ansys multiphysics for electronic and electrical simulation · pdf fileansys multiphysics for...

© 2011 ANSYS, Inc. June 26, 2014 1

ANSYS Multiphysics For Electronic and Electrical Simulation

Ankit Adhiya Lead Engineer

([email protected])

© 2011 ANSYS, Inc. June 26, 2014 2

Content

• Multiscale Single Physics Simulation

• Why Industry needs Multiphysics Solutions

• ANSYS Multiphysics Solutions

• Summary

© 2011 ANSYS, Inc. June 26, 2014 3

Content




• Summary

© 2011 ANSYS, Inc. June 26, 2014 4

Thermal

Multiscale Single Physics Simulations

Chip Level Analysis

nm μm mm cm m

Nu

mb

er

of

sub

co

mp

on

ents

Solder Reliability

Structural Mechanics

IGBT Reliability

Electromagnetics

Fluid Flow + Thermal

PCB Reliability

Electromagnetics

System Reliability

© 2011 ANSYS, Inc. June 26, 2014 5

Agenda


• Why Industry needs Multi-physics Solutions


• Summary

© 2011 ANSYS, Inc. June 26, 2014 6

Product Development Trends: Driving The Need For Multiphysics

Advanced Materials Increasing Power Density

Environmental Sustainability Miniaturization

Need an image

© 2011 ANSYS, Inc. June 26, 2014 7

• Real-world multiphysics environments impact

– Proper operation of components

– Integrity and life of components

– Overall product reliability

• Product reliability of high performance electronic devices requires

– Multiphysics approach incorporating electromagnetic, thermal and mechanical simulation to simulate real world environments

Multiphysics for Electronic Design

Fusing of an electronic trace on a printed circuit board from a current overload

© 2011 ANSYS, Inc. June 26, 2014 8

• Multiphysics simulation delivers a deeper understanding of product performance by considering the interaction of multiple engineering disciplines.

Multiphysics Simulation

Structural- Mechanics

Fluid Dynamics

Electromagnetics Systems and

Embedded Software

© 2011 ANSYS, Inc. June 26, 2014 9

Agenda

• Multi-scale Simulation



• Summary

© 2011 ANSYS, Inc. June 26, 2014 10

Multiscale Multiphysics Simulations

Chip Level Analysis

Solder Reliability

nm μm mm cm m

Nu

mb

er

of

sub

co

mp

on

ents


Electromagnetics

Fluid + Thermal


Electromagnetics

Fluid + Thermal


Electromagnetics

Fluid + Thermal


Fluid + Thermal

Fluid + Thermal

Electromagnetics IGBT Reliability

PCB Reliability

System Reliability

© 2011 ANSYS, Inc. June 26, 2014 11

Chip Package System Analysis

© 2011 ANSYS, Inc. June 26, 2014 12

3D IC Industry Trends and Challenges

3D IC stacked dies

Flipchip dies on single Interposer die with TSVs

Trends

• Accommodates dies with mixed process technologies/ gate sizes

• Various formats of multiple semiconductor dies and 3D-ICs

• Gate sizes keep decreasing

Challenges

• Increases interdependence between heat dissipation and temperature fields

– Actual operating environment should be taken into account

– The system temperature can affect die power due to change in leakage power

• Thermal run-away problems

© 2011 ANSYS, Inc. June 26, 2014 13

ANSYS Multiphysics Solution for 3D IC Industry

Power

Library

Temperature

CTM

Converged

Power Map

System

thermal

BC

IC DESIGN

CTM Generation

RedHawk, Totem

Package Design

IC Thermal Analysis

Sentinel-TI

System

Thermal

Tools

Icepak

System Design

PCB/Pkg Temperature

Electromagnetics Fluid Dynamics

3D IC Power Budgeting

3D IC Thermal Management

System level Thermal Management

© 2011 ANSYS, Inc. June 26, 2014 14

Case Study : 3D IC Simulation

Scenario Heat Sink

Blower Logic Die Max Temperature in Sentinel TI

1 Yes Yes 99.3⁰ C

2 Yes No 112.3⁰ C

3 No Yes 101.8⁰ C

4 No No 124.3⁰ C

MCM Flipchip : Full Package

Mem Logic

PLL SiI

Dies assembly

Sentinel-TI Icepak

Compact power Map

System Thermal BC

Sentinel TI Results: Scenario1

© 2011 ANSYS, Inc. June 26, 2014 15

• Countermeasures for possible failure modes

• Improve Battery Life

• Reduced product development cycle significantly by optimizing IC, Package, and System performance,

