3dic & 2.5d tsv interconnect for advanced packaging 2014 report by