Rev. 0.4 8/11 Copyright © 2016 by Silicon Laboratories Si24xxVMB-EVB

Global Voice ISOmodem-EVB

Evaluation Board for the Si2494/39/38/37/36/35/29/19/18/17 ISOModem

Description

The Global Voice ISOmodem EVB evaluation boardprovides the system designer with an easy way ofevaluating the ISOmodem. The Voice ISOmodem EVBconsists of a motherboard with a complete removabledaughter cardThe Voice ISOmodem is a complete controller basedmodem chipset with an integrated and programmabledirect access arrangement (DAA) that meets the globaltelephone line requirements. It is available in a 24-pin or38-pin system side device and a 16-pin line side device.The hardware versions at the time of publication are:

Voice Mother Board Si24xxVMB Rev 2.0

Modem Daughter Card Si24xx2G-DC Rev 2.0

Modem Daughter Card Si24xx2G-QFN38-DC Rev 1.0

The voice daughter card is populated with the correctISOmodem system side chip (Si2494/39/38/37/36/35/29/19/18/17) and the correct line side DAA chip, theSi3018 to suit the voice applications.

The ISOmodem eliminates the need for a separate DSPdata pump, modem controller, memories, codec,isolation transformers, relays, opto-isolators and a 3-4wire hybrid. The ISOmodem is ideal for embeddedmodem and voice applications due to its small boardarea, controller based architecture, low powerconsumption and global compliance.

An onboard rectifier, filter, and voltage regulator allowthe power input to be 7.5–13 V ac or dc (either polarity)supplied through a screw terminal (J8) or a standard2 mm power jack (J9). Alternatively, power can besupplied through the USB interface (whether the USB orRS232 interface is used).

The Power Source Selection in automatic, while thesignaling port is selected by a jumper (JP23).

The evaluation board audio power amplifier can drivean external speaker for either call progress monitoringor speakerphone function. A small onboard speaker,suitable for call progress monitoring, is installed.

Please note that fax modem versions listed in the titlerequire a software driver in order to implement fax send/receive functionality. The driver must be compliant withthe Silicon Labs ISOmodem and with applicable ITU-Tstandards (e.g., T.30, T.31, T.4 and T.6) Contact SiliconLabs for details.

Features

This evaluation board includes the following:

Socketed module with the modem chipset

USB or asynch RS232 Serial Interface

RJ11 connection to the phone line

Onboard relay-excludable RJ11 connection

RS232 and USB interface to the PC

Direct access to the ISOmodem signals for embedded system evaluation

Power from a provided 8.5–13.5 V dc power supply or from the USB port

Handset connector (J1)

Onboard hookswitch

External hookswitch connector

Jumper matrix that allows any handset wiring scheme to work with this board

Onboard speakerphone microphone

RCA jack connector to an optional off-board speakerphone electret microphone

Selectable and adjustable electret power supplies for both handset and speakerphone microphones

Onboard 300 mW audio power amplifier (into a 4 load) for driving either onboard or external speaker.

Onboard voice coil driven loudspeaker for call monitoring

LED display of all RS232 signals

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

2 Rev. 0.4

Functional Block Diagram

As shown in Figure 1, the daughter card is a plug-in component with the complete modem, while the rest of themotherboard provides selectable serial RS232 or USB links, the sound subsystem, and power regulation anddistribution.

Figure 1. Functional Block Diagram

The voice ISOmodem EVB provides a sound system consisting of the Si3000 codec along with a handset RJ10connector as well as onboard microphone and loudspeaker with options for these devices to be placed off-board.

The bias voltages for both the onboard microphone and the handset microphone can modified and alternatesources used.

This allows the board to be used as a telephone or as a speakerphone as is, or to be integrated into the customer'ssystem.

The evaluation board can drive an external speaker or a small onboard speaker. For speaker-phone applications itis recommended that an off board loudspeaker be used.

An onboard rectifier, filter and voltage regulator allow the power input to be 8.5 to 13.5 V peak ac or dc of eitherpolarity supplied through screw terminals (J8) or a standard 2 mm power jack (J9). Alternatively the power can besupplied through the USB interface. Automatic switching is provided for the power, but not for the data interface.That data interface is selected by JP23.

Call Progress

Audio

Si3000PCM

USB/RS232 Connectors

J11/J10

I/O LED Display

SoundSubsystem

RJ 11 Telephone Connector

RJ 11 Telephone Connector

Exclusion Relay

On Board Hook Switch

Si2494/Si2438 Series

ISOmodem

Silicon Labs SI3018 DAA

ISOmodem Daughter

Card

Handset RJ10

Ext. Speaker

JP11

Interface Logic

EXT. Microphone

J2

Loudspeaker

Power Connectors

Regulation &

Switching

LED Status Display

Pwr Amp

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

Rev. 0.4 3

1. Global Voice ISOmodem EVB

The evaluation board is shown in Figure 2. Note the socketed daughter card with the modem chipset on the bottomright of the board.

Figure 2. Global Voice ISOmodem Evaluation Board

The ISOmodem chip requires software driver in order to perform either FAX or sound functionality. Contact SiliconLabs for details. “AN244: Si2438/37/36/35/29/19/18/17 Fax Modem Designer’s Guide” and “AN93: Si2494/93/57/39/34/15/04 Data Modem Designer’s Guide” are useful for driver development.

The Global Voice ISOmodem EVB provides an RJ11 jack for interfacing to the phone line and the USB or serialports can interface to a PC or a host CPU. This allows the board to operate as a class 1 fax modem for anevaluation or as a global voice and data modem (depending on the specific ISOmodem used).

A handset, microphone and speaker can also be attached to demonstrate the sound features, which may includeTAM and speaker-phone operations, depending on the specific ISOmodem chip used. Table 1 lists whichISOmodem chips have these features. A software driver or application is required to perform these data and soundoperations. The included UltraCOM application can demonstrate the sound features of the ISOmodem andprovides a tool to aid development.

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

4 Rev. 0.4

2. Daughter Cards

There are two types of daughter cards available for this EVB. One supports the TSSOP version of the system sidechip, and the other supports the QFN38 version of the system side.

An example of the TSSOP version of the daughter card is shown in Figure 3. It has the ISOmodem system-sidechip as well as the Si3018 DAA chip. The left side of the board contains the system side while the right sidecontains the DAA chip along with the few interface parts needed to connect tot a telephone line.

Figure 3. Daughter Card

Although this card is provided as part of the global voice EVB, it can also be directly connected to an embeddedsystem using TTL logic.

When run by a software driver the chipset on this daughter card is capable of making fax calls, telephone calls witha handset, data calls and both. TAM and speaker-phone operations. Table 1 lists the various ISOmodem chips andtheir features.

Table 1. ISOModem Features

Part Number Fax Data Handset TAM Speaker Phone

Si2417 ≤V.17 — — —

Si2418 ≤V.17 —

Si2419 ≤V.17 ≤V.32bis — —

Si2429 ≤ V.29 —

Si2435 ≤V.34 — — —

Si2436 ≤V.34 —

Si2437 ≤V.34 ≤V.34 — —

Si2438 ≤V.34 ≤V.34

Si2439 — ≤V.34

Si2494 — ≤V.92

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

Rev. 0.4 5

3. Setup and Evaluation

This section explains how to set up the Voice ISOmodem EVB for evaluation as an RS-232 or USB interface.Jumper settings and system interconnections are given, as well as the use of an demonstration and testapplication provided called UltraCOM.

See the following documents for additional technical details

Si2494/39/38/37/36/35/29/19/18/17 data sheets

“AN244: Fax Modem Designer's Guide"

“AN93: Data Modem Designer’s Guide”

Diagrams and tables are provided here that define the operation of all the jumpers, settings and connectors, aswell as their default states.

A typical global voice EVB as it arrives from the factory can be connected into a system by using only four cables.

Figure 4. Global Voice ISOmodem EVB Connection

The UltraCOM application provided on the included CD can be used to demonstrate:

Telephone Operation.

Speakerphone Operation

Telephone answering machine operation.

Fax Operation can be demonstrated but requires a fax driver application.

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

6 Rev. 0.4

3.1. JumpersFigure 5 shows the function and location of the jumpers present on the global fax EVB.

JP23

Sel

ects

USB

or

RS2

32

oper

atio

n bu

t If

no ju

mpe

r is i

n pl

ace

neith

er is

us

ed a

nd h

ost

mus

t con

nnec

tvi

a J

103

to

conn

ect

J10.

DB9

co

nnec

tion

to

Host

if J

P 23

se

lect

s it.

J11.

USB

co

nnec

tion

to H

ost

if JP

23

sele

cts i

t.

J2. O

ptio

nal

mic

. Inp

ut

conn

ecto

r

JP8.

On

boar

d m

ic. A

nd

jum

per t

o en

able

it.

JP1,

2, 3

, 4.

Jum

pers

that

co

nfig

ure

hand

set w

iring

to

any

styl

e. S

ee

sche

mat

ic fo

r de

tails

.

JP14

, On

Boar

d Sp

eake

r ena

ble

jum

per

JP12

. On

Boar

d Po

wer

Am

p En

able

.

J8, J

9. A

ltern

ate

pow

er su

pply

co

nnec

tor

optio

ns.

JP11

, Aud

io

pow

er o

utpu

t. Re

com

men

ded

for s

peak

er-

phon

e op

erat

ion.

J5. P

STN

RJ1

1 co

nnec

tion

J5. T

elep

hone

RJ

11 co

nnec

tion

Daug

hter

Car

ds

(rev

2.0

TSS

OP

, or

rev

1.0

QFN

) pl

ug in

to J1

01,

and

JP16

. her

e.

T1, V

1A, V

1B, Y

2A, Y

2B, P

STN

pr

otec

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devi

ces.

Alte

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otpr

ints

supp

ort m

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poss

ible

con

figur

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ns

UAR

T sig

nal

LED

disp

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an

d te

st

poin

ts

J103

. Alte

rnat

e sig

nal

conn

ectio

n pa

th to

ho

st. U

sed

if no

ju

mpe

r is

at JP

23.

CMO

S sig

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g

LS1,

On

Boar

d Sp

eake

r.

J1. H

ands

et

Conn

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r

JP33

Aut

obau

den

able

T59,

TP1

2,TP

13.

Shun

t Res

istor

and

te

st p

oint

s for

cu

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t m

easu

rem

ents

J30.

Aux

Au

dio

conn

ecto

r

R13.

Spe

aker

-ph

one

mic

gain

co

ntro

l

JP6,

JP15

, JP9

. Si

3000

line

in m

ixer

ju

mpe

rs fo

r :

mic

roph

one,

AU

X in

(J3

0), &

AO

UT

JP5.

Mic

. fix

ed g

ain

vsad

just

able

ga

in ju

mpe

r

R24.

Aud

io

pow

er a

mpl

ifier

ga

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J6.

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tions

. Sh

own

for T

SSO

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d Q

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efau

lt se

tup.

JP34

Ena

ble

Excl

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lay

(ope

rate

d by

RI

pin)

JP24

Cho

oses

EE

PRO

M o

pera

tion

inst

ead

of S

i300

0 fo

r no

n Q

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augh

ter

card

s

JP10

, JP7

, JP1

3.

PWR

Amp

inpu

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er

jum

pers

for :

AO

UT,

Si3

000

line

out,

& A

UX

IN (J

30)

Fig

ure

5.F

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Lo

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Glo

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B J

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s

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

Rev. 0.4 7

Table 2 explains the use of the data related jumpers. It also shows the default state.

Check all jumper settings on the EVB before applying power.

These default data related jumper settings shown below configure the EVB for USB serial operation with auto baudas a default. Any terminal emulator program configured to communicate through the virtual com port created by theprovided driver can be used to communicate with the EVB. There are no BAUD settings required since the modemhas an auto baud feature.

The USB virtual com port drivers needed for the USB link to work are on the provided CD.

Customers that want to use an RS232 port only need to change JP23 and connect an RS232 cable to the host. Aswith the USB configuration, any terminal emulator program configured to communicate through a PC COM portcan be used to communicate with the EVB.

Although the user can exercise many of the modem commands (including voice features) using a terminalemulator program, a fax driver is required to implement fax send/receive functionality.

This EVB also provides an application, UltraCOM distributed on the CD that can act as a terminal emulator and asa sound feature demonstration vehicle. See Appendix I for an UltraCOM quick start guide that shows how to runthis demonstration.

Table 2. Digital Data Related Jumpers

Jumper Number Pins Jumped Default State Comments

JP231–2 USB selected

2–3 UART selected

J6 1-2, 4-5, 7-8, 10-11, 13-14 Typical Si2438/37/36/35/29/19/18/17 FT setup (24 pin pkg)

JP33 1-2 Disable Auto baud

JP24 1-2 Enable EEPROM

2-3 Enable Si3000

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8 Rev. 0.4

Table 3 explains the use of the analog audio oriented jumpers and adjustments, while showing the default state.These jumpers and adjustments can be used to tailor the operation of the global fax EVB so that it interfaces wellwith the users host system and provides the maximum flexibility as the choice of loudspeaker microphone andalternate sources of sound.

Table 3. Sound Related Jumpers

Jumper Number

Pins Jumped Default State

Comments

JP34 1–2 Enable Exclusion Relay

JP1 1–2 Handset pin 4 connection (ground)*

JP2 1–2 Handset pin 3 connection (ground)*

JP3 4–5 Handset pin 2 connection (earpiece signal)*

JP4 2–3 Handset pin 1 connection (mouthpiece signal)*

JP241–2 Enable EEPROM (factory use only)

2–3 Enable Si3000

JP51–2 Variable mic gain = 6 to 34 dB

3–3 Fixed mic gain = 21 dB

JP6 1–2 Mic to input mixer

JP15 1–2 External Line In to input mixer

JP9 1–2 AOUT to input mixer

JP8 1–2 Connects on board mic

JP10 1–2 AOUT to power amp mixer

JP7 1–2 Si3000 line out to power amp mixer

JP13 1–2 Aux Input to power amp mixer

JP14 1–2 On Board Speaker connected

JP12 1–2 Enable Pwr Amp.

*Note: For typical Cisco handset.

