freescale usb development board usb-kw40z user's guide

Freescale Semiconductor, Inc.User’s Guide

© 2015 Freescale Semiconductor, Inc. All rights reserved.

1 About this guideThis manual describes the Freescale USB-KW40Z development platform. The USB-KW40Z board is a small, cost-effective evaluation and development board for application prototypes and demonstration of the MKW40Z160 SoC family of devices. This evaluation board offers an easy-to-use mass-storage device mode flash programmer, a virtual serial port, classic programming, and run-control capabilities.

The MKW40Z160 SoC is an ultra low-power, highly integrated single-chip device that enables Bluetooth Low Energy (BLE) and/or IEEE® Std. 802.15.4/RF connectivity for portable, extremely low-power embedded systems. The MKW40Z160 SoC family integrates a radio transceiver operating in the 2.36 GHz to 2.48 GHz range supporting a range of FSK/GFSK and O-QPSK modulations, and ARM® Cortex®- M0+ MCU, 160 KB flash memory and 20 KB SRAM, BLE Link Layer hardware, 802.15.4 packet processor hardware, and peripherals optimized to meet the requirements of the target applications.

1.1 Audience

This manual is intended for system designers.

Document Number: USBKW40ZUGRev. 0, 10/2015

Contents1. About this guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1.Audience . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12. Safety information . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

2.1.FCC guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . 22.2.Regulatory approval for Canada (IC RSS 210) . . . 32.3.Electrostatic discharge considerations . . . . . . . . . . 32.4.Disposal instructions . . . . . . . . . . . . . . . . . . . . . . . 3

3. USB-KW40Z overview and description . . . . . . . . . . 43.1.Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43.2.Board features . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43.3.Serial and debug adapter . . . . . . . . . . . . . . . . . . . . 6

4. USB-KW40Z development board . . . . . . . . . . . . . . . 74.1.USB-KW40Z board overview . . . . . . . . . . . . . . . . 74.2.Functional description . . . . . . . . . . . . . . . . . . . . . . 94.3.Schematic, board layout, and bill of material . . . 16

5. PCB manufacturing specifications . . . . . . . . . . . . . . 215.1.Single PCB construction . . . . . . . . . . . . . . . . . . . 215.2.Panelization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225.3.Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225.4.Solder mask . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 235.5.Silk screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 235.6.Electrical PCB testing . . . . . . . . . . . . . . . . . . . . . 235.7.Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 235.8.Hole specification/tool table . . . . . . . . . . . . . . . . 235.9.File description . . . . . . . . . . . . . . . . . . . . . . . . . . 23

6. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Freescale USB Development Board USB-KW40Z User's Guide

Freescale USB Development Board USB-KW40Z User’s Guide, Rev. 0, 10/2015

2 Freescale Semiconductor, Inc.

Safety information

2 Safety information

2.1 FCC guidelines

This equipment is for use by developers for evaluation purposes only and must not be incorporated into any other device or system. This device may not be sold to the general public. Integrators will be responsible for reevaluating the end product (including the transmitter) and obtaining a separate FCC authorization.

FCC approval of this device only covers the original configuration of this device as supplied. Any modifications to this product, including changes shown in this manual, may violate the rules of the Federal Communications Commission and Industry Canada and make operation of the product unlawful.

2.1.1 Labeling

FCC labels are physically located on the back of the board.

2.1.2 Operating conditions

This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions:

• This device may not cause harmful interference.

• This device must accept any interference received, including interference that may cause undesired operation.

2.1.3 Exposure limits

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. The antenna(s) used for this equipment must be installed to provide a separation distance of at least 8 inches (20 cm) from all persons.

2.1.4 Antenna restrictions

An intentional radiator is designed to ensure that no antenna other than that furnished by the responsible party is used with the device. The use of a permanently attached antenna or of an antenna that uses a unique coupling to the intentional radiator is considered sufficient to comply with the provisions of this Section. The manufacturer may design the unit so that a broken antenna can be replaced by the user, but the use of a standard antenna jack or electrical connector is prohibited. This requirement does not apply to carrier current devices or to devices operated under the provisions of Sections 15.211, 15.213, 15.217, 15.219, or 15.221 of the IEEE Std. 802.15.4. This requirement does not apply to intentional radiators that must be professionally installed, such as perimeter protection systems and some field disturbance sensors, or to other intentional radiators which, in accordance with Section 15.31(d), must be measured at the installation site. However, the installer is responsible for ensuring that the proper antenna is employed so that the limits in this Part are not exceeded.


Freescale Semiconductor, Inc 3

Safety information

2.2 Regulatory approval for Canada (IC RSS 210)

This equipment complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions:

1. This board may not cause interference, and

2. This board must accept any interference, including interference that may cause undesired operation of the device.

2.2.1 26 PART 5 – Appendix

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes:

1. l'appareil ne doit pas produire de brouillage, et

2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

2.3 Electrostatic discharge considerations

Although damage from electrostatic discharge (ESD) is much less common on these devices than on early CMOS circuits, normal handling precautions should be used to avoid exposure to static discharge. Qualification tests are performed to ensure that these devices can withstand exposure to reasonable levels of static without suffering any permanent damage.

