trends in automotive packaging 2018 - yole …...market with a breakdown by packaging platform and...
TRANSCRIPT
Trends in Automotive
Packaging 2018
From Technologies to Market
©2018
SAMPLE
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TABLE OF CONTENTS AUTOMOTIVE REPORT
• Report scope & definitions
o Scope of the report
o Companies cited in this report
o Glossary
• Executive summary
• Introduction of the automotive market
o Why packaging is so important in automotive ?
o 4 Megatrends : Electrification, autonomy, connectivity &
confort
o Worldwide automotive industry, plus focus on China
o Role of advanced packaging in automotive
• Automotive regulations & specific grades
• Applications
o Different applications in automotive
• Main axis: Power, Safety, Infotainment, Connectivity,
Lighting
o Different electronics devices in automotive (LED, MEMS and
sensors, ADAS sensors, power conversion, connectivity,
processing and storage)
• Cost analysis of electronic devices
• Automotive packaging focus by platform and
application
o Type of packaging platform in automotive
o Packages description (FO, WLCSP, QFN, FC…)
o Packaging trends per applications
o Focus on innovative packages and evolving apps
o Packages / Applications Matrix
• Players of the automotive packaging industry
o Supply chain of each application (camera, lighting,
radars…)
o Company profiles (ASE, Bosch, NXP…)
• Market forecastso Revenues per packages (breakdown per applications)
o Volumes (by packages, breakdown per applications)
• Conclusions
• About the author / Related Reports / Company
presentation
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Biographies & contacts
Jérôme Azémar
©2018 | www.yole.fr | Trends in Automotive Packaging - Sample
Lauranne Chemisky
Emilie Jolivet
As Technical Project Development Director at Yole Développement (Yole), Jérôme Azémar is supporting the development of strategic projects, following leading customers
of the company within the semiconductor industry, from manufacturing to packaging. His mission is to develop business and knowledge of the company, maintain long term
relationship with its Yole’s accounts and meet their expectations. Jérôme is a member of Yole since 2013 and worked as a senior analyst, managing the day to day production
of technology & market reports as well as custom consulting projects. He also deeply contributed to the business development of the Advanced Packaging & Semiconductor
Manufacturing activities. Jérôme is the author of numerous analysis and international publications covering advanced packaging, power electronics and semiconductor
manufacturing. Prior to this and upon graduating from INSA Toulouse (France) with a Master’s in Microelectronics and Applied Physics, Jérôme joined ASML and worked in
Veldhoven (The Netherlands) for three years as an Application Support Engineer specializing in immersion scanners. During this time, he acquired Photolithography skills
which he then honed over a two-year stint as a Process Engineer at STMicroelectronics (France).
Emilie Jolivet is Director of the Semiconductor & Software Division at Yole Développement, part of Yole Group of Companies, where her specific interests cover package &
assembly, semiconductor manufacturing, memory and software & computing fields. Based on her valuable experience in the semiconductor industry, Emilie manages the
expansion of the technical and market expertise of the Semiconductor and Software Team. The team interacts daily with leading companies allowing semiconductor &
software analysts to collect a large amount of data and integrate their understanding of the evolution of the market with technology breakthroughs. In addition, Emilie’s
mission focusses on the management of business relationships with semiconductor leaders and the development of market research and strategy consulting activities inside
the Yole group. Emilie Jolivet holds a Master’s degree in Applied Physics specializing in Microelectronics from INSA (Toulouse, France). After an internship in failure analysis
at Freescale (France), she was an R&D engineer for seven years in the photovoltaic business where she co-authored several scientific articles. Enriched by this experience,
she graduated with an MBA from IAE Lyon and then joined EV Group (Austria) as a business development manager in 3D & Advanced Packaging before joining Yole
Développement in 2016.
Lauranne Chemisky is a technology and market analyst in the Semiconductor & Software Team at Yole Développement (Yole). Lauranne is currently engaged in the
development of market research reports as well as customized services for clients. She is able to leverage her technology training and experience in the fields of materials
and semiconductor manufacturing processes for advanced packaging applications. Previously, Lauranne worked at Apple in the Softgoods Product Design Team as a material
development engineer (CA, USA). Lauranne holds a master’s degree in Materials Science & Polymers from ITECH (Lyon, FR) and an M.Sc. in Technology and Innovation
Management from EMLyon Business School (Lyon, FR).
