andrunning, apply power to the Si2493/57/34/15/04-EVB.Type “AT<cr>”, and the modem should return “OK”indicating the modem is working in the command modeand communicating with the terminal. If the “OK”response is not received, try resetting the modem bypressing the manual reset switch (S1); then, again type“AT<cr>.” Next, type “ATI6<cr>.” The modem shouldrespond with “2493”, “2457”, “2434”, “2415”, or “2404”indicating the terminal is communicating with an Si2493,Si2457, Si2434, Si2415, or Si2404.

Type “ATS0=2<cr>” to configure the modem to answeron the second ring.

To take the modem off-hook, type “ATH1<cr>.” Themodem should go to the off-hook state, draw loopcurrent, and respond with an “OK.” Next, type“ATH<cr>” or “ATH0<cr>”, and the modem should hangup (go on-hook) and stop drawing loop current.

To make a modem connection, type “ATDT(calledmodem phone number)<cr>.” Once the connection isestablished, a “CONNECT” message appears indicatingthe two modems are in the data mode andcommunicating. Typing on one terminal should appearon the other terminal. To return to the command modewithout interrupting the connection between the twomodems, type “+++.” Approximately two seconds later,“OK” appears. The modem is now in command modeand accepts “AT” commands.Type “ATH” (or “ATH0”) toterminate the data connection, or type “ATO” to return to

the data mode. After the ATO command, the modemresumes the data connection and no longer accepts ATcommands.

1.7. EVB Part NumbersThe ISOmodem evaluation boards are offered inmultiple speeds and packaging options. The first fournumbers indicate the system-side device. The next twoletters indicate the system-side package (FS–Lead-free,16-pin SOIC; FT–Lead-free, 24-pin TSSOP). The finaltwo numbers indicate the line-side device. See Figure 7.

Figure 7. EVB Part Number Example

2. Si2493/57/34/15/04-EVB Functional Description

The Si2493/57/34/15/04-EVB is a multipurposeevaluation system. The modem daughter cardillustrates the small size and few components requiredto implement an entire controller-based modem withglobal compatibility. The daughter card can be usedindependently of, or in conjunction with, themotherboard. The motherboard adds features thatenhance the ease of evaluating the many capabilities ofthe Si2493/57/34/15/04 ISOmodem®.

2.1. MotherboardThe motherboard provides a convenient interface to theSi2493/57/34/15/04 DC (daughter card). The versatilepower supply allows for a wide range of ac and dcvoltages to power the board. RS-232 transceivers and aDB9 connector allow the Si2493/57/34/15/04-EVB to beeasily connected to a PC or other terminal device.Jumper options allow direct access to the LVCMOS/TTLlevel serial inputs to the Si2493/57/34/15/04, bypassingthe RS-232 transceivers or USB interface. This isparticularly useful for directly connecting the Si2493/57/34/15/04 to embedded systems.

The Si24xxURT-EVB motherboard connects to thedaughter card through two connectors, JP101 and JP2.JP101 is an 8x2 header providing connection to allSi2493/57/34/15/04 digital signals and regulated 3.3 Vpower for the Si2493/57/34/15/04. The Si2493/57/34/15/04 digital signals appearing at JP101 (daughter cardinterface) are LVCMOS and TTL compatible. JP2 is a4x1 socket providing connection between the daughter

Si2457-D-FS18-EVB

LS Part Number (Si30xx)SS Package

SS Part NumberSS Revision

Si2493/57/34/15/04

Rev. 0.7 9

card and the RJ-11 phone jack.

2.1.1. Voltage Regulator/Power Supply

The input voltage to either J8 or J9 must be between 7.5and 13.5 V dc or 7.5 and 13.5 VPEAK ac. Themotherboard includes a diode bridge (D12) to guardagainst a polarity reversal of the dc voltage or to rectifyan ac voltage. The power source must be capable ofcontinuously supplying at least 100 mA. C44 serves asa filter cap for an ac input. The voltage regulator, U10,provides 5 V for the motherboard and the input forvoltage regulator U3, which outputs 3.3 V for use on themotherboard and to power the daughter card. Si24xxDCpower consumption can be measured by placing ameter across R59. Power is supplied to U2 through D5from the USB.

2.1.2. Reset Circuitry

The Si2493/57/34/15/04 requires a reset pulse toremain low for at least 5.0 ms after the power supplyhas stabilized during the powerup sequence or for atleast 5.0 ms during a power-on reset. Most productionSi2493/57/34/15/04 modem chipset applications requirethat RESET be controlled by the host processor. CertainSi2493/57/34/15/04 operation modes, includingpowerdown, require a hardware reset to recover.

The Si2493/57/34/15/04-EVB contains two resetoptions, an automatic power-on reset device, U18(DS1818) (default), and a manual reset switch (S1) topermit resetting the chip without removing power. Areset, regardless of the mechanism, causes all modemsettings to revert to factory default values.

2.1.3. Automatic Reset (DS1818)

The DS1818 is a small, low-cost device that monitorsthe voltage on VD and an external reset pushbutton. IfVD drops below 3.0 V, the DS1818 provides a 220 msactive-low reset pulse. On powerup, the DS1818 alsooutputs an active low reset pulse for 220 ms after VDreaches 90% of the nominal 3.3 V value. The DS1818outputs a 220 ms reset pulse any time the power supplyvoltage exceeds the 3.3 V ±10% window.

2.1.4. Manual Reset

The manual reset switch (S1) performs a power-onreset. This resets the Si2493/57/34/15/04 to factorydefaults without turning off power. Pressing S1 activatesthe reset monitor in the DS1818 and produces a 220 msactive low reset pulse.

2.1.5. EEPROM Enable (FT Only)

Connecting JP34 and JP35 enables the optionalEEPROM, U5. See “AN93: Si2457/Si2434/Si2415/Si2404 Modem Designer’s Guide” for programmingdetails.

2.1.6. Interface Selection

The serial interface of the Si2493/57/34/15/04-EVB canbe connected to a computer, terminal, embeddedsystem, or any other data terminal equipment (DTE) viaa standard RS-232 interface, USB interface, or througha direct TTL serial interface.

The Si2493/57/34/15/04 can be tested as a standarddata modem by connecting the Si2493/57/34/15/04-EVB to a personal computer or other DTE power supplyand a phone line. A PC can communicate with theSi2493/57/34/15/04-EVB using a standard terminalprogram, such as HyperTerm or ProComm.

Jumper settings determine how the Si2493/57/34/15/04-EVB is connected to the DTE.

2.1.7. RS-232 Interface

This operation mode uses the standard factory jumpersettings illustrated in Figure 1 on page 3. The MaximMAX3237 transceiver interfaces directly with the TTLlevels available at the serial interface of the Si2493/57/34/15/04 and, using internal charge pumps, makesthese signals compatible with the RS-232 standard. TheRS-232 transceiver on the Si2493/57/34/15/04-EVB cancommunicate at rates between 300 bps and 1 Mbps.This simplifies the connection to PCs and other dataterminal equipment (DTE). The signals available on theSi2493/57/34/15/04-EVB serial interface (DB9connector) are listed in Table 3.