All ESD testing is in conformity with the JESD22 Stress Test Qualification for Commercial Grade Integrated Circuits. During the device qualification ESD stresses were performed for the human body model (HBM), the machine model (MM) and the charge device model (CDM).

All latch-up test testing is in conformity with the JESD78 IC Latch-Up Test.

When operating or handling the development boards or components, Freescale strongly recommends using at least the grounding wrist straps plus any or all of the following ESD dissipation methods:

• Flexible fabric, solid fixed size, or disposable ESD wrist straps

• Static control workstations, static control monitors, and table or floor static control systems

• Static control packaging and transportation materials and environmental systems

2.4 Disposal instructions

This product may be subject to special disposal requirements. For product disposal instructions, refer to freescale.com/productdisposal.

http://www.freescale.com/about/technology-leadership/environmentally-preferred-products/product-disposal:ENV_PRODUCTDISPOSAL



USB-KW40Z overview and description

3 USB-KW40Z overview and description

3.1 Introduction

The USB-KW40Z development platform is an evaluation environment based on the Freescale MKW40Z160 SoC device. The MKW40Z160 SoC integrates a radio transceiver operating in the 2.36 GHz to 2.48 GHz range, supporting a range of FSK/GFSK and O-QPSK modulations, an ARM Cortex-M0+ MCU into a single package.

Freescale supplements the MKW40Z160 SOC with tools and software that include hardware evaluation and development boards, software development IDE, applications, drivers, custom PHY usable with IEEE Std. 802.15.4 compatible MAC, BLE Link Layer, and enables the Bluetooth Low Energy protocol to be used in the MBAN frequency range for proprietary applications.

3.2 Board features

3.2.1 USB-KW40Z board

The USB-KW40Z development board contains the MKW40Z160 device it is one of the simplest reference design utilizing the on chip USB block for power and communication. The USB-KW40Z is a small form factor self-contained board for evaluation of wireless application and can be used as a packet sniffer. The USB type-A connection is used with USB enabled hardware such as a computer.

Figure 1 shows the USB-KW40Z development platform.

Figure 1. USB-KW40Z development board




The USB-KW40Z development board includes the following features:

• Based on the Freescale ultra low-power MKW40Z160 SoC BLE device

• Fully compliant IEEE Std. 802.15.4, 2006, transceiver supporting 250 kbit/s O-QPSK data in 5.0 MHz channels and full spread-spectrum encode and decode

• Fully compliant Bluetooth v4.1 Low Energy (BLE)

• Full IEEE 802.15.4 compliant wireless node with KSDK enable software

• Reference design area with small footprint, low-cost RF node

— Differential input/output port used with external balun for single port operation

— Low external component count

— Programmable output power from –20 dBm to +5 dBm at the MMCX connector, no harmonic trap using bypass mode of operation

— Receiver sensitivity: –102 dBm, typical (@1% PER for 20 byte payload packet), for 802.15.4 at the MMCX connector

— Receiver sensitivity: -91 dBm for BLE applications at the MMCX connector

• Integrated PCB inverted meander type antenna and MMCX (Micro-Miniature Coaxial) RF port

• Bypass operation mode

• 32 MHz reference oscillator

• 32 kHz reference oscillator

• 2.4 GHz frequency operation (ISM and MBAN)

• Reset switch drive to MKW40Z160.

• Reset switch drive to debug interface (OpenSDA)

• Cortex 10-pin (0.05 inch) SWD debug port for target MCU

• Cortex 10-pin (0.05 inch) JTAG port for OpenSDA updates

• Integrated open-standard serial and debug interface (OpenSDA)

• 2 Blue LED indicators primary drive thought MKW40Z160 MCU, also connected to MK22FN512

• 1 Push button switch drive to MKW40Z160 MCU, also connected to MK22FN512




Figure 2 shows the main board features and I/O headers for the Freescale USB-KW40Z board.

Figure 2. USB-KW40Z component placement

3.3 Serial and debug adapter

The USB-KW40Z development board can be enabled with OpenSDA v2.1, a serial and debug adapter circuit that includes an open-source hardware design, an open-source bootloader, and debug interface software. It bridges serial and debug communications between a USB host and an embedded target processor. The hardware circuit is based on a Freescale Kinetis K22F family microcontroller (MCU). OpenSDAv2.1 enables the CMSIS-DAP bootloader, an open-source mass storage device (MSD) bootloader, and the CMSIS-DAP Interface firmware (also known as the mbed interface), that provides a MSD flash programming interface, a virtual serial port interface, and a CMSIS-DAP debug protocol interface. For more information on the OpenSDAv2.1 software, see mbed.org and https://github.com/mbedmicro/CMSIS-DAP.

NOTE

Driver considerations, you must install a windows driver that can be downloaded from the following link:

https://developer.mbed.org/handbook/Windows-serial-configuration

USB-KW40Z comes pre-programed with a sniffer application. In order to enable this board with OpenSDA feature and as a development board, refer to the following: freescale.com/USB-KW40Z/startnow

mbed.org

mbed.org

https://github.com/mbedmicro/CMSIS-DAP

https://github.com/mbedmicro/CMSIS-DAP

https://developer.mbed.org/handbook/Windows-serial-configuration

freescale.com/USB-KW40Z/startnow

freescale.com/USB-KW40Z/startnow



USB-KW40Z development board

4 USB-KW40Z development board

4.1 USB-KW40Z board overview

The USB-KW40Z board is an evaluation board based on the Freescale MKW40Z160 SoC. The USB-KW40Z provides a platform to evaluate the MKW40Z160 SoC device and to develop software and applications. The core device is accompanied by a the 32 MHz reference oscillator crystal, RF circuitry including antenna, and supporting circuitry.

