printed circuit technology for the future „leiterplattentechnik für die zukunft“

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Printed Circuit Technology for the Future „Leiterplattentechnik für die Zukunft“. Why chosing MOS?. - PowerPoint PPT Presentation

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  • Printed Circuit Technology for the FutureLeiterplattentechnik fr die Zukunft

  • Why chosing MOS?MOS Electronic GmbHMOS Electronics has been experienced in the production of printed circuit boards for nearly three decades. The co-operation with our partners in the Far-East enables us to offer all types of printed circuit boards of any quantity. From prototype to high volume this means you will get it from one source!

    Often during development of prototypes engineering requirements will change that later will effect mass production. Our logo is: always a step ahead that means your products will be produced today with technology of tomorrow. >> Printed circuit technology for the future >>

  • Our CompanyMOS Electronic GmbHWe are a medium-sized company employing 60 peopleWe are specialized in quick turnaround service of small and medium sized productionWe have customized technology to your specificationWe have large volume production by partners in the Far-East We are owner-managed

  • HistoryMOS Electronic GmbH1977 Established as electro-plating service1984 Re-establishment as PCB-production1993 Move into a new building1994 Introduction of modern PPS-system1995 Introduction CAM1995 Establishment Joint Venture H&S CEE SA1996 Start of multilayer-production 1999 Certification ISO 90021999 Expansion of production area2000 Mechanical Microvias 2002 Lasermicrovias, SBU, HDI2002 New Certification ISO 9001:20002003 Flex and flex-rigid-production

    First production plantPlant 1Plant 2

  • HistoryDie MOS Electronic GmbH2003 Impedance-controlled circuit boards2004 Development Multilayer-HDI process2004 First double-sided sprayer for soldermask2005 Complete ROHS-conform circuit board2005 Expansion of flex and flex-rigid production2005 Expansion of HF-production2006 Foundation of Corporation with Chinese partners2007 Expansion of HDI-production2007 Introduction of Envision Process2007 Expansion of quality management trading goods2008 Introduction LDI2009 Foundation 2-mil-technology (50m line/space)2010 Expansion of thick-copper and pressfit technology

  • Lauffer Multistage (Multilayerpress)Innovation: Bonding machine DIS 77:First exemplar on the European MarketLegend ink printer Orbotech Sprint 8Ultra fine line etching machine with etchant regeneration system (Schmid)MEC-Etch system (Innerlayer pre-treatment)X-ray drilling machineDrilling / routing machine for metal core PCBDrilling / routing machine with 4 spindles

    Investments 2010/2011MOS Electronic GmbH

  • Investmentplanning 2011/2012MOS Electronic GmbHInnerlayer liquid resist platingVia hole pluggingCAM-system INCAM3D-Videomicroscope for development expensesIntegr8tor + CRM-Software.

    Mass production 2-mil-TechnologyExpansion stacked-via-TechnologyNew building for production of HDI Technology 4000 mISO TS 16949 introduction in 2012 ISO 1348 introduction

  • Company PhilosophyOur productsThe quality standard of our products is a firm part of our company philosophy. Since the foundation of our company it has always been our intention to keep our production to a technological first class standard. Permanent re-investigations and product improvements have always been significant elements of our succes.

  • Express-ServiceOur productsExpress-service begins with quotation!We know your engineers always wanted it yesterdayProduction of prototypes from one day turnaroundHDI and Flex rigid delivery time on demandProduction in series qualityIdentical processes and machinesIdentical data-processing and filingTransferable to seriesNo board-design limitationsOur big strength: emergency production also for substantial seriesFlexibility is a matter of course for us For very urgent orders we also produce on week-ends

  • TechnologyOur productsFrom Single-sided up to 28 layers (thickness 6.0 mm max.)HDI- and SBU-Multilayer (4 + core + 4 max.)Blind-, buried- and microviasStacked viasHF / Impedance-control (POLAR) Halogen-free circuit boardsCopper up to 400 mPressfit technologyAluminium based PCBFlex / flex-rigid (also HDI)Different-coloured soldermasksVia Hole Plugging and Copper Hole FillingRoHS / ULProduction according to customers requirements

  • Service and AdviceOur productsImpedance calculations and design suggestionsTechnological advice, also for the selection of the appropriate materials.Support of the development of new productsDevelopment of alternative solutions and further development to product stabilitySelection of the optimal producerDesign for Manufacturing (DFM)

  • SizesTechnologyStandard panel size for single-sided and doublesided:580 mm x 427 mm (usable area)Standard panel size for multilayer:570 mm x 417 mm (usable area)Standard panel size for SBU-multilayer:540 mm x 370 mm (usable area)Special sizes on demand

  • MaterialsTechnologyStandard for single- and doublesided: Nan Ya FR-4-86 UV Block (TG 140, improved for leadfree process)Standard for multilayer:Isola IS400 (TG 150, filled)Nan Ya NP155F (TG 150, filled)TG 170 materialsHF materials (e.g. Rogers)Halogen-free materialsPolyimideTeflonAluminium-based MaterialsSpecial materials according to customers request

  • SurfacesTechnologyFinal surfacesScreen-printings

  • HDI TechnologyTechnology

    C

    D

    E

    H

    J

    A

    B

    B

    A

    B

    B

    G

    G + G

    Symbol

    Description

    Standard

    Fine line

    Ultra fine line

    A

    Outer line width

    150 m

    100 m

    70 m

    B

    Outer distance

    150 m

    100 m

    70 m

    C

    Inner line width

    150 m

    100 m

    70 m

    D

    Outer distance

    150 m

    100 m

    70 m

    E

    Microvia diameter

    150 m

    150 m

    130 m

    1300 m

    G

    Microvia Pad

    300 m

    300 m

    200 m

    H

    Hole diameter

    300 m

    200 m

    200 m

    J

    E/J (aspect ratio)

    1 : 0,5

    1 : 0,5

    1 : 0,5

  • QualityQuality

  • ReferencesReferences

  • Quality and ControlQuality and Control Strongly increased requirements as well as the ever higher complexity already made constant examinations of the products necessary during the manufacturing. In the following we would like to present to you some of the examinations accomplished in our company:

  • Manual-optical controlQuality and ControlDuring production regular optical tests are made by our well-skilled staff...

