itm 12864k0 tecnico

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INTECH LCD GROUP LTD

安达新液晶显示器(深圳)有限公司

CUSTOMER: MODEL NO: ITM-12864K0YTBL CUSTOMER NO:

Ver. Revision Record Date 01 2007-02-27

Designed By Checked By Approved By

GLJ

SPECIFICATION APPROVED

SAMPLE APPROVED

CUSTOMER APPROVAL: DATA:

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Contents

(1) Electronic unit................……….…………………………...............….3 1.1 Absolute Maximum Ratings...............………………………………...................3 1.2 Electrical Characteristics.....................…..……………………………........……3 1.3 Interface Pin Function............................…………………………………...........4 1.4 Block Diagram...……....... ......….......….………………………………........…...4 (2) Mechanical Units............................…………………………….…..... 5 2.1 Feature.............................…………………………………….............…......…...5 2.2 Mechanical Specification.................………………………………................…..5 2.3 Mechanical Diagram................................……………………………….....…….6 (3) Back –Light Specification.........…………………………...........…...…7 3.1 Absolute Maximum Ratings ..................…………………….…………...........…..7 3.2 Electrical/Optical Characteristic.........………………………..………...............….7 3.3 Measured Method................................………………………………….......……7 (4) Elector –optical units..................…………………………….....…...... 8 4.1 Elector –optical characteristics.................………………………………......…...8 4.2 Optical definitions....................................………………………………………...8 (5)Controller IC Function Description. ....………………………...………..…10 5.1 Power Supply Circuit Diagram ...........………………………...............10 5.2 System Interface.......……………………………………………….…....10 5.3 operating principles & methods…………………………..…………........12 5.4 Display Control Instruction……………………….…………………........14 (6)Packing Method ........….... ...............…………………………….…..16 6.1 Packing Material:(per carton)..................…………………………........16 6.2 Packing Specifications And Quantity.......………………………….……16 (7) Quality Units..............................………………………………...….....17 7.1 Purpose.........................................…………………………………….....…......17 7.2 Standard for Quality Test......................……………………………….....….......17 7.3 Nonconforming Analysis & Deal while Manners.....……………………....…….17 7.4 Agreement Items..........................................………………………………….…18 7.5 Standard of the Product Appearance Test..............……..………………….….18 (8) Reliability Test Conditions And Methods....…………..……………...19 (9) Inspection standard....................………………..……..….......20

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(1) Electronic unit 1.1 Absolute Maximum Ratings

ITEM SYMBOL MIN. TYP. MAX. UNIT

OPERATING

TEMPERATURE Top -0 - +50 ℃

STORAGE TEMPERATURE Tst -20 - +70 ℃

INPUT VOLTAGE Vin -0.3 - Vdd+0.3 V

SUPPLY VOLTAGE FOR

LOGIC Vdd -0.3 - +7.0 V

SUPPLY VOLTAGE FOR

LCD Vlcd -0.3 - +18.0 V

1.2 Electrical Characteristics ITEM SYMBOL CONDITION MIN. TYP. MAX. UNIT

SUPPLY VOLTAGE

FOR LOGIC Vdd-Vss - 2.7 3.3 5.5

V

SUPPLY VOLTAGE

FOR LCD VLCD - 13.8 14.0 14.2

V

HIGH Vih - 0.8Vdd - VDD V INPUT

VOLTAGE LOW Vil - Vss - 0.2Vdd V

HIGH Voh IOH=-0.5mA 0.8Vdd - Vdd V OUTPUT

VOLTAGE LOW Vol IOL=0.5mA Vss - 0.2Vdd V

Current Consumption ldd - - 100 200 uA

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1.3 Interface Pin Function

DESCRIPTIONLEVELSYMBOLITEM

No Connection.(Open)

Operating Voltage for LCD (variable).

No Connection.(Open)

For LCD driver circuit.

For internal logic circuit (+5V+10%).

DAta input/output pin of intermal shift register.

Chip Select Signal for IC 1.

Data bus [0~7].There state I/O common terminal.

Reset signal.

Ground.

Enable signal.Read or Write.