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Rev. 0.4 9

3.2. I/O and AdjustmentsTable 4 explains the use of the adjustable analog audio-oriented controls as well as their default state.

3.3. USB Interface Data Link Setup Quick Start1. Set jumpers according to the default configuration shown in Table 2 on page 7.

2. Connect:

Install USB cable and provided driver.

RJ-11 to phone line or test box.

3. Open the terminal emulator program, and apply power to the EVB.

4. Select the serial COM channel used.

5. Type "AT" followed by a carriage return. (Autobaud automatically adjusts modem DTE speed and protocol.). The modem should echo "AT" and then send the "OK" response code.

6. Type ATH1 and ATH0 to seize and release the telephone line.

3.4. UltraCOM Installation InstructionsPerform the following steps:

1. Double-click the ultracom.msi file to launch the installer. Click Next.

Figure 6. UltraCOM Setup Wizard

2. Accept the default installation path and click Next.

Table 4. Audio Adjustments

Ref Default State Comments

R13 4 turns CW Mic Preamp Gain 6 dB to 34 dB

R24 CCW(21.4 dB) Power Amp Gain 21.4 dB to 46.4 dB WRT line out

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

10 Rev. 0.4

Figure 7. Select Installation Folder Dialog Box

3. Click Install to start the installation.

Figure 8. Install Dialog Box

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

Rev. 0.4 11

4. After installation is complete, click Finish to close the installer.

Figure 9. Completing UltraCOM Setup Wizard

5. UltraCOM may be launched from the desktop link or from the Start menu: Start Programs→UltraCOM→UltraCOM

6. From the UltraCOM main menu, select Help Index. This will load the help file.

7. Select the Quick Start link from the main menu and review the information.

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

12 Rev. 0.4

Figure 10. Quick Start

3.5. USB Interface Data Link Setup Quick Start1. Set jumpers according to the default configuration shown in Figure 5.

2. Install the USB driver for your operating system from the CD supplied with the evaluation board.

3. Connect:

USB cable to PC

RJ-11 to phone line or test box

4. Open the terminal emulator program.

5. Select one of the USB Virtual Com Port numbers in the emulator program's user interface.

6. Type "AT" followed by a carriage return. (Autobaud automatically adjusts modem DTE speed and protocol.). The modem should echo "AT" and then send the "OK" response code.

7. Type ATH1 and ATH0 to seize and release the telephone line.

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

Rev. 0.4 13

3.6. Sound Demonstration Using UltraCOM Quick Start GuideStep 1: Perform the Quick Start USB Interface Data Link Setup Quick Start

1. Set jumpers according to the default configuration shown in Figure 5.

2. Install the USB driver for your operating system from the CD supplied with the evaluation board.

3. Connect:

USB cable to PC

RJ-11 to phone line or test box

4. Open the terminal emulator program.

5. Select one of the USB Virtual Com Port numbers in the emulator program's user interface.

6. Type "AT" followed by a carriage return. (Autobaud automatically adjusts modem DTE speed and protocol.). The modem should echo "AT" and then send the "OK" response code.

7. Type ATH1 and ATH0 to seize and release the telephone line.

Step 2

Add connections to a loudspeaker and a handset as shown in the following diagram.

Figure 11. Sound Demonstration Hardware Interconnect Guide

Step 3:

1. Install UltraCOM (provided in this kit) on Windows XP

2. Launch UltraCOM.

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

14 Rev. 0.4

Step 4:

Select "Terminal-Open" making sure the serial configuration is as shown (except for port selection), then select OK.

Figure 12. UltraCOM Serial Configuration Dialog Box

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

Rev. 0.4 15

Step 5:

1. Select Open Plug-In (The Green Icon) in the screen snapshot that follows.

2. Respond OK to "Load Plug-in" "24xx Voice Functions"

Figure 13. UltraCOM Load Plug-In Dialog Box

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

16 Rev. 0.4

Step 6:

Wait for the screen below to open and the patch to load.

Figure 14. UltraCOM Plug-Ins Patch Load Phase

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

Rev. 0.4 17

Step 7:

Use the interface above to do the following:

Go off hook with the handset by selecting the handset symbol

Select the speakerphone button to start that mode.

Dial a DTMF number.

Note the following suggestions.Use the external off-board speaker for speakerphone functionalityUse the on-board electret for the microphone.Use the PSTN, a PBX or a Line Simulator for the phone line.

How to Change the Patch Used in the UltraCOM Plug-In

Figure 15. UltraCOM Plug-In Patch Changing

3.7. Power RequirementsThe EVB has an onboard diode bridge, filter capacitor, and voltage regulators. Power can be supplied from theUSB connection or a source capable of providing 8.5–13.5 V dc or 6–9.5 VRMS peak ac and at least 300 mA. Asuitable wall mounted 9 V supply is provided with the kit.

Of the 300 mA required current 200 mA is used to drive the loudspeaker and may be removed from therequirement if the power amp is enabled by placing a jumper on JP12.

Power may be applied to the Voice ISOmodem EVB through the screw terminals, J8, the 2 mm power jack, J9, orthe USB cable. The modem cable may be used to supply power even if the modem is configured for RS-232operation.

The power consumed by the audio section is limited with an active limiter. This circuit will protect the powersources when the sound is overdriven or if the amplifier output is shorted. The power amplifier is also naturallyprotected with thermal limiting. Digital operations such as host to modem serial data transfer or the modemtelephone line operations are unaffected by the limiter operation.

Note that the modem will take power from wherever it finds it and that it is possible to use the RS232 port for

signaling and the USB for power or to use the USB for signaling and to provide power through the providedexternal 9 V supply.

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

18 Rev. 0.4

3.8. EVB Part NumbersThe Voice ISOmodem evaluation boards are offered in multiple versions. The first four numbers indicate thesystem-side device. The options include speed and various audio capabilities as well as package and temperature.See Figure 16:

Figure 16. EVB Part Number Example

S i2 4 3 8 F T 1 8 -E V BS i2 4 3 7 F T 1 8 -E V BS i2 4 3 6 F T 1 8 -E V BS i2 4 3 5 F T 1 8 -E V BS i2 4 1 9 F T 1 8 -E V BS i2 4 1 8 F T 1 8 -E V BS i2 4 1 7 F T 1 8 -E V BS i2 4 9 4 A F M 1 8 -E V BS i2 4 3 9 A F M 1 8 -E V B

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

Rev. 0.4 19

4. Voice ISOmodem EVB Functional Description

The Voice ISOmodem EVB is a multipurpose evaluation system. The modem daughter card illustrates the smallsize and few components required to implement an entire controller-based modem with global compatibility. Thedaughter card can be used independently of, or in conjunction with, the motherboard. The motherboard addsfeatures that enhance the ease of evaluating the many capabilities of the Si24xx ISOmodem.

4.1. MotherboardThe motherboard provides a convenient interface to the Si24xx ISOmodem DC (daughter card). The versatilepower supply allows for a wide range of ac and dc voltages to power the board.

A versatile digital IO system allows either a USB virtual com port to be used to interface to the board or an RS-232transceivers with a DB9 connector allowing the EVB to be easily connected to a PC or other terminal device. Ajumper option allows direct access to the LVCMOS/TTL level serial inputs to the Si24xx, bypassing the RS-232transceivers or USB interface. This is particularly useful for directly connecting the Si24xx to embedded systems.

The motherboard provides connectivity to a telephone line or a phone extension via a pair of RJ11connectors. Theextension connector may be actively excluded by an onboard relay.

A switch and a connector is provided on the motherboard that is read by the modem firmware and can perform thehookswitch function.

The motherboard also contains a complete sound system including microphone, loudspeaker and handsetconnector. The sound system includes easy to adjust gain controls and extra inputs that allow system generatednoises to be added to the sound.

A functional block diagram of the system as a whole can be seen below.

Figure 17. Sound System Block Diagram

Call Progress

Audio PWM

RXD, TXD, CTSb

Si3000PCM

USB Interface CP2101

USB Connector

J11

RS232 Connector

J10

MUX

LED Drivers & Display

OptioningSwitchMatrix

J6

Sound Subsystem

CD, RI,

DTR, RTS, DSR

RJ 11 Telephone Connector

RJ 11 Telephone Connector

Exclusion Relay

Tip and RingRIb

Enabled by JP34

J103

JP23 jumper selects USB vs. UART or neither

Si24xx ISOmodem

Silicon Labs Si3018 DAA ISOmodem

Daughter Card

J101

JP16

Direct Access Header

Handset RJ10

Ext. Speaker

JP11 RS232

Drivers & receivers

EXT. Microphone

J2

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20 Rev. 0.4

4.1.1. Power Supply

4.1.1.1. Power Distribution

The power distribution diagram for the global voice EVB can be seen in Figure 18 below. Analog and Digitalvoltages are separately regulated while the audio power amplifier supply is current limited to prevent accidentaloverload and disruption of the digital supplies.

Figure 18. Power Distribution Diagram

The onboard full-wave rectifier and filter ensure the correct polarity is applied to the Voice ISOmodem EVB.

Daughter card 3.3 V power is supplied through voltage regulator U3. Daughter card current can be measured byconnecting a DVM across R59, a 1 current sensing resistor in the 3.3 V supply line to the daughter card.

The input voltage to either J8 or J9 must be between 8.5 and 13.5 V dc, or 6 and 9.5 VPEAK ac. The motherboardincludes a diode bridge (D12) to guard against a polarity reversal of the dc voltage or to rectify an ac voltage. Thepower source must be capable of continuously supplying at least 100 mA. The voltage regulator, U10, can provide5 V for the motherboard and the input for voltage regulator U3, which outputs 3.3 V for use on the motherboard andto power the daughter card. Alternately, power may be supplied to U3 through D11 from the USB port.

The power consumed by the audio section is limited with an active limiter. This circuit will protect both powersources and the audio amplifier when the sound is overdriven or if the amplifier output is shorted. Digital operationssuch as host to modem serial data transfer or the modem telephone line operations are unaffected by the limiteroperation.

Two indicator LEDs indicate main power (+5 V) and audio amp power (~+4.5 V). See Figure 15 for locations. Youwill notice the one for the audio power blinking when audio is loud and clipping. This is normal.

USB Connector

J11

External Power

Connector J8

External Power

Connector J9

Rectifier Bridge & Capacitor

5 Volt Regulator

Switch(2 diodes)

3.3 Volt Regulator

Reset GeneratorManual

Reset Switch

Switch(2 diodes)

5 Volt Regulator

CurrentLimiter

+(4-5)V Audio Pwr Amp

3.3 Volt Regulator

+3.3V Analog

+3.3V Digital

+5V Power

Master Reset

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

Rev. 0.4 21

4.1.2. Reset Circuitry

The Si24xx requires a reset pulse to remain low for at least 5.0 ms after the power supply has stabilized during thepower up sequence or for at least 5.0 ms during a power-on reset. Most production Si24xx modem chipsetapplications require that RESET be controlled by the host processor. Certain Si24xx operation modes, includingpower down, require a hardware reset to recover.

The Voice ISOmodem EVB contains two reset options, an automatic power-on reset device, U18 (DS1818)(default), and a manual reset switch (S1) to permit resetting the chip without removing power. A reset, regardless ofthe mechanism, causes all modem settings to revert to factory default values.

4.1.3. DS1818

The DS1818 is a small, low-cost device that monitors the voltage on VD and an external reset pushbutton. If VDdrops below 3.0 V, the DS1818 provides a 220 ms active-low reset pulse. On power up, the DS1818 also outputsan active low reset pulse for 220 ms after VD reaches 90% of the nominal 3.3 V value. The DS1818 outputs a 220ms reset pulse any time the power supply voltage exceeds the 3.3 V 10% window.

4.1.4. Manual Reset

The manual reset switch (S1) performs a power-on reset. This resets the Si24xx to factory defaults without turningoff power. Pressing S1 activates the reset monitor in the DS1818 and produces a 220 ms active low reset pulse.

4.1.5. Interface Selection

The serial interface of the Voice ISOmodem EVB can be connected to a computer, terminal, embedded system, orany other data terminal equipment (DTE) via a standard RS-232 interface, USB interface, or through a direct TTLserial interface.

At the heart of this capability is the MUX and the jumper that controls it: JP23.

4.1.5.1. RS-232 Interface

The serial cable connects to J10 on the motherboard and provides a data link the PC or embedded host processor.

Moving the jumper on JP23 enables the RS232 interface or the USB interface.

The Maxim MAX3237 transceiver interfaces directly with the TTL levels available at the serial interface of theSi24xx and, using internal charge pumps, makes these signals compatible with the RS-232 standard. The RS-232transceiver on the Voice ISOmodem EVB can communicate at rates between 300 bps and 1 Mbps. This simplifiesthe connection to PCs and other data terminal equipment (DTE).

The signals available on the Voice ISOmodem EVB serial interface (DB9 connector) are listed in Table 6 along withthe various signal names used and both connector pin numbers and ISOmodem package pin numbers.

Table 5. Board Configuration

JP23 Modem Signalling Done Via

X Header, J103

1–2 Jumped USB Port

2–3 Not Jumped Serial Port

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

22 Rev. 0.4

4.1.5.2. USB Interface

The USB cable connects to J11 on the motherboard and provides both data and power.

This operation mode uses the standard factory jumper settings illustrated in Table 2 on page 7.

Installing a jumper on J23 enables the USB interface and disables the RS-232 interface. The USB interface isprovided by U12. A USB driver for this chip is available for most PC and MAC operating systems on the CD.

4.1.5.3. Direct Access Interface

The direct access interface header (J103) can be used to connect the motherboard to an embedded system.

If J103 is used in this manner, it is necessary to remove the jumber from JP23 to disable both the RS-232 and USBinterface and prevent signal contention. See Table 5.

In this mode, the motherboard continue to supply a few other signals and functions such as power (derived fromJ8, J9, or USB) as well as a power-on reset signal and the telephone line connection via the exclusion relay contactand the RJ-11 jack connected to the modem line side.

J103 provides access to all the ISOmodem system side signals available on the daughter card.