2.1.8. USB InterfaceThe USB cable connects to J10 on the motherboardand provides both data and power. Installing a jumperon JP23 enables the USB interface and disables theRS-232 interface. The USB interface is provided byU12. A USB driver for this chip is available for most PCand MAC operating systems on the CD.

Si2493/57/34/15/04

10 Rev. 0.7

2.1.9. Direct Access Interface

While the motherboard supplies power through J8, J9,or USB, power-on reset, and an RJ–11 jack for themodem, the direct access interface (J103) is used toconnect the motherboard to an embedded system. J103provides access to all Si2493/57/34/15/04 signalsavailable on the daughter card.

It is necessary to remove the jumper on JP23 to disableboth the RS-232 and USB interface and prevent signalcontention.

2.1.10. PCM Interface (24-Pin FT Only)

The Si2493/57/34/15/04 PCM interface can bedemonstrated using the voice motherboard, not with thisEVB.

2.1.11. AOUT Call Progress Audio Output

Call progress audio output is provided by the Si2493/57/34/15/04 on the AOUT pin as a PWM signal. This signalallows the user to monitor call progress signals, such asdial tone, DTMF dialing, ring, busy signals, and modemnegotiation. Control of this signal is provided by ATcommands and register settings described in theintroduction. The AOUT signal is connected to an onboard amplifier, for a high-quality output. AOUT canalso be connected to a summing amplifier or multiplexerin an embedded application as part of an integratedaudio system.

2.1.11.1. AOUT Audio Processing

The AOUT signal discussed in this section leaves theSi2493/57/34/15/04 is processed (demodulated) by ahigh pass filter: (R133,134,135, and C24, C25, 26,C27). It is critically important to not put a dc load on theAOUT pin since the pin also acts as a modem featurecontrol on reset and is internally weakly pulled up. Anyunintentional dc load on AOUT prevents proper

operation of the modem. See “AN93: Si3457/34/15/04Modem Designer’s Guide” for more details on thefeatures controlled by pin strapping.

Since this PWM signal swings rail to rail and is simplyfiltered by a low pass filter to acquire the audio. It isimportant to keep the power supply to the modem freeof noise in the audio spectrum.

2.1.11.2. The Audio Output Amplifier (LM4819)

The Power amplifier on the EVB is powered by a currentlimited 4.2 V supply. The current limit is implemented inthe EVB because it is intended for HW/SWdevelopment and is not needed for a production design.This amplifier can drive an 8 speaker with 200 mW ofCall progress audio (i.e., ISOmodem's call progressdialing and negotiation tones).

The power amplifier itself is a low cost, rugged H bridgetype device. There are several pin compatible designsfrom multiple vendors that can provide alternate price/power tradeoffs for this amplifier. This power amp canbe shut down by removing jumper JP12. The signal atJP12 can also be tied to a control signal to allow thehost to shut down the amplifier. The customer canchange the values of R172 and R173 when integratingthe EVB to his system, but should keep the RC formedby C37 and R173 at a 50 Hz or higher corner to avoid apower-on thump.

2.1.11.3. The Call Progress Speaker

The Call progress speaker, Regal RE-2308-NL isconnected to the amplifier via a jumper, JP14. If anotherspeaker is to be connected then it is necessary toremove JP14 and connect the external speaker to JP11,Pins 1 and 4. It is important to remember that thespeaker signal is differential. Both the output pins aredriven outputs and must not be grounded.

Table 3. DB9 Pin Connections

J1 Name J1 Symbol J1 Pin Si2493/57/34/15/04 Pin

Si2493/57/34/15/04 Name

Carrier Detect CD 1* See note DCD/EESD

Received Data RXD 2 9 RXD

Transmit Data TXD 3 10 TXD

Data Terminal Ready DTR 4* See note ESC/RI

Signal Ground SG 5 6 GND

Data Set Ready DSR 6* See note INT/AOUT

Ready to Send RTS 7* See note RTS/RXCLK

Clear to Send CTS 8 11 CTS

Ring Indicator RD 9* 17 RI

*Note: JP6 jumper option.

Si2493/57/34/15/04

Rev. 0.7 11

2.2. Modem Daughter Card OperationThe Si2493/57/34/15/04URT-EVB daughter card is acomplete modem solution perfectly suited for use in anembedded system. The daughtercard contains both themodem system-side chip and the isolated line interface(DAA).

The daughter card requires a 3.3 V supply capable ofproviding at least 35 mA and communicates with thesystem via LVCMOS/TTL-compatible digital signals onJP1. The RJ-11 jack (TIP and RING) is connected viaJP2. Be sure to provide the proper power-on reset pulseto the daughter card if it is used in the stand-alonemode.

2.2.1. Reset Requirements

The Si2493/57/34/15/04 ISOmodem® daughter cardmust be properly reset at powerup. The reset pin (pin 8)of the Si2493/57/34/15/04 (JP103, J101 pin 13) must beheld low for at least 5.0 ms after power is applied andstabilized to ensure the device is properly reset.

2.2.2. Crystal Requirements

Clock accuracy and stability are important in modemapplications. To ensure reliable communication betweenmodems, the clock must remain within ±100 ppm of thedesign value over the life of the modem. The crystalselected for use in a modem application must have afrequency tolerance of less than ±100 ppm for thecombination of initial frequency tolerance, drift over thenormal operating temperature range, and five yearaging. Other considerations, such as productionvariations in PC board capacitance and the tolerance ofloading capacitors, must also be taken into account.

2.2.3. Protection

The Si2493/57/34/15/04-EVB meets or exceeds all FCCand international PTT requirements andrecommendations for high-voltage surge and isolationtesting without any modification. The protection/isolationcircuitry includes C1, C2, C8, C9, FB1, FB2, and RV1.The PCB layout is also a key “component” in theprotection circuitry. The Si2493/57/34/15/04-EVBprovides isolation to 3 kV. Contact Silicon Laboratoriesfor information about designing to higher levels ofisolation.

Si2493/57/34/15/04

12 Rev. 0.7

3. Design

The following sections contain the schematics, bill of materials, and layout for the Si2493/57/34/15/04 including thedaughter card and motherboard.

The

se c

ompo

nent

s ar

e fo

r in

tern

al S

ilabs

use

onl

y.