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100 companies are cited in this report
ASE, Amkor, ams, Analog Devices, Apple, AT&S, Audi, Autoliv, BAIC, Baidu, Benewake, Build Your Dreams, BMW, Bosch, Brightek, Brillance Auto Group, Broad-Ocean, CammSys, Cepton, Cheng-Tech, Chery Automotive, CHJ Automotive, Citroën, Continental, Daihatsu, Daimler, Dajun Technologies, Delphi, DeNA, Denso, DEPO, Didi Chuxing, Discovery Semiconductor, Dongfeng Motor
Corporation, Dynex Semiconductors, Edison Automotive, EM Microelectronics, Everlight Electronics, Excelitas Technologies, Finisar, FAW Group, Ford, Fuji Electric, Galaxycore, Geely, General Motors, Genesis Photonics, Gentex, Google, Hamamatsu,
Heller Automotive, Hesai, Himax, Hitachi, Honda, Hongli Zhihui, Honeywell, Huayu Automotive System, Hynix, Hyundai, Ichikoh Industries, II-VI Incorporated, IMI, Insemi Technology Services, Infineon, Innoviz, Inovance, INVT, Jabil Circuit, Jaguar, JCET, JEE Automation Equipment, JJE Automotive, Kingpak Technology, Koito Manufacturing, KOSTAL, LeddarTech, LeiShen Intelligent
System, LG Innotek, Lumentum, Lingsen, Lumileds, Lyft, Magna International, Mando, Mazda, Mercedes-Benz, Mitsubishi Electric, nepes, Nichia, Nidec, NIO, Nissan, NXP, OLSA, OmniVision Technologies, On Semiconductor, Optotech, Orsam, Ouster,
Panasonic, Philips, Pixelplus, Powertech Technology, Renault, Robosense, Samsung Electro-Mechanics, Samsung, Semikron, SensL, Seoul Semiconductor, SAIC Motor, Sony, Spectrolab, SPIL, Stanley, STATS ChipPAC, STMicroelectronics, Sure Start, Taxas
Instruments, Tesla, Thorlabs, Tong Hsing Electronics, Toshiba, TowerJazz, Toyota, Transdev, TriLumina, TRW Automotive, United Automotive Electronic Systems, Uber, Ushio, Valeo, Velodyne LiDAR, Volkswagen, Waymo, Wuhu sensorthch Intelligent Technology,
xFab and more…
COMPANIES CITED IN THE REPORT
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OBJECTIVES OF THE REPORT
• Identify and analyze the major advanced packaging platforms used in the automotive industry
• Point out advanced packaging technical trends related to LiDAR, CIS, radar, power and lightingdevices, MEMS and sensors…
• Understand the impact of automotive regulations and specifications on packaging development
• Present a detailed technology roadmap for advanced packaging platforms for automotive applications
• Identify the market drivers, disruptions and business opportunities for the supply chain players
• Analyze key benefits and added value of emerging advanced packaging platforms
• Detail the automotive industry supply chain, with a focus on IDMs and OSATs and the competitivelandscape
• Give an overview of the players involved in the supply chain and specificities of each market segment
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SCOPE OF THE REPORT
This report only cover packaging technologies for innovative devices in the automotive industry
• Introduction about the differences between automotive and consumer markets, based on ouradvanced packaging industry analysis
• Analysis of packaging technologies that are implemented or will be developed for the automotiveindustry
• Packaging trends in the automotive devices
• Adoption of new technologies takes time due to qualification process based on norms andspecifications
• Advanced packaging market forecast with breakdown by platform and application
• Players of the advanced packaging supply chain involved in the automotive industry
• Market forcast in units and revenue split by application and platform
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INTRODUCTION OF THE AUTOMOTIVE INDUSTRY
• Automotive is the new El Dorado for microelectronics with several drivers for growth – 4 main trends :
• Electrification, autonomy, connectivity and comfort
• Electronics used for automotive stands 9% of the total IC market
• It’s a growing market :
• 7% growth for automotive sales
• 15% growth of electronics in automotive
• 20% growth for semiconductors in automotive
• About 30% growth for OSATs in automotive packaging
• the automotive market differs from the consumer market by higher requirements and a better reliability for the electronics
• A electronic failure in a car can cause serious accident
• With more than hundreds of electronics parts in a car, the price pressure is higher than in the consumer industry also because the margins in the automotive industry are smaller
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HOW SIGNIFICANT IS THE AUTOMOTIVE PACKAGING MARKET ?
Two industries, both controlled by giant companies with ~$250B in revenue
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MICROELECTRONICS IN AUTOMOTIVE
Non exhaustive listWhat are the different electronic devices ?
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4 MEGA TRENDS DRIVE INNOVATION IN INNOVATION
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AUTOMOTIVE PACKAGING RELIABILITY
Requirements
Infotainment / Comfort Powertrain Safety Connectivity
Grade 3 & 2
-40°C to +105°C
Grade 1 & 0
-40°C to +150°C
Grade 1
-40°C to +125°CGrade 3 & 2
-40°C to +105°C
Lighting
Grade 1 (ext)
-40°C to +125°C
Grade 3 & 2 (int)
-40°C to +105°C
• 5 main application groups were identified with very different needs and operating conditions
• In these 5 applications, you can find specific electronic devices (ex: LEDs in lighting) or some electronic devices can be
found in several but with different specs (ex: MCUs in safety vs. MCUs in infotainment)
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AUTOMOTIVE PACKAGING ANALYSIS
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TECHNOLOGY ROAD MAPS FOR AUTOMOTIVE DEVICES
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AUTOMOTIVE MARKET UNIT FORECAST BY APPLICATION
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AUTOMOTIVE MARKET UNIT FORECAST BY PLATFORM
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AUTOMOTIVE PACKAGING MARKET SHARES : IDM VS. OSAT
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OEMS WORLDWIDE Non exhaustive list
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SUPPLY CHAIN ANALYSIS
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AUTOMOTIVE LANDSCAPE & FOCUS ON CHINESE PLAYERS
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RELATED REPORTS
©2018 | www.yole.fr | Trends in Automotive Packaging - Sample
The automotive market grew by 7% in revenue in 2017, while semiconductor technology in the automotive market is growing by 20%. Electronic devices are more and more common in cars and the number of electronic systems is also increasing. The quantity of electronics in a car has increased 2.5 times since the 90’s; in 2017, 26 cm² of semiconductor substrates was used in a car, while in 2023 we expect 35 cm². Four main trends are leading this augmentation, electrification, autonomy, connectivity and comfort. All of them involve a large number of sensors, power supplies, communication chips, lighting components and
processors that can come from the consumer market or be developed specifically for automotive. This increase in electronic devices in cars will drive the packaging market. In fact, in 2017, the packaging for automotive total revenue was quoted at ~$3.7B and it will reach ~$7B in 2023, including LED module. The automotive packaging industry is involved in many device types and thus in many packaging platforms. In the report, you will find detailed scenarios for growth of the market with a breakdown by packaging platform and automotive application, such as radar, LiDAR, power devices, lighting and photonics.