  • Automatic-Optical Inspection (AOI)Quality and ControlThe corroded conductive pattern is submitted additionally to manual controls of machine-supported by Automatic-Optical Control (AOI).The etched conductive pattern will be compared with the CAM layout data.

  • Micro-sectionsQuality and ControlThe galvanic copper construction requires inspection of the coating thickness and the quality of the deposited copper.In addition by each order micro-sections are provided and documented.

  • DimensionsQuality and ControlAfter the mechanical treatment, accuracy to size is examined

  • Surface and coating thicknessQuality and ControlVision Stereomicroscope:Examination of the surface finish.Fischer MMS-PC coating thickness measuring:Hole copper and copper on the surface.Material thickness inside.Thickness of soldermask.Fischerscope X-Ray fluorescence measuring instrument:Examination of the coating thickness of the final surface (imm. Sn, imm. Ni/Au, imm. Ag).Couloscope CMS tin coating measuring instrument:Measurement of the tin coating available for the soldering process.

  • The electrical testQuality and ControlThe last and most important examination is the electrical test. Here it is guaranteed that no short-circuits or breaks are present.

  • The MOS CorporationThe MOS Corporation

  • The MOS CorporationSuccessful cooperation with Asian series manufacturers since 2005All PCB types in all batch sizes availableThe MOS Corporation

  • The MOS CorporationOrganisationMOS takes over the entire completion:Selection of productionTechnical clarifyingTransport and logisticMOS is locally in ChinaQuality responsibility is withMOSPartner in Germany is MOSCompletely final inspection with MOS Possibility of emergency production with MOSRemachining possibility with MOS

  • The MOS CorporationQuality assuranceOur series manufacturers are ISO 9001, TS16949 and ISO 14001 certifiedProfessional selection of the partners:

    We have a second source for each technology and batch size

  • The MOS CorporationGoods inwards quality-checkBefore distribution to our customers, all supplies of our corporation partners have an extensive incoming goods check:Verification and validation of the products and the necessary documents in relation to the customer defaults.Sampling inspection:Examination of the quality of the plated-through holes. Examination of the mechanical dimensions. Measurement of coating thickness (stackup, copper, Ni/AU, Ag, Sn). Archiving of all documents including resetting samples and inspection documentation.Special measurement after customer's request

  • EnvironmentEnvironment

    Environmental protection and preservation of resources is a subject that is always in the forefront of our policies. Our company, being at the edge of a protected area in the nature park of Black Forest, constantly pays attention for the saving of materials, water and energy. With the selection of new manufacturing plants, these factors play a substantial role, too. Recycling of materials is an important point in our policies. The selection of the partners within our group was likewise an important factor. They are also certified according to ISO14001. Meaning our environmental philosophy is reflected in our principle: Printed circuit technology for the future.

  • ContactGeneral Manager

    Mr. Horst Schmalstieg

    Phone: +49 70 55 92 99 [email protected] Manager

    Mrs. Margrit Schmalstieg

    Phone: +49 70 55 92 99 [email protected] Manager

    Mr. Reinhard Rosen

    Phone: +49 70 55 92 99 [email protected] Management

    Mr. Jens Rosen

    Phone: +49 70 55 92 99 [email protected]

    Support / logistic trading goods

    Phone: +49 70 55 92 99 [email protected] Office

    MOS Electronic GmbHPhone: +49 70 55 92 99 0Fax: +49 70 55 15 [email protected] Managing Director

    Herr Jrgen Bauer

    Phone: +49 70 55 92 99 [email protected] board:

    Sales department:

  • ContactProduction / Technology

    Mr. Michael Klingler

    Phone: +49 70 55 92 99 [email protected] / Technology

    Mr. Matthias Klingler

    Phone: +49 70 55 92 99 [email protected] preparation department

    Mrs. Gabi Walz

    Phone: +49 70 55 92 99 [email protected] / Data

    Mr. Klaus Holdermann

    Phone: +49 70 55 92 99 [email protected] assurance

    Mrs. Sibylle Klingler

    Phone: +49 70 55 92 99 [email protected] / Purchasing

    Mrs. Elke Lrcher

    Phone: +49 70 55 92 99 [email protected] consultation / supervision of production:

    Work preparartion department:

    Quality assurance / Accounting / Purchasing:

  • LocationMOS Electronic GmbHHermann-Lns-Strae 40-44D-75389 Neuweiler

    Phone: +49 7055 9299- 0Fax: +49 7055-1581Mail: [email protected]: http://www.mos-electronic.de

  • MOS Electronic GmbH>> Demand us >>Permanent advancement and constant investments into new technologies have secured us a leading position in the printed circuit board industry in Germany. Our high measure of authority and experience of many years as printed circuit board manufacturers have made us a very effective and successful co-operation possible with our partners for middle and large series in the Far East. For our usually medium-sized customers as a result of it singular resources in things printed circuit board arise.

  • MOS Electronic GmbHMany thanks for your interest.