�������

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No

R103

R106

R101

No

No

No

No

No

No

Yes

No

No

No

Yes

PKG_16.11 & PKG_24.15

PKG_16.3 & PKG_24.4

PKG_16.15 & PKG_24.23

PKG_16.7 & PKG_24.11

PKG_24.16

R102

No

No

Yes

Yes

Yes

No

Yes

X XNo

No

Yes

SPI 32 kHz

SPI 27 MHz

SPI 4.9252 MHz

Pin11

Pin3

Pin15

Pin7

Pin15

Pin23

Pin11

R104

R106

R101

R102

No

Yes

X X

No

Yes

No

Yes

No

Yes

Pin16

16 p

in s

ys s

ide

str

appi

ng t

able

UART 4.9152 MHz

UART 27 MHz

UART 32 kHz

Parallel

PKG_24.17

R105

Pin17

XX

XX

Parallel

27 Mhz

4.9152 MHz

SPI

SPI

SPI

No

Yes

No

Yes

No

No

Yes

27 Mhz

Yes

X4.9152 MHz

32.768 kHz

No

No

No

No

UART

No

Yes

32.768 kHz

X

No

No

UART

No

No

No

No

No

UART

No

No

Yes

4.9152 MHz

27 Mhz

24 p

in s

yste

m s

ide

stra

ppin

g ta

ble

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��

%��#����$

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�'( )��

�( �*�

CTSb

AOUT_INTb

INTb

RIb

DCDb

CTSb

AOUT_INTb

FSYNCH(RI)

DCDb

SD

O_E

EC

LK_R

TS

b

DC

Db

ES

C

AO

UT

_IN

Tb

RX

D

RE

SE

Tb

XT

ALI

XT

ALO

RX

DR

TS

b

RE

SE

Tb

DC

Db

FS

YN

CH

RT

Sb

INT

b

ES

C

RIb

SD

I_E

ES

D

AO

UT

_IN

Tb

CLK

OU

T_E

EC

Sb_

AO

CLK

OU

T_E

EC

Sb_

AO

TX

DC

TS

b

TX

DC

TS

b

FS

YN

CH

SD

O_E

EC

LK_R

TS

b

SD

O_E

EC

LK_R

TS

b

SD

I_E

ES

DR

Ib

AO

UT

_IN

Tb

FS

YN

CH

INT

b

ES

C

DC

Db

RIb

SD

I_E

ES

D

VD

A

XT

ALO

XT

ALI

XT

ALO

AO

UT

_IN

Tb

CT

Sb

DC

Db

FS

YN

CH

INT

bR

IbVD

A

VD

B

RX

DT

XD

CT

Sb

XT

ALI

RE

SE

Tb

C1A

C2A

C1A

C2A

VD

D

VD

D

VD

D

VD

D

R10

110

KR

101

10K

C41

33pF

C41

33pF

R12

1N

IR

121

NI

R18

1.2K

R18

1.2K

R11

120

0R

111

200

R12

0N

IR

120

NI

FB

5F

B5

C51

0.22

uFC

510.

22uF

R10

410

KR

104

10K

R10

210

KR

102

10K

C56

0.1u

FC

560.

1uF

R10

310

KR

103

10K

C52

0.1u

FC

520.

1uF

R10

510

KR

105

10K

R11

220

0R

112

200

U13

Si2

4xx-

16 p

inU

13S

i24x

x-16

pinCLK

IN/X

TA

LI1

XT

ALO

2

RIb

3

VDD3.34

RX

D_S

PI_

MIS

O5

TX

D_S

PI_

MO

SI

6

CT

Sb_

SP

I_S

CLK

7

RE

SE

T8

C2A

9

C1A

10

INT

b11

GND12

VA

13

ES

C14

DC

Db

15

RT

Sb_

SP

I_C

Sb

16

J1

SO

CK

ET

8x2

J1

SO

CK

ET

8x2

11

22

33

44

55

66

77

88

99

1010

1111

1313

1515

1212

1414

1616

C53

0.22

uFC

530.

22uF

C40

33pF

C40

33pF

C55

0.1u

FC

550.

1uF

C54

1uF

C54

1uF

Y3

27 M

Hz

Y3

27 M

Hz

GN

D2

VC

C4

OU

T3

NC

1

C50

0.1u

FC

500.

1uF

R10

610

KR

106

10K

R11

020

0R

110

200

Y1B

32.7

68K

Hz

Y1B

32.7

68K

Hz

U12

Si2

493

U12

Si2

493

CLK

IN/X

TA

LI1

XT

ALO

2

CLK

OU

T/E

EC

Sb/

A0

3

FS

YN

CH

/D6

4

VD3.35

GND6

VD

A7

RT

Sb/

SP

I_C

Sb/

D7

8

VD

B19

GND20

VD 3.321

C2A

13

C1A

14

ES

C/D

322

DC

Db/

D4

23S

DO

/EE

CLK

/D5

24

CT

S/S

PI_

SC

LK/C

Sb

11

RX

D/S

PI_

MIS

O/R

Db

9

TX

D/S

PI_

MO

SI/W

Rb

10

RE

SE

T12

RIb

/D1

17

SD

I/EE

SD

/D2

18

AO

UT

/INT

b15

INT

b/D

016

Y1

4.91

52M

Hz

Y1

4.91

52M

Hz

Fig

ure

8.i2

493/

57/3

4/15

/04

Sch

emat

ic

Si2493/57/34/15/04

Rev. 0.7 13

Bias

Ring Detect/CID/Voltage monitoring

DC Term

Add

0.0

20 to

0.0

30 s

q.in

ches

of

Cu

at a

lltr

ansi

stor

col

lect

ors

Place C3 near D1

No

GN

D o

r I_

GN

Dco

pper

pla

nes

in D

AA

se

ctio

n.

TIP

RING

Kee

p 5

mm

cre

epag

eru

les

betw

een

this

DA

A

sect

ion

and

all e

lse.

C1A

C2A

I_G

ND

I_G

ND

I_G

ND

I_G

ND

R12

56.2

R12

56.2

C10

0.01

uF

C10

0.01

uF

Q5

MM

BT

A06

LT1

Q5

MM

BT

A06

LT1

Q3

MM

BT

A42

LT1

Q3

MM

BT

A42

LT1

C4X

1uF

25V

X8R

C4X

1uF

25V

X8R

RV

1

P31

00S

B

RV

1

P31

00S

B

Q1

MM

BT

A42

LT1

Q1

MM

BT

A42

LT1

FB

1

600

Ohm

FB

1

600

Ohm

R2

150

R2

150

R4

2.49

K

R4

2.49

K

C5

0.1u

FC

0603

C5

0.1u

FC

0603

C6

0.1u

FC

0603

C6

0.1u

FC

0603

C2

33pF

C2

33pF

C8

680p

FC

868

0pF

-+

D1

HD

04

-+

D1

HD

04

Q2

MM

BT

A92

LT1

Q2

MM

BT

A92

LT1

C9

680p

FC

968

0pF

R6

100K

R6

100K

FB

2

600

Ohm

FB

2

600

Ohm

R11

73.2R11

73.2

C1

33pF

C1

33pF

R13

56.2

R13

56.2

C7

2.7n

FC

72.

7nF

+

C4

1uF

+

C4

1uF

R15 0R15 0

Z1

43V

Z1

43V

R7

20M

R7

20M

J2T

SM

-104

-01-

T-S

V4X

1 H

eade

r

J2T

SM

-104

-01-

T-S

V4X

1 H

eade

r

Q4

MM

BT

A06

LT1

Q4

MM

BT

A06

LT1

R8

20M

R8

20M

R3

3.65

K

R3

3.65

K

C3

0.01

uF

C3

0.01

uF

R9

1MR9

1M

R5

100K

R5

100K

R1

1.07

KR

11.