TRENDS IN AUTOMOTIVE PACKAGING 2018Market & Technology report - November 2018
PACKAGING DEDICATED TO AUTOMOTIVE ELECTRONICS IS GROWING AND WILL REACH $7B IN 2023
OSATs are gaining benefits from advanced packaging in automotive.
KEY FEATURES• Introduction about the differences
between automotive and consumer markets, based on our advanced packaging industry analysis
• Analysis of packaging technologies that are implemented or will be developed for the automotive industry
• Packaging trends in the automotive devices
• Adoption of new technologies takes duration based on specifications and norms
• Advanced packaging market forecast with breakdown by platform and application
• Players of the advanced packaging supply chain involved in the automotive industry
• Market forcast in units and revenue split by application and platform
(Yole Développement, November 2018)
Power conversion
ADAS sensors
MEMS & sensors
LightingProcessing & Storage
Connectivity modules / Telematics
Display
Front light
Rear light
MOSFET
IGBT
Memory
MCU
DC-DC convertor
GaN HEMT
CPU/GPU
Screen
Wifi
CISRadar
LiDAR
Accelerometers
Gyroscope
Microphones
ToF
Interior lighting
GPSPressure sensor
Infrared imager
ECU
BMIC
Micro bolometer
Micromirror IMUs
Magnetometer Ultrasonic
Humidity sensor
Small lamp
Front-end module
Antenna
Switch
*Non exhaustive list of applications
2018 Automotive industry: electronic parts overview*
The automotive industry is highly regulated, due to concerns about safety and pollution. Due to all the specifications required for each component, new device development takes a long time for qualification. This obstacle is a limitation in terms of use of new types of packaging. More-over, the automotive industry is not the most receptive for innovations in packaging. But we are entering a new era for automotive development that may accelerate things. There are significant demands for power applications that can drive innovation. A second wave could be led by increasing autonomy
and connectivity. It is important also to notice that is the first time in history that a big effort is made to adapt consumer technologies to automotive to drive innovation in dedicated applications such as powertrain. Although the main platform in term of units is the Wire Bond Ball Grid Array (WBBGA) package, which represents half of the market, advanced packaging platforms such as flip-chip and fan-out are finding their place. The next innovation expected is embedded die in substrate for converter dies. Packages like Quad Flat No-leads package (QFN), Interstitial Ball
DESPITE THE HIGH DEGREE OF REGULATION, CONSUMER PACKAGING TYPES ARE SLOWLY ADAPTED TO, AND ADOPTED BY, THE AUTOMOTIVE MARKET
TRENDS IN AUTOMOTIVE PACKAGING 2018
Automotive packaging roadmap
(Yole Développement, November 2018)
THE BIG WINNERS OF DIVERSIFICATION AND THE INCREASE OF ELECTRONICS IN THE AUTOMOTIVE MARKET ARE THE OSATS
Players in the advanced packaging industry for automotive can be split into two groups, the IDMs/Tier 1 and the OSATs. IDMs and Tier 1 are the main suppliers of the car OEMs for integrated systems, and OSATs specialize in the initial packaging and testing. Automotive packaging was mostly done in-house
by IDMs and Tier 1, as it allows an easier integration and a faster development of systems. As ever more electronics are implemented in cars, more and more outsourcing goes to OSATs. In the past, OSATs supplied relatively little of the electronic advanced packaging for the automotive market, while today OSATs represent 38% of the total revenue for advanced packaging for cars and this proportion might keep growing. This change has been made possible due to the increasing quantity of devices, diversification of components, the increased complexity of the packaging and the reliability of specific manufacturers. Moreover, some devices come from the consumer market that OSATs already supply. Currently, Amkor and ASE represent more than 80% of the automotive advanced packaging for automotive supplied by OSATs. In 2015, Amkor acquired J-Devices, one of the larger Japanese OSATs. Thanks to this acquisition and new brand positioning focused on the automotive market, Amkor is now the top OSAT in automotive packaging with more than 50% of the market, followed by ASE and STATS ChipPAC.
Grid Array Package (iBGA) and ceramic packaging are also growing for specific applications like CMOS Image Sensors (CIS), MEMS and power devices. You
will find details on all the types of packages used in the automotive industry, technology road maps and a market analysis for each of them.
