laplace - pactech · 2014. 3. 10. · bayan lepas industrial zone, 11900 bayan lepas, penang,...

www.pactech.de PacTech USA Inc. 328 Martin Avenue, Santa Clara, CA 95050, USA PacTech Asia Sdn. Bhd. Plot 14, Medan Bayan Lepas, Technoplex, Phase 4 Bayan Lepas Industrial Zone, 11900 Bayan Lepas, Penang, Malaysia PacTech - Packaging Technologies GmbH Am Schlangenhorst 15-17, 14641 Nauen, Germany Contact us at [email protected] LAPLACE Laser Flip Chip Bonder The LAPLACE-system provides an integrated solution for flip chip and capacitor/ resistor attach. The laser assisted assembly is applied for soldering, ACF and NCP interconnec- tions. The integrated dispensing unit in the flip chip assembly platform allows a maximal flexibility for flux, solder paste and/or ACF, NCP dispense. LAPLACE is a solution for Smart Cards, Smart Label products, LCD-Drivers, Flip Chip on Flex and Flip Chip on Board application. Soldering and Curing of underfill is done by use of laser. Specifications: [±5μm, ±10μm, ±25μm] • Flip chip placement, reflow & curing in one step • Fluxfree reflow with laser • No addtional reflow and curing • Suitable for Flip Chip Soldering and adhesive • Substrate materials: • In-Line capability • High throughput • Available with different accuracy specs • Vision system • Temperature control unit • Laser class I Flip Chip: ACF, NCP, ICA - PI, PVC, PE, Polyester - Paper based low cost substrates (IEC825, E DIN VDE 0750, 871, 837, CDRH) Optional: • Reel to Reel Unit • Wafer Handling Systems

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Page 1: LAPLACE - PacTech · 2014. 3. 10. · Bayan Lepas Industrial Zone, 11900 Bayan Lepas, Penang, Malaysia PacTech - Packaging Technologies GmbH Am Schlangenhorst 15-17, 14641 Nauen,

www.pactech.de

PacTech USA Inc.328 Martin Avenue, Santa Clara, CA 95050, USA

PacTech Asia Sdn. Bhd.Plot 14, Medan Bayan Lepas, Technoplex, Phase 4Bayan Lepas Industrial Zone, 11900 Bayan Lepas,Penang, Malaysia

PacTech - Packaging Technologies GmbHAm Schlangenhorst 15-17, 14641 Nauen, Germany

LAPLACELaser Flip Chip Bonder

The LAPLACE-system provides an integrated solution for flip chip and capacitor/ resistorattach. The laser assisted assembly is applied for soldering, ACF and NCP interconnec-tions. The integrated dispensing unit in the flip chip assembly platform allows a maximalflexibility for flux, solder paste and/or ACF, NCP dispense. LAPLACE is a solution for Smart Cards, Smart Label products, LCD-Drivers, Flip Chip onFlex and Flip Chip on Board application. Soldering and Curing of underfill is done by useof laser.

Specifications:

[±5µm, ±10µm, ±25µm]

• Flip chip placement, reflow & curing in one step• Fluxfree reflow with laser• No addtional reflow and curing• Suitable for Flip Chip Soldering and adhesive

• Substrate materials:

• In-Line capability• High throughput• Available with different accuracy specs

• Vision system• Temperature control unit• Laser class I

Flip Chip: ACF, NCP, ICA

- PI, PVC, PE, Polyester- Paper based low cost substrates

(IEC825, E DIN VDE 0750, 871, 837, CDRH)

Optional:• Reel to Reel Unit• Wafer Handling Systems

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