If the user wishes to go further and use his embedded system's power supply or reset line, he can remove thedaughter card from the mother board and integrate it directly into his system.

Table 6. DB9 Pin Connections (J10)

J10 Name J10 Symbol J10 Pin ISOmodem Pin Number

ISOmodem Signal Name

Carrier Detect CD 1* See Note* DCD/EESD

Received Data RXD 2 9 RXD

Transmit Data TXD 3 10 TXD

Data Terminal Ready DTR 4* See Note* ESC/RI

Signal Ground SG 5 6 GND

Data Set Ready DSR 6* See Note* INT/AOUT

Ready to Send RTS 7* See Note* RTS/RXCLK

Clear to Send CTS 8 11 CTS

Ring Indicator RD 9* 17 RI

*Note: JP6 jumper option.

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

Rev. 0.4 23

4.1.6. Exclusion Relay

The exclusion relay (Figure 19) on the motherboard allows the modem to turn on the relay and exclude the phoneline connection from an auxiliary device such as a telephone connected to the second RJ11 socket. The relay isenabled via jumper JP34.

The control signal used is the one called RIb and is managed by special command sequences (see applicationnotes AN93 or AN244). RIb goes low to turn on the relay via a driver transistor.

See the diagram below for the location of the connectors and the relay.

Note that the RIb signal must be kept high during the reset pulse, due to the use of this pin for specialmanufacturing functions. This demands that this pin drive either an NMOS relay driver transistor or a 3.3 Vreferenced buffer like the one used here.

Figure 19. Exclusion Relay and Surge Protection

RJ11 connection to PSTN

RJ11 connection to Telephone

Exclusion Relay 

Optional Footprints to be used if customer longitudinal surge voltage requirements exceed capability of exclusion relay.   

Optional Footprints to be used if customer  has unusual metallic surge voltage requirements.

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

24 Rev. 0.4

4.1.7. Surge Protection Circuits

This evaluation board is designed to provide several possible levels of surge protection.

The ISOmodem alone does not need surge protection for a global implementation except for the componentsnormally selected and implemented on the daughter card. These are the P3100B sidactor and the Y2 caps usedfor C1, C2, C8, and C9.

There are two basic reasons a customer may enhance this surge protection. The first is to protect the telephoneexclusion relay, which often does not meet the same surge capability of the Y2 caps, and the second is to meetenhanced requirements put forth by customers and/or corporate guidelines.

Thus, footprints for either low-current 800 V or 1 kV high-current longitudinal GDTs are in place on the board (seeFigure 20) to protect either the typical 2.5 kV exclusion relay or the 5 kV capacitors on the daughter card. But, notethat the relay used on this motherboard is 5 kV rated (as are the capacitors) and does not need special protection.Regardless of which GDT is used by the customer, it is required to stay at 1 kV or less to control stress on theISOmodem during the GDT arcing process.

For extra metallic protection where higher current surges are mandated, a GDT combined with a common-modechoke acting as a delay element is recommended. The choke protects the Sidactor due to its leakage inductance,allowing the metallic GDT to fire first. There are two possible GDTs shown in Figure 20, and the optimal one can bechosen by the trading of cost for current carrying capacity. When populated with capable ceramic parts, themotherboard and modem can survive 15 kV/ 2 , 1.2/50 µs combination waveform, i.e. 7.5 kA surge current.

Figure 20. Optional Surge Protection Enhancement Circuits

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

Rev. 0.4 25

4.1.8. The Sound System

Figure 21. Sound System

The sound system on the board is centered around the Si3000 code chip shown in the above diagram, and isdesigned to demonstrate handset operation as well as speakerphone and telephone answering machineoperation.

The Si3000 links to the ISOmodem via a PCM bus that allows the transfer of audio between the modem and thevarious audio "peripherals" that the Si3000 links to the following:

Loudspeaker

Handset microphone and speaker

Microphone

Line In

Line Out

4.1.8.1. The Power Amplifier and Loudspeaker

The Power amplifier on the global Voice ISOmodem EVB can drive a 4 speaker with 300 mW of audio that has 3possible sources:

Si3000 Line out

Aux in, J30 signal SPKR_AUX_IN (e.g., a customer system's generated beeps or ticks)

Call progress analog signal from modem. (ISOmodem's call dialing and negotiation tones)

The power amplifier itself is a low cost, rugged 3.3 V bridge device, the LM4862M. Similar parts are available fromother vendors.

The sources listed above can be independently turned off by jumpers JP7, 10, and 13 or be gain controlled with nointeraction, by changing the value of the summing node current injection resistors' values.

The inverted input of this chip is used as a summing junction for an audio mixer for the inputs mentioned above andwith gain control effected via the feedback resistor R24.

PWM PCM

JP15

JP6

AOUT

ISOmodem Si3000

External Speaker

JP11 Mixer & Jumpers

External Microphone

J2

Handset J1

Line Out

Aux In (JP30)

Local Speaker Enabled by JP14

Mixer

SI3000 LINE IN (J30)

Filter

JP7

Line In

JP10

JP13

JP9

Handset Type Matrix JP1-4

Power Amp

R24 sets gain,JP12 enables

Preamp

JP5 & R13 set gain

JP30

SP

KR

_L

SP

KR

_R

LIN

E_O

Optional Connections

Internal Microphone

JP8

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

26 Rev. 0.4

The customer can change the resistor values when integrating the global Voice ISOmodem EVB to his system, butshould keep the RC formed by the 1 µF input caps at a 50 Hz or higher corner to avoid a thump on turn on.

The power amplifier is enabled by JP12. This jumper can also be tied to a host signal to allow the host to shut downthe amplifier.

4.1.8.2. The Call Progress Signal

The call progress tone discussed in this section comes from a PWM output pin on the ISOmodem. The PWMsignal is processed by a high-pass filter (see below).

When using this circuit it is important to extend the modem reset time to 10 ms. This is the time to charge C83 viathe built in weak pull ups in case that the modem has been operating prior to reset and has put the AOUT into aPWM state that is 100% low. Any modifications to this circuit or reset time should be done keeping in mind thefollowing rule: The ISOmodem reset time and AOUT capacitive loading must be balanced so that the AOUT pinmust have time to charge it's load to a high state.

It should be noted that when creating the call progress output with this circuit, about half the noise present in theaudio bandwidth on the modem supply pins is passed along with the call progress tone. Consequently, the modemsupply needs to be fairly clean.

Figure 22. High-Pass Filter

4.1.8.3. The Input Mixer

An input mixer is also in the sound section of the global fax EVB. It drives the line input of the Si3000 with a mixtureof the following possible sources:

An electret microphone

An auxiliary line input, J30 signal (Si3000_LINE_IN)

Call progress analog signal from modem. (ISOmodem's call dialing and negotiation tones)

4.1.8.4. The Speakerphone Electret Microphone

The electret microphone listed above is amplified by a preamp before this mixer. The gain of the microphonepreamp can be adjusted via a potentiometer if JP5 pins 1 and 2 are jumpered, or is fixed by R12 and R15 whenJP5 pins 2 and 3 are jumpered. It is intended for speakerphone use.

This electret microphone in this case can be either the microphone that comes installed on this board or anexternal one connected to the RCA jack J2. There is a dedicated electret power supply available to power either ofthese two microphones. The supply is configured so that it is easy for the user to adjust its voltage between 0 and3.3 V by varying R27 and R30. This allows the user to most closely match the operation of his intended target. Theonboard electret is enabled by JP8.

PWM FilterPWM Filter

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

Rev. 0.4 27

4.1.8.5. The Handset

The handset signals are all processed by the Si3000 chip. The board provides a matrix of connectors to allow ANYhandset pin configuration to be used. This jumper array is shown in Figure 23. The default setting is shown inTable 3 on page 8.

Figure 23. Handset

Microphone Signal

Earpiece Signal

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

28 Rev. 0.4

4.2. Daughter CardsThere are two types of daughter card; one is for QFN packaged modem chips, and one is for smaller packages.The daughter card itself is a complete modem solution perfectly suited for use in an embedded system.

The daughter card requires a 3.3 V supply capable of providing at least 35 mA. Be sure to provide the properpower-on reset pulse to the daughter card if it is used in the stand-alone mode.

The Voice ISOmodem EVB motherboard connects to the daughter card through two connectors, J101 and JP16.JP101 is an 8x2 socket providing connection to all Si24xx digital signals and a regulated 3.3 V power.

The Si24xx digital signals and power also appear at JP103 and they are LVCMOS and TTL compatible. JP103 canbe used for monitoring purposes or may be used as the interface to the users host if JP23 has no jumper, thusdisabling the on board digital multiplexer. In this case note that the PCM link to the Si3000 is still in place and is stillconnected to the daughter card signals.

JP16 is a 4x1 socket providing connection between the daughter card and both the RJ-11 phone jack and theexclusion relay on the motherboard.

The daughter cards for this global Voice ISOmodem EVB come with the appropriate ISOmodem system side chipinstalled and are identical otherwise. The possible ISOmodem system side chips are shown in Figure 24:

Figure 24. ISOmodem System-Side Chip Part Number Scheme

The line side chip on the daughter card is the Si3018 DAA chip. It works with a few low cost discrete parts thatcomplete the telephone line interface.

Small 33 pF capacitors link the system side to the isolated side and provide both data and power transfer to theisolated telephone line circuit.

The connection between the Si3018 chip and the telephone line is done via a diode bridge to control line polarityand beads to control EMI.

A Sidactor is placed across the phone line for surge arresting reasons, while a pair of capacitors link the tip andring to system ground in order to minimize EMI radiation and EMI Susceptibility.

PCB layout for this circuit is somewhat critical, for link integrity, EMI, and surge reasons,. Anyone planning todesign a PCB layout should check application note AN244 or AN93 and also submit the PCB design to SiliconLabs for checking. The layout used on this daughter card is shown in this user's guide.

Si2438FTSi2437FTSi2436FTSi2435FTSi2419FTSi2418FTSi2417FTSi2494FMSi2439FM

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

Rev. 0.4 29

4.2.1. Reset Requirements

The Voice ISOmodem daughter card must be properly reset at powerup. The reset pin (pin 8) of the Si24xx (J101,pin 13) must be held low for at least 5.0 ms after power is applied and stabilized to ensure the device is properlyreset.

4.2.2. Crystal Requirements

Clock accuracy and stability are important in modem applications. To ensure reliable communication betweenmodems, the clock must remain within 100 ppm of the design value over the life of the modem. The crystalselected for use in a modem application must have a frequency tolerance of less than 100 ppm for the combinationof initial frequency tolerance, drift over the normal operating temperature range, and five year aging. Otherconsiderations, such as production variations in PC board capacitance and the tolerance of loading capacitors,must also be taken into account.

4.2.3. Protection

The Voice ISOmodem EVB meets or exceeds all FCC and international PTT requirements and recommendationsfor high-voltage surge and isolation testing without any modification. The protection/isolation circuitry includes C1,C2, C8, C9, FB1, FB2, and RV1. The PCB layout is also a key "component" in the protection circuitry. The VoiceISOmodem EVB provides isolation to 3 kV. Contact Silicon Laboratories for information about designing to higherlevels of isolation.

4.2.4. Daughter Card Strapping and Jumper Options

Both types of daughter cards have some strapping options that are preconfigured at the factory. These areexplained in the schematic and in more detail in AN93.

The QFN daughter card also has a two jumper options. One, JP1, selects SPI operation, which is usable if the useralso does not use a jumper at JP23 on the motherboard and provides host SPI connectivity at J103. The otherjumper, JP2, enables the operation of the EEPROM chip, which is on the daughter card. There is an EEPROM chipon the motherboard, which is only used with the TSSOP daughter card.

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

30 Rev. 0.4

5. Motherboard and Daughter Card Schematics

"RS232"

Connectors

for ISOModem

module.

TXD

GPIO3

RXD

NC

CTS

NC

RESET

GND

NC

VD

GPIO4

GPIO5

NC

NC

Si2401

GPIO2

GPIO1

TXD/WR

ESC/D3

RXD/RD

SDI/EESD/D2

CTSb/CS

RIb/D1

RESET

GND

INTb/D0

VD

AOUT/INTb

FSYNCH/D6

RTSb/D7

CLKOUT/EECS/A0

Si24xx

DCDb/D4

SDO/EECLK_RTSb/D5

15

16

13

14

11

12

9 10

7 861 3 4 5

Net names correspond to Si24xx.

See table for Si2401 equivalents

2

Table NOT on silkscreen

JP1/3

"USB"

RXD

TXD

CTSb

CDRIb

RTSb

RTSb

"FSYNCHb"

"SDO_EECLK_RTSb"

"SDI_EESD"

DSRb

"RXD"

"TXD"

"CTSb"

"RESETb"

"RTSb"

"DCDb"

"INT"

"AOUT_INTb"

"RIb"

"ESC"

"CLKOUT_EECSb"

"SI3000 EN"

"EEPROM EN"

TSSOP24

SOIC16

SOIC16

24xx

24xx

2401

SDI/EESD

NC

NC

FSYNCH

RIb

RIb

RIb

NC

NC

SDO/EECLK

RTSb

GPIO1

AOUT/INTb

INTb

INTb/AOUT

TSSOP24

24xx

SOIC16

24xx

SOIC16

2401

DCD

DCD

DCD

NC

NC

RIb

ESC

ESC

ESC

NC

NC

INTb

NC

NC

RTSb

Silk Screen Text

"GND"

"+3.3V"

JP6 Left Pin Signals

JP6 Right Pin Signals

Lea

ded

Lea

ded

Lea

ded

Lea

ded

Pull Down Can

strap FSYNCHb to

GND enabling

EEPROM

Select High Chooses B2 port

From

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rcui

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Voi

cean

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all P

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Pag

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Voi

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d C

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Pag

e

T1 a

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DT'

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ay b

ene

eded

for

unn

usua

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rge

req

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men

ts.

For

deta

ils

con

tact

the

fact

ory.

5 kV

rat

ed R

elay

Ext

ra H

igh

Surg

e P

rote

ctio

n: L

arge

Cer

amic

GD

T's

Ext

ra S

urge

Pro

tect

ion:

Smal

l Gla

ssG

DT'

s.