Automotive packaging – 2017 market shares: IDM vs. OSAT
(Yole Développement, November 2018)
OBJECTIVES OF THE REPORT• Identify and analyze the major advanced packaging platforms currently used in the automotive
industry• Point out advanced packaging technical trends related to LiDAR, CIS, radar, power and lighting
devices, MEMS and sensors…• Understand the impact of automotive regulations and specifications on packaging development• Present a detailed technology roadmap for advanced packaging platforms for automotive applications• Identify the market drivers, disruptions and business opportunities• Analyze key benefits and added value of emerging advanced packaging platforms • Detail the automotive industry supply chain, with a focus on IDMs and OSATs and the competitive
landscape• Give an overview of who is doing what, and specificities of each market segment
OSATs38%IDMs & Tiers 1
62%
Automotive packaging revenue 2017 total:~$ 3.7B including LED module
ASE25%
STATS ChipPAC5%
Others14%Amkor
56%
OSATs market shares in 2017
OSATs
Current advanced packaging technologies Future technologies Market drivers
Integrationcost
*Number of cars that adapts CMOS Image Sensor (CIS) for ADAS sensors
**Numbers of CIS in a car, high-end market grows faster
Cooling
Cooling
IntegrationFoot print
Thermal managementReliability
Sensitivityhermetic
IntegrationThermal management
Fan-OutWLCSP (Fan in)
Flip chip (FC)/ Multi-die
Organic packagesCeramic packages
Organic packages*Ceramic packages**
Cu clip (or thicker Cu wire)Cu wire
FC in QFN
Quad Flat No-leads package(QFN)(Low/mid power)
Power Module (high power)
Power
Radar
CIS
Power
More semi-open cavitiesShielding QFNWettable flanks
MEMS
Through holeEmbedded dieHigh Density Interconnect
(HDI) board
Standard substrate L/S
Embedded die
Side to side chip in QFN
QFN
Substrate Connection layers
MARKET & TECHNOLOGY REPORT
COMPANIES CITED IN THE REPORT (non exhaustive list)ASE, Amkor, ams, Analog Devices, Apple, AT&S, Audi, Autoliv, BAIC, Baidu, Benewake, Build Your Dreams, BMW, Bosch, Brightek, Brillance Auto Group, Broad-Ocean, CammSys, Cepton, Cheng-Tech, Chery Automotive, CHJ Automotive, Citroën, Continental, Daihatsu, Daimler, Dajun Technologies, Delphi, DeNA, Denso, DEPO, Didi Chuxing, Discovery Semiconductor, Dongfeng Motor Corporation, Dynex Semiconductors, Edison Automotive, EM Microelectronics, Everlight Electronics, Excelitas Technologies, Finisar, FAW Group, Ford, Fuji Electric, Galaxycore, Geely, General Motors, Genesis Photonics, Gentex, Google, Hamamatsu, Heller Automotive, Hesai, Himax, Hitachi, Honda, Hongli Zhihui, Honeywell, Huayu Automotive System, Hynix, Hyundai, Ichikoh Industries, II-VI Incorporated, IMI, Insemi Technology Services, Infineon, Innoviz, Inovance, INVT, Jabil Circuit, Jaguar, JCET, JEE Automation Equipment, JJE Automotive, Kingpak Technology, Koito Manufacturing, KOSTAL, LeddarTech, LeiShen Intelligent System, LG Innotek, Lumentum, Lingsen, Lumileds, Lyft, Magna International, Mando, Mazda, Mercedes-Benz, Mitsubishi Electric, nepes, Nichia, Nidec, NIO, Nissan, NXP, OLSA, OmniVision Technologies, On Semiconductor, Optotech, Orsam, Ouster, Panasonic, Philips, Pixelplus, Powertech Technology, Renault, Robosense, Samsung Electro-Mechanics, Samsung, Semikron, SensL, Seoul Semiconductor, SAIC Motor, Sony, Spectrolab, SPIL, Stanley, STATS ChipPAC, STMicroelectronics, Sure Start, Taxas Instruments, Tesla, Thorlabs, Tong Hsing Electronics, Toshiba, TowerJazz, Toyota, Transdev, TriLumina, TRW Automotive, United Automotive Electronic Systems, Uber, Ushio, Valeo, Velodyne LiDAR, Volkswagen, Waymo, Wuhu sensorthch Intelligent Technology, xFab and more…
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As Technica l Projec t Development Director at Yole Déve l oppe me n t ( Yo l e) , Jérôme Azémar is suppor ting the development of strategic projects, following leading customers of the company within the semiconductor industry, from manufacturing to packaging. His mission is to develop Yole’s business and technical knowledge in the industry, maintain long term relationships with its accounts and meet their expectations.Jérôme is the author of numerous analysis and international publications covering advanced packaging, power electronics and semiconductor manufacturing. Prior to this and upon graduating from INSA Toulouse (France) with a Master’s in Microelectronics and Applied Physics, Jérôme worked three years at ASML as application engineer and two years at STMicroelectronics as process engineer.