07K

R16 0

R16 0

U2

Si3

018

U2

Si3

018 Q

E1

DC

T2

RX

3

IB4

C1B

5

C2B

6

VR

EG

7

RN

G1

8

DC

T2

16IGND

15

DC

T3

14

QB

13

QE

212

SC11

VR

EG

210

RN

G2

9

R10

536R

10

536

Fig

ure

9.S

i301

8/10

DA

A S

chem

atic

Si2493/57/34/15/04

14 Rev. 0.7

4. Bill of Materials: Si24xx Daughter Card

Table 4. Si24xx Daughter Card Bill of Materials

Item Qty Ref Value Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr

1 2 C1, C2 33 pF Y2 250 V ±10% Y2 C1808 SCC1808X330K502T Holy Stone

2 1 C3 0.01 µF 250 V ±10% X7R C0805 GRM21BR72E103KW03L Murata

3 1 C4 1 µF 50 V ±20% Alum_Elec C3.3X3.3MM EEE1HS010SR Panasonic

4 2 C5, C6 0.1 µF 16 V ±20% X7R C0603 C0603X7R160-104M Venkel

5 1 C7 2.7 nF 50 V ±20% X7R C0603 C0603X7R500-272M Venkel

6 2 C8, C9 680 pF Y2 250 V ±10% Y2 C1808 SCC1808X681K502T Holy Stone

7 1 C10 0.01 µF 16 V ±20% X7R C0603 C0603X7R160-103M Venkel

8 2 C40, C41

18 pF 50 V ±5% COG C0603 C0603COG500-180J Venkel

9 3 C50, C52, C56

0.1 µF 10 V ±20% X7R C0603 C0603X7R100-104M Venkel

10 2 C51, C53

0.22 µF 6.3 V ±10% X5R C0603 C0603X7R6R3-224K Venkel

11 1 C54 1 µF 25 V ±10% X5R C0603 C0603X5R250-105K Venkel

12 1 D1 HD04 0.8 A 400 V BRIDGE MiniDIP4 HD04-T Diodes Inc.

13 3 FB1, FB2, FB5

600 200 mA SMT L0603 BLM18AG601SN1 Murata

14 1 J1 SOCKET 8x2 SOCKET SOCKETX8-100-SMT SSW-108-22-G-D-VS Samtec

15 1 J2 4X1 Header_0 CONN1X4-100-SMT TSM-104-01-T-SV Berg

16 2 Q1 Q3 MMBTA42LT1 200 mA 300 V NPN SOT23-BEC MMBTA42LT1 On Semi

17 1 Q2 MMBTA92LT1 100 mA 300 V PNP SOT23-BEC MMBTA92LT1 On Semi

18 2 Q4 Q5 MMBTA06LT1 500 mA 80 V NPN SOT23-BEC MMBTA06LT1 On Semi

19 1 RV1 P3100SB 275 V Sidactor DO-214AA-NP P3100SBL Littelfuse

20 1 R1 1.07 k 1/2 W ±1% ThickFilm R2010 CR2010-2W-1071F Venkel

21 1 R2 150 1/16 W ±5% ThickFilm R0603 CR0603-16W-151J Venkel

22 1 R3 3.65 k 1/2 W ±1% ThickFilm R2010 CR2010-2W-3651F Venkel

23 1 R4 2.49 k 1/2 W ±1% ThickFilm R2010 CR2010-2W-2491F Venkel

24 2 R5, R6 100 k 1/16 W ±5% ThickFilm R0603 CR0603-16W-104J Venkel

25 2 R7, R8 20 M 1/8 W ±5% ThickFilm R0805 CR0805-8W-206J Venkel

26 1 R9 1 M 1/16 W ±1% ThickFilm R0603 CR0603-16W-1004F Venkel

27 1 R10 536 1/4 W ±1% ThickFilm R1206 CR1206-4W-5360F Venkel

28 1 R11 73.2 1/2 W ±1% ThickFilm R2010 CR2010-2W-73R2F Venkel

29 2 R12, R13

56.2 1/16 W ±1% ThickFilm R0603 CR0603-16W-56R2F Venkel

30 2 R15, R16

0 1 A ThickFilm R0603 CR0603-16W-000 Venkel

31 2 R120, R121

0 1 A ThickFilm R0603 CR0603-16W-000 Venkel

32 1 R18 1.2 k 1/10 W ±5% ThickFilm R0603 CR0603-10W-121J Venkel

33 4 R101, R102, R103, R104, R106

10 k 1/10 W ±5% ThickFilm R0603 CR0603-10W-103J Venkel

Si2493/57/34/15/04

Rev. 0.7 15

34 1 R105 1 k 1/10 W ±5% ThickFilm R0603 CR0603-10W-102J Venkel

35 3 R110, R111, R112

200 1/10 W ±5% ThickFilm R0603 CR0603-10W-2000J Venkel

36 1 U2 Si3018 300 V LineSide SO16N6.0P1.27 Si3018-F-GS SiLabs

37 1 U12 Si24xx ISOMODEM TSSOP24N6.4P0.65 Si2493-E-FT SiLabs

38 1 U13 Si24xx-16 pin 16pin SOIC 2493 Silicon Laboratories

39 1 Y1B (Y1, Y3)

32.768 kHz XTAL-3X8-LD ECS–.327–12.5–8X ECS International

40 1 Z1 43 V 500 mW 43 V Zener SOD-123 BZT52C43-7-F Diodes Inc.

Table 4. Si24xx Daughter Card Bill of Materials (Continued)

Item Qty Ref Value Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr

Si2493/57/34/15/04

16 Rev. 0.7

"RS232"

Connectors for ISOModem module.

TXD

GPIO3

RXD

NC

CTS

NC

RESETb

GND

NC

VD

GPIO4

GPIO5

NC

NC

Si2401

GPIO2

GPIO1

TXD/WR

ESC/D3

RXD/RD

SDI/EESD/D2

CTSb/CS

RIb/D1

RESETb

GND

INTb/D0

VD

AOUT/INTb

FSYNCH/D6

RTSb/D7

CLKOUT/EECS/A0

Si24xx

DCDb/D4

SDO/EECLK_RTSb/D5

15

16

13

14

11

12

9 10

7 861 3 4 5

Net names correspond to Si24xx.

