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SB²-JetLaser Solder Jetting Systems

Product Features• Single-step solder ball placement and reflow• Flux-free reflow with laser• No special fooling required• No additional reflow required• Solder-ball diameter from 40µm to 760µm• High solder alloy flexibility · Eutectic SnPb · High-lead SnPb · Lead-free SnAg, SnAgCu, etc. · AuSn · InSn · SnBi• In-line capability• High throughput• High accuracy axis system• Automated fiducial alignment• Ball rework and repair capability• Option configurations · 2D bump-inspection systems · Integrated laser power sensor · Solder rework station · Automatic handling/robot system · Reel-to-reel (300-400mm or 35-70mm)

Applications• Hard disk drives (HGA, HSA)• Flip-chip, BGAs, cLCC’s, CSPs• 3D packaging• 4- to 12-inch wafers• Repair/rework of BGA-like packages• Optoelectronics/Microoptics• MEMS• Camera modules• Wafer bumping

Solder ball placement systems within the semiconductor industry have reached a new standard for advanced and reliable solder ball placement, reflow and rework. The high-speed SB² systems can achieve a ball placement rate up to 10 balls per second. They provide an exceptional solution for economical solder ball, reflow and repair. SB² systems provide reproducible solder bumping technology for packaging optoelectronic devices, hard disk drives (HGA, HSA), MEMS, sensors, camera modules, BGA’s, chip-scale packaging and flip-chips. They are available in three configurations: fully automatic (SB²-Jet), semiautomatic (SB²-SM) and small foot print (SB²-M). SB² systems have the ability to singulate, to position and to reflow solder balls with diameters of 40µm to 760µm. They are designed for water bumping, single-chip bumping and selective solder deposition on substrates (FR4, ceramic, flex materials). They are suitable for wafer or substrates sizes up to 300mm. They also allow a flexible method of solder ball placement on chip-scale packages (CSP) and ball-grid arrays (BGA). One of the major applications is for 3D interconnections such as chip-on-flex, stacked 3D modules and HGA’s. Solder ball reflow is performed by a class 1 laser system using an infrared wavelength. All components of the system are integrated into a single cabinet.

Ball Placement Solder Balling foroptoelectronics/MEMS

3D Laser Vertical ChipBonding

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SB²-JetThe SB²-Jet is the most advanced, automated high-speed sequential solder-ball attach system available today. It can operate in either an automatic mode or semiautomatic mode. In automatic mode, the SB2-Jet uses pre-pro-grammed coordinates. In semiautomati mode, an operator employs "eyes-on" control. The solder jetting process has a ball placement rate of up to 10 balls per second, with ball diameters ranging from 40μm to 760μm. A single cycle consists of solder ball singula-tion, solder-ball placement (or solder jetting) and laser reflow.

The SB²-Jet axis uses a gantry system for bond head movement suitable for wafer or substrate sizes up to 12 inches. In a fully loaded version, the SB²-Jet is delivered with a vision and pattern-recognition system, an after-bump 2D inspection and an additional repair unit. The system is fully in line capable and can be equipped with an automated substrate or wafer handling solution such as conveyor, robot or reel-to-reel systems.

SB²-SM

The axis system of the SB²-SM is driven by piezo linear motors, as opposed to the gantry system used in the SB²-Jet. In a fully loaded version, the system can be equipped wih a vision and pattern+recognition system, and an additional solder ball rework unit. In the basic configuration, the system is delivered with solder ball placement only, automated substrate or waferhandling is not available for this system.

The SB²-SM has a smaller footprint than the SB²-Jet and a maximum Wafer or substrate size of 8-inches. In areas with limited floor space, or Costly environmental aspects, using the SB²-SM has distinct Advantages. The SB²-SM product line is a fully automated high-speed Sequential solder ball attach system that can operate either in a fully automatic mode or in a semiautomatic mode. In automatic mode, the SB²-SM operates. Using programmed coordinates. The ball placement rate is up to 5 balls per second, when using PacTech's solder jetting process. Ball diameters range from 40μm to 760μm.

SB²-M

high-resolution five-step-zoom stereo microscope. In the basic configura-tion, the system is delivered with solder jetting process only. The solder ball rework unit is available as an optional feature. Automated substrate or wafer handling is not available for this system.