AUTHORS
Report scope and definitions 6
> Scope of the report> Companies cited in this report> Glossary
Executive summary 11Introduction of the automotive market 33
> Why packaging is so important in automotive?> 4 Megatrends : Electrification, autonomy,
connectivity & comfort> Worldwide automotive industry, plus focus on
China> Role of advanced packaging in automotive
- Automotive regulations & specific gradesApplications 75
> Different applications in automotive - Main axis: Power, Safety, Infotainment,
Connectivity, Lighting
> Different electronics devices in automotive (LED, MEMS and sensors, ADAS sensors, power conversion, connectivity, processing and storage)
> Cost analysis taking count of different level of carAutomotive packaging focus by platform and application 107
> Type of packaging platform in automotive- Packages description (FO, WLCSP, QFN, FC…)
> Packaging trends per applications- Focus on innovative packages and evolving apps
> Packages / Applications MatrixPlayers of the automotive packaging industry 145
> Supply chain of each application (camera, lighting, radars…)
> Company profiles (ASE, Bosch, NXP…)Market forecasts 165
> Revenues per packages (breakdown per applications)
> Volumes (by packages, breakdown per applications)Conclusions 200About the author / Related reports / Company presentation 205
TABLE OF CONTENTS (complete content on i-Micronews.com)
Lauranne Chemisky is a technology and market analyst in the Semiconductor & Software Team at Yole Développement (Yole). Lauranne is currently engaged in the development of market research reports as well as customized services for clients. She is able to leverage her technology training and experience in the fields of materials and semiconductor manufacturing processes for advanced packaging applications. Previously, Lauranne worked at Apple in the Softgoods Product Design Team as a material development engineer (CA, USA).Lauranne holds a master’s degree in Materials Science & Polymers from ITECH (Lyon, FR) and an M.Sc. in Technology and Innovation Management from EM Lyon Business School (Lyon, FR).
Emilie Jolivet is Director of the Semiconductor & Software Division at Yole Développement (Yole), part of Yole Group of Companies, where her specif ic interests cover package & assembly, semiconductor manufacturing, memory and software & computing f ields.Based on her valuable exper ience in the semiconductor industry, Emilie manages the expansion of the technical and market expertise of her team. In addition, Emilie’s mission focusses on the management of business relationships with semiconductor leaders and the development of market research and strategy consulting activities inside the Yole group.Emilie Jolivet holds a Master’s degree in Applied Physics specializing in Microelectronics from INSA (Toulouse, France).
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Teardown and reverse engineering
Cost simulation tools
www.systemplus.fr
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consulting
www.yole.fr
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Patent assessment
www.knowmade.fr
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www.bmorpho.com
Design and characterization of
innovative optical systems
www.piseo.fr
Yole Group of Companies
5©2018 | www.yole.fr | About Yole Développement
OUR GLOBAL ACTIVITY
30%of our business
40%of our business 30%
of our business
Greater
China office
Yole Japan
HQ in Lyon
Nantes
Paris
Nice
Vénissieux
Europe office
Frankfurt
Hsinchu
Tokyo
Yole Inc.
Phoenix
Yole Korea
Seoul
Palo Alto
6©2018 | www.yole.fr | About Yole Développement
ANALYSIS SERVICES - CONTENT COMPARISON
Technology
and Market
Report
Leadership
Meeting
Q&A
Service
Depth of the analysis
Bre
adth
of th
e a
nal
ysis
Meet the
Analyst
Custom
Analysis
High
High
Low
7©2018 | www.yole.fr | About Yole Développement
SERVING THE ENTIRE SUPPLY CHAIN
Our analysts provide market analysis,
technology evaluation,
and business plans along the entire
supply chain
Integrators, end-
users and software
developers
Device manufacturers
Suppliers: material, equipment,
OSAT, foundries…
Financial investors, R&D centers
8©2018 | www.yole.fr | About Yole Développement
SERVING MULTIPLE INDUSTRIAL FIELDS
We workacross
multiples industries to understand
the impact of More-than-
Moore technologies from deviceto system
From A to Z…
Transportation
makers
Mobile phone
and
consumer
electronics
Automotive
Medical
systems
Industrial
and defense
Energy
management
9©2018 | www.yole.fr | About Yole Développement
o Yole Développement, System Plus Consulting, KnowMade and PISEO, all part of Yole Group of Companies, keep on increasing their collaboration to offer, in 2018, a
collection of 150+ reports. Combining respective expertise and methodologies from the 4 companies, the reports aim to provide market & technology analysis, patent
investigation and patent infringement risk analysis, teardowns & reverse costing analysis.They cover:
o You are looking for:
• An analysis of your product market
• A review of your competitors evolution
• An understanding of your manufacturing and production costs
• An understanding of your industry technology roadmap and related IPs
• A clear view on the evolution of the supply chain…
Our reports are for you!
The combined team of 60+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting, KnowMade and PISEO, collect information,identify the trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industrylandscape.
In the past 20 years, we worked on more than 1 700 projects, interacting with technology professionals and high level opinion makers from the main players of theindustry.
o In 2018, Yole Group of Companies plan to publish +150 reports. Gain full benefit from our Bundled Offer and receive at least a 36% discount.