Chip Select Signal for IC 2.(PCB ver: 05)Chip Select Signal for IC 2.(PCB ver: 002)

1.4 Block Diagram

6464

64

DRIVECOMMON

DRIVE

BACK LIGHT

SEGMENT SEGMENTDRIVE

LCD PANELE

V0D/I

R/WRST

AK

VEEVSS

CS1CS2

DB0-DB7

VDD

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(2) Mechanical Units 2.1 Feature 1) Display format: 128*64 DOTS 2) Display type: STN transflective yellow-green Positive MODE 3) Driving method: 1/64 duty. 1/9 bias 4) Controller IC: SBN0064 OR S6B0108 OR PT6608 OR SA3108 5) Power supply Voltage: 3.3V 6) IC Package Type: COB 7) Back light: yellow-green bottom LED backlight 2.2 Mechanical Specification

ITEM STANDARD VALUE UNIT

MODULE

DIMENSION

87.0*71.0*14.6 mm

VIEWING AREA 62.5*43.5 mm

ACTIVE AREA 55.84*37.76 mm

DOT SIZE 0.44*0.60 mm

DOT PITCH 0.40*0.56 mm

NUMBER OF

CHARACTER

128*64 dots

APPROX. WEIGHT 82 g

BACK LIGHT Yellow-green bottom LED backlight

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2.3 Mechanical Diagram

0.56

0.40

0.04

87.00

79.70

75.00

V.A.43.50

75.70

29.42

φ2.50(TY

P.4)

A

10.16

K

3.65

71.00

67.00

58.50

54.50

2.502.54X19=48.26

37.76

55.84

128X64 D

OT M

ATR

IX

20

V.A.62.50

1

3.00

4.25

12.37

10.00

8.50 14.60

MA

X.

1.60

0.04

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(3) Back-Light Specification 3.1 Absolute Maximum Ratings (Ta=25℃,Unless specified, The Ambient temperature Ta=25℃)

Item Symbol Condition Rating Unit Reverse Voltage Vr 5 V Reverse Current Ir 100 UA Absolute maximum forward current Ifm 900 mA

Peak forward current Ifp I mess plus 10% Duty cycle 660 mA

Power description pd 2700 mW Operating temperature range Topr -0~+50 0C Storage temperature range Tst -20~+70 0C 3.2 Electrical/Optical Characteristic (Ta=25℃,Unless specified, The Ambient temperature Ta=25℃)

Item Symbol min typ max Unit Test Condition

Forward Voltage Vf 4.0 4.2 4.4 V If=660 mA Reverse Current Ir 40 200 uA Vr=10 V Peak wave length λp 570 nm If=660 mA Spectral Line Half width Δλ 30 If=660 mA Luminance Lv 60 cd/㎡ If=660 mA NOTE:

1. Backlight Only 2. Average Luminous Intensity Of P1--P5 3. Luminous Intensity Tolerance= ( (MAX-MIN)/MAX ) X 100%

3.3 Measured Method （Effective spatial Description） Hole Diameter±10；1 to 5 per position Measured Luminous Intensity

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(4) Elector –Optical Units 4.1 Elector –Optical Characteristics

ITEM SYMBOL CONDITION MIN. TYP. MAX. UNIT

VIEW ANGLE (V) θ CR≥2 -35 - +35 deg. VIEW ANGLE (H) φ CR≥2 -35 - +35 deg..

CONTRAST RATIO

CR Ta=25℃ - 5 - -

RESPONSE TIME

Tr+Td Ta=25℃ - 400 ms

OPERATING VOLTAGE FOR LCD

VLCD Ta=25℃ - 14.0 V

DUTY 1/64 DUTY DRIVE METHOD BIAS 1/9 BIAS

LCD TYPE STN, Transflective, Positive, yellow/green model

VIEWING

DIRECTION 6'OCLOCK

4.2 Optical Definitions

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(5) Controller IC Function Description 5.1 Power Supply Circuit Diagram

VDD-V0 : LCD DRIVING VOLTAGEVR : 10K-20K

VR

VSS

VDD-V0

V0 VDDVEE

VDD-5V~-15V

5.2 System Interface

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5.3 OPERATING PRINCIPLES & METHODS 1. I/O Buffer

Input buffer controls the status between the enable and disable of chip. Unless the CS1 or CS2 is in active mode, Input or output of data and instruction does not execute. Therefore internal state is not change. But RSTB and ADC can operate regardless CS1 and CS2.