The SB²-M is the smallest available equipment in the SB²-series. It is a semiautomatic solder ball placement reflow/rework machine designed for small volume manufacturing, prototyping, and research and development. Maximum throughput is 5 balls per second if the solder jetting option is installed. The ball diameters range from 150μm to 760μm. Equipped with the optional solder ball remov-al unit, it is ideal for BGA and CSP rework. The axis of the system are driven by piezo linear motors for either 4-inch substrate capability. In manual mode, a joystick controls the axis. Visual inspection is accomplished using a

System ConfigurationAll SB² systems are self-contained into a compact chassis. The systems cansingulate, position and reflow solder balls that have diameters ranging from40μm to 760μm. The solder-ball bumper base is constructed of highly stablegranite with isolation. SB² systems consist of the following elements:

• Bond head (mounted on a Z stage)• Axis and drives with 4-inch for the SB²-M or 8-inch chuck for the system control unit• Class 1 laser system

Bond HeadFor different solder ball diameters, a specific bond head is required. For theSB²-Jet and the SB²-SM bond heads for ball diameters ranging from 40μm to760μm are available The minimum ball size for the SB²-M is 150μm. A bondhead consists of the following elements:

• Solder ball loading station• Singulation unit• Capillary holding for ball positioning• Fiber-coupling unit• Optical sensor• Rotation motor stage• Pressure sensor

System Control UnitThe SB² system-control unit fulfills all requirements for industrial PCstandards. The system-control computer can be linked to a host computer,via Ethernet, to administer all data. The integration of a SECS GEM protocolis optional. The basic system-control unit configuration consists of thefollowing:

Processor: IntelCore, Duo 2.6 GHzMemory: 1-GB minimumHard Drive: 120-GB minimumAdditional Drive: DVD ROMMonitor: 17-inch TFTInput Devices: Keyboard and joystickVGA Card: 256NB PCI Express

Laser Class 1 SystemPacTech uses a fibre laser that is incorporated into a standard 19-inch rack configuration. The entire system includes the laser power supply and cooling unit. A red pilot laser light is used as a target light to precisely locate the high-power laser spot.The laser system, when combined into the SB²-Jet, SB²-SM or SB²-M systems safety housing, is specified as a class 1 laser product . The entire system is manufactured in accordance with IEC825 (European Standards E DIN VDE 0750, 871, 835 and 837). When the system is exported to the United States, the laser system complies with the U.S. Federal Performance Standards for class lV laser products (21 CFR 1040.10 and 1040.11)

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Note 2

Note 3

Note 4

Ball Placement Rate and Reflow Specified Depending on Layout

Up to 10 balls/sec. Up to 5 balls/sec. 3 balls/sec.

Mechanical Data Dimensions (L x W x H) mm Inches

Total weight (Approx.) kg/Pounds (lb)Floor Space (Approx.) mm/Inches

1230 x 1200 x 170047.25 x 47.25 x 65.75881.85 x 1102.31 x 2954.19

800 / 1765

1200 x 1200/47.25 x 47.25

1300 x 850 x 180043.31 x 24 x 63

300 / 660

1100 x 610/43.31 x 24

1300 x 1000 x 185039.37 x 5.20 x 65.75

150 / 330

1300 x 1000/39.37 x 25.20

Ancillary Supply Vacuum-Pressure Vacuum-Tube Diameter Air-Pressure (bar/PSI) Air-Flow Rate Air-Tube Diameter Nitrogen-Pressure (bar/PSI) Nitrogen-Flow Rate (l/min.) Nitrogen-Tube Diameter

Approx... 0.03 bar6mm/8mm ID/OD7 bar. max.126 l/min. max.6mm/8mm ID/OD3 bar min., 12 bar max.0.75 l/min. max.6mm/8mm ID/OD

Approx... 0.03 bar6mm/8mm ID/OD7 bar. max.126 l/min. max.6mm/8mm ID/OD3 bar min., 12 bar max.0.75 l/min. max.6mm/8mm ID/OD