RIGHT

RIGHT

NC or INTb

nc or INTb/AOUT

Table on back

silkscreen for

J6

RS-232

Si24xx 16 pin

Si2401 16 pin

CD

DCD or NC

DCD or nc

RI

NC or RIb

NC or RIb

DTR

ESC or NC

ESC or NC

RTS

NC or RTSb

nc or GPIO1

DSR

"J6 Jumper Connectiveity"

Si24xx 24 pin

"SOIC16: 1-2, 5-6, 7-8, 11-12, 14-15"

"TSSOP24: 1-2, 4-5, 7-8, 10-11, 13-14"

"Recommended J6 settings"

INTb or AOUT/INTb

DCD or SDI/EESD

RI or FSYNCH

ESC or RIb

RTS or SDO/EECLK

LEFT

LEFT

LEFT

RIGHT

CLK

OU

T_E

EC

Sb

FS

YN

CH

bS

DI_

EE

SD

CLK

OU

T_E

EC

Sb

CT

Sb

RE

SE

Tb

RXD

DC

Db

ES

C

RT

S_M

CD

_M

DT

R_M

DS

R_M

AO

UT

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Tb

VC

C_M

odem

DC

Db

RIb

FS

YN

CH

b

RI_

M

RT

Sb

TXD

INT

b

SD

I_E

ES

D

ES

C

SD

I_E

ES

D

FS

YN

CH

b

RIb

RIb

SD

O_E

EC

LK_R

TS

b

SD

O_E

EC

LK_R

TS

b

SD

I_E

ES

D

ES

C

RT

Sb

DC

Db

RIb

INT

b

CT

Sb

INT

b

TXD

AO

UT

_IN

Tb

RXD

CLK

OU

T_E

EC

Sb

FS

YN

CH

b

RXD

TXD

RE

SE

Tb

CT

Sb

RT

Sb

SE

LEC

T

CLK

OU

T_E

EC

Sb

SD

O_E

EC

LK_R

TS

b

SD

O_E

EC

LK_R

TS

bS

DI_

EE

SD

DS

R_M

CD

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R_M

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RXD

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S_T

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CD

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RI_

T

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S_U

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CD

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FS

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SD

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+3.3

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+3.3

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+3.3

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+3.3

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+3.3

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+3.3

V

U14

IDT

74C

BT

LV32

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U14

IDT

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BT

LV32

57

GND8

VCC16

1B1

2

2B1

5

3B1

11

4B1

14

1A4

2A7

3A9

4A12

1B2

3

2B2

6

3B2

10

4B2

13

OE

15

S1

R15

768

1R

157

681

C35

0.1u

FC

350.

1uF

K1C

K1C

910 8

D46

DT

RD

46D

TR

R91

10K

R91

10K

R15

568

1R

155

681

Q5

MM

BT

3906

-7-F

Q5

MM

BT

3906

-7-F

C70

560p

FC

7056

0pF

D48

DS

RD

48D

SR

TP

7T

urre

tG

ND

TP

7T

urre

tG

ND

J103

8X2

Shr

oude

d H

eade

rJ1

038X

2 S

hrou

ded

Hea

der

11

22

33

44

55

66

77

88

99

1010

1111

1313

1515

1212

1414

1616

D54

BA

V23

A

D54

BA

V23

A

C73

560p

FC

7356

0pF

C69

1uF

C69

1uF

C72

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FC

720.

1uF

R16

268

1R

162

681

TP

19T

P19

D53

RE

DR

S23

2D

53R

ED

RS

232

TP

17T

P17

V1A

1000

VR

A-1

02M

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YN

OP

OP

V1A

1000

VR

A-1

02M

-C6-

YN

OP

OP

D45

RI

D45

RI

R84

1.5k

R84

1.5k

U27

MA

X452

1U

27M

AX4

521

IN1

1

V+13

GND5

IN4

8IN

39

NC

311

V-4

NC

214

IN2

16

NC

13

NC

46

CO

M1

2

CO

M2

15

CO

M3

10

CO

M4

7

VL12

TP

24T

P24

TP

8T

urre

tG

ND

TP

8T

urre

tG

ND

R11

40

NI

R11

40

NIV

2A

350V

RA

-351

M-C

6-Y

NO

PO

P

V2A

350V

RA

-351

M-C

6-Y

NO

PO

P

R11

310

KR

113

10K

D6

MM

BD

3004

S-7

-FD

6M

MB

D30

04S

-7-F

R17

068

1R

170

681

C75

0.1u

FC

750.

1uF

TP

25T

urre

t

GN

DT

P25

Tur

ret

GN

D

R43

10K

R43

10K

D41

RXD

D41

RXD

V1B

800V

NO

PO

PG

TC

A28

-801

L-P

05

V1B

800V

NO

PO

PG

TC

A28

-801

L-P

05

FB

1160

0 O

hmB

LM18

AG

601S

N1

FB

1160

0 O

hmB

LM18

AG

601S

N1

R16

068

1R

160

681

TP

6

TIP

BLU

ET

P6

TIP

BLU

E

TP

23T

P23

C33

0.1u

FC

330.

1uF

R70

0R

700

R60

10K

R60

10K

+

-

K1A

Fuj

itsu

FT

R-C

1GA

4.5G

+

-

K1A

Fuj

itsu

FT

R-C

1GA

4.5G

1

12

V2B 35

0V

NO

PO

PG

TC

A28

-351

L-P

05

V2B 35

0V

NO

PO

PG

TC

A28

-351

L-P

05

Q1

MM

BT

A06

LT1

Q1

MM

BT

A06

LT1

TP

12

+3.3

VR

ED

TP

12

+3.3

VR

ED

J7 NO

PO

P

J7 NO

PO

P

11

22

33

44

55

JP24

JP24

R15

868

1R

158

681

R39

10K

NO

PO

P

R39

10K

NO

PO

P

R10

120

0R

101

200

R11

50

NI

R11

50

NI

TP

2T

urre

tG

ND

TP

2T

urre

tG

ND

TP

22T

P22

R15

668

1R

156

681

D52

RE

DU

SB

D52

RE

DU

SB

U13

IDT

74C

BT

LV32

57

U13

IDT

74C

BT

LV32

57

GND8

VCC16

1B1

2

2B1

5

3B1

11

4B1

14

1A4

2A7

3A9

4A12

1B2

3

2B2

6

3B2

10

4B2

13

OE

15

S1

J5A

RJ-

11

TE

LEP

HO

NE

J5A

RJ-

11

TE

LEP

HO

NE

1 2 3 4 5 6

D5

EXC

LUS

ION

D5

EXC

LUS

ION

R59

1.0R

59

1.0

K1B

K1B

43 5

R16

368

1R

163

681

J6

HE

AD

ER

5x3

J6

HE

AD

ER

5x3

1 23

4 56

7 89

10 11 131512

14 TP

20T

P20

C74

1uF

C74

1uF

T1

3.3m

HN

OP

OP

T1

3.3m

HN

OP

OP

23

14

R51

10K

R51

10K

J5B

RJ-

11

PS

TN

LIN

E

J5B

RJ-

11

PS

TN

LIN

E7 8 9 10 11 12

R85

1.5k

R85

1.5k

R87

10K

R87

10K

JP33

Aut

obau

d D

is.

JP33

Aut

obau

d D

is.

12JP

34

Exc

lusi

on E

n.

JP34

Exc

lusi

on E

n.

12

JP16

4X1

Soc

ket

JP16

4X1

Soc

ket

D44

CD

D44

CD

TP

9T

urre

tG

ND

TP

9T

urre

tG

ND

TP

5

RIN

GB

LUE

TP

5

RIN

GB

LUE

R41

10K

R41

10K

D43

CT

SD

43C

TS

TP

16T

P16

R52

10K

R52

10K

R69

0R

690

R16

968

1R

169

681

C71

0.1u

FC

710.

1uF

J101

HE

AD

ER

8x2

J101

HE

AD

ER

8x2

11

22

33

44

55

66

77

88

99

1010

1111

1313

1515

1212

1414

1616

TP

13

Isen

seR

ED

TP

13

Isen

seR

ED

R42

10K

R42

10K

D47

RT

SD

47R

TS

R15

968

1R

159

681

D42

TXD

D42

TXD

R49

10K

R49

10K

U5

EE

PR

OM

32K

U5

EE

PR

OM

32K

/CS

1M

ISO

2M

OS

I5

SC

LK6

/WP

3

GND4

/HO

LD7

VCC8

U26

74LC

X541

U26

74LC

X541

A1

2

A2

3

A3

4

A4

5

A5

6

A6

7

A7

8

A8

9

G1

1

G2

19

Y1

18

Y2

17

Y3

16

Y4

15

Y5

14

Y6

13

Y7

12

Y8

11

VCC20

GND10

JP23

JP23

TP

21T

P21

R40

10K

R40

10K

Fig

ure

25.M

oth

erb

oar

d M

ain

Dig

ital

Lo

gic

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

Rev. 0.4 31

To MUX

EXT MIC IN

GAIN SEL

1-2 Variable

2-3 Fixed

5.5KHz

pole

CW: 34 dB

CCW: 6 dB

EXT MIC IN GAIN ADJ

power

Consumption

Here is 20

mA at 3.3

Volts

CAPS FOR AD8602ARM OPAMPS

EXT DIFF SPKR GAIN ADJ

High Pass set for 50 Hz Corner

"Do

not g

ound

spea

ker+

or

Spe

aker

-

14KHZ pole

Gain WRT to Line

Out: CW/46.4 dB

CCW: 21.4 dB

To MODEM

Si3000 Option Strapping

Several footprint compatiple

variations of this amplifier are in

production allowing an easy price

vs power tradeoff. EG. LM4819.

"Pin 1"

"Pin 1"

ATT Ref Handset

Speaker at pins 2&3

Mic. in. is at pin 4

with GND at pin 1.

Pin 1JP1

JP4

Pin 5

Pin 5

Cisco Ref Handset

Speaker at pins

2&3, Mic. in. is

at pin 1 and GND

is pin 4

Pin 1JP1

JP4

Differing handsets can be accomodated

as shown in these two examples

SP

KR

_AU

X_IN

SI3

000_

LIN

E_I

N

SI3

000_

LIN

E_I

N

SP

KR

_AU

X_IN

FS

YN

CH

b

RE

SE

Tb

SS

I_C

LKO

UT

SS

I_S

DO

SD

I_E

ES

D

AO

UT

_IN

Tb

+3V

3_A

VG

ND

+3V

3_A

VG

ND

+3V

3_A

+3V

3_A

+3V

3_A

VG

ND

+3.3

V

+3V

3_A

GN

D

GN

D

VG

ND

+3V

3_A

+3V

3_A

VG

ND

+3V

3_A

+4.5

V

VG

ND+3

.3V

JP6

JUM

PE

R

JP6

JUM

PE

R

12

R9

0R

90

C7

1uF

C7

1uF

R25

10K

R25

10K

JP14

En.

Lcl

. Spe

aker

JP14

En.

Lcl

. Spe

aker

12

C18

1uF

C18

1uF

R31 10

KR

31 10K

J30

5X2

Shr

oude

d H

eade

r

J30

5X2

Shr

oude

d H

eade

r

11

22

33

44

55

66

77

88

99

1010

R3

200

R3

200

R23 3.

01K

R23 3.

01K

R6

2KR6

2K

R20

10K

R20

10K

R45

100K R45

100K

FB

160

0 O

hmF

B1

600

Ohm

+C

1710

0uF

+C

1710

0uF

JP1

JP1

R410K R410K

C4

0.1u

F

C4

0.1u

F

R14

1KR

141K

R29

3.01

KR

293.

01K

C20 1u

F

C20 1u

F

R13

50K

R13

50K

13

2

U4

LM48

62

U4

LM48

62

SH

UTD

OW

N1

BY

PA

SS

2IN

+3

IN-

4

VO

28

GND7

VDD6

VO

15

FB

260

0 O

hmF

B2

600

Ohm

R37

100K

R37

100K

JP5

JP5

C15

2.2n

FC

152.

2nF

R33

1KR33

1K

R32

0

R32

0

R28

200

R28

200

R38

100K

R38

100K

R10

4.7K

R10

4.7K

C12 0.1u

F

C12 0.1u

F

R22 49

9R

22 499

Input

Output

Si3

000

U2

Input

Output

Si3

000

U2

MC

LK7

SC

LK8

FSY

NC

6S

DI

4S

DO

5

RE

SE

T*9

LIN

EI

11

MIC

_BIA

S2

MIC

_IN

10

LIN

EO

15

SP

KR

_L16

SP

KR

_R1

VD12

VA13

GND14

HD

ST

3

LS1

SP

EA

KE

R

LS1

SP

EA

KE

R

R12

5.1K

R12

5.1K

+ -

U22

BA

D86

02A

RM

+ -

U22

BA

D86

02A

RM

5 67

JP10

JP10

12

R30

10M

R30

10M

+

C6

100u

F

+

C6

100u

F

JP12

Pw

r A

mp

Ena

ble

JP12

Pw

r A

mp

Ena

ble

12

C11

1uF

C11

1uF

R3610

0KR

36100K

C28

0.1u

F

C28

0.1u

F

+-

U21

BA

D86

02A

RM

+-

U21

BA

D86

02A

RM

567

C37

1uF

C37

1uF

JP2

JP2

C27

0.1u

F

C27

0.1u

F

J2RC

A J

AC

K

EXT

MIC

.

J2RC

A J

AC

K

EXT

MIC

.

C23

1uF

C23

1uF

R27

324K

R27

324K

JP13

JP13

12

R35

1KR35

1K

R18

100K

R18

100K

+ -

V+

V-

U21

A AD

8602

AR

M

+ -

V+

V-

U21

A AD

8602

AR

M

123

48

C24

0.1u

F

C24

0.1u

F

C22

1uF

C22

1uF

MK

1

LCL.

MIC

.

MK

1

LCL.