See table for Si2401 equivalents

2

JP1/3

"USB"

RXD

TXD

CTSb

CDRIb

RTSb

DTRb

"FSYNCHb"

"SDO_EECLK_RTSb"

"SDI_EESD"

DSRb

"SOIC16: 1-2, 5-6, 7-8, 11-12, 14-15"

"TSSOP24: 1-2, 4-5, 7-8, 10-11, 13-14"

"Recommended J6 settings"

"RXD"

"TXD"

"CTSb"

"RESETb"

"RTSb"

"DCDb"

"INT"

"AOUT_INTb"

"RIb"

"ESC"

"CLKOUT_EECSb"

TSSOP24

SOIC16

SOIC16

24xx

24xx

2401

SDI/EESD

NC

NC

FSYNCH

RIb

RIb

RIb

NC

NC

SDO/EECLK

RTSb

GPIO1

AOUT/INTb

INTb

INTb/AOUT

TSSOP24

24xx

SOIC16

24xx

SOIC16

2401

DCD

DCD

DCD

NC

NC

RIb

ESC

ESC

ESC

NC

NC

INTb

NC

NC

RTSb

Silk Screen Text

"GND"

"+3.3V"

JP6 Left Pin Signals

JP6 Right Pin Signals

Lea

ded

Select

High

Chooses

B2 port

To H

ost

Inte

rfac

e P

age

To A

OU

T ci

rcui

t on

Cal

lP

rogr

ess

Pag

e

NC or INTb

nc or INTb/AOUT

Table on back

silkscreen for

JP6

RS-232

Si24xx 16 pin

Si2401

CD

DCD or NC

DCD or nc

RI

NC or RIb

NC or RIb

DTR

ESC or NC

ESC or NC

RTS

NC or RTSb

nc or GPIO1

DSR

Si24xx 24 pin

INTb or AOUT/INTb

DCD or SDI/EESD

RI or FSYNCH

ESC or RIb

RTS or SDO/EECLK

LEFT

LEFT

LEFT

RIGHT

RIGHT

RIGHT

"J6 Jumper Connectiveity"

SILABS

Internal

Use Only

SPI_CSb

SPI mode

CLK

OU

T_E

EC

Sb

FS

YN

CH

bS

DI_

EE

SD

CLK

OU

T_E

EC

Sb

CT

Sb

RE

SE

Tb

RXD

DC

Db

ES

C

RT

S_M

CD

_M DT

R_M

DS

R_M

AO

UT

_IN

Tb

VC

C_M

odem

DC

Db

RIb

FS

YN

CH

b

RI_

M

RT

Sb

TXD

INT

b

SD

I_E

ES

D

ES

C

SD

I_E

ES

D

FS

YN

CH

b

RIb

RIb

SD

O_E

EC

LK_R

TS

b

SD

O_E

EC

LK_R

TS

b

SD

I_E

ES

D

ES

C

RT

Sb

DC

Db

RIb

INT

b

CT

Sb

INT

b

TXD

AO

UT

_IN

Tb

RXD

CLK

OU

T_E

EC

Sb

FS

YN

CH

b

RXD

TXD

RE

SE

Tb

CT

Sb

RT

Sb

SE

LEC

TS

DO

_EE

CLK

_RT

Sb

SD

I_E

ES

D

CD

_M RI_

M DT

R_M

RT

S_M

DS

R_M

SD

O_E

EC

LK_R

TS

b

AO

UT

_IN

Tb

FS

YN

CH

bC

LKO

UT

_EE

CS

b

SD

I_E

ES

D

EN

AB

LE_M

UXb

FS

YN

CH

b

CLK

OU

T_E

EC

Sb

TXD

_T

RT

S_T

DT

R_T

TXD

_U

RT

S_U

DT

R_U

RXD

_T

CT

S_T

DS

R_T

CD

_T

RI_

T

RXD

_U

CT

S_U

DS

R_U

CD

_U RI_

U

RE

SE

Tb

AO

UT

_IN

Tb

+3.3

V

+3.3

V

+3.3

V

+3.3

V

+3.3

V

+3.3

V

+3.3

V

+3.3

V

+3.3

V

+3.3

V

+3.3

V

+3.3

V

C98

0.1u

FC

980.

1uF

D44

CD

D44

CD

FB

11F

B11

R15

968

1R

159

681

J103

8X2

Shr

oude

d H

eade

rJ1

038X

2 S

hrou

ded

Hea

der

11

22

33

44

55

66

77

88

99

1010

1111

1313

1515

1212

1414

1616

TP

7T

urre

tG

ND

TP

7T

urre

tG

ND

D48

RE

D

DS

RD

48

RE

D

DS

R

TP

19T

P19

C72

0.1u

FC

720.

1uF

D45

RI

D45

RI

R16

068

1R

160

681

JP35

EE

En.

JP35

EE

En.

12

C69

1uF

C69

1uF

TP

20T

P20

TP

13

Isen

seR

ED

TP

13

Isen

seR

ED

R16

968

1R

169

681

JP2

4X1

Soc

ket

JP2

4X1

Soc

ket

R59

1.0R

59

1.0

D46

DT

RD

46D

TR

J6

HE

AD

ER

5x3

J6

HE

AD

ER

5x3

1 23

4 56

7 89

10 11 131512

14

R17

068

1R

170

681

C70

560p

FC

7056

0pF

R40

10K

R40

10K

JP33 A

utob

aud

Dis

. Str

ap

JP33 A

utob

aud

Dis

. Str

ap

12

TP

21T

P21

JP23

JP23

J101

HE

AD

ER

8x2

J101

HE

AD

ER

8x2

11

22

33

44

55

66

77

88

99

1010

1111

1313

1515

1212

1414

1616

D41

RXD

D41

RXD

R43

10K

R43

10K

U26

74LC

X541

U26

74LC

X541

A1

2

A2

3

A3

4

A4

5

A5

6

A6

7

A7

8

A8

9

G1

1

G2

19

Y1

18

Y2

17

Y3

16

Y4

15

Y5

14

Y6

13

Y7

12

Y8

11

VCC20

GND10

C73

560p

FC

7356

0pF

R10

120

0R

101

200

D54

BA

V23

A

D54

BA

V23

A

R39

10K

NO

PO

PR

3910

KN

OP

OP

R48

10K

R48

10K

J5B

RJ-

11J5

BR

J-11

7 8 9 10 11 12

R52

10K

R52

10K

TP

22T

P22

R16

268

1R

162

681

TP

16T

P16

TP

12

+3.3

VR

ED

TP

12

+3.3

VR

ED

D42

TXD

D42

TXD

R15

568

1R

155

681

R16

368

1R

163

681

TP

5R

ING

BLU

ET

P5

RIN

G

BLU

E

TP

8T

urre

tG

ND

TP

8T

urre

tG

ND

C71

0.1u

FC

710.