REPORTS COLLECTION
www.i-Micronews.com
• MEMS & Sensors
• RF devices & technologies
• Imaging
• Medical technologies (MedTech)
• Photonics
• Advanced packaging
• Manufacturing
• Advanced substrates
• Power electronics
• Batteries and energy management
• Compound semiconductors
• Solid state lighting
• Displays
• Software
• Memory
10©2018 | www.yole.fr | About Yole Développement
OUR 2018 REPORTS COLLECTION (1/4)
MEMS & SENSORS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the MEMS Industry 2018 – Update
− Silicon Photonics 2018 – Update
− Consumer Biometrics: Hardware & Software 2018 – Update
− Inkjet Functional and Additive Manufacturing for Electronics 2018
− Fingerprint Sensor Applications and Technologies – Consumer Market Focus 2017
− Sensors and Sensing Modules for Smart Homes and Buildings 2017
− Acoustic MEMS and Audio Solutions 2017
− MEMS & Sensors for Automotive Market & Technology Trends 2017
− High End Inertial Sensors 2017
− Magnetic Sensor 2017
o REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
– by System Plus Consulting
− Piezo MEMS 2018 *
o PATENT ANALYSES – by KnowMade
− MEMS Microphone – Patent Landscape Analysis
− Knowles MEMS Microphones in Apple iPhone 7 Plus – Patent-to-Product
Mapping 2017
o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade
− MEMS Pressure Sensor 2018 – Market & Technology Report
− MEMS Pressure Sensor Comparison 2018 – Structure, Process & Cost Report
− Gas & Particles 2018 – Market & Technology Report
− Gas & Particles Comparison 2018 – Structure, Process & Cost Report
− LiDARs for Automotive and Industrial Applications 2018 – Market &
Technology Report
− LiDAR for Automotive 2018 – Patent Landscape Analysis
− MEMS Packaging 2017 – Market & Technology Report
− MEMS Packaging Comparison 2017 – Structure, Process & Cost Report
RF DEVICES AND TECHNOLOGIES
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Wireless technologies (Radar, V2X) for Automotive 2018
− RF Standards and Technologies for Connected Objects 2018
− RF & Photonic Components & Technologies for 5G Infrastructure 2018
o REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT– by System
Plus Consulting
− Automotive Radar Comparison 2018
o PATENT ANALYSES – by KnowMade
− RF Acoustic Wave Filters 2017 – Patent Landscape Analysis
o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade
− 5G impact on RF Front End Modules and Connectivity for Cellphones 2018 – Market
& Technology Report – Update
− RF Front-End Module Comparison 2018 – Structure, Process & Cost Report
− RF Front End Modules for Cellphones 2018 – Patent Landscape Analysis
− Advanced RF System-in-Package for Cellphones 2018 – Market & Technology
Report – Update*
− Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process
& Cost Report
− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023
Market & Technology Report – Update
− RF GaN Comparison 2018* – Structure, Process & Cost Report
− RF GaN 2018 – Patent Landscape Analysis
SOFTWARE
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Consumer Biometrics: Sensors & Software 2018 – Update
− Processing Hardware and Software for AI 2018 - Vol. 1 & 2
− From Image Processing to Deep Learning, Introduction to Hardware and Software
Update : 2017 version still available / *To be confirmed
11©2018 | www.yole.fr | About Yole Développement
OUR 2018 REPORTS COLLECTION (2/4)
IMAGING & OPTOELECTRONICS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the Compact Camera Module and Wafer Level Optics
− Industry 2018 – Update
− 3D Imaging and Sensing 2018 – Update
− Sensors for Robotic Vehicles 2018
− Machine Vision for Industry and Automation 2018
− Imagers and Detectors for Security and Smart Buildings 2018
− Uncooled Infrared Imagers 2017
o PATENT ANALYSES – by KnowMade
− iPhone X Dot Projector – Patent-to-Product Mapping
o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade
− Status of the CMOS Image Sensor Industry 2018 – Market & Technology Report -
Update
− CMOS Image Sensor Comparison 2018 – Structure, Process & Cost Report
− CMOS Image Sensors Monitor 2018* – Quarterly Update**
− Camera Module 2017 – Market & Technology Report
− Compact Camera Module Comparison 2018 – Structure, Process & Cost Report
− LiDARs for Automotive and Industrial Applications 2018 – Market & Technology
Report
− LiDAR for Automotive 2018 – Patent Landscape Analysis
ADVANCED PACKAGING
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of Advanced Packaging Industry 2018 – Update
− Status of Advanced Substrates 2018: Embedded Die and Interconnects, Substrate Like PCB Trends
− 3D TSV and Monolithic Business Update 2018 – Update
− Power Modules Packaging 2018 – Update
− Discrete Power Packaging 2018 – Update*
− Status of Panel Level Packaging 2018
− Trends in Automotive Packaging 2018
− Hardware and Software for AI 2018 - Vol. 1 & 2
− Thin-Film Integrated Passive Devices 2018
− Memory Packaging Market and Technology Report 2018 – Update*
o PATENT ANALYSES – by KnowMade
− Hybrid Bonding for 3D Stack – Patent Landscape Analysis
o LINKED REPORTS– by Yole Développement and System Plus Consulting