MIC

.1 2

C8

10uF

C8

10uF

+ -

V+

V-

U20

A

AD

8602

AR

M

+ -

V+

V-

U20

A

AD

8602

AR

M

123

48

C26

0.1u

F

C26

0.1u

F

C25

0.1u

F

C25

0.1u

F

J1H

AN

DS

ET

J1H

AN

DS

ET

1 2 3 4JP

3JP

3

R2

0N

IR

20

NI

D1

MM

BD

3004

S-7

-F

D1

MM

BD

3004

S-7

-F

R7

2KR

72K

C29

0.1u

F

C29

0.1u

F

JP4

JP4

D2

MM

BD

3004

S-7

-F

D2

MM

BD

3004

S-7

-F

C21

1uF

C21

1uF

FB

460

0 O

hmF

B4

600

Ohm

JP11

DIF

F S

PK

R O

UT

JP11

DIF

F S

PK

R O

UT

R44

3.01

KR

443.

01K

C19

2.2n

FC

192.

2nF

C34 1u

FC

34 1uF

JP9

JUM

PE

RJP

9JU

MP

ER

12

C10

0.1u

F

C10

0.1u

F

C5 0.

1uF

C5 0.

1uF

FB

360

0 O

hmF

B3

600

Ohm

C3 0.1u

F

C3 0.1u

F

JP15

JUM

PE

RJP

15JU

MP

ER

12

JP8

EN

. LC

L M

ICJP

8E

N. L

CL

MIC

12

R24

50K

R24

50K

13

2

R34

1KR34

1K

C14

0.1u

F

C14

0.1u

F

R21

2KR21

2K

D3

MM

BD

3004

S-7

-F

D3

MM

BD

3004

S-7

-F

R11 2K

R11 2K

R17

10K

R17

10K

R15

49.9

K

R15

49.9

K

C30

0.1u

F

C30

0.1u

F

+ -

V+

V-

U22

AA

D86

02A

RM

+ -

V+

V-

U22

AA

D86

02A

RM

123

48

C31

1uF

C31

1uF

C98

4.7u

FC

984.

7uF

+-

U20

B

AD

8602

AR

M

+-

U20

B

AD

8602

AR

M

567

C13

560p

FC

1356

0pF

JP7

JP7

12

R19

10K

R19

10K

R5

100K

R5

100K

R16

1KR

161K

Fig

ure

26.M

oth

erb

oar

d S

ou

nd

Pro

cess

ing

Cir

cuit

s

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

32 Rev. 0.4

RS

-232

, Fem

ale,

Fro

nt V

iew

US

B

input

threshold of

0.8 and 2.4

Volts

Output voltages:

CMOS, 0 and 5

Volts

Keep Very Close

RXD

_232

CT

S_2

32

RD

_232

TXD

_232

DT

R_2

32

DS

R_2

32

RT

S_2

32

CD

_232

RXD

_T

CT

S_T

DS

R_T

CD

_T

RI_

T

TXD

_T

RT

S_T

DT

R_T

RI_

UC

D_U

DS

R_U

TXD

_UR

XD_U

CT

S_U

RT

S_U

DT

R_U

+3.3

V

+3.3

V

VC

C_U

SB

DN515V DN515V

C58

0.1u

F

C58

0.1u

F

R11

210

KR

112

10K

DN415V DN415V

DN115V DN115V

FB

8

600

Ohm

BLM

18A

G60

1SN

1

FB

8

600

Ohm

BLM

18A

G60

1SN

1

R11010K R11010K

U11

MA

X323

7

U11

MA

X323

7

C2+

1

C2-

3

C1+

28

C1-

25V

+27

V-

4

T1IN

24

T2IN

23

T3IN

22

T4IN

19

T5IN

17

R1O

UTB

16

R1O

UT

21

R2O

UT

20

R3O

UT

18

EN

13

GND2

T1O

UT

5

T2O

UT

6

T3O

UT

7

T4O

UT

10

T5O

UT

12

VCC26

R1I

N8

R2I

N9

R3I

N11

MB

AU

D15

SH

DN

14

C62

0.1u

F

C62

0.1u

F

DN815V DN815VC53

0.1u

F

C53

0.1u

F

DN315V DN315V

C52

560p

FC

5256

0pF

R10910K R10910K

J10

DB

9

J10

DB

9

CD

(O)

1

RX

D(O

)2

TXD

(I)

3

DTR

(I)

4

SG

5

DS

R(O

)6

RTS

(I)

7

CTS

(O)

8

RD

(O)

9

MH10

MH11

D14

D14

C63 0.

1uF

C63 0.

1uF

DN715V DN715V

DN215V DN215V

R11110K R11110K

U12

CP

2102

U12

CP

2102

RE

GIN

7

VDD6

GND3

VB

US

8

D-

5

D+

4

CTS

23R

TS24

RX

D25

TXD

26D

SR

27D

TR28

DC

D1

RI

2

SU

SP

EN

D11

SU

SP

EN

D12

RS

T9

GNDEPAD

D15

D15

C57

0.1u

FC

570.

1uF

C61 0.1u

F

C61 0.1u

F

J11

US

B T

ype

BJ1

1U

SB

Typ

e B

+V1

D-

2

D+

3

GN

D4

SH5SH6

C59 0.1u

F

C59 0.1u

F

C56

0.1u

FC

560.

1uF

DN615V DN615V

FB

9

600

Ohm

BLM

18A

G60

1SN

1

FB

9

600

Ohm

BLM

18A

G60

1SN

1

R10

80 N

OP

OP

R10

80 N

OP

OP

C54

1uF

C54

1uF

C60

0.01

uF

C60

0.01

uF

C55

1uF

C55

1uF

Fig

ure

27.M

oth

erb

oar

d H

ost

I/O

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

Rev. 0.4 33

RE

SE

Tb

+4.5

V

+3.3

V

VC

C_U

SB

+3V

3_A

+5V

_RA

W

J8 7-12

V A

C/D

C P

WR

J8 7-12

V A

C/D

C P

WR

12

C40

0.1u

F

50VC40

0.1u

F

50V

R10

31.

6R

103

1.6

R10

51.

6R

105

1.6

+C

4156

0uF

6.3V

+C

4156

0uF

6.3V

D51

RE

D

+4.5

V

D51

RE

D

+4.5

V

Q4

MM

BT

A06

LT1

Q4

MM

BT

A06

LT1

D49

MM

BD

3004

S-7

-F

D49

MM

BD

3004

S-7

-F

D11

ST

PS

140Z

SO

D-1

23D

11

ST

PS

140Z

SO

D-1

23

R98

0.05

R98

0.05

TP

10

+4.5

VR

ED

TP

10

+4.5

VR

ED

U1

LT19

63A

-3.3

VS

OT

223

U1

LT19

63A

-3.3

VS

OT

223

GN

DIN

OU

TG

ND

D50

RE

D

+3.3

V P

WR

D50

RE

D

+3.3

V P

WR

C65

1uF

C65

1uF

D9

ST

PS

140Z

D9

ST

PS

140Z

D13

ST

PS

140Z

D13

ST

PS

140Z

U18 DS

1818

U18 DS

1818

VC

C2

GN

D3

RS

T1

U3

LT19

63A

-3.3

VS

OT

223

U3

LT19

63A

-3.3

VS

OT

223

GN

DIN

OU

TG

ND

+C45

470u

F

+C45

470u

F

C51

0.01

uF

25V

C51

0.01

uF

25V

C66

10uF

C66

10uF

R97

200

R97

200

C48

0.1u

F50

V

C48

0.1u

F50

VF

B7

600

Ohm

FB

7

600

Ohm

R10

01.

33K

R10

01.

33K

C96

0.1u

F

C96

0.1u

F

Q3

FC

X105

1AT

A

Q3

FC

X105

1AT

A

FB

6

600

Ohm

FB

6

600

Ohm

C2

10uF

C2

10uF

-+

D12

Brid

ge R

ectif

ier

-+

D12

Brid

ge R

ectif

ier

TP

1

+3V

3_A

RE

DT

P1

+3V

3_A

RE

D

C43

1uF

C43

1uF

R57

0.05

R57

0.05

C42

0.01

uF25

V

C42

0.01

uF25

V

R16

168

1R

161

681

R99

200R

99

200

C39

10uF

C39

10uF

C1

0.1u

FN

OP

OP

C1

0.1u

FN

OP

OP

C49

10uF

C49

10uF

R1

0.05

R1

0.05

+C44

470u

F

+C44

470u

F

U10

TO

263-

3NLM

2937

ES

-5.0

U10

TO

263-

3NLM

2937

ES

-5.0

GN

DIN

OU

TG

ND

U8

TO

263-

3NLM

2937

ES

-5.0

U8

TO

263-

3NLM

2937

ES

-5.0

GN

DIN

OU

TG

ND

S1

RE

SE

T

S1

RE

SE

T

R10

2

1.33

K

R10

2

1.33

K

J9 7-12

V A

C/D

C P

WR

J9 7-12

V A

C/D

C P

WR

3 2 1R

104

0.05

R10

40.

05

R96

3.57

R96

3.57

D7

ST

PS

140Z

SO

D-1

23D

7

ST

PS

140Z

SO

D-1

23

Fig

ure

28.M

oth

erb

oar

d P

ow

er S

up

ply

an

d R

eset

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

34 Rev. 0.4

The

se c

ompo

nent

s ar

e fo

r in

tern

al S

ilabs

use

onl

y.

����

���

���

�� �

������

�����

No

R103

R106

R101

No

No

No

No

No

No

Yes

No

No

No

Yes

PKG_16.11 & PKG_24.15

PKG_16.3 & PKG_24.4

PKG_16.15 & PKG_24.23

PKG_16.7 & PKG_24.11

PKG_24.16

R102

No

No

Yes

Yes

Yes

No

Yes

X XNo

No

Yes

SPI 32 kHz

SPI 27 MHz

SPI 4.9252 MHz

Pin11

Pin3

Pin15

Pin7

Pin15

Pin23

Pin11

R104

R106

R101

R102

No

Yes

X X

No

Yes

No

Yes

No

Yes

Pin16

SO

IC16

Sys

tem

Sid

e S

trap

ping

Tab

le

UART 4.9152 MHz

UART 27 MHz

UART 32 kHz

Parallel

PKG_24.17

R105

Pin17

XX

XX

Parallel

27 Mhz

4.9152 MHz

SPI

SPI

SPI

No

Yes

No

Yes

No

No

Yes

27 Mhz

Yes

X4.9152 MHz

32.768 kHz

No

No

No

No

UART

No

Yes

32.768 kHz

X

No

No

UART

No

No

No

No

No

UART

No

No

Yes

4.9152 MHz

27 Mhz

TS

SO

P24

Sys

tem

Sid

e S

trap

ping

Tab

le

Y1,

Y1B

& Y

3 ar

e al

tern

ate

foot

prin

ts a

nd fr

eque

ncie

s.T

he V

alue

s of

C40

& C

41 v

ary.

See

The

BO

M.

�����

����

����

�����

������

���

�����

�������

����

���

�� �

��

CTSb

AOUT_INTb

INTb

RIb

DCDb

CTSb

AOUT_INTb

FSYNCH(RI)

DCDb

SD

O_E

EC

LK_R

TS

b

DC

Db

ES

C

AO

UT

_IN

Tb

RX

D

RE

SE

Tb

XT

ALI

XT

ALO

RX

DR

TS

b

RE

SE

Tb

DC

Db

FS

YN

CH

RT

Sb

INT

b

ES

C

RIb

SD

I_E

ES

D

AO

UT

_IN

Tb

CLK

OU

T_E

EC

Sb_

AO

CLK

OU

T_E

EC

Sb_

AO

TX

DC

TS

b

TX

DC

TS

b

FS

YN

CH

SD

O_E

EC

LK_R

TS

b

SD

O_E

EC

LK_R

TS

b

SD

I_E

ES

DR

Ib

AO

UT

_IN

Tb

FS

YN

CH

INT

b

ES

C

DC

Db

RIb

SD

I_E

ES

D

VD

A

XT

ALO

XT

ALI

XT

ALO

AO

UT

_IN

Tb

CT

Sb

DC

Db

FS

YN

CH

INT

bR

IbVD

A

VD

B

RX

DT

XD

CT

Sb

XT

ALI

RE

SE

Tb

C1A

C2A

C1A

C2A

VD

D

VD

D

VD

D

VD

D

C41

33pF

C41

33pF

U12

Si2

493

U12

Si2

493

CLK

IN/X

TA

LI1

XT

ALO

2

CLK

OU

T/E

EC

Sb/

A0

3

FS

YN

CH

/D6

4

VD3.35

GND6

VD

A7

RT

Sb/

SP

I_C

Sb/

D7

8

VD

B19

GND20

VD 3.321

C2A

13

C1A

14

ES

C/D

322

DC

Db/

D4

23S

DO

/EE

CLK

/D5

24

CT

S/S

PI_

SC

LK/C

Sb

11

RX

D/S

PI_

MIS

O/R

Db

9

TX

D/S

PI_

MO

SI/W

Rb

10

RE

SE

T12

RIb

/D1

17

SD

I/EE

SD

/D2

18

AO

UT

/INT

b15

INT

b/D

016

Y3

27 M

Hz

Y3

27 M

Hz

GN

D2

VC

C4

OU

T3

NC

1

R11

120

0R

111

200

C54

1uF

C54

1uF

C55

0.1u

FC

550.

1uF

R11

020

0R

110

200

U13

Si2

4xx-

16 p

inU

13S

i24x

x-16

pinCLK

IN/X

TA

LI1

XT

ALO

2

RIb

3

VDD3.34

RX

D_S

PI_

MIS

O5

TX

D_S

PI_

MO

SI

6

CT

Sb_

SP

I_S

CLK

7

RE

SE

T8

C2A

9

C1A

10

INT

b11

GND12

VA

13

ES

C14

DC

Db

15

RT

Sb_

SP

I_C

Sb

16

R18

1.2K

R18

1.2K

R11

220

0R

112

200

C40

33pF

C40

33pF

Y1

4.91

52M

Hz

Y1

4.91

52M

Hz

C53

0.22

uFC

530.

22uF

J1S

OC

KE

T 8

x2J1

SO

CK

ET

8x2

11

22

33

44

55

66

77

88

99

1010

1111

1313

1515

1212

1414

1616

C56

0.1u

FC

560.

