semiconductor device fabrication technology€¦ · module i introduction to semiconductor...
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Course Title: Semiconductor Device Fabrication Technology Credit Units: 3 Course Level: UG Course Code: SAE406 Course Objectives: This course covers fundamentals of semiconductor devices and their processing steps in detail Prerequisites: Basic physics Course Contents/ Syllabus:
Modules Weightage 1
Module I Introduction to semiconductor manufacturing technology • Crystal growth, • Wafer preparation, cleaning of wafers • Epitaxial silicon deposition • Basic semiconductor devices: silicon based bipolar transistor,
MOS transistor
20%
2
Module II Oxidation • Oxidation of silicon • Dry & wet oxidation • Oxidation systems • Evaluation of oxide layers • Oxide layer isolation
20%
3 Module III Diffusion and Ion implantation • Laws of diffusion, • Dopants and dopant sources • Diffusion from a constant/instantaneous source, the two step
20%
L T P/S
SW/FW
TOTAL CREDIT UNITS
3 0 0 0 3 411
diffusion • Junction formation • Diffusion systems • Ion implantation basics and processes • Ion implantation for substrate doping
4 Module IV Photolithography and Etching • Optical, electron and X-ray lithography • Ion lithography • Optical resists, masks, etch mechanisms, selectivity and profile
control • Reactive plasma etching techniques and equipment • Wet chemical etching
20%
5 Module V Metallization • Introduction to vacuum science and technology • Metal deposition techniques • Physical vapor deposition: thermal evaporation, e-beam and
sputtering techniques • Chemical vapor deposition
20%
Student Learning Outcomes: The student will be able to use the knowledge of semiconductor fabrication processes to work in industry/ institute in the area of semiconductor devices. Pedagogy for Course Delivery: The class will be taught using theory from standard text books covering the syllabus. In addition the course instructor will update the knowledge of latest state of art of the respective subjects from various media. The instructor will cover the ways to think innovatively and liberally. Lab/ Practical Details, if applicable: NA List of Experiments: NA Assessment/ Examination Scheme:
Internal Assessment Total
Theory L/T (%) Lab/Practical/Studio (%)
100 NA 100
Theory Assessment (L&T):
Continuous Assessment/Internal Assessment End Term Examination
Components (Drop down)
Mid-Term Exam
Project Viva Attendance
Weightage (%) 10 10 5 5 70
Text Readings:
1. ULSI Technology C.Y. Chang & S.M. Sze 2. Introduction to Semiconductor Manufacturing Technology, Hang Kiao 3. The Theory and Practice of Microelectronics, Sorab K. Gandhi. 4. Fundamentals of semiconductor device fabrication, S.M. Sze
References: NA
Additional Readings: NA
Any other study material: NA