Multiphysics Benefits for 3D IC Design

© 2011 ANSYS, Inc. June 26, 2014 16

Solder Reliability in Reflow Process

© 2011 ANSYS, Inc. June 26, 2014 17

Solder Joint Reliability in Reflow Process

• Joint made of components having different material properties

• In Reflow Process the electronic assembly is subjected to controlled heat

• Solder joint reliability issues in Reflow process

– Thermal stress developed due to abrupt temperature change

© 2011 ANSYS, Inc. June 26, 2014 18

ANSYS Solution for Reflow Analysis

Temperature

Package and System Design

Thermal Analysis

Icepak/Fluent

Stress and Deformations

Mechanical

Solder Reliability Design

Fluid Dynamics Structural Mechanics

© 2011 ANSYS, Inc. June 26, 2014 19

Case Study : Reflow Analysis Radiant Heat

Source

Air

Inlet

package

Outlet

Temperature

Controlled Temperature Profile

Convection and Radiative Heat transfer inside oven

Equivalent Plastic Strain on Solder Ball

© 2011 ANSYS, Inc. June 26, 2014 20

• Get and better insight of Reflow process

• Optimizing reflow oven settings to enhanced performance, yield and reliability

• Reduce test matrix, cost and time

Multiphysics Benefit for Solder Reliability in Reflow

© 2011 ANSYS, Inc. June 26, 2014 21

IGBT Reliability

© 2011 ANSYS, Inc. June 26, 2014 22

IGBT Reliability

Trends

• Higher Switching Frequency

• Higher Current withstand Capability

• Higher power density

Challenges

• Reduce Switching Losses

• Increase system reliability

– Increased thermal stresses

– Higher Lorentz forces

• Better Performance at elevated temperature

© 2011 ANSYS, Inc. June 26, 2014 23

ANSYS Solution for Multiphysics IGBT Reliability Simulation

Current

Ohmic Loss

Solve IGBT Circuit

Terminal Current

Simplorer

Magnetostatics

Electromagnetic Simulation

Maxwell

Temperature

Calculation

Thermal

Stress

and

Deformation

Mechanical

Structural

Lorrentz Forces

Switching Loss Loss

Switching Loss

Temperature

Electromagnetics Fluid Dynamics Structural Mechanics

© 2011 ANSYS, Inc. June 26, 2014 24

Case Study : IGBT Reliability Simulation

Current Density in Maxwell

Temperature Distribution inside IGBT

Stress Distribution with enlarged deformation scale

© 2011 ANSYS, Inc. June 26, 2014 25

• Predict the reliability of bond wires

• Robust design of the electric drive

• Optimize the performance of the system, reducing maintenance costs and increasing the life cycle of the inverter

Multiphysics Benefit for IGBT Reliability

© 2011 ANSYS, Inc. June 26, 2014 26

PCB Reliability

© 2011 ANSYS, Inc. June 26, 2014 27

PCB Reliability

Trends

• Electronic components with smaller footprint and higher power requirement

Challenges

• Increase in current density leads to Trace/Joule heating

• Joule heating further affects the electric performance of PCB

Fusing of an electronic trace on a printed circuit board from a current overload

© 2011 ANSYS, Inc. June 26, 2014 28

ANSYS Solution

Temperature

Board Level Analysis

Thermal Analysis

Icepak

Stress and Deformations

Mechanical


Fluid Dynamics Structural Mechanics


DC-IR Drop

SIwave

Temperature

Power Loss

Thermal Convergence

Electromagnetics

© 2011 ANSYS, Inc. June 26, 2014 29

Case Study : Power Supply Board

• Objective: Use Multi-physics to model realistic conditions that improve PCB reliability