The USB-KW40Z board is intended as the core PCB for MKW40Z160 device evaluation and application development, and can be used as a simple standalone valuation solution or as packet sniffer.

4.1.1 PCB features

The USB-KW40Z board provides the following features:

• USB small form factor

• 4-Layer metal, 0.062 inch thick FR4 board

• LGA footprint and power supply bypass mode

• Printed Meander Antenna and footprint for installing a (user supplied) MMCX connector

• 32 MHz reference oscillator crystal

• 32 kHz crystal provided for optional timing oscillator

• Secondary (MK22FN512) device to use as voltage regulator and MCU processor for BLE sniffer.

4.1.2 Form factor

Figure 3 shows the USB-KW40Z development board layout and footprint.

Figure 3. USB-KW40Z top side (component side) footprint




Figure 4 shows a footprint of the USB-KW40Z with the location of the headers.

Figure 4. USB-KW40Z I/O headers location

4.1.3 Board level specifications

Table 1. USB-KW40Z specifications

Parameter Min Typ Max Units Notes/Conditions

General

Size (PCB: X, Y) — — 18.5 x 61.40.73 x 2.42

mminches

Layer build (PCB) — 1.570.062

— mminches

4-Layer

Dielectric material (PCB) — — — — FR4

Power

Current consumption — — — mA Varies with operational mode, Refer to datasheet.

Temperature

Operating temperature (see note) -40 +25 +70 °C Operating temperature is limited to +70 °C due to switches. Basic circuit is good for a maximum temperature of +85 °C.

Storage temperature -30 +25 +70 °C

RF

802.15.4 Frequency range 2405 — 2480 MHz All 16 channels in the 2450 MHz band

BLE Frequency range 2400 — 2483 MHz All 40 channels in the 2450 MHz band

ISM and MBAN Frequency range 2360 — 2483 MHz

RF Receiver

Saturation (maximum input level) — +0 — dBm Refer to datasheet

Sensitivity for 1% packet error rate (PER) (+25 °C) 802.15.4

— -102 — dBm Refer to datasheet




1] Trap will add 1 to 2 dB of loss.

4.2 Functional description

The USB-KW40Z is built around the Freescale MKW40Z160 SoC in a 48-pin LGA package. The USB-KW40Z features a IEEE Std. 802.15.4 and BLE 2.4 GHz radio frequency transceiver and a Kinetis family ultra low-power, mixed-signal ARM Cortex-M0+ microcontroller in a single package. This board is intended as a simple evaluation platform and as a building block for application development. The four-layer board provides the MKW40Z160 with its required RF circuitry and a 32 MHz reference oscillator crystal. The layout for this base level functionality can be used as a reference layout for your target board. Figure 5 shows a simple block diagram.

Sensitivity for 1% packet error rate (PER) (+25 °C) BLE

— -94 — dB Refer to datasheet

RF Transmitter

RF Power Output -20 — +5 dBm Programmable in steps. At the MMCX connector with no trap. 1

2nd harmonic — ≤50 ≤40 dBm —

3rd harmonic — ≤50 ≤40 dBm —

Regulatory Approval

FCC — — — — Product is approved according to the FCC part 15 standard

CE (ETSI) — — — — Product is approved according to the EN 300 328 V1.7.1 (2006-10) standard

CE (EMC) — — — — Product is approved according to the EN 301 489-1 V1.6.1 (2005-09) and EN 301 489-17 V1.2.1 (2002-08) standards

Safety

UL — — — — Product is approved according to the IEC 60950-1 and EN 60950-1, First Edition standards

Environment

RoHS — — — — Product complies with the EU Directive 2002/95/EC of 27 January 2003

WEEE — — — — Product complies with the EU Directive 2002/95/EC of 27 January 2003

Table 1. USB-KW40Z specifications (continued)

Parameter Min Typ Max Units Notes/Conditions




Figure 5. USB-KW40Z block diagram

4.2.1 RF performance and considerations

The USB-KW40Z board’s integrated transceiver includes a 1 mW nominal output power PA with internal voltage controlled oscillator (VCO), integrated transmit/receive switch, on-board power supply regulation, and full spread-spectrum encoding and decoding. Key specifications for the MKW40Z160 SoC are:

• Nominal output power is set to 0 dBm

• Programmable output power from -20 dBm to +5 dBm at the MMCX, no harmonic trap

• Typical sensitivity is -102 dBm (@1% PER for 25 °C) at the MMCX (802.15.4)

• Typical sensitivity is -91 dBm (@1% PER for 25 °C) at the MMCX (BLE)

• Frequency range is 2360 to 2480 MHz

• Differential bidirectional RF I/O port with integrated transmit/receive switch

• Meander printed metal antenna for a small footprint, low cost design

• Uses a minimum number of RF marching components and external 50:100 balun

An external 50 (bal): 100 (unbal) balun connects a single-ended 50 ohm port to the differential RF port of the MKW40Z160 SoC’s transceiver. The layout has provision for out-of-band signal suppression (components L3 and C20) if required. Figure 6 shows the typical topology for the RF circuitry. The RF connector J4 has been included in the design for measurement purposes and is used as a DNP.