2. Input register Input register is provided to interface with MPU which is different operating frequency. Input register stores the data temporarily before writing it into display RAM. When CS1 or CS2 are in the active mode, R/W and RS select the input register. The data from MPU is written into input register. Then writing it into display RAM. Data latched for falling of the E signal and write automatically into the display data RAM by internal operation.

3. Output register Output register stores the data temporarily from display data RAM when CS1 or CS2 are in active mode and R/W and RS=H, stored data in display data RAM is latched in output register. When CS1B to CS3 is in active mode and R/W=H, RS=L, status data (busy check) can read out. To read the contents of display data RAM, twice access of read instruction is needed. In first access, data in display data RAM is latched into output register. In second access, MPU can read data, which is latched. That is to read the data in display data RAM, it needs dummy read. But status read is not needed dummy read. RS R/W Function

L Instruction L H Status read (busy check) L Data write (from input register to display data RAM ) H H Data read (from display data RAM to output register)

4. Reset The system can be initialized by setting RSTB terminal at low level when turning power on, receiving instruction from MPU. When RSTB becomes low, following procedure is occurred. 1. Display off 2. 0 set display start line register. (Z-address 0) While RSTB is low, No instruction except status read can by accepted. Therefore, execute other instructions after making sure that DB4= (clear RSTB) and DB7=0 (ready) by status read instruction. The conditions of power supply at initial power up are shown in table 1.

Table 1. Power Supply Initial Conditions Item Symbol Min Typ Max Unit Reset Time tRS 1.0 - - us Rise Time tR - - 200 ns

0.3VDD 0.7VDD

VDD

RSTB tR

tRS

2.7[V]

5. Busy flag

Busy flag indicates that KS0108B is operating or no operating. When busy flag is high, KS0108B is in internal operating. When busy flag is low, KS0108B can accept the data or instruction. DB7indicates busy flag of the KS0108B.

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Busy Flag

E

T Busy

fCLK is CLK1, CLK2 Frequency

1/fCLK<T Busy<3/fCLK

6. Display On/Off flip-flop The display on/off flip-flop makes on/off the liquid crystal display. When flip-flop is reset (logical low), selective voltage or non-selective voltage appears on segment output terminals. When flip-flop is set (logic high), non-selective voltage appears on segment output terminals regardless of display RAM data. The display on/off flip-flop cans changes status by instruction. The display data at all segments disappear while RSTB is low. The status of the flip-flop is output to DB5 by status read instruction. The display on/off flip-flop synchronized by CL signal.

7. X Page Register X page register designates pages of the internal display data RAM. Count function is not available. An address is set by instruction.

8. Y address counter Y address counter designates address of the internal display data RAM. An address is set by instruction and is increased by 1 automatically by read or writes operations of display data.

9. Display Data RAM Display data RAM stores a display data for liquid crystal display. To indicate on state dot matrix of liquid crystal display, write datra1. The other way, off state, writes 0. Display data RAM address and segment output can be controlled by ADC signal. ADC=H => Y-address 0: S1~Y address 63: S64 ADC=L => Y-address 0: S64~Yaddress 63: S1 ADC terminal connect the VDD or VSS.

10. Display Start Line Register The display start line register indicates of display data RAM to display top line of liquid crystal display. Bit data (DB<0.5>) of the display start line set instruction is latched in display start line register. Latched data is transferred to the Z address counter while FRM is high, presetting the Z address counter. It is used for scrolling of the liquid crystal display screen.

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5.4 Display Control Instruction The display control instructions control the internal state of the KS0108B. Instruction is received from MPU to KS0108B for the display control. The following table shows various instructions.

Instruction RS RW DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Function

Read Display Date 1 1 Read data

Reads data (DB[7:0]) from display data RAM to the data bus.