1uF

J5A

RJ-

11

PS

TN

LIN

E

TE

LEP

HO

NE

J5A

RJ-

11

PS

TN

LIN

E

TE

LEP

HO

NE

1 2 3 4 5 6

J7 NO

PO

P

J7 NO

PO

P

11

22

33

44

55

TP

23T

P23

R15

668

1R

156

681

U13

IDT

74C

BT

LV32

57U

13ID

T74

CB

TLV

3257

GND8

VCC16

1B1

2

2B1

5

3B1

11

4B1

14

1A4

2A7

3A9

4A12

1B2

3

2B2

6

3B2

10

4B2

13

OE

15

S1

TP

6T

IP

BLU

ET

P6

TIP

BLU

E

TP

9T

urre

tG

ND

TP

9T

urre

tG

ND

U5

EE

PR

OM

32K

U5

EE

PR

OM

32K

/CS

1M

ISO

2M

OS

I5

SC

LK6

/WP

3

GND4

/HO

LD7

VCC8

D47

RT

SD

47R

TS

D43

CT

SD

43C

TS

R41

10K

R41

10K

R15

768

1R

157

681

D52

RE

D

US

B

D52

RE

D

US

B

U14

IDT

74C

BT

LV32

57U

14ID

T74

CB

TLV

3257

GND8

VCC16

1B1

2

2B1

5

3B1

11

4B1

14

1A4

2A7

3A9

4A12

1B2

3

2B2

6

3B2

10

4B2

13

OE

15

S1

JP34

EE

Str

apJP

34E

E S

trap

12

C74

1uF

C74

1uF

TP

25T

urre

tG

ND

TP

25T

urre

tG

ND

TP

17T

P17

R42

10K

R42

10K

TP

24T

P24

R15

868

1R

158

681

C75

0.1u

FC

750.

1uF

D53

RE

D

RS

232

D53

RE

D

RS

232

Fig

ure

10.M

oth

erb

oar

d M

od

em In

terf

ace

Sch

emat

ic

Si2493/57/34/15/04

Rev. 0.7 17

"Do

not g

ound

spea

ker+

or

Spe

aker

-A

OU

T_

INT

b

+4

.7V

+4

.7V

JP1

4E

n. L

cl. S

pe

ake

rJP

14

En.

Lcl

. Sp

eak

er

12

R3

11

0K

R3

11

0K

U2

7

LM

48

19

U2

7

LM

48

19

SH

UT

DO

WN

1

BY

PA

SS

2

IN+

3

IN-

4

VO

28

GND7

VDD6

VO

15

R3

31

KR

33

1K

R1

72

20

.0K

R1

72

20

.0K

JP1

2P

wr

Am

p E

n.JP

12

Pw

r A

mp

En.

12

C3

71

uFC

37

1uF

C2

7

0.1

uF

C2

7

0.1

uFC

23

1uF

C2

31

uF

R3

51

KR

35

1K

C2

4

0.1

uF

C2

4

0.1

uF

R1

75

0R

17

50

LS

1

SP

EA

KE

R

LS

1

SP

EA

KE

R

C2

6

0.1

uF

C2

6

0.1

uF

C2

5

0.1

uF

C2

5

0.1

uF

C2

11

uFC

21

1uF

JP1

1

DIF

F S

PK

R O

UT

JP1

1

DIF

F S

PK

R O

UT

R1

74

20

.0K

R1

74

20

.0K

R3

41

KR

34

1K

C9

71

nFC

97

1nF

R1

73

20

.0K

R1

73

20

.0K

Fig

ure

11.A

ud

io A

mp

lifie

r S

chem

atic

Si2493/57/34/15/04

18 Rev. 0.7

RE

SE

Tb

+3

.3V

VC

C_

US

B+

4.7

V

J8

7-1

2V

AC

/DC

PW

R

J8

7-1

2V

AC

/DC

PW

R

12

R1

03

1.6

R1

03

1.6

R1

05

1.6

R1

05

1.6

D4

9

MM

BD

30

04

S-7

-F

D4

9

MM

BD

30

04

S-7

-F

D1

1

ST

PS

14

0Z

SO

D-1

23

D1

1

ST

PS

14

0Z

SO

D-1

23

D5

0R

ED

+3

.3V

PW

R

D5

0R

ED

+3

.3V

PW

R

D1

3S

TP

S1

40

ZD

13

ST

PS

14

0Z

U1

8

DS

18

18

U1

8

DS

18

18

VC

C2

GN

D3

RS

T1

U3

LT

19

63

A-3

.3 V

SO

T2

23

U3

LT

19

63

A-3

.3 V

SO

T2

23

GN

DIN

OU

TG

ND

C5

1

0.0

1uF

25

V

C5

1

0.0

1uF

25

V

C6

61

0uF

C6

61

0uF

C4

8

0.1

uF5

0V

C4

8

0.1

uF5

0V

FB

7

60

0 O

hm

FB

7

60

0 O

hmC

96

0.1

uF

C9

6

0.1

uF

FB

6

60

0 O

hm

FB

6

60

0 O

hm

-+

D1

2

Brid

ge

Re

ctifi

er

-+

D1

2

Brid

ge

Re

ctifi

er

C4

31

uFC

43

1uF

R5

70

.05

R5

70

.05

C4

2

0.0

1uF

25

V

C4

2

0.0

1uF

25

V

R1

61

68

1R

16

16

81

C4

91

0uF

C4

91

0uF

+C4

4

47

0uF

+C4

4

47

0uF

U1

0

TO

26

3-3

NL

M2

93

7E

S-5

.0U

10

TO

26

3-3

NL

M2

93

7E

S-5

.0

GN

DIN

OU

TG

ND

S1

RE

SE

T

S1

RE

SE

T

R1

02

1.3

3K

R1

02

1.3

3K

J9

7-1

2V

AC

/DC

PW

R

J9

7-1

2V

AC

/DC

PW

R

3 2 1

Fig

ure

12.P

ow

er S

up

ply

Sch

emat

ic

Si2493/57/34/15/04

Rev. 0.7 19

RS

-232

, F

emal

e,F

ront

Vie

w

US

BKe

ep V

ery

Clos

e

RX

D_

23

2

CT

S_

23

2

RD

_2

32

TX

D_

23

2

DT

R_

23

2

DS

R_

23

2

RT

S_

23

2

CD

_2

32

RX

D_

T

CT

S_

T

DS

R_

T

CD

_T

RI_

T

TX

D_

T

RT

S_

T

DT

R_

T

RI_

UC

D_

U

DS

R_

UT

XD

_U

RX

D_

U

CT

S_

UR

TS

_U

DT

R_

U

+3

.3V

+3

.3V

VC

C_

US

B

DN515V DN515V

C5

8

0.1

uF

C5

8

0.1

uF

R1

12

10

KR

11

21

0K

DN415V DN415V

DN115V DN115V

FB

8

60

0 O

hmB

LM

18

AG

60

1S

N1

FB

8

60

0 O

hmB

LM

18

AG

60

1S

N1

R11010K R11010K

U1

1

MA

X3

23

7

U1

1

MA

X3

23

7

C2+

1

C2-

3

C1+

28

C1-

25

V+

27

V-

4

T1IN

24

T2IN

23

T3IN

22

T4IN

19

T5IN

17

R1O

UT

B16

R1O

UT

21

R2O

UT

20

R3O

UT

18

EN

13

GND2

T1O

UT

5

T2O

UT

6

T3O

UT

7

T4O

UT

10

T5O

UT

12

VCC26

R1IN

8

R2IN

9

R3IN

11

MB

AU

D15

SH

DN

14

C6

2

0.1

uF

C6

2

0.1

uF

DN815V DN815VC5

3

0.1

uF

C5

3

0.1

uF

DN315V DN315V

C5

25

60

pF

C5

25

60

pF

R10910K R10910K

J10

DB

9

J10

DB

9

CD

(O)