1uF

R10

310

KR

103

10K

R10

610

KR

106

10K

R12

0N

IR

120

NI

R12

1N

IR

121

NI

C50

0.1u

FC

500.

1uF

R10

110

KR

101

10K

C51

0.22

uFC

510.

22uF

C52

0.1u

FC

520.

1uF

Y1B

32.7

68K

Hz

Y1B

32.7

68K

Hz

R10

210

KR

102

10K

R10

410

KR

104

10K

FB

5F

B5

R10

51K

R10

51K

Fig

ure

29.D

aug

hte

r C

ard

(S

i24x

x2G

-DC

Rev

2.0

) S

yste

m S

ide

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

Rev. 0.4 35

Bias

Ring Detect/CID/Voltage monitoring

DC Term

Add

0.0

20 to

0.0

30 s

q.in

ches

of

Cu

at a

lltr

ansi

stor

col

lect

ors

Place C3 near D1

No

GN

D o

r I_

GN

Dco

pper

pla

nes

in D

AA

se

ctio

n.

TIP

RING

Kee

p 5

mm

cre

epag

eru

les

betw

een

this

DA

A

sect

ion

and

all e

lse.

C1A

C2A

I_G

ND

I_G

ND

I_G

ND

I_G

ND

R12

56.2

R12

56.2

C10

0.01

uF

C10

0.01

uF

Q5

MM

BT

A06

LT1

Q5

MM

BT

A06

LT1

Q3

MM

BT

A42

LT1

Q3

MM

BT

A42

LT1

C4X

1uF

25V

X8R

C4X

1uF

25V

X8R

RV

1

P31

00S

B

RV

1

P31

00S

B

Q1

MM

BT

A42

LT1

Q1

MM

BT

A42

LT1

FB

1

600

Ohm

FB

1

600

Ohm

R2

150

R2

150

R4

2.49

K

R4

2.49

K

C5

0.1u

FC

0603

C5

0.1u

FC

0603

C6

0.1u

FC

0603

C6

0.1u

FC

0603

C2

33pF

C2

33pF

C8

680p

FC

868

0pF

-+

D1

HD

04

-+

D1

HD

04

Q2

MM

BT

A92

LT1

Q2

MM

BT

A92

LT1

C9

680p

FC

968

0pF

R6

100K

R6

100K

FB

2

600

Ohm

FB

2

600

Ohm

R11

73.2R11

73.2

C1

33pF

C1

33pF

R13

56.2

R13

56.2

C7

2.7n

FC

72.

7nF

+

C4

1uF

+

C4

1uF

R15 0R15 0

Z1

43V

Z1

43V

R7

20M

R7

20M

J2T

SM

-104

-01-

T-S

V4X

1 H

eade

r

J2T

SM

-104

-01-

T-S

V4X

1 H

eade

r

Q4

MM

BT

A06

LT1

Q4

MM

BT

A06

LT1

R8

20M

R8

20M

R3

3.65

K

R3

3.65

K

C3

0.01

uF

C3

0.01

uF

R9

1MR9

1M

R5

100K

R5

100K

R1

1.07

KR

11.

07K

R16 0

R16 0

U2

Si3

018

U2

Si3

018 Q

E1

DC

T2

RX

3

IB4

C1B

5

C2B

6

VR

EG

7

RN

G1

8

DC

T2

16IGND

15

DC

T3

14

QB

13

QE

212

SC11

VR

EG

210

RN

G2

9

R10

536R

10

536

Fig

ure

30.D

aug

hte

r C

ard

(S

i24x

x2G

-DC

Rev

2.0

) L

ine

Sid

e

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

36 Rev. 0.4

Thes

e co

mpon

ents

are

for

int

erna

l Si

labs

use

onl

y.

R103

R102

27 M

hz

4.91

52 M

Hz

32.7

68 k

Hz

The

two

Crys

tals

are

alte

rnat

e f

ootp

rint

s an

d fr

eque

ncie

s. T

he v

alue

s of

C40

and

C41

are

dif

fere

nt a

tth

e tw

o fr

eque

ncie

s. S

ee T

heBO

M.

The

27 M

Hz o

scil

lato

r is

ast

and-

in f

or a

cus

tome

rpr

ovid

e sy

stem

cl

ock,

sav

ing

the

cost

of

a cr

ysta

l an

d tw

oca

ps.

RIb

DCDb

P1 P2P3 P14

P10 P8 P4 P5 P9 P7 P11

P12

P16

P13

Pin

2Pi

n 35

Pin

19Pi

n 28

Yes

Yes

No No

No No

Y1C

Y1B

Y1A

Yes

Yes

Yes

NoNo

No

No

No No

** R

102

is 1

k be

caus

eVo

ice

moth

erbo

ards

use

a

10 k

pul

lup

on

RIb

when

the

excl

usio

n re

lay

driv

eris

ena

bled

via

the

jum

per.

RX

D_

SP

I_M

ISO

FS

YN

CH

RT

Sb

_S

PI_

CS

INT

b

ES

C

RIb

SD

I

AO

UT

CL

KO

UT

TX

D_

SP

I_M

OS

IC

TS

b_

SP

I_S

CL

K

SD

O

RE

SE

Tb

DC

Db

RIb

SD

I

XT

AL

O

DC

Db

INT

b

RIb

XT

AL

I

AO

UT

EE

SD

IE

ES

DO

RX

D_

SP

I_M

ISO

TX

D_

SP

I_M

OS

IR

TS

b_

SP

I_C

S

CT

Sb

_S

PI_

SC

LK

RE

SE

Tb

CL

KO

UT

ES

CX

TA

LO

EE

CS

DC

Db

EE

CL

K

XT

AL

I

SD

O

FS

YN

CH

INT

b

RIb

SD

I

FS

YN

CH

EE

CL

KE

ES

DI

EE

SD

OE

EC

S

GP

IO1

GP

IO1

C1

A

C2

A

VD

D

VD

D

VD

D

VD

D

VD

D

C1

AC

2A

TP

V3

TP

V3

JP2

EE

En

JP2

EE

En

C5

0

0.1

uFC

04

02

C5

0

0.1

uFC

04

02

TP

V6

TP

V6

TP

V4

TP

V4

C5

2

0.1

uFC

04

02

C5

2

0.1

uFC

04

02

C4

13

3p

FC

41

33

pF

R1

21

0R

12

10

C5

6

0.1

uF

C5

6

0.1

uF

R1

20

0R

12

00

J1S

OC

KE

T 8

x2J1

SO

CK

ET

8x2

11

22

33

44

55

66

77

88

99

10

10

11

11

13

13

15

15

12

12

14

14

16

16

FB

5F

B5

TP

V1

TP

V1

R1

01

10

KR

10

11

0K

TP

V5

TP

V5

C5

10

.22

uFC

51

0.2

2uF

R1

8

1.2

K

R1

8

1.2

K

TP

V2

TP

V2

C4

03

3p

FC

40

33

pF

JP1

SP

I En

JP1

SP

I En

C5

41

uFC

54

1uF

Y1

C2

7 M

Hz

Y1

C2

7 M

Hz

GN

D2

VC

C4

OU

T3

NC

1

C5

50

.1uF

C5

50

.1uF

R1

03

10

KR

10

31

0K

C5

70

.1uF

C5

70

.1uF

U3

EE

PR

OM

32

K

U3

EE

PR

OM

32

K/CS

1M

ISO

2M

OS

I5

SC

LK

6/W

P3

GND4

/HO

LD

7

VCC8

R1

02

1K

R1

02

1K

R1

22

0R

12

20

Y1

A3

2.7

68

KH

zY

1A

32

.76

8K

Hz

U1

Si2

49

3U

1S

i24

93

GP

IO1

1

NC

14

FS

YN

CH

_2

CLK

OU

T3

VDD5

GND6

VR

EG

7

SD

I8

RIb

19

GP

IO11/A

020

UA

RT

_C

TS

_/S

PI_

SC

LK

/CS

_21

EE

CLK

13

AO

UT

b14

UA

RT

_R

XD

/SP

I_M

ISO

/RD

_22

UA

RT

_T

XD

/SP

I_M

OS

I/W

R_

23

UA

RT

_R

TS

_/S

PI_

CS

_/D

724

EE

SD

O11

SD

O9

EE

SD

I10

EE

CS

12

C2A

17

C1A

18

AO

UT

15

RE

SE

T_

16

GP

IO18/D

034

INT

_35

CLK

IN/X

TA

LI

36

XT

ALO

37

NC

338

NC

227

GND25VDD

26

EC

/D5

29

GP

IO25/D

331

GP

IO16/D

232

DC

D_/D

628

GP

IO24/D

430

GP

IO17/D

133

TP

V7

TP

V7

R1

23

0R

12

30

Y1

B4

.91

52

MH

zY

1B

4.9

15

2M

Hz

R1

04

10

KR

10

41

0K

Fig

ure

31.Q

FN

Dau

gh

ter

Car

d (

Si2

4xx2

G-Q

FN

38-D

C R

ev 1

.0)

Sys

tem

Sid

e

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

Rev. 0.4 37

Bias

Ring

Det

ect/

CID/

Volt

age

moni

tori

ng

Hook

swit

ch

DC T

erm

Add

0.02

0 to

0.0

30 s

q. i

nche

s of

Cu

at a

lltr

ansi

stor

col

lect

ors

Plac

e C3

nea

r D1

No

Gro

und

Pla

ne In

DA

A S

ectio

n

TIP

RING

C1

A

C2

A

I_G

ND

I_G

ND

I_G

ND

I_G

ND

C1

0

0.0

1uF

C1

0

0.0

1uF

R1

2

56

.2

R1

2

56

.2

Q1

MM

BT

A4

2L

T1

Q1

MM

BT

A4

2L

T1

RV

1

P3

10

0S

B

RV

1

P3

10

0S

B

C4

X1

uF2

5V

X8

RC

4X

1uF

25

VX

8R

Q3

MM

BT

A4

2L

T1

Q3

MM

BT

A4

2L

T1

Q5

MM

BT

A0

6L

T1

Q5

MM

BT

A0

6L

T1

R2

15

0

R2

15

0F

B1

60

0 O

hm

FB

1

60

0 O

hm

C2

33

pF

C2

33

pF

C6

0.1

uFC

06

03

C6

0.1

uFC

06

03

C5

0.1

uFC

06

03

C5

0.1

uFC

06

03

R4

2.4

9K

R4

2.4

9K

Q2

MM

BT

A9

2L

T1

Q2

MM

BT

A9

2L

T1

-+

D1

HD

04

-+

D1

HD

04

C8

68

0p

FC

86

80

pF

R6

10

0K

R6

10

0K

C9

68

0p

FC

96

80

pF

C1

33

pF

C1

33

pF

R1

1

73

.2

R1

1

73

.2

FB

2

60

0 O

hm

FB

2

60

0 O

hm

C7

2.7

nFC

72

.7nF

R1

3

56

.2

R1

3

56

.2R

15

0R

15

0

+

C4

1uF

+

C4

1uF

J2

TS

M-1

04

-01

-T-S

V

4X

1 H

ead

er

J2

TS

M-1

04

-01

-T-S

V

4X

1 H

ead

er

R7

20

MR

72

0M

Z1

43

VZ

14

3V

R8

20

MR

82

0M

Q4

MM

BT

A0

6L

T1

Q4

MM

BT

A0

6L

T1

R3

3.6

5K

R3

3.6

5K

C3

0.0

1uF

C3

0.0

1uF

R9

1M

R9

1M

R5

10

0K

R5

10

0K

R1

0

53

6R1

0

53

6

U2

Si3

01

8

U2

Si3

01

8 QE

1

DC

T2

RX

3

IB4

C1B

5

C2B

6

VR

EG

7

RN

G1

8

DC

T2

16

IGND15

DC

T3

14

QB

13

QE

212

SC11

VR

EG

210

RN

G2

9

R1

60

R1

60

R1

1.0

7K

R1

1.0

7K

Fig

ure

32.D

aug

hte

r C

ard

(S

i24x

x2G

-QF

N38

-DC

Rev

1.0

) L

ine

Sid

e

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

38 Rev. 0.4

6. Motherboard and Daughter Card PCB Layouts

Fig

ure

33.M

oth

erb

oar

d P

rim

ary

Sid

e C

om

po

nen

t an

d S

ilksc

reen

Vie

w

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

Rev. 0.4 39

Fig

ure

34.M

oth

erb

oar

d B

ott

om

Sid

e C

om

po

nen

t an

d S

ilks

cree

n V

iew

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

40 Rev. 0.4

Fig

ure

35.M

oth

erb

oar

d P

rim

ary

Sid

e S

ign

al L

ayer

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

Rev. 0.4 41

Fig

ure

36.M

oth

erb

oar

d L

ayer

2 G

rou

nd

Pla

ne

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

42 Rev. 0.4

Fig

ure

37.M

oth

erb

oar

d L

ayer

3 P

ow

er P

lan

e

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

Rev. 0.4 43

Fig

ure

38.M

oth

erb

oar

d S

eco

nd

ary

Sid

e, S

ign

al L

ayer

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

44 Rev. 0.4

Fig

ure

39.D

aug

hte

r C

ard

Pri

mar

y S

ide,

Co

mp

on

ent

and

Silk

scre

en

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

Rev. 0.4 45

Fig

ure

40.D

aug

hte

r C

ard

Sec

on

dar

y S

ide,

Co

mp

on

ent

and

Silk

scre

en

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

46 Rev. 0.4

.

Fig

ure

41.D

aug

hte

r C

ard

Pri

mar

y S

ide

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

Rev. 0.4 47

Fig

ure

42.D

aug

hte

r C

ard

Sec

on

dar

y S

ide

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

48 Rev. 0.4

Fig

ure

43.Q

FN

Dau

gh

ter

Car

d P

rim

ary

Sid

e, C

om

po

nen

t an

d S

ilksc

reen

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

Rev. 0.4 49

Fig

ure

44.Q

FN

Dau

gh

ter

Car

d S

eco

nd

ary

Sid

e, C

om

po

nen

t an

d S

ilksc

reen

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

50 Rev. 0.4

Fig

ure

45.Q

FN

Dau

gh

ter

Car

d P

rim

ary

Sid

e

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

Rev. 0.4 51

Fig

ure

46.Q

FN

Dau

gh

ter

Car

d S

eco

nd

ary

Sid

e

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

52 Rev. 0.4

7. Bill of Materials

The following sections contain the bills of materials for the motherboard and daughter card.

