www.pactech.de

PacTech USA Inc.328 Martin Avenue, Santa Clara, CA 95050, USA

PacTech Asia Sdn. Bhd.Plot 14, Medan Bayan Lepas, Technoplex, Phase 4Bayan Lepas Industrial Zone, 11900 Bayan Lepas,Penang, Malaysia

PacTech - Packaging Technologies GmbHAm Schlangenhorst 15-17, 14641 Nauen, Germany

Contact us at sales@pactech.de

LAPLACE-CapHigh Accuracy Automatic Laser Bonder

for Capacitor Bonding on Wafer Probe Cards

Specification:

Capacitor Bonding and Laser Reflow for High Density Applicationswith Very Fine Component to Component Distances on SpecialSubstrates Like e.g. Wafer Probe Cards

• Capacitor feeder• Pick and place tool with 1µm resolution• Max. capacitor size: 1.25mm x 2.0mm

• Heating system with temperature controlling

• Patented laser thermode tool• Bonding direction is 180°• Requires only a thin layer of solder on the

• No additional reflow process needed• Max. working area: 325mm x 325mm• Placement accuracy: +/- 10µm• Throughput: 500 capacitors per hour

(upgradable to max.: 2.5mm x 2.5mm)

(Max. temp.: 150°C, temp. range: +/- 3°C)

(including soldering)

substrate/component pad