1

RX

D(O

)2

TX

D(I

)3

DT

R(I

)4

SG

5

DS

R(O

)6

RT

S(I

)7

CT

S(O

)8

RD

(O)

9

MH10

MH11

D1

4D

14

C6

3 0.1

uF

C6

3 0.1

uF

DN715V DN715V

DN215V DN215V

R11110K R11110K

U1

2

CP

21

02

U1

2

CP

21

02

RE

GIN

7

VDD6

GND3

VB

US

8

D-

5

D+

4

CT

S23

RT

S24

RX

D25

TX

D26

DS

R27

DT

R28

DC

D1

RI

2

SU

SP

EN

D11

SU

SP

EN

D12

RS

T9

GNDEPAD

D1

5D

15

C5

70

.1uF

C5

70

.1uF

C6

1

0.1

uF

C6

1

0.1

uF

J11

US

B T

ype

BJ1

1U

SB

Typ

e B

+V

1

D-

2

D+

3

GN

D4

SH5SH6

C5

9

0.1

uF

C5

9

0.1

uF

C5

60

.1uF

C5

60

.1uF

DN615V DN615V

FB

9

60

0 O

hmB

LM

18

AG

60

1S

N1

FB

9

60

0 O

hmB

LM

18

AG

60

1S

N1

R1

08

0 NO

PO

P

R1

08

0 NO

PO

P

C5

41

uFC

54

1uF

C6

0

0.0

1uF

C6

0

0.0

1uF

C5

51

uFC

55

1uF

Fig

ure

13.R

S-2

32 In

terf

ace

and

US

B In

terf

ace

Sch

emat

ic

Si2493/57/34/15/04

20 Rev. 0.7

5. Bill of Materials: Si24xx Motherboard

Table 5. Si24xx Motherboard Bill of Materials

Item Qty Ref Value Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr

1 8 C21, C23, C37, C43, C54, C55, C69, C74

1 µF 10 V ±10% X7R C0603 C0603X7R100-105K Venkel

2 17 C24, C25, C26, C27, C53, C56, C57, C58, C59, C61, C62, C63, C71, C72, C75, C96,

C98

0.1 µF 10 V ±20% X7R C0402 C0402X7R100-104M Venkel

3 3 C42, C51, C60

0.01 µF 25 V ±10% X7R C0402 C0402X7R250-103K Venkel

4 1 C44 470 µF 25 V ±20% Alum_Elec

C10.3X10.3MM EMVE250ADA471MJA0G United Chemicon

5 1 C48 0.1 µF 50 V ±10% X7R C0603 C0603X7R500-104K Venkel

6 2 C49, C66 10 µF 16 V ±10% X5R C0805 C0805X5R160-106K Venkel

7 3 C52, C70, C73

560 pF 16 V ±10% X7R C0603 C0603X7R160-561K Venkel

8 1 C97 1 nF 100 V ±10% X7R C0603 C0603X7R101-102K Venkel

9 8 DN1, DN2, DN3, DN4, DN5, DN6, DN7, DN8

15 V 225 mW 15 V Zener, Dual

SOT23-AAK MMBZ15VDLT1G On Semi

10 2 D11, D13 STPS140Z 1.0 A 40 V Schottky SOD-123 STPS140Z ST MICRO

11 1 D12 Bridge Rectifier

0.8 A 100 V BRIDGE MiniDIP4 HD01-T Diodes Inc.

12 3 D14, D15, D49

MMBD3004S-7-F

225 mA 300 V DUAL SOT23-AKC MMBD3004S-7-F Diodes Inc.

13 11 D41, D42, D43, D44, D45, D46, D47, D48, D50, D52,

D53

RED 25 mA 1.9 V SMT, Chip LED

LED-HSMX-C170

HSMC-C170 Avago Technologies

14 1 D54 BAV23A 400 mA 200 V DUAL SOT23-KKA BAV23A Diodes Inc.

15 5 FB6, FB7, FB8, FB9,

FB11

600 Ohm 200 mA SMT L0603 BLM18AG601SN1 MuRata

16 4 HW1, HW2, HW3, HW4

spacer 2397 SPC Technology

17 4 HW5, HW6, HW7, HW8

screw NSS-4-4-01 Richco Plastic Co

Si2493/57/34/15/04

Rev. 0.7 21

18 1 JP11 HEADER 4X1

Header CONN-1X4 TSW-104-07-T-S Samtec

19 2 JP12, JP14 JUMPER Header CONN-1X2 TSW-102-07-T-S Samtec

20 1 JP23 HEADER 1x3

Header CONN-1X3 TSW-103-07-T-S Samtec

21 3 JP33, JP34, JP35

JUMPER Unshrouded

CONN-1X2 68000-402 Berg

22 1 J5 RJ-11 RJ-11 RJ11-DUAL-MTJG

MTJG-2-64-2-2-1 ADAM TECH

23 1 J6 HEADER 5x3

Header TSW-105-07-S-T Samtec

24 1 J8 CONN TRBLK 2

TERM BLK

CONN-1X2-TB 1729018 PHOENIX CONTACT

25 1 J9 Power Jack

1 A BARREL CONN-3-PWR ADC-002-1 Adam Tech

26 1 J10 DB9 D-SUB CONN-9-DBF D09S33E4GX00LF FCI

27 1 J11 USB Type B

USB CONN-USB-B 292304-1 Tyco

28 1 J101 HEADER 8x2

Header CONN2X8 16/80 pins of 9-146252-0-08

Tyco/AMP

29 1 J102 Socket 1x4 Header SSW-104-01-T-S Samtec

30 1 J103 8X2 Shrouded Header

Shrouded CONN2X8-4W 5103309-3 Tyco

31 1 LS1 SPEAKER 0.5 W Max

RE-2308-NL RE-2308-NL Regal

32 7 R31, R40, R41, R42, R43, R52,

R109, R110, R111, R112

10 k 1/10 W ±1% ThickFilm R0603 CR0603-10W-1002F Venkel

33 3 R33, R34, R35

1 k 1/16 W ±1% ThickFilm R0603 CR0603-16W-1001F Venkel

34 1 R48 100 k 1/10 W ±1% ThickFilm R0603 CR0603-10W-1003F Venkel

35 1 R57 0.05 1/4 W ±5% ThickFilm R0805 LCR0805-R050J Venkel

36 1 R59 1 1/10 W ±1% ThickFilm R0603 CR0603-10W-1R00F Venkel

37 1 R101 200 1/10 W ±5% ThickFilm R0603 CR0603-10W-2000J Venkel

38 1 R102 1.33 k 1/10 W ±1% ThickFilm R0603 CR0603-10W-1331F Venkel

39 2 R103, R105 1.6 1/4 W ±5% ThickFilm R1206 CR1206-8W-1R6J Venkel

40 11 R155, R156, R157, R158, R159, R160, R161, R162, R163, R169,

R170

681 1/10 W ±1% ThickFilm R0603 CR0603-10W-6810F Venkel

Table 5. Si24xx Motherboard Bill of Materials (Continued)