7.1. Motherboard Bill of Materials

Table 7. MotherBoard Bill of Materials

Item NI Qty Ref Value Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr

48 NI 3 R2, R114, R115

0 1A ThickFilm R0603 CR0603-16W-000 Venkel

1 NOPOP 1 C1 0.1 µF 10V ±20% X7R C0402 C0402X7R100-104M Venkel

33 NOPOP 1 J7 2 mm, RT ANG SHROUDED

CONN1X5-S5B-PH-SM4-TB

S5B-PH-SM4-TB JST

63 NOPOP 6 R39, R49, R51

10 k 1/10W ±1% ThickFilm R0603 CR0603-10W-1002F Venkel

71 NOPOP 1 R108 0 1A ThickFilm R0603 CR0603-16W-000 Venkel

77 NOPOP 1 T1 3.3 mH TelCom IND-CMC-7X8 750311349 Wurth/Mid-com

90 NOPOP 1 V1A 1000 V 1000V GDT GDT-RA-C6-Y RA-102M-C6-Y OKAYA

91 NOPOP 1 V1B 800 V 800V GDT GDT-450-6X8MM GTCA28-801L-P05 Tyco

92 NOPOP 1 V2A 350 V 350V GDT GDT-RA-C6-Y RA-351M-C6-Y OKAYA

93 NOPOP 1 V2B 350 V 350V GDT GDT-450-6X8MM GTCA28-351L-P05 Tyco

2 2 C2 C39 10 µF 10V ±20% X7R C1206 C1206X7R100-106M Venkel

3 27 C3, C4, C5, C10, C12, C14, C24, C25, C26, C27, C28, C29, C30, C33, C35, C53, C56, C57, C58, C59, C61, C62, C63, C71, C72, C75, C96

0.1 µF 10V ±20% X7R C0402 C0402X7R100-104M Venkel

4 2 C6, C17 100 µF 16V ±20% Alum_Elec C6.6X6.6MM EEEFK1C101P Panasonic

5 16 C7, C11, C18, C20, C21, C22, C23, C31, C34, C37, C43, C54, C55, C65, C69, C74

1 µF 10V ±10% X7R C0603 C0603X7R100-105K Venkel

6 3 C8, C49, C66

10 µF 16V ±10% X5R C0805 C0805X5R160-106K Venkel

7 4 C13, C52, C70 C73

560 pF 16V ±10% X7R C0603 C0603X7R160-561K Venkel

8 2 C15, C19 2.2 nF 16V ±10% X7R C0603 C0603X7R160-222K Venkel

9 2 C40, C48 0.1 µF 50V ±10% X7R C0603 C0603X7R500-104K Venkel

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

Rev. 0.4 53

10 1 C41 560 µF 6.3V ±20% Alum_Elec C3.5X8MM-RAD EEUFM0J561 Panasonic

11 3 C42, C51, C60

0.01 µF 25 V ±10% X7R C0402 C0402X7R250-103K Venkel

12 2 C44, C45 470 µF 25 V ±20% Alum_Elec C10.3X10.3MM EMVE250ADA471MJA0G

United Chemicon

13 1 C98 4.7 µF 6.3 V ±10% X5R C0603 C0603X5R6R3-475K Venkel

14 8 DN1, DN2, DN3, DN4, DN5, DN6, DN7, DN8,

15 V 225 mW 15 V Zener, Dual SOT23-AAK MMBZ15VDLT1G On Semi

15 7 D1, D2, D3, D6, D14, D15, D49

MMBD3004S-7-F 225 mA 300 V DUAL SOT23-AKC MMBD3004S-7-F Diodes Inc.

16 13 D5, D41, D42, D43, D44, D45, D46, D47, D48, D50, D51, D52,

D53

RED 25 mA 1.9 V SMT, Chip-LED

LED-HSMX-C170 HSMC-C170 Avago Technolo-

gies

17 4 D7, D9, D11, D13

STPS140Z 1.0 A 40 V Schottky SOD-123 STPS140Z ST MICRO

18 1 D12 Bridge Rectifier

0.8 A 100 V BRIDGE MiniDIP4 HD01-T Diodes Inc.

19 1 D54 BAV23A 400 mA 200 V DUAL SOT23-KKA BAV23A Diodes Inc.

20 9 FB1, FB2, FB3, FB4, FB6, FB7, FB8, FB9,

FB11

600 200 mA SMT L0603 BLM18AG601SN1 MuRata

21 4 HD5, HD6, HD7, HD8

Screw MH-125NP NSS-4-4-01 Richco Plastic Co

22 4 HW1, HW2, HW3, HW4

Standoff N/A 2397 SPC Tech-nology

23 4 JP1, JP2, JP3, JP4

Header 5x1 Header CONN1X5-TSW TSW-105-07-T-S Samtec

24 3 JP5, JP23, JP24

Header 1x3 Header CONN-1X3 TSW-103-07-T-S Samtec

25 9 JP6, JP7, JP8, JP9,

JP10, JP12, JP13, JP14,

JP15

Jumper Header CONN-1X2 TSW-102-07-T-S Samtec

26 1 JP11 HEADER 4X1 Header CONN-1X4 TSW-104-07-T-S Samtec

27 1 JP16 4X1 Socket Socket CONN-1X4 SSW-104-01-T-S Samtec

28 2 JP33, JP34 JUMPER Unshrouded CONN-1X2 68000-402 Berg

29 1 J1 RJ10 - Handset Handset RJ10-4P4C 806-GMX-N-44 Mouser

30 1 J2 RCA Jack RCA CONN-RCA-RCJ-04X

161-0097-E Kobiconn

Table 7. MotherBoard Bill of Materials (Continued)

Item NI Qty Ref Value Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

54 Rev. 0.4

31 1 J5 RJ–11 RJ-11 RJ11-DUAL-MTJG MTJG-2-64-2-2-1 ADAM TECH

32 1 J6 HEADER 5x3 Header CONN3X5 TSW-105-07-S-T Samtec

34 1 J8 CONN TRBLK 2 TERM BLK CONN-1X2-TB 1729018 PHOENIX CONTACT

35 1 J9 Power Jack 1 A BARREL CONN-3-PWR ADC-002-1 Adam Tech

36 1 J10 DB9 D-SUB CONN-9-DBF D09S33E4GX00LF FCI

37 1 J11 USB Type B USB CONN-USB-B 292304-1 Tyco

38 1 J30 5x2 Shrouded Header

Shrouded CONN2X5-4W 5103309-1 Tyco

39 1 J101 HEADER 8x2 Header CONN2X8 TSW-108-07-S-D Samtec

40 1 J103 8x2 Shrouded Header

Shrouded CONN2X8-4W 5103309-3 Tyco

41 1 K1 Relay HV DPDT RLY-TXS2SA FTR-C1GA4.5G Fujitsu

42 1 LS1 Speaker 0.5 W Max

SPEAKER-RE2308NL

RE-2308-NL Regal

43 1 MK1 Microphone MIC-6X2.7mm CMC-2742PBJ-A CUI Inc

44 2 Q1 Q4 MMBTA06LT1 500 mA 80 V NPN SOT23-BEC MMBTA06LT1 On Semi

45 1 Q3 FCX1051ATA 2 W 40 V NPN SOT89-BCE FCX1051ATA Zetex

46 1 Q5 MMBT3906-7-F 200 mA 40 V PNP SOT23-BEC MMBT3906-7-F Diodes Inc.

47 4 R1, R57, R98, R104

0.05 1/4 W ±5% ThickFilm R0805 LCR0805-R050J Venkel

49 2 R3, R28 200 1/10 W ±1% ThickFilm R0603 CR0603-10W-2000F Venkel

50 16 R4, R17, R19, R20, R25, R31, R40, R41, R42, R43, R52, R60, R87, R91

R109, R110, R111, R112,

R113

10 k 1/10 W ±1% ThickFilm R0603 CR0603-10W-1002F Venkel

51 6 R5, R18, R36, R37, R38, R45

100 k 1/10 W ±1% ThickFilm R0603 CR0603-10W-1003F Venkel

52 4 R6, R7, R11, R21

2 k 1/10 W ±1% ThickFilm R0603 CR0603-10W-2001F Venkel

53 2 R9, R32 0 1A ThickFilm R0603 CR0603-16W-000 Venkel

54 1 R10 4.7 k 1/16 W ±5% ThickFilm R0603 CR0603-16W-472J Venkel

55 1 R12 5.1 k 1/16 W ±5% ThickFilm R0603 CR0603-16W-512J Venkel

56 2 R13, R24 50 k TRIM POT-PV37W PV37W503C01B00 Murata

57 5 R14, R16, R33, R34,

R35

1 k 1/16 W ±1% ThickFilm R0603 CR0603-16W-1001F Venkel

Table 7. MotherBoard Bill of Materials (Continued)

Item NI Qty Ref Value Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

Rev. 0.4 55

58 1 R15 49.9 k 1/16 W ±0.5%

ThickFilm R0603 CR0603-16W-4992D Venkel

59 1 R22 499 1/10 W ±1% ThickFilm R0603 CR0603-10W-4990F Venkel

60 3 R23, R29, R44

3.01 k 1/16 W ±1% ThickFilm R0603 CR0603-16W-3011F Venkel

61 1 R27 324 k 1/10 W ±1% ThickFilm R0603 CR0603-10W-3243F Venkel

62 1 R30 10 M 1/16 W ±1% ThickFilm R0603 CR0603-16W-1005F Venkel

64 1 R59 1 1/10 W ±1% ThickFilm R0603 CR0603-10W-1R00F Venkel

65 2 R69, R70 0 10 A 0 Wire RES-7MM ZOR-12-R Yageo

66 2 R84, R85 1.5 k 1/16 W ±5% ThickFilm R0603 CR0603-16W-152J Venkel

67 1 R96 3.57 1/10 W ±1% ThickFilm R0603 CR0603-10W-3R57F Venkel

68 3 R97, R99, R101

200 1/10 W ±5% ThickFilm R0603 CR0603-10W-2000J Venkel

69 2 R100, R102 1.33 K 1/10 W ±1% ThickFilm R0603 CR0603-10W-1331F Venkel

70 2 R103, R105 1.6 1/4 W ±5% ThickFilm R1206 CR1206-8W-1R6J Venkel

72 11 R155, R156, R157, R158, R159, R160, R161, R162, R163, R169,

R170

681 1/10 W ±1% ThickFilm R0603 CR0603-10W-6810F Venkel

73 1 S1 SW Pushbutton

50 mA 12 Vdc Tactile SW4N6.5X4.5-PB 101-0161-EV Mountain Switch

74 4 TP1, TP10, TP12, TP13

Red Loop Testpoint 151-207-RC Kobiconn

75 5 TP2, TP7, TP8, TP9,

TP25

Turret Turret TP[12594] 2551-2-00-44-00-00-07-0

Mill-Max

76 10 TP5, TP6, TP16, TP17, TP19, TP20, TP21, TP22, TP23, TP24,

Blue Loop Testpoint 151-205-RC Kobiconn

78 2 U1, U3 LT1963A-3.3 V 1.5 A max

LDO SOT223 LT1963AEST-3.3#PBF

Linear Tech-nologies

79 1 U2 Si3000 VOICE CODEC

SO16N6.0P1.27 SI3000-KS SiLabs

80 1 U4 LM4862 SO8N6.0P1.27 LM4862M National Semicon-

ductor

81 1 U5 EEPROM 32K Serial TSSOP8N6.4P0.65 25LC320A-I/ST Microchip Technology

82 2 U8, U10 5 0.5 A max

LDO TO263-3N LM2937ES-5.0 National Semicon-ductors

83 1 U11 MAX3237 5.5 V RS232 TSSOP28 MAX3237EIPWR TI

Table 7. MotherBoard Bill of Materials (Continued)

Item NI Qty Ref Value Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

56 Rev. 0.4

84 1 U12 CP2102 MCU QFN28N5X5P0.5 CP2102-GM SiLabs

85 2 U13, U14 IDT74CBTLV3257 MUX TSSOP16N6.4P0.65 IDT74CBTLV3257PGG

IDT

86 1 U18 DS1818 3.3 V 10% SOT-23 DS1818-10 Dallas Semicon-

ductor

87 3 U20, U21, U22

AD8602ARM SOP8N4.9P0.65 AD8602ARM Analog Devices

88 1 U26 74LCX541 Buffer TSSOP20N6.4P0.65 74LCX541MTC Fairchild

89 1 U27 MAX4521 TSSOP16N6.4P0.65 MAX4521CUE+ Maxim

Table 8. Motherboard Bill of Materials (Non-Populated Footprints)

Item Qty Reference Value Rating Tol Dielectric PCB Footprint Manufacturer Part Number

Manufacturer

91 3 R1,R73,R102 0R 1/16 W RC0603 CR0603-16W-000T Venkel

92 2 R31,R32 10k 1/16 W ±5% RC0603 CR0603-16W-103JT Venkel

93 1 C10 10 uF 10 V ±10%

X7R CC0805 GRM21BR71A106KE51L Murata

Table 7. MotherBoard Bill of Materials (Continued)

Item NI Qty Ref Value Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

Rev. 0.4 57

7.2. Daughter Card Bill of Materials

Table 9. Si24xx Daughter Card Bill of Materials

Item Qty Ref Value Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr

1 2 C1, C2 33 pF Y2 250 V ±10% Y2 C1808 SCC1808X330K502T Holy Stone

2 1 C3 0.01 µF 250 V ±10% X7R C0805 GRM21BR72E103KW03L Murata

3 1 C4 1 µF 50 V ±20% Alum_Elec C3.3X3.3MM EEE1HS010SR Panasonic

4 2 C5, C6 0.1 µF 16 V ±20% X7R C0603 C0603X7R160-104M Venkel

5 1 C7 2.7 nF 50 V ±20% X7R C0603 C0603X7R500-272M Venkel

6 2 C8, C9 680 pF Y2 250 V ±10% Y2 C1808 SCC1808X681K502T Holy Stone

7 1 C10 0.01 µF 16 V ±20% X7R C0603 C0603X7R160-103M Venkel

8 2 C40, C41

18 pF 50 V ±5% COG C0603 C0603COG500-180J Venkel

9 3 C50, C52, C56

0.1 µF 10 V ±20% X7R C0603 C0603X7R100-104M Venkel

10 2 C51, C53

0.22 µF 6.3 V ±10% X5R C0603 C0603X7R6R3-224K Venkel

11 1 C54 1 µF 25 V ±10% X5R C0603 C0603X5R250-105K Venkel

12 1 D1 HD04 0.8 A 400 V BRIDGE MiniDIP4 HD04-T Diodes Inc.