Write Display Date 1 0 Write data

Writes data (DB[7:0]) into the DDRAM. After writing instruction, Y address is incriminated by 1 automatically

Status Read 0 1 Busy 0 ON/

OFF Re-set 0 0 0 0

Reads the internal status BUSY

0: Ready 1: In operation

ON/OFF 0: Display ON 1: Display OFF

RESET 0: Normal 1: Reset

Set Address (Y address) 0 0 0 1 Y address (0~63) Sets the Y address at the

column address counter

Set Display Start Line 0 0 1 1 Display start line (0~63)

Indicates the Display Data RAM displayed at the top of the screen.

Set Address (X address) 0 0 1 0 1 1 1 Page (0~7) Sets the X address at the

X address register.

Display On/off 0 0 0 0 1 1 1 1 1 0/1

Controls the display ON or OFF. The internal status and the DDRAM data are not affected. 0: OFF, 1: ON

1. Display On/Off

The display data appears when D is 1 and disappears when D is 0. Though the data is not on the screen with D=0, it remains in the display data RAM. Therefore, you can make it appear by changing D=0 into D=1. RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 0 0 0 0 1 1 1 1 1 D

2. Set Address (Y Address)

Y address (AC0~AC5) of the display data RAM is set in the Y address counter. An address is set by instruction and increased by 1 automatically by read or write operations of display data.

RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 0 0 0 1 AC5 AC4 AC3 AC2 AC1 AC0

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3. Set Page (X Address) X address (AC0~AC2) of the display data RAM is set in the X address register. Writing or reading to or from MPU is executed in this specified page until the next page is set.

RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 0 0 1 0 1 1 1 AC2 AC1 AC0

4. Display Start Line (Z Address)

Z address (AC0~AC5) of the display data RAM is set in the display start line register and displayed at the top of the screen. When the display duty cycle is 1/64 or others (1/32~1/64), the data of total line number of LCD screen, from the line specified by display start line instruction, is displayed.

RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 0 0 1 1 AC5 AC4 AC3 AC2 AC1 AC0

5. Status Read

RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0

0 1 BUSY 0 ON/OF

F RESE

T 0 0 0 0

l BUSY When BUSY is 1, the Chip is executing internal operation and no instructions are accepted. When BUSY is 0; the Chip is ready to accept any instructions.

l ON/OFF when ON/OFF is 1, the display is on. When ON/OFF is 0, the display is off.

l RESET When RESET is 1, the system is being initialized. In this condition, no instructions except status read can be accepted. When RESET is 0, initializing has finished and the system is in the usual operation condition.

6. Write Display Data

Writes data (D0~D7) into the display data RAM. After writing instruction, Y address is increased by 1 automatically. RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 1 0 D7 D6 D5 D4 D3 D2 D1 D0

7. Read Display Data

Reads data (D0~D7) from the display data RAM. After reading instruction, Y address is increased by 1 automatically. RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 1 1 D7 D6 D5 D4 D3 D2 D1 D0

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(6) Packing Method

6.1 Packing Material :( per carton)

NO ITEM MODEL DIMENSIONS

(mm)

UNIT WEIGHT

(Kg) QUANTITY

1 LCM MODULE 2 Packing box 3 Tray 4 Carton 5 Casing Bag 6 Gross Weight

6.2 Packing Specifications and Quantity (1) Quantity per box: PCS

(2) Total quantity in carton: NO. of boxes * quantity per box =

label

QC inspection

Box upseal carton

Use static bagPut tape to

LCD MODULE

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(7) Quality Units 7.1 Purpose

This standard for Quality Assurance should affirm the quality of LCD module products to supply to purchaser by WINTEK CORPORATION (Supplier).

7.2 Standard for Quality Test 7.2.1 Inspection

Before delivering, the supplier should take the following tests, and affirm the quality of product.

7.2.2 Electro-Optical Characteristics According to the individual specification to test the product.

7.2.3 Test of Appearance Characteristics: According to the individual specification to test the product.

7.2.4 Test of Reliability Characteristics: According to the definition of reliability on the specification for testing produces.

7.2.5 Delivery Test: Before delivering, the supplier should take the delivery test.

① Test method: According to MIL-STD-105E, General inspection level II take a single time.