Item Qty Ref Value Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr

Si2493/57/34/15/04

22 Rev. 0.7

41 3 R172, R173, R174

20.0 k 1/16 W ±1% ThickFilm R0603 CR0603-16W-2002F Venkel

42 1 R175 0 2 A ThickFilm R1206 CR1206-4W-000 Venkel

43 1 S1 SW PUSH-BUTTON

50 mA 12 Vdc Tactile SW4N6.5X4.5-PB

101-0161-EV Mountain Switch

44 10 TP5, TP6, TP16, TP17, TP19, TP20, TP21, TP22, TP23, TP24

BLUE Loop TESTPOINT 151-205-RC Kobiconn

45 4 TP7, TP8, TP9, TP25

Turret Turret TP[12594] 2551-2-00-44-00-00-07-0 Mill-Max

46 1 TP11 RED Loop TESTPOINT 151-207-RC Kobiconn

47 1 U3 LT1963A-3.3 V

1.5 A max

LDO SOT223 LT1963AEST-3.3#PBF Linear Tech-nologies

48 1 U5 EEPROM 32K

Serial TSSOP8N6.4P0.65

25LC320A-I/ST Microchip Technology

49 1 U10 5 0.5 A max

LDO TO263-3N LM2937ES-5.0 National Semiconduc-

tors

50 1 U11 MAX3237 5.5 V RS232 TSSOP MAX3237EIPWR TI

51 1 U12 CP2102 MCU QFN28N5X5P0.5

CP2102-GM SiLabs

52 2 U13, U14 IDT74CBTLV3257

TSSOP-16 IDT74CBTLV3257 IDT

53 1 U18 DS1818 3.3 V 10% SOT-23 DS1818-10 Dallas Semi-conductor

54 1 U26 74LCX541 Buffer TSSOP20N6.4P0.65

74LCX541MTC Fairchild

55 1 U27 LM4819 350 mW SO8N6.0P1.27 LM4819M National Semiconduc-

tor

Unpopulated Components

56 1 J7 2MM, RT ANG

SHROUDED

CONN1X5-S5B-PH-SM4-TB

S5B-PH-SM4-TB JST

1 1 R39 10 k 1/10 W ±1% ThickFilm R0603 CR0603-10W-1002F Venkel

1 1 R108 0 1 A ThickFilm R0603 CR0603-16W-000 Venkel

Table 5. Si24xx Motherboard Bill of Materials (Continued)

Item Qty Ref Value Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr

Si2493/57/34/15/04

Rev. 0.7 23

Fig

ure

14.D

aug

hte

r C

ard

Pri

mar

y S

ide

Sil

kscr

een

Si2493/57/34/15/04

24 Rev. 0.7

Fig

ure

15.D

aug

hte

r C

ard

Sec

on

dar

y S

ide

Silk

scre

en

Si2493/57/34/15/04

Rev. 0.7 25

Fig

ure

16.D

aug

hte

r C

ard

Pri

mar

y S

ide

Lay

ou

t

Si2493/57/34/15/04

26 Rev. 0.7

Fig

ure

17.D

aug

hte

r C

ard

Sec

on

dar

y S

ide

Lay

ou

t

Si2493/57/34/15/04

Rev. 0.7 27

Fig

ure

18.M

oth

erb

oar

d P

rim

ary

Sid

e S

ilksc

reen

Si2493/57/34/15/04

28 Rev. 0.7

Fig

ure

19.M

oth

erb

oar

d S

ilksc

reen

(S

eco

nd

ary

Sid

e)

Si2493/57/34/15/04

Rev. 0.7 29

Fig

ure

20.M

oth

erb

oar

d P

rim

ary

Sid

e L

ayo

ut

Si2493/57/34/15/04

30 Rev. 0.7

Fig

ure

21.M

oth

erb

oar

d S

eco

nd

ary

Sid

e L

ayo

ut

Si2493/57/34/15/04

Rev. 0.7 31

Fig

ure

22.M

oth

erb

oar

d G

rou

nd

Pla

ne

Lay

ou

t

Si2493/57/34/15/04

32 Rev. 0.7

Fig

ure

23.M

oth

erb

oar

d P

ow

er P

lan

e L

ayo

ut

Si2493/57/34/15/04

Rev. 0.7 33

6. Complete Design Package on CD (See Sales Representative for Details)

Silicon Laboratories can provide a complete designpackage of the Si2493/57/34/15/04-EVB including thefollowing:

OrCad Schematics

Gerber Files

BOM

Documentation

Contact your local sales representative or SiliconLaboratories headquarters sales for orderinginformation.

Si2493/57/34/15/04

34 Rev. 0.7

DOCUMENT CHANGE LIST

Revision 0.2 to Revision 0.3 Updated Figure 15, “Daughter Card Secondary Side

Silkscreen,” on page 24.

Updated Figure 16, “Daughter Card Primary Side Layout,” on page 25.

Updated Figure 17, “Daughter Card Secondary Side Layout,” on page 26.

Updated “Bill of Materials: Si24xx Daughter Card” .

Revision 0.3 to Revision 0.4 Changed from Rev.1.0 to Rev.1.1 Daughter Card.

Revision 0.4 to Revision 0.5 Changed from Rev.3.1 to Rev.3.2 Motherboard.

Revision 0.5 to Revision 0.6 Changed from Rev.1.1 to Rev.1.2 Daughter Card.

Added FS (SOIC) Package Option.

Revision 0.6 to Revision 0.7 Changed R1.2 to 2.0 daughtercard.

Changed R32 to 5.0 motherboard.

Changed power amplifier chip and speakers.

Removed connector to SSI BUS.

Changed regulator and power on reset circuit.

Changed various jumper locations.

Si2493/57/34/15/04

Rev. 0.7 35

NOTES:

DisclaimerSilicon Laboratories intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Laboratories products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Laboratories reserves the right to make changes without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Silicon Laboratories shall have no liability for the consequences of use of the information supplied herein. This document does not imply or express copyright licenses granted hereunder to design or fabricate any integrated circuits. The products must not be used within any Life Support System without the specific written consent of Silicon Laboratories. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Laboratories products are generally not intended for military applications. Silicon Laboratories products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons.

Trademark InformationSilicon Laboratories Inc., Silicon Laboratories, Silicon Labs, SiLabs and the Silicon Labs logo, CMEMS®, EFM, EFM32, EFR, Energy Micro, Energy Micro logo and combinations thereof, "the world’s most energy friendly microcontrollers", Ember®, EZLink®, EZMac®, EZRadio®, EZRadioPRO®, DSPLL®, ISOmodem ®, Precision32®, ProSLIC®, SiPHY®, USBXpress® and others are trademarks or registered trademarks of Silicon Laboratories Inc. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. All other products or brand names mentioned herein are trademarks of their respective holders.

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