Figure 6. USB-KW40Z RF circuitry

4.2.2 Clocks

The USB-KW40Z provides two clock sources to the MKW40Z160:

• 32 MHz Reference Oscillator - Figure 7 shows the external 32 MHz external crystal Y1. This mounted crystal must meet the specifications outlined in the AN3251 application note. The IEEE Std. 802.15.4 requires that the frequency be accurate to less than ±40 ppm.

— Capacitors C4 and C5 provide the bulk of the crystal load capacitance. At 25 °C, it is desired to have the frequency accurate to ±10 ppm or less to allow for temperature variation.

• Optional 32.768 kHz Crystal Oscillator: Provision is also made for a secondary 32.768 kHz crystal Y2 (see Figure 8). This oscillator can be used for a low power accurate time base.

— The module comes provided with this Y2 crystal and its load capacitors C6 and C7.

— Load capacitors C6 and C7 provide the entire crystal load capacitance; there is no onboard trim capacitance.

Figure 7. USB-KW40Z board’s 32 MHz reference oscillator circuit




Figure 8. USB-KW40Z board’s optional 32.768 kHz oscillator circuit

4.2.3 Power management

There is one way to power on the USB-KW40Z board, a J5 type-A connector to supply 5 V(V_USB) directly to the secondary MCU, that includes an internal regulator, 3.3 V output to enable theMKW40Z160 device. The USB-KW40Z power management circuit is shown in Figure 9.

Figure 9. USB-KW40Z power management circuit

Additionally, a green LED marked as D1 is available as a power indicator. For current measurements, users can isolate the MKW40Z160 device, through SH13 cut-trace, this will disable the VCC path (including LED).




4.2.4 USB-KW40Z peripheral functions

The board includes two different MCUs, one dedicated to RF (MKW40Z160) acquisition and the second features an OpenSDA debugger and processor for BLE sniffer application (MK22FN512).

4.2.4.1 MKW40Z160 peripheral functions

The USB-KW40Z development board includes two push buttons: one for a general purpose peripheral function to assist in implementing targeted applications and the other dedicated to MKW40Z160 hardware reset.

The board also include three LEDs, two for general purposes and the other as a Power-On indicator. Figure 10 shows the push buttons and LEDs for MKW40Z160.

The application LEDs (D2 and D3) are connected not only with MKW40Z, they also share this connection with the MK22FN512 MCU. You can isolate LEDs to remove or cut the trace over SH5 and SH6.

Figure 10. USB-KW40Z MKW40Z160 push button & LED

4.2.4.2 MK22FN512/Open SDA Interface

• The USB-KW40Z includes an OpenSDA circuitry based on the MK22FN512, that includes all the necessary components to enable communication and debugging, it also provides power output to all MKW40Z160 peripherals. Figure 11 shows the OpenSDA circuitry based on the MK22FN512 MCU, and all the necessary connections to interface with MKW40Z160.




Figure 11. USB-KW40Z OpenSDA circuitry




4.2.4.2.1 OpenSDA interface clock

The USB-KW40Z provides one clock source for the OpenSDA MK22FN512 MCU.

• 8 MHz Reference Oscillator - Figure 12 shows the external 8 MHz external crystal X1. This mounted crystal must meet MK22FN512 specifications. It also provides C44 and C45 to the bulk of the crystal load capacitance.

Figure 12. USB-KW40Z MK22FN512 8 MHz clock source

4.2.4.2.2 MK22FN512 peripheral functions

The USB-KW40Z OpenSDA interface circuit also includes one switch button, to assist in MK22FN512 MCU hardware reset. Figure 13 shows the push button for MK22FN512