② The defects classify of AQL as following: Major defect: AQL=0.65; Minor defect: AQL=2.5; Total defect: AQL=2.5

7.3 Nonconforming Analysis & Deal with Manners 7.3.1 Nonconforming analysis:

① Purchaser should supply the detail data of non-conforming sample and the non-suitable state.

② After accepting the detail data from purchaser, the analysis of nonconforming should be finished in two weeks.

③ If supplier can not finish analysis on time, must announce purchaser before two weeks.

7.3.2 Disposition of nonconforming; ① If find any product defect of supplier during assembly time, supplier must change

the good product for every defect after recognition. ② Both supplier and customer should analyze the reason and discuss the

disposition of nonconforming when the reason of nonconforming is not sure. 7.4 Agreement Items

Both sides should discuss together when the following problems happen. 7.4.1 There is any problem of standard of quality assurance, and both sides think that it

must be modified. 7.4.2 There is any argument item, which does not record in the standard of quality

assurance.

7.4.3 Any other special problem. 7.5 Standard of the Product Appearance Test

7.5.1 Manner of appearance test: ① The test must be under 20W×2 or 40W fluorescent light, and the distance of view

must be at 30cm.

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② When text the model of transmissive product must add the reflective plate.. ③ The test direction is base on about around 45。of vertical line.

④ Definition of area:

Area A: Viewing area. Area B: Out of viewing (outside viewing area)

7.5.2 Basic principle

① t will accord to the AQL when the standard can not be scribed. ② The sample of the lowest acceptable quality level must be discussed by both supplier

and customer when any dispute happened.

③ Must add new item on time when it is necessary. 7.5.3 Standard of inspection:(unit: mm)

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(8) Reliability Test Conditions And Methods

NO Item Condition Method

1 High / Low

Temperature Storage

70℃/-20℃ 500hrs Check and record every 96Hrs

2 High / Low

Temperature Life

50℃/0℃ 500hrs (operating mode)

Check and record every 96Hrs

3

High Temperature

High Humidity Operating

40℃ 90% RH, 120Hrs Check and record every 48hrs

4 Vibration 10Hz~55Hz~10Hz Amplitude: 1.5mm

2hrs for each direction (X, Y, Z)

Each direction end, Check the Appearance and

Electrical Characteristics

5 Static Electricity

Gap mood: ±1KV~±8KV (10 times air discharge with

positive/negative voltage, voltage gap: 1kv)

Touch mood: ±1KV~±4KV

Each discharge end, Check the Electrical

Characteristics

7 Slump Free faller movement for each

side、cording、angle (75cm High、 6 sides、2 angle、2 cording)

End

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(9) Inspection standard

No Item Criterion AQL

01 Outline Dimension In accord with drawing 0.65

02

Position-finding

Dimension Assemble Dimension

In accord with drawing 0.65

03 Electrical Testing

1. Missing vertical, horizontal segment, segment contrast defect. 2. Missing character, dot or icon. 3.Display malfunction 4. No function or no display. 5. Current consumption exceeds product specifications. 6. LCD viewing angle defect. 6. Mixed product types. 8. Contrast defect.

0.65

04

Black or white spots on LCD (display only)

1.White and black spots on display ≤0.25mm,no more than three white or black spots present.

2.densely spaced: No more than two spots or line within 3mm.

2.5

Round type: As following drawing 1 Small area LCD Unit : mm

Dimension Qualified Quantity

D≤0.1 Ignore

0.1＜D≤0.15 2 D＞0.15 0

2.5

05

LCD black spots,

white spots (Round type)

2 Large area LCD Unit : mm

Dimension Qualified Quantity

D≤0.1 Ignore 0.1＜D≤0.15 2 0.15＜D≤0.20 1

D＞0.20 0

2.5

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Line type: As following drawing 1 Small area LCD Unit : mm

Length Width Qualified Quantity

- ≤0.015 Ignore ≤1.0 2 ≤2.0

0.015＜W≤0.025 1

≤1.0 0.025＜W≤0.05 1

- D＞0.05 According to circle

2.5

06

LCD black spots,

white spots (Line Style) 2 Large area LCD

n

Length Width Qualified Quantity

- ≤0.015 Ignore

≤2.0 0.015＜W≤0.025 2

≤1.0 0.025＜W≤0.05 1

- D＞0.05 According to circle

2.5

07

LCD Scratch 、Threadlike

Fiber

Follow NO.5 and NO.6 black spots, white spots, and contamination. 2.5

08 POL

It is not admissible that POL is beyond the edge of glass, else, unqualified.