− Advanced RF System-in-Package for Cellphones 2018 – Market & Technology Report -
Update*
− Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process
& Cost Report
− Fan-Out Packaging 2018 – Market & Technology Report – Update*
− Fan-Out Packaging Comparison 2018* – Structure, Process & Cost Report
MANUFACTURING
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Wafer Starts for More Than Moore Applications 2018
− Equipment for More than Moore: Technology & Market Trends
for Lithography & Bonding/Debonding 2018
− Polymeric Materials for wafer-level Advanced Packaging 2018
− Laser Technologies for Semiconductor Manufacturing 2017
− Glass Substrate Manufacturing in the Semiconductor Field 2017
− Equipment and Materials for Fan-Out Packaging 2017
− Equipment and Materials for 3D TSV Applications 2017
o LINKED REPORTS – by Yole Développement and System Plus Consulting
− Equipment for More than Moore: Technology & Market Trends for
Lithography & Bonding/Debonding 2018 – Market & Technology Report
− Wafer Bonding Comparison 2018 – Structure, Process & Cost Report
Update : 2017 version still available / *To be confirmed
12©2018 | www.yole.fr | About Yole Développement
OUR 2018 REPORTS COLLECTION (3/4)MEMORY
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Emerging Non Volatile Memory 2018 – Update
− Memory Packaging Market and Technology Report 2018 – Update*
o QUARTERLY UPDATE – by Yole Développement**
− Memory Market Monitor 2018 (NAND & DRAM)
o MONTHLY UPDATE – by Yole Développement**
− Memory Pricing Monitor 2018 (NAND & DRAM)
o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting
− DRAM Technology & Cost Review 2018
− NAND Memory Technology & Cost Review 2018
o PATENT ANALYSES – by KnowMade
− 3D Non-Volatile Memories – Patent Landscape
COMPOUND SEMICONDUCTORS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of Compound Semiconductor Industry 2018*
− GaAs Materials, Devices and Applications 2018
− InP Materials, Devices and Applications 2018
− Bulk GaN Substrate Market 2017
o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade
− Power SiC 2018: Materials, Devices, and Applications – Market & Technology
Report – Update
− SiC Transistor Comparison 2018 – Structure, Process & Cost Report
− Power SiC 2018 – Patent Landscape Analysis
− Power GaN 2018: Materials, Devices, and Applications – Market & Technology Report
– Update
− GaN-on-Silicon Transistor Comparison 2018 – Structure, Process & Cost Report
− Status of the GaN IP – Patent Watch 2018 & Patent Activity 2017
− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023
– Market & Technology Report – Update
− RF GaN – Patent Landscape Analysis
POWER ELECTRONICS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of Power Electronics Industry 2018 – Update
− Discrete Power Packaging 2018 – Update*
− Power Electronics for Electric Vehicles 2018 – Update
− Integrated Passive Devices (IPD) 2018
− Wireless Charging Market Expectations and Technology Trends 2018
− Thermal Management Technology and Market Perspectives in Power
− Electronics and LEDs 2017
− Gate Driver 2017
− Power MOSFET 2017
− IGBT 2017
− Market Opportunities for Thermal Management Components in Smartphones 2017
o LINKED REPORTS – by Yole Développement, System Plus Consulting
and KnowMade
− Power Modules Packaging 2018 – Market & Technology Report – Update
− Automotive Power Module Packaging Comparison 2018 – Structure, Process & Cost Report
− Power ICs Market Monitor 2018 – Quarterly Update**
− Power ICs Market Comparison 2018* – Structure, Process & Cost Report
BATTERY AND ENERGY MANAGEMENT
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Li-ion Battery Packs for Automotive and Stationary Storage Applications 2018 –Update
o PATENT ANALYSES – by KnowMade
− Status of the Battery Patents – Patent Watch 2018 & Patent Activity 2017
o LINKED REPORTS – by Yole Développement and KnowMade
− Solid State Electrolyte Battery 2018 – Market & Technology Report
− Solid-State Batteries 2018 – Patent Landscape Analysis
Update : 2017 version still available / *To be confirmed / ** Can not be selected within an Annual Subscription offer
13©2018 | www.yole.fr | About Yole Développement
OUR 2018 REPORTS COLLECTION (4/4)
SOLID STATE LIGHTING
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− IR LEDs and Lasers 2018: Technology, Industry and Market Trends – Update
− Automotive Lighting 2018: Technology, Industry and Market Trends – Update
− UV LEDs 2018: Technology, Industry and Market Trends – Update
− LiFi: Technology, Industry and Market Trends
− LED Lighting Module Technology, Industry and Market Trends 2017
− CSP LED Lighting Modules
− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays
− Horticultural Lighting 2017
o LINKED REPORTS – by Yole Développement and System Plus Consulting
− VCSELs 2018: Technology, Industry and Market Trends – Market & Technology
Report
− VCSELs Comparison 2018 – Structure, Process & Cost Report
DISPLAYS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Quantum Dots and Wide Color Gamut Display Technologies 2018 – Update
− Displays and Optical Vision Systems for VR/AR/MR 2018
− MicroLED Displays 2018 – Market & Technology Report – Update