13 3 FB1, FB2, FB5

600 200 mA SMT L0603 BLM18AG601SN1 Murata

14 1 J1 SOCKET 8x2 SOCKET SOCKETX8-100-SMT SSW-108-22-G-D-VS Samtec

15 1 J2 4X1 Header_0 CONN1X4-100-SMT TSM-104-01-T-SV Berg

16 2 Q1 Q3 MMBTA42LT1 200 mA 300 V NPN SOT23-BEC MMBTA42LT1 On Semi

17 1 Q2 MMBTA92LT1 100 mA 300 V PNP SOT23-BEC MMBTA92LT1 On Semi

18 2 Q4 Q5 MMBTA06LT1 500 mA 80 V NPN SOT23-BEC MMBTA06LT1 On Semi

19 1 RV1 P3100SB 275 V Sidactor DO-214AA-NP P3100SBL Littelfuse

20 1 R1 1.07 k 1/2 W ±1% ThickFilm R2010 CR2010-2W-1071F Venkel

21 1 R2 150 1/16 W ±5% ThickFilm R0603 CR0603-16W-151J Venkel

22 1 R3 3.65 k 1/2 W ±1% ThickFilm R2010 CR2010-2W-3651F Venkel

23 1 R4 2.49 k 1/2 W ±1% ThickFilm R2010 CR2010-2W-2491F Venkel

24 2 R5, R6 100 k 1/16 W ±5% ThickFilm R0603 CR0603-16W-104J Venkel

25 2 R7, R8 20 M 1/8 W ±5% ThickFilm R0805 CR0805-8W-206J Venkel

26 1 R9 1 M 1/16 W ±1% ThickFilm R0603 CR0603-16W-1004F Venkel

27 1 R10 536 1/4 W ±1% ThickFilm R1206 CR1206-4W-5360F Venkel

28 1 R11 73.2 1/2 W ±1% ThickFilm R2010 CR2010-2W-73R2F Venkel

29 2 R12, R13

56.2 1/16 W ±1% ThickFilm R0603 CR0603-16W-56R2F Venkel

30 2 R15, R16

0 1 A ThickFilm R0603 CR0603-16W-000 Venkel

31 2 R120, R121

0 1 A ThickFilm R0603 CR0603-16W-000 Venkel

32 1 R18 1.2 k 1/10 W ±5% ThickFilm R0603 CR0603-10W-121J Venkel

33 4 R101, R102, R103, R104, R106

10 k 1/10 W ±5% ThickFilm R0603 CR0603-10W-103J Venkel

34 1 R105 1 k 1/10 W ±5% ThickFilm R0603 CR0603-10W-102J Venkel

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

58 Rev. 0.4

35 3 R110, R111, R112

200 1/10 W ±5% ThickFilm R0603 CR0603-10W-2000J Venkel

36 1 U2 Si3018 300 V LineSide SO16N6.0P1.27 Si3018-F-GS SiLabs

37 1 U12 Si24xx ISOMODEM TSSOP24N6.4P0.65 Si2493-E-FT SiLabs

38 1 U13 Si24xx 16pin SOIC Si24xx Silicon Laboratories

39 1 Y1B (Y1, Y3)

32.768 kHz XTAL-3X8-LD ECS–.327–12.5–8X ECS International

40 1 Z1 43 V 500 mW 43 V Zener SOD-123 BZT52C43-7-F Diodes Inc.

Table 10. Daughter Card Bill of Materials (Non-Populated Footprints)

Item Qty Reference Value Rating Tol Dielectric PCB Footprint Manufacturer Part Number

Manufacturer

1 1 C50 0.1 µF 16 V ±20% X7R CC0603 C0603X7R160-104MNE Venkel

2 2 C55,C56 0.1 µF 10 V ±20% X7R CC0603 C0603C124K Kemet

3 1 R18 1.3 k 1/16 W ±5% RC0603 CR0603-16W-132JT Venkel

4 5 R19,R20,R21,R22,R23

0 1/16W ±5% RC0603 CR0603-16W-000J Venkel

5 1 U4 Si2401 16pin SOIC Silicon Labs

Table 9. Si24xx Daughter Card Bill of Materials (Continued)

Item Qty Ref Value Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

Rev. 0.4 59

7.3. QFN Daughter Card Bill of Materials

Table 11. Si24xx QFN Daughter Card Bill of Materials

Item Qty Ref Value Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr

1 2 C1, C2 33 pF Y2 250 V ±10% Y2 C1808 SCC1808X330K502T Holy Stone

2 1 C3 0.01 µF 250 V ±10% X7R C0805 C0805X7R251-103K Venkel

3 1 C4 1 µF 50 V ±20% Alum_Elec C3.3X3.3MM EEE1HS010SR Panasonic

5 2 C5, C6 0.1 µF 16 V ±20% X7R C0603 C0603X7R160-104M Venkel

6 1 C7 2.7 nF 50 V ±20% X7R C0603 C0603X7R500-272M Venkel

7 2 C8, C9 680 pF Y2 250 V ±10% Y2 C1808 SCC1808X681K502T Holy Stone

8 1 C10 0.01 µF 16 V ±20% X7R C0603 C0603X7R160-103M Venkel

9B 2 C40, C41 18 pF 50 V ±5% COG C0603 C0603COG500-180J Venkel

10 5 C50, C52, C55, C56,

C57

0.1 µF 10 V ±10% X7R C0402 C0402X7R100-104K Venkel

11 1 C51 0.22 µF 10 V ±10% X7R C0603 C0603X7R100-224K Venkel

12 1 C54 1 µF 25 V ±10% X5R C0603 C0603X5R250-105K Venkel

13 1 D1 HD04 0.8 A 400 V BRIDGE MiniDIP4 HD04-T Diodes Inc.

14 3 FB1, FB2, FB5

600 200 mA SMT L0603 BLM18AG601SN1 MuRata

15 2 JP1, JP2 JUMPER Header CONN-1X2 TSW-102-07-T-S Samtec

16 1 J1 SOCKET 8x2 SOCKET SOCKETX8-100-SMT SSW-108-22-G-D-VS Samtec

17 1 J2 4X1 Header SMT CONN1X4-TSM TSM-104-01-T-SV Samtec

18 2 Q1, Q3 MMBTA42LT1 200 mA 300 V NPN SOT23-BEC MMBTA42LT1 On Semi

19 1 Q2 MMBTA92LT1 100 mA 300 V PNP SOT23-BEC MMBTA92LT1 On Semi

20 2 Q4, Q5 MMBTA06LT1 500 mA 80 V NPN SOT23-BEC MMBTA06LT1 On Semi

21 1 RV1 P3100SB 275 V Sidactor DO-214AA-NP P3100SBL Littelfuse

22 1 R1 1.07 k 1/2 W ±1% ThickFilm R2010 CR2010-2W-1071F Venkel

23 1 R2 150 1/16 W ±5% ThickFilm R0603 CR0603-16W-151J Venkel

24 1 R3 3.65 k 1/2 W ±1% ThickFilm R2010 CR2010-2W-3651F Venkel

25 1 R4 2.49 k 1/2 W ±1% ThickFilm R2010 CR2010-2W-2491F Venkel

26 2 R5, R6 100 k 1/16 W ±5% ThickFilm R0603 CR0603-16W-104J Venkel

27 2 R7, R8 20 M 1/8 W ±5% ThickFilm R0805 CR0805-8W-206J Venkel

28 1 R9 1 M 1/16 W ±1% ThickFilm R0603 CR0603-16W-1004F Venkel

29 1 R10 536 1/4 W ±1% ThickFilm R1206 CR1206-4W-5360F Venkel

30 1 R11 73.2 1/2 W ±1% ThickFilm R2010 CR2010-2W-73R2F Venkel

31 2 R12, R13 56.2 1/16 W ±1% ThickFilm R0603 CR0603-16W-56R2F Venkel

32 2 R15, R16 0 1 A ThickFilm R0603 CR0603-16W-000 Venkel

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

60 Rev. 0.4

33 1 R18 1.2 k 1/16 W ±5% ThickFilm R0402 CR0402-16W-122J Venkel

34 2 R101, R104

10 k 1/10 W ±5% ThickFilm R0603 CR0603-10W-103J Venkel

36 1 R122 0 1 A ThickFilm R0402 CR0402-16W-000 Venkel

38 1 U1 Si2494/39 ISOMODEM QFN38N5X7P0.5 Si2494-A-FM/Si2439-A-FM

SiLabs

39 1 U2 Si3018 300 V LineSide SO16N6.0P1.27 Si3018-F-GS SiLabs

40 1 U3 EEPROM 32K Serial TSSOP8N6.4P0.65 25LC320A-I/ST Microchip Technology

41 1 Y1A 32.768 kHz XTAL-3X8-LD ECS–.327–12.5–8X ECSInternational

44 1 Z1 43 V 500 mW 43 V Zener SOD-123 BZT52C43-7-F Diodes Inc.

Table 12. Si24xx QFN Daughter Card Bill of Materials (Non-Populated Footprints)

Item Qty Ref Value Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr

4 1 C4X 1 µF 25 V ±10% X8R C1206 C3216X8R1E105K TDK

9 2 C40, C41 33 pF 50 V ±5% COG C0402 C0402COG500-330J Venkel

32B 2 R120,R121

0 1 A ThickFilm R0603 CR0603-16W-000 Venkel

34 1 R103 10 k 1/10 W ±5% ThickFilm R0603 CR0603-10W-103J Venkel

35 1 R102 1 k 1/10 W ±5% ThickFilm R0603 CR0603-10W-1001J Venkel

36B 1 R123 0 1 A ThickFilm R0402 CR0402-16W-000 Venkel

42 1 Y1B 4.9152 MHz XTAL-HC49U-SMT FOXSDLF/049-20 FOX Electronic

43 1 Y1C 27 MHz 3.3 V XTAL OSC OSC4N5X3.2-FOX924 FOX924B-27.000 FOX

Table 11. Si24xx QFN Daughter Card Bill of Materials

Item Qty Ref Value Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

Rev. 0.4 61

8. Complete Design Package on CD

(See Sales Representative for Details)

Silicon Laboratories can provide a complete design package of the Voice ISOmodem EVB including the following:

OrCad Schematics

Gerber Files

Please contact your local sales representative or Silicon Laboratories headquarters sales for ordering information.

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

62 Rev. 0.4

DOCUMENT CHANGE LIST

Revision 0.1 to Revision 0.2 Updated Voice Motherboard description,

schematics, silkscreens, and configuration from 1.0 to 2.0 revision.

Updated Daughtercard description, schematics, silkscreens, and configuration.

Added support for Si2494/39 voice and data modems.

Updated "Description" on page 1.

Updated "2.Daughter Cards" on page 4.

Added "4.1.7.Surge Protection Circuits" on page 24.

Updated "4.1.8.2.The Call Progress Signal" on page 26.

Updated "4.2.Daughter Cards" on page 28.

Added "4.2.4.Daughter Card Strapping and Jumper Options" on page 29.

Added "7.3.QFN Daughter Card Bill of Materials" on page 59.

Added "8.Complete Design Package on CD" on page 61.

Updated Figure 5, “Function and Location of Global Voice ISOmodem EVB Jumpers,” on page 6.

Updated Figure 29 on page 34.

Added Figure 31, “QFN Daughter Card (Si24xx2G-QFN38-DC Rev 1.0) System Side,” on page 36.

Added Figure 32, “Daughter Card (Si24xx2G-QFN38-DC Rev 1.0) Line Side,” on page 37.

Added Figure 43, “QFN Daughter Card Primary Side, Component and Silkscreen,” on page 48.

Added Figure 44, “QFN Daughter Card Secondary Side, Component and Silkscreen,” on page 49.

Added Figure 45, “QFN Daughter Card Primary Side,” on page 50.

Added Figure 46, “QFN Daughter Card Secondary Side,” on page 51.

Updated Table 2, “Digital Data Related Jumpers,” on page 7.

Added Table 11, “Si24xx QFN Daughter Card Bill of Materials,” on page 59.

Added Table 12, “Si24xx QFN Daughter Card Bill of Materials (Non-Populated Footprints),” on page 60.

Revision 0.2 to Revision 0.3 Updated Table 3, “Sound Related Jumpers,” on

page 8.

Corrected R13 adjustment information.

Changed obsolete references, such as “JP5”.

Updated Table 5, “Board Configuration,” on page 21.Added missing jumper information.

Revision 0.3 to Revision 0.4 Updated "3.3.USB Interface Data Link Setup Quick

Start" on page 9.Removed JP5 reference.

Si2494/39/38/37/36/35/29/19/18/17FT18-EVB

Rev. 0.4 63

NOTES:

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DisclaimerSilicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice to the product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Without prior notification, Silicon Labs may update product firmware during the manufacturing process for security or reliability reasons. Such changes will not alter the specifications or the performance of the product. Silicon Labs shall have no liability for the consequences of use of the information supplied in this document. This document does not imply or expressly grant any license to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any FDA Class III devices, applications for which FDA premarket approval is required or Life Support Systems without the specific written consent of Silicon Labs. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons. Silicon Labs disclaims all express and implied warranties and shall not be responsible or liable for any injuries or damages related to use of a Silicon Labs product in such unauthorized applications.

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