It is essential that POL is over the 50 percent of width of frame, else, unqualified.

According to the drawing in case of special definition.

2.5

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09 Chipped

Glass

Symbols: x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: LCD side length l: Electrode pad length 1 General glass chip 1.1 Chip on panel surface and crack between panels:

z: Chip thickness y: Chip width X: Chip length

z<=1/2t Not over viewing area X<=1/8a

1/2t<z<=2t Not exceed 1/3k X<=1/8a

If there are 2 or more chips, x is the total length of each chip 1.2 Comer crack:


z<=1/2t not over viewing area X<=1/8a

1/2t<z<=2t Not exceed 1/3k X<=1/8a

If there are 2 or more chips, x is the total length of each chip

2.5

10 PCB、COB

1 COB seal may not have pinholes larger than 0.2mm or Contamination.

2 COB seal surface may not have pinholes through to the IC.

3 The height of the COB should not exceed the height indicated in the assembly diagram.

4 There may not be more than 2mm of sealant outside the seal area on the PCB. And there should be no more than three places.

5 No oxidation or contamination PCB terminals. 6 Parts on the PCB must be he same as on the

production characteristic chart. There should be no wrong parts, missing parts or excess parts.

7 The jumper on the PCB should conform to the product characteristic char.

8 If solder gets on bezel tab pads, LED pad, zebra pad or screw hole pad, make sure it is smoothed down.

2.5 2.5 0.65 2.5 2.5 0.65 0.65 2.5

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11 Glass Crack

Symbols: x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: LCD side length l: Electrode pad length 1 Protrusion over terminal 1.1 Chip on electrode pad:


0<z<=t Y<=0.5mm X<=1/8a

1.2 Non-conductive portion:


0<z<=t Y<=L X<=1/8a

If the chipped area touches the ITO terminal, over 2/3 if the ITO must remain and be inspected according to electrode terminal specifications. If the product will be heat sealed by the customer, the alignment mark must not be damaged. 1.3 Substrate protuberance and internal crack:

Y: width X: length Y<=1/3L X<=a

2.5

12 Backlight elements

1 Illumination source flickers when lit. 2 Spots or scratches that appear when lit must be judged.

Using LCD spots, lines and contamination standards. 3 Backlight doesn’t light or color is wrong.

0.65 2.5 0.65

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13 Bezel 1 Bezel may not have rust, be deformed or have fingerprints,

stains or other contamination. 2 Bezel must comply with job specifications.

2.5 0.65

14 Soldering

1 No unmated solder paste may be present on the PCB. 2 No cold solder joints, missing solder connections,

oxidation or icicle. 3 No short circuits in components on PCB.

2.5 2.5 0.65

15 General Appearance

1 No oxidation, contamination, curves or, bends on interface Pin(OLB) of TCP.

2 No cracks on interface pin(OLB) of TCP. 3 No contamination, solder residue or solder balls on

product. 4 The IC on the TCP may not be damaged, circuits. 5 The uppermost edge of the protective strip on the

interface pin must be present or look as if it causes the interface pin to sever.

6 The residual rosin or tin oil of soldering (component or chop component) is not burned into brown or black color.

7 Sealant on top of the ITO circuit has not hardened. 8 Pin type must match type in specification sheet. 9 LCD pin loose or missing pins. 10 Product packaging must the same as specified on

packaging specification sheet. 11 Product dimension and structure must conform to product

specification sheet. 12 The appearance of Heat Seal should not admit any dirt

and break.

2.5 0.65 2.5 2.5 2.5 2.5 2.5 2.5 0.65 0.65 0.65 0.65

itm 12864k0 tecnico

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