Figure 13. USB-KW40Z MK22FN512 push button & LED




4.3 Schematic, board layout, and bill of material

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PTB0

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PTB1

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VDCDC_IN10

DCDC_GND13

VDD_1P814

VDD_1P4515

VDD_020

VSSA26

VREFH27

VDDA28

VDD_XTAL31

VDD_RF232

VDD_RF135

VDD_1/VDD44

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PTA0

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CS1

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PTA1

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9/TP

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12

PTA2

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33

PTA1

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I0_C

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4

PTA1

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I0_C

H11

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PM_C

LKIN

15

PTA1

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I0_C

H12

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K/TP

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06

PTA1

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H13

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17

ADC

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PSW

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CS0

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48

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DC

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RF_

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RF_

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GND1058

GND1159

GND1260

GND1361

GND1462

GND1563

GND1664

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MK2

2FN

512V

MP1

2

PTC

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C0_

SE14

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S4/P

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F_O

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D8

PTC

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PI0_

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1_SD

A/FT

M3_

CH

7/FB

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PTC

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SPI0

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ART1

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FB_A

D12

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PUAR

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TSB7

PTC

3/LL

WU

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CM

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N1/

SPI0

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S1/U

ART1

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FTM

0_C

H2/

CLK

OU

T/I2

S0_T

X_BC

LK/L

PUAR

T0_R

XC

8

PTC

4/LL

WU

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SPI0

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ART1

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FTM

0_C

H3/

FB_A

D11

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P1_O

UT/

LPU

ART0

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B8

PTC

5/LL

WU

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SPI0

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K/LP

TMR

0_AL

T2/I2

S0_R

XD0/

FB_A

D10

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P0_O

UT/

FTM

0_C

H2

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PTC

6/LL

WU

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P0_I

N0/

SPI0

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PDB0

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RG

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BCLK

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AD9/

I2S0

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LKA7

PTC

7/C

MP0

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1/SP

I0_S

IN/U

SB_S

OF_

OU

T/I2

S0_R

X_FS

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B6

PTC

8/AD

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FTM

3_C

H4/

I2S0

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LK/F

B_AD

7A6

PTC

9/AD

C1_

SE5b

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N3/

FTM

3_C

H5/

I2S0

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BCLK

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AD6/

FTM

2_FL

T0B5

PTE0

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OU

T32K

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C1_

SE4a

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1_PC

S1/U

ART1

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I2C

1_SD

A/R

TC_C

LKO

UT

A1

PTE1

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U_P

0/AD

C1_

SE5a

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1_SO

UT/

UAR

T1_R

X/I2

C1_

SCL/

SPI1

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B1

RES

ETF8

VBATH5

VDD1C5

VDD2G7

VDD3E4

VDDAF4

VREFHG4

ADC

1_D

M0/

ADC

0_D

M3

F2AD

C1_

DP0

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C0_

DP3

G2

ADC

0_D

M0/

ADC

1_D

M3

F1AD

C0_

DP0

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C1_

DP3

G1

PTD

0/LL

WU

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0_PC

S0/U

ART2

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3_C

H0/

FB_A

LE/F

B_C

S1/F

B_TS

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ART0

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C3

PTD

1/AD

C0_

SE5b

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0_SC

K/U

ART2

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3_C

H1/

FB_C

S0/L

PUAR

T0_C

TSA4

PTD

2/LL

WU

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0_SO

UT/

UAR

T2_R

X/FT

M3_

CH

2/FB

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4/LP

UAR

T0_R

X/I2

C0_

SCL

C2

PTD

3/SP

I0_S

IN/U

ART2

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FTM

3_C

H3/

FB_A

D3/

LPU

ART0

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I2C

0_SD

AB3

PTD

4/LL

WU

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0_PC

S1/U

ART0

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0_C

H4/

FB_A

D2/

EWM

_IN

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1_PC

S0A3

PTD

5/AD

C0_

SE6b

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0_PC

S2/U

ART0

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0_C

H5/

FB_A

D1/

EWM

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T/SP

I1_S

CK

C1

PTD

6/LL

WU

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C0_

SE7b

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0_PC

S3/U

ART0

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FTM

0_C

H6/

FB_A

D0/

FTM

0_FL

T0/S

PI1_

SOU

TB2

PTD

7/U

ART0

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FTM

0_C

H7/

FTM

0_FL

T1/S

PI1_

SIN

A2

VSSAF3

VREFLG3

PTA0

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G_T

CLK

/SW

D_C

LK/E

ZP_C

LK/U

ART0

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0_C

H5

D3

PTA1

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G_T

DI/E

ZP_D

I/UAR

T0_R

X/FT

M0_

CH

6D

4

PTA2

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G_T

DO

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ACE_

SWO

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T0_T

X/FT

M0_

CH

7E5

PTA3

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G_T

MS/

SWD

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T0_R

TS/F

TM0_

CH

0D

5

PTA4

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U_P

3/N

MI/E

ZP_C

S/FT

M0_

CH

1G

5

PTA5

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IN/F

TM0_

CH

2/I2

S0_T

X_BC

LK/J

TAG

_TR

STF5

PTA1

2/FT

M1_

CH

0/I2

S0_T

XD0/

FTM

1_Q

D_P

HA

H6

PTA1

3/LL

WU

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FTM

1_C

H1/

I2S0

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FS/F

TM1_

QD

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BG

6

PTA1

8/EX

TAL0

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0_FL

T2/F

TM_C

LKIN

0H

8

PTA1

9/XT

AL0/

FTM

1_FL

T0/F

TM_C

LKIN

1/LP

TMR

0_AL

T1G

8

PTB0

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U_P

5/AD

C0_

SE8/

ADC

1_SE

8/I2

C0_

SCL/

FTM

1_C

H0/

FTM

1_Q

D_P

HA

F7

PTB1

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C0_

SE9/

ADC

1_SE

9/I2

C0_

SDA/

FTM

1_C

H1/

FTM

1_Q

D_P

HB

F6

PTB2

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C0_

SE12

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0_SC

L/U

ART0

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0_FL

T3E7

PTB3

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C0_

SE13

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0_SD

A/U

ART0

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/FTM

0_FL

T0E8

PTB1

6/SP

I1_S

OU

T/U

ART0

_RX/

FTM

_CLK

IN0/

FB_A

D17

/EW

M_I

NE6

PTB1

7/SP

I1_S

IN/U

ART0

_TX/

FTM

_CLK

IN1/

FB_A

D16

/EW

M_O

UT

D7

PTB1

8/FT

M2_

CH

0/I2

S0_T

X_BC

LK/F

B_AD

15/F

TM2_

QD

_PH

AD

6

PTB1

9/FT

M2_

CH

1/I2

S0_T

X_FS

/FB_

OE/

FTM

2_Q

D_P

HB

C7

VSS1C4

VSS2H7

VSS3E3

VREG

IND

2

VOU

T33

E2

USB

0_D

PE1

USB

0_D

MD

1

EXTA

L32

H4

XTAL

32H

3

VREF

_OU

T/C

MP1

_IN

5/C

MP0

_IN

5/AD

C1_

SE18

H1

DAC

0_O

UT/

CM

P1_I

N3/

ADC

0_SE

23H

2

C35

1000

pF

SH8

0

TP17

TP6

L5 330

OH

M

12

C31

0.1U

F

L4 330

OH

M

12

TP21

R19 0 DN

P

SH3

0

R7

33

SH13

0

C37

2.2U

F




Figure 15. USB-KW40Z development board component location (top view)

Figure 16. USB-KW40Z development board test points

Figure 17. USB-KW40Z development board layout (top view)




Figure 18. USB-KW40Z development board layout (bottom view)

4.3.1 Bill of materials

Table 2 details the common parts for all frequency bands.

Table 2. Bill of materials (common parts for all frequency bands) (Sheet 1 of 2)