o PATENT ANALYSES – by KnowMade
− MicroLED Display – Patent Landscape Analysis
MEDTECH
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− BioMEMS & Non Invasive Emerging Biosensors: Microsystems for Medical
− Applications 2018 – Update
− Point-of-Need Testing Application of Microfluidic Technologies 2018 – Update
− Neurotechnologies and Brain Computer Interface 2018
− CRISPR-Cas9 Technology: From Lab to Industries 2018
− Ultrasound Technologies for Medical, Industrial and Consumer Applications 2018
− Inkjet Functional and Additive Manufacturing for Electronics 2018
− Liquid Biopsy: from Isolation to Downstream Applications 2018
− Chinese Microfluidics Industry 2018
− Scientific Cameras for the Life Sciences & Analytical Instrumentation
Laboratory Markets 2018*
− Artificial Organ Technology and Market 2017
− Connected Medical Devices Market and Business Models 2017
− Status of the Microfluidics Industry 2017
− Organs-On-Chips 2017
− Solid-State Medical Imaging 2017
− Medical Robotics Market & Technology Analysis 2017
o PATENT ANALYSES – by KnowMade
− Microfluidic IC Cooling – Patent Landscape
− Circulating Tumor Cell Isolation – Patent Landscape
− OCT Medical Imaging – Patent Landscape
− Pumps for Microfluidic Devices – Patent Landscape 2017
− Microfluidic Technologies for Diagnostic Applications – Patent Landscape 2017
− FLUIDIGM – Patent Portfolio Analysis 2017
− Consumer Physics SCiO Molecular Sensor – Patent-to-Product Mapping 2017
o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade
− Organs-On-Chips 2017 – Market & Technology Report
− Organ-on-a-Chip – Patent Landscape Analysis
Update : 2017 version still available / *To be confirmed
14©2018 | www.yole.fr | About Yole Développement
OUR 2017 PUBLISHED REPORTS LIST (3/3)
OUR PARTNERS’ REPORTS
PATENT ANALYSES – by KnowMade
− Wireless Charging Patent Landscape Analysis
− RF Acoustic Wave Filters Patent Landscape Analysis
− NMC Lithium-Ion Batteries Patent Landscape Analysis
− Pumps for Microfluidic Devices Patent Landscape
− III-N Patent Watch
− FLUIDIGM Patent Portfolio Analysis
− Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping 2017
− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping
− Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk and Potential Targets
− Microfluidic Technologies for Diagnostic Applications Patent Landscape
TEARDOWN & REVERSE COSTING – by System Plus Consulting
More than 60 teardowns and reverse costing analysis and cost simulation tools published in 2017
MORE INFORMATION
o All the published reports from theYole Group of Companies are available on our website www.i-Micronews.com.
o Ask for our Bundle Subscription offers: With our bundle offer, you choose the number of reports you are interested in and select the related offer. You then have up
to 12 months to select the required reports from the Yole Développement, System Plus Consulting and KnowMade offering. Pay once and receive the reports
automatically (multi-user format). Contact your sales team according to your location (see the last slide).
15©2018 | www.yole.fr | About Yole Développement
MICRONEWS MEDIA
o About Micronews Media
To meet the growing demand for market,
technological and business information,
Micronews Media integrates several tools able
to reach each individual contact within its
network.We will ensure you benefit from this.
ONLINE ONSITE INPERSON
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Contact: Camille Veyrier ([email protected]), Marketing & Communication Project Manager
16©2018 | www.yole.fr | About Yole Développement
CONTACT INFORMATION
o CONSULTING AND SPECIFIC ANALYSIS, REPORT
BUSINESS
• North America:
• Steve LaFerriere, Senior Sales Director for Western US &
Canada
Email: [email protected] – + 1 310 600-8267
• Troy Blanchette, Senior Sales Director for Eastern US &
Canada
Email: [email protected] – +1 704 859-0453
• Japan & Rest of Asia:
• Takashi Onozawa, General Manager, Asia Business
Development (India & ROA)
Email: [email protected] - +81 34405-9204
• Miho Othake, Account Manager (Japan)
Email: [email protected] - +81 3 4405 9204
• Itsuyo Oshiba, Account Manager (Korea & Singapore)
Email: [email protected] - +81-80-3577-3042
• Greater China: Mavis Wang, Director of Greater China Business
Development
Email: [email protected] - +886 979 336 809
• Europe: Lizzie Levenez, EMEA Business Development Manager
Email: [email protected] - +49 15 123 544 182
• RoW: Jean-Christophe Eloy, CEO & President, Yole Développement
Email [email protected] - +33 4 72 83 01 80
o FINANCIAL SERVICES (in partnership with Woodside
Capital Partners)
• Jean-Christophe Eloy, CEO & President
Email: [email protected] - +33 4 72 83 01 80
• Ivan Donaldson, VP of Financial Market Development
Email: [email protected] - +1 208 850 3914
o CUSTOM PROJECT SERVICES
• Jérome Azémar, Technical Project Development Director
Email: [email protected] - +33 6 27 68 69 33
o GENERAL
• Sandrine Leroy, Director, Public Relations
Email: [email protected] - +33 4 72 83 01 89 / +33 6 33 11 61 55
• Email: [email protected] - +33 4 72 83 01 80
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