Approx... 0.03 bar6mm/8mm ID/OD7 bar. max.126 l/min. max.6mm/8mm ID/OD3 bar min., 12 bar max.0.75 l/min. max.6mm/8mm ID/OD

Environmental Conditions Temperature Relative Humidity (non-condensing) Climatization Time Cleanroom Recommendations

20°C ±5°30% - 80%12 hoursClass 10.000 or better

20°C ±5°30% - 80%12 hoursClass 10.000 or better

20°C ±5°30% - 80%12 hoursClass 10.000 or better

Optional Features Pattern Recognition Vision System (2D Inspection) Automatic Wafer Substrate Handling ESD Protection

IncludedOptionalOptionalOptional

OptionalN/AN/AN/A

OptionalN/AN/AN/A

Laser Specifications Wavelength Laser Energy (max.) Pulse Frequency Pulse Widths (Cont. adjustable) Pilot Diode Laser Divergense Stability

1064nm8J in 10msUp to 40Hz at 4J1ms - 20ms2 - 3mW (635nm)<6mrad±5%

1064nm8J in 10msUp to 10Hz at 4J1ms - 20ms2 - 3mW (635nm)<6mrad±5%

1064nm8J in 10msUp to 10Hz at 4J1ms - 20ms2 - 3mW (635nm)<6mrad±5%

Electrical Data Line voltage Maximum Current/Frequency

208V/400V, Three Phase24(400V)/32(208V)/50/60Hz

110/230V, Single Phase16(230V)/25(110V)/50/60Hz

110/230V, Single Phase16(230V)/25(110V)/50/60Hz

SB²-Jet

Note 1Axis (travel range) X, Y Axis Work area Z Axis

Gantry500mm x 500mm320mm x 320mm

50mm

Piezo linear motorsMax. 300mm x 200mm200mm x 200mm

50mm

Piezo linear motors100mm x 100mm (4-inch)150mm x 100mm

50mm

SB²-SM SB²-M

Technical Data and Facility Requirements

Notes:1. The resolution for all systems is 1µm with a repetition accuracy of 3µm.2. All systems are delivered with a transformer in order to meet the specific needs of the customer.3. An optional vacuum ejector can be used to create the vacuum. This will require compressed air.4. Maximum laser energy for diode laser is 400mJ.

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PacTech USA Inc.328 Martin Avenue, Santa Clara, CA 95050, USA

PacTech Asia Sdn. Bhd.No.14, Medan Bayan Lepas, Technoplex, Phase 4Bayan Lepas Industrial Zone, 11900 Bayan Lepas,Penang, Malaysia

PacTech - Packaging Technologies GmbHAm Schlangenhorst 15-17, 14641 Nauen, Germany

Contact us at sales@pactech.de

Specifications for Pattern Recognition and2D Ball Inspection Software used with SB²Solder Ball Placement Equipment

Machine Details

SB²-Jet Machine Headfor BGA Ball Attach

SB²-Jet Machine Headfor Wafer Bumping

Schematic of the SB²-Jet Process

SB² solder ball placement

Process Principles

System OS Windows-based OS

Optics Integrated lighting and optics

Communications I/O Serial and digital I/O (TTL)

Accuracy andReapeatability

Up to 5µm

Device Types Flip-chip, CSP, BGA, HGA, HSA, cLLC,Camera module, Microoptics

Results Reporting Overall device dataIndividual ball data

Calibration Calibration not necessaryFocus optimization

User I/F Standard Windows-based GUIOptional user definable GUI

Substrate/WaferHandling

Manual (optional automatic handlingsystem available)

Ball PatternsSupported

All patterns, including non-symmetricaland arbitrary

Video Input/Output CCIR video inputStrobed camera supportNear real-time video display over PC bus

Speed 5-inch 6-inch 8-inch12-inch

Macrolens 2X 2 min. 3 min. 5 min.11 min.

ToleranceMeasurements

Ball sizeBall positionBall pitchBall absenceBall shapeExtra or misplaced ballSolder bridges

Ball Diameter RangeSB²-JetSB²-SMSB²-M

40µm up to 760µm40µm up to 760µm150µm up to 760µm

Macrolens 1X0.50 min.0.75 min.1.25 min.2.75 min.