Item Qty Reference Value Description Mfg. Name Mfg. Part Number

1 1 ANT1 MEANDER_ANT_HORZ

PCB MEANDER ANTENNA HORIZONTAL, NO PART TO ORDER

NO PART TO ORDER NO PART TO ORDER

2 1 C17 0.6PF CAP CER 0.6PF 50V +/-0.05PF C0G 0402

MURATA GRM1555C1HR60WA01D

3 1 C20 DNP 1.8PF CAP CER 1.8PF 50V 0.25PF C0G 0402

MURATA GRM1555C1H1R8CA01D

4 1 C19 10PF CAP CER 10PF 50V 5% C0G 0402 AVX 04025A100JAT2A

5 2 C4,C5 11PF CAP CER 11PF 50V 1% C0G 0402 AVX 04025U110FAT2A

6 5 C6,C7,C23,C24,C25 12PF CAP CER 12PF 50V 5% C0G 0402 MURATA GRM1555C1H120JZ01D

7 2 C44,C45 DNP 18PF CAP CER 18PF 50V 5% C0G 0402 KEMET C0402C180J5GAC

8 2 C8,C35 1000PF CAP CER 1000PF 50V 5% C0G 0402 MURATA GRM1555C1H102JA01D

9 1 C34 0.01UF CAP CER 0.01UF 16V 20% X7R 0402 AVX 0402YC103MAT2A

10 11 C16,C21,C26,C27,C28,C29,C30,C31,C32,C33,C36

0.1UF CAP CER 0.1UF 10V 10% X5R 0402 KEMET C0402C104K8PAC

11 1 C37 2.2UF CAP CER 2.2UF 6.3V 20% X5R 0402 KEMET C0402C225M9PACTU

12 1 D1 GREEN LED GRN SGL 30MA SMT 0805 LITE ON LTST-C171KGKT

13 2 D2, D3 RED LED RED CLEAR SGL 30MA SMT 0805

LITE ON LTST-C171KRKT

14 2 J1,J6 HDR 2X5 HDR 2X5 TH 50MIL CTR 254H AU 91L

SAMTEC FTSH-105-04-F-D

15 1 J4 DNP MM8030-2600B CON COAX SMT 1.9MM SP 40H AU MURATA MM8030-2610B

16 1 J5 USB_TYPE_A CON 1X4 USB_TYPE_A_MALE RA SMT -- 178H AU

SAMTEC USB-AM-S-S-B-SM1

17 1 L3 2.2NH IND -- 2.2NH@500MHZ 220MA 4% 0402

MURATA LQP15MN2N2B02

18 2 L4,L5 330 OHM IND FER BEAD 330OHM@100MHZ 2.5A -- SMT

TDK MPZ2012S331A




19 4 MH1,MH2,MH3,MH4 MH_80MIL REWORK HOLE NON-PLATED 50MIL DRILL SIZE 65MIL SOLDERMASK TH, NO PART TO ORDER

NO PART TO ORDER NO PART TO ORDER

20 2 R2,R3 0 RES MF ZERO OHM 1/16W 5% 0402 ROHM MCR01MZPJ000

21 1 R12 DNP 0 RES MF ZERO OHM 1/16W 5% 0402 ROHM MCR01MZPJ000

22 1 R19 0 RES TF ZERO OHM 1/16W AEC-Q200 RC0402

VISHAY INTERTECHNOLOGY

CRCW04020000ZS

23 2 R7,R8 33 RES MF 33 OHM 1/16W 5% 0402 SMEC RC73L2Z330JTF

24 3 R9,R10,R14 330 RES MF 330 OHM 1/16W 5% 0402 VISHAY INTERTECHNOLOGY

CRCW0402330RJNED

25 6 R15,R16,R17,R18,R23,R25

1.0K RES MF 1.0K 1/16W 1% 0402 YAGEO AMERICA RC0402FR-071KL

26 5 R4,R5,R6,R20,R21 10.0K RES MF 10.0K 1/16W 1% AEC-Q200 0402


CRCW040210K0FKED

27 2 R11,R13 DNP 10.0K RES MF 10.0K 1/16W 1% AEC-Q200 0402


CRCW040210K0FKED

28 1 R22 27K RES MF 27K 1/16W 5% 0402 VISHAY INTERTECHNOLOGY

CRCW040227K0JNED

29 1 R24 DNP 27K RES MF 27K 1/16W 5% 0402 VISHAY INTERTECHNOLOGY

CRCW040227K0JNED

30 1 RT1 MINISMDC050F-2 FUSE PLYSW 0.5A 24V SMT TYCO ELECTRONICS MINISMDC050F-2

31 14 SH1,SH2,SH3,SH4,SH5,SH6,SH7,SH8,SH9,SH10,SH11,SH12,SH13,SH14

0 ZERO OHM CUT TRACE 0402 PADS; NO PART TO ORDER

LAYOUT ELEMENT ONLY

LAYOUT ELEMENT ONLY

32 3 SW1,SW2,SW3 TL1015AF160QG SW SPST PB 50MA 12V SMT E SWITCH TL1015AF160QG

33 14 TP1,TP2,TP3,TP6,TP7,TP8,TP9,TP10,TP15,TP17,TP18,TP19,TP20,TP21

TPAD_040 TEST POINT PAD 40MIL DIA SMT, NO PART TO ORDER

NOTACOMPONENT NOTACOMPONENT