1. SIwave was used to obtain DC solution and resistive losses (Joule heating).

2. Icepak was used to compute full CFD solution.

3. Mechanical was used for thermal-stress analysis.

Courtesy: Toshiba Corporation, ANSYS Advantage

© 2011 ANSYS, Inc. June 26, 2014 30

Case Study : Power Supply Board

• Difference between Icepak / SIwave + Icepak coupling

• Difference between Icepak + Mechanical / SIwave + Icepak + Mechanical coupling

Icepak SIwave + Icepak

Icepak + Mechanical

Shift of max stress

quantity and location

Hotspot off by

10.3 C vs

experiments

Hotspot off by

2.3 C vs

experiments

Siwave + Icepak + Mechanical Courtesy: Toshiba Corporation, ANSYS Advantage

© 2011 ANSYS, Inc. June 26, 2014 31

• Deeper insight into the effect Joule heating on PCB and package design.

• Predict accurate temperature and electrical performance

• Improve reliability and reduce warranty period

Multiphysics Benefit for PCB Reliability

© 2011 ANSYS, Inc. June 26, 2014 33

Electric Drive Reliability

Trends

• Reduce machine size and weight

• Increase machine efficiency

Challenges

• Maintain efficiency and durability over a wide range of operating conditions

• Reduce machine noise

• Increase PM Reliability

© 2011 ANSYS, Inc. June 26, 2014 34

Case Study

Electromagnetics Fluid Dynamics Structural Mechanics

2.00 3.00 4.00 5.00 6.00 7.00 8.00 9.00 10.00Time [ms]

123.75

140.00

160.00

180.00

200.00

213.75

Y1 [N

ew

tonM

ete

r]

2D_cooling_insideTorqueCurve Info avg

Moving1.TorqueSetup1 : Transient

156.4067

Moving1.Torque_22_degImported

181.9289

Moving1.Torque_2eme_it_52degImported

157.3518

Moving1.Torque_3eme_it_53degImported

156.4067

Time (ms)

Torq

ue

(N)

Single physics simulation, assuming a magnet temperature of 22C

3-way Multiphysics simulation shows that the actual magnet temperature: 53C

16% drop in

predicted

performance

Maxwell Fluent Mechanical

© 2011 ANSYS, Inc. June 26, 2014 35

Multiphysics Benefit: Provide Accurate Performance Predictions

When predicting the performance (torque) of an electric motor, multiphysics simulation captures the strongly coupled interactions between the hot electromagnetic material and surrounding cooling fluid.

Assumption

Metal Temperature Motor Performance

Single Physics Simulation

Heat Generation

Metal Temperature Motor Performance

Multiphysics Simulation

Performance

Torque: 186 N

Performance

Torque: 158 N

ANSYS Fluent ANSYS Maxwell

Single-physics simulation over-predicts system performance by 18%

Coolant Temperature

© 2011 ANSYS, Inc. June 26, 2014 37

Summary

• Multiphysics Simulation helps to

– Optimize performance considering all physical phenomena

– Ensure product performance across and beyond performance envelope

– Early insight to failure mode due to different physics interaction

– Accelerate the design process and increase design accuracy

© 2011 ANSYS, Inc. June 26, 2014 39

Multiphysics Setup In Workbench

Now, let’s add a Structural

simulation with loads transferred

from CFD.

Select Static Structural

Drag it into your project

There are multiple “drop targets”

with a preview of the result.

© 2011 ANSYS, Inc. June 26, 2014 40

SYSTEMS & MULTIPHYSICS

ELECTRO- MAGNETICS

STRUCTURAL MECHANICS

FLUID DYNAMICS

• Multiphysics Made Easy – Automated setup and workflows

• Flexible & Open Solutions – 1-way coupling

– 2-way coupling

– Single solve solutions

– Combine ANSYS with 3rd party tools

• Performance & Advanced Modeling – Best-in-class physics modeling

– Highly scalable parallel processing

ANSYS Advantage

ansys multiphysics for electronic and electrical simulation · pdf fileansys multiphysics for...

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