advanced multiphysics simulation for high performance power … · 2016. 7. 1. · advanced...

• Comparison between 10mil AlN, 10mil Al 2 O 3 and ZBC • 2kV ~ 3kV application • Anand Consititutive Model for Sn63Pb37 • Center point at bottom face was fixed • From 180 o C to 25 o C in 160s Advanced Multiphysics Simulation for High Performance Power Electronic Packaging Design Xin Zhao, Yang Xu, Douglas C. Hopkins Multi-physics Simulation • Finite Element Method based analysis approach • Investigate interactions between thermal, electrical and mechanical aspects within Power Electronics Packaging • Applications • Power Electronic Packaging Design • Manufacturing Processes Optimization • Reliability Assessment Points of Contact: Xin Zhao, (919)908-3977, [email protected] and Dr. Hopkins, [email protected] High Voltage High Temperature Power Module Development • Multiphysics simulations to verify SiC power module layout design and components selection for >10kV and >200 o C ambient applications • 10kV applied to the power module • Electric field distribution verified 10kV capability of designed power module • Power Module Thermal Impedance was 0.4398 o C/W obtained by simulation results • Temperature distribution verified highest operation temperature was 214 o C 20µm / 40μm ZrO 2 based ceramic as Power Module Substrate • Fringing Effect • Estimate error induced by fringing effect for relative permittivity measurement of ultra-thin ZBC substrate • Ceramic model placed at the center of air sphere (r=40mm) 40µm ZBC with 40µm electrodes 4mm ZBC with 40µm electrodes 40µm ZBC with 20µm electrodes 2% Error 43.88% Error 1.8% Error • Pre-stress Analysis • Stress Distribution in Models (AlN, Al 2 O 3 , 20µm ZBC, 40µm ZBC) • Von Mises Stress Distribution • Shear Stress Distribution in Solder layers • Shear Stress Distribution in Ceramic layers • Maximum Von Mises Stresses were located at far end corner of the interface between ceramic layers and Cu layers 141 MPa 261 MPa 292 MPa 248 MPa 0.3586 MPa 0.7612 MPa 0.772 MPa 0.2904 MPa 33.8 MPa 194 MPa 118 MPa 60.9 MPa Parasitics Extraction of 50kW EV Motor Drive Busbar • 4-layer PCB board busbar with 4 oz copper on each layer, FR4 dielectric thickness was 0.2mm • Schematic of three phase inverter with DC link capacitors and busbar model • Current distribution on the busbar and parasitics distribution on the busbar L= L 1 + L 2 – 2M • Parasitics on the ceramic capacitor loop was 4 nH • Parasitics on the film capacitor loop was 9 nH Conclusions • Multiphysics simulation is a powerful tool to investigate interactions between thermal, electrical, mechanical aspects in power electronics packaging • Layout design and components selections were verified for 10 kV power module applications • Parasitics on 50kW EV motor drive busbar was extracted • Fringing effects and pre-stress of ZBC substrate were investigated

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• Comparison between 10mil AlN, 10mil Al2O3 and ZBC• 2kV ~ 3kV application• Anand Consititutive Model for Sn63Pb37• Center point at bottom face was fixed• From 180oC to 25oC in 160s

Advanced Multiphysics Simulation for High Performance Power Electronic Packaging Design

Xin Zhao, Yang Xu, Douglas C. HopkinsMulti-physics Simulation

• Finite Element Method based analysis approach• Investigate interactions between thermal, electrical and

mechanical aspects within Power Electronics Packaging

• Applications• Power Electronic Packaging Design• Manufacturing Processes Optimization• Reliability Assessment

Points of Contact: Xin Zhao, (919)908-3977, [email protected] and Dr. Hopkins, [email protected]

High Voltage High Temperature Power Module Development

• Multiphysics simulations to verify SiC power module layout design and components selection for >10kV and >200oC ambient applications

• 10kV applied to the power module• Electric field distribution verified 10kV capability of

designed power module

• Power Module Thermal Impedance was 0.4398oC/W obtained by simulation results

• Temperature distribution verified highest operation temperature was 214oC

20µm / 40μm ZrO2 based ceramic asPower Module Substrate

• Fringing Effect• Estimate error induced by fringing effect for relative

permittivity measurement of ultra-thin ZBC substrate• Ceramic model placed at the center of air sphere

(r=40mm)40µm ZBC with 40µm electrodes

4mm ZBC with 40µm electrodes

40µm ZBC with 20µm electrodes

2% Error

43.88% Error

1.8% Error

• Pre-stress Analysis

• Stress Distribution in Models (AlN, Al2O3, 20µm ZBC, 40µm ZBC)• Von Mises Stress Distribution

• Shear Stress Distribution in Solder layers

• Shear Stress Distribution in Ceramic layers

• Maximum Von Mises Stresses were located at far end corner of the interface between ceramic layers and Cu layers

141 MPa 261 MPa292 MPa248 MPa

0.3586 MPa 0.7612 MPa0.772 MPa0.2904 MPa

33.8 MPa 194 MPa118 MPa60.9 MPa

Parasitics Extraction of 50kW EV Motor Drive Busbar

• 4-layer PCB board busbar with 4 oz copper on each layer, FR4 dielectric thickness was 0.2mm

• Schematic of three phase inverter with DC link capacitors and busbar model

• Current distribution on the busbar and parasitics distribution on the busbar

L= L1 + L2 – 2M • Parasitics on the ceramic capacitor loop was 4 nH• Parasitics on the film capacitor loop was 9 nH

Conclusions• Multiphysics simulation is a powerful tool to investigate

interactions between thermal, electrical, mechanical aspects in power electronics packaging

• Layout design and components selections were verified for 10 kV power module applications

• Parasitics on 50kW EV motor drive busbar was extracted• Fringing effects and pre-stress of ZBC substrate were investigated