34 2 TP4,TP14 TPAD_030 TEST POINT PAD 30MIL DIA SMT, NO PART TO ORDER

NOTACOMPONENT NOTACOMPONENT

35 1 TP16 DNP TEST POINT WHITE

TEST POINT WHITE 40 MIL DRILL 180 MIL TH 109L

COMPONENTS CORPORATION

TP-105-01-09

36 1 U1 MKW40Z160VHT4 IC MCU XCVR 2.4GHZ BLUETOOTH LOW ENERGY MAPLGA64

FREESCALE SEMICONDUCTOR

MKW40Z160VHT4

37 1 U5 MK22FN512VMP12

IC MCU 32BIT 512KB FLASH 128KB RAM 1.71-3.6V 120MHZ MAPBGA 64

FREESCALE SEMICONDUCTOR

MK22FN512VMP12

38 1 U6 NC7SZ14M5X IC INV SGL 1.65-5.5V SOT23-5 FAIRCHILD NC7SZ14M5X

39 1 U8 74LVC125 IC QUAD BUF LINE DRV TS 1.2-3.6V DHVQFN14

NXP SEMICONDUCTORS

74LVC125ABQ,115

40 1 X1 8.00MHZ XTAL 8.00MHZ RSN CERAMIC -- SMT

MURATA CSTCE8M00G55-R0

41 1 Y1 32MHZ XTAL 32MHZ 9PF -- SMT 3.2X2.5MM NDK EXS00A-CS02368

42 1 Y2 32.768KHZ XTAL 32.768KHZ SMT ROHS COMPLIANT

EPSON ELECTRONICS

FC-135 32.7680KA-A3

43 1 Z1 2400MHZ 50OHM XFMR BALUN 2400 +/-100MHZ SMT MURATA LDB212G4005C-001

Table 2. Bill of materials (common parts for all frequency bands) (Sheet 2 of 2)

Item Qty Reference Value Description Mfg. Name Mfg. Part Number



PCB manufacturing specifications

NOTES

• USB-KW40Z includes neither J4 (the MMCX connector) nor the external antenna.

• For external measurements and/or external antenna usage, J4 should be installed and soldered in place.

• A 50 ohm MMCX connector is required; recommended part number MM8030-2600B from Murata.

• When selecting an external antenna to connect to the MMCX connector, choose an antenna designed for the desired frequency band. Operation with an external antenna may require a separate certification of your product.

5 PCB manufacturing specificationsThis section provides the specifications used to manufacture the USB-KW40Z development printed circuit board (PCB) described in this guide.

The USB-KW40Z development platform PCBs must comply with the following:

• The PCB must comply with Perfag1D/3C (www.perfag.dk/en/)

• The PCB manufacturer’s logo is required

• The PCB production week and year code is required

— The manufacturer’s logo and week/year code must be stamped on the back of the PCB solder mask

— The PCB manufacturer cannot insert text on the PCB either in copper or in silkscreen without written permission from Freescale Semiconductor, Inc.

• The required Underwriter’s Laboratory (UL) Flammability Rating

— The level is 94V-0 ((http://ulstandards.ul.com/standard/?id=94)

— The UL information must be stamped on the back of the PCB solder mask

NOTE

• A complete set of design files for the MKW40Z160 development boards is available at the Freescale website (www.freescale.com/KW40Z) under “Software and Tools.” These reference designs should be used as a starting point for a custom application.

• The Freescale IEEE 802.15.4 / ZigBee Package and Hardware Layout Considerations Reference Manual, (ZHDCRM) is also available at the same web site to provide additional design guidance.

5.1 Single PCB construction

This section describes individual PCB construction details.

• The USB-KW40Z PCBs are four-layer, multi-layer designs

• The PCBs contain no blind, buried, or micro vias

http://www.perfag.dk/en/

http://www.freescale.com/KW40Z

http://ulstandards.ul.com/standard/?id=94

http://fsls.co/doc/ZHDCRM




• PCB data:

— USB-KW40Z size: Approximately 18.5x 61.4 mm (0.73 x 2.42 inches)

— USB-KW40Z final thickness (Cu/Cu): 1.57 mm (0.62 inches) +/- 10% (excluding solder mask)

Table 3 defines some of the layers of the completed PCB. The artwork identification refers to the name of the layer in commonly used terms.

IMPORTANT: The USB-KW40Z development board contains high frequency 2.4 GHz RF circuitry. As a result, RF component placement, line geometries and layout, and spacing to the ground plane are critical parameters. Therefore, BOARD STACKUP GEOMETRY IS CRITICAL. Dielectric and copper thicknesses and spacing must not be changed; follow the stackup information provided with the reference design (see Figure 19) information provided with the reference design.

Figure 19. USB-KW40Z PCB stackup cross-section (four layer)

• Solder mask is required

• Silk screen is required

5.2 Panelization

The panel size can be negotiated depending on production volume.

5.3 Materials

The PCB composite materials must meet the following requirements:

• Laminate—the base material (laminate) must be FR4. If the laminate material is changed, the RF electrical characteristics may change and degrade RF performance.

Table 3. USB-KW40Z layer by layer overview

Layer Artwork Identification File Name

1 Silkscreen Top PSS.art

2 Top Layer Metal L1_PS.art

3 Ground Layer L2_GND.art

4 Signal Layer L3_INT_1.art

5 Bottom Layer Metal L4_SS.art

6 Silkscreen Bottom SSS.art




• Copper foil

— Top and bottom copper layers must be 1 oz. copper

— Interior layers must be 1 oz. copper

• Plating—All pad plating must be Hot Air Levelling (HAL)

5.4 Solder mask

The solder mask must meet the following requirements:

• Solder mask type: Liquid Film Electra EMP110 or equivalent

• Solder mask thickness: 10–30 µm

5.5 Silk screen

The silk screen must meet the following requirements:

• Silk screen color: White

• Silk screen must be applied after application of solder mask if solder mask is required

• The silk screen ink must not extend into any plated-thru-holes

• The silk screen must be clipped back to the line of resistance

5.6 Electrical PCB testing• All PCBs must be 100 percent tested for opens and shorts

• Impedance measurement - An impedance measurement report is not mandatory

5.7 Packaging

Packaging for the PCBs must meet the following requirements:

• Finished PCBs must remain in panel

• Finished PCBs must be packed in plastic bags that do not contain silicones or sulphur materials. These materials can degrade solderability

5.8 Hole specification/tool table

See the ncdrill-1-4.tap file included with the Gerber files and the FAB-28441.pdf file.

5.9 File description

Files included with the download include Design, Gerber, and PDF files. Gerber files are RS-274x format. Not all files included with the Gerber files are for PCB manufacturing.

PDF files included are:

• FAB-28441.pdf—USB- Board fabrication drawing

• GRB-28441.zip—USB- Metal layers, solder mask, solder paste and silk screen



Revision history

• SPF-28441.pdf—USB- Schematic

Design files are in Allegro format with OrCAD schematic capture.

6 Revision history

Rev.number

Date Substantive change(s)

0 10/2015 Initial release

Document Number: USBKW40ZUG Rev. 010/2015

Information in this document is provided solely to enable system and software implementers

to use Freescale products. There are no express or implied copyright licenses granted

hereunder to design or fabricate any integrated circuits based on the information in this

document.

Freescale reserves the right to make changes without further notice to any products herein.

Freescale makes no warranty, representation, or guarantee regarding the suitability of its

products for any particular purpose, nor does Freescale assume any liability arising out of

the application or use of any product or circuit, and specifically disclaims any and all

liability, including without limitation consequential or incidental damages.

“Typical” parameters that may be provided in Freescale data sheets and/or specifications can

and do vary in different applications, and actual performance may vary over time. All

operating parameters, including “typicals,” must be validated for each customer application

by customer’s technical experts. Freescale does not convey any license under its patent rights

nor the rights of others. Freescale sells products pursuant to standard terms and conditions of

sale, which can be found at the following address: freescale.com/SalesTermsandConditions.

How to Reach Us:Home Page: freescale.com

Web Support: freescale.com/support

Freescale, the Freescale logo and Kinetis are trademarks of Freescale Seminconductor, Inc. Reg. U.S. Pat. & Tm. Off All other products or service names are the property of their respective owners. ARM, the ARM Powered logo, and Cortex are registered trademarks of ARM Limited (or its subsidiaries) in the EU and/or elsewhere.

IEEE 802.15.4 is the registered trademark of the Institute of Electrical and Electronic Engineers. This product is not endorsed or approved by the IEEE.

© 2015 Freescale Semiconductor, Inc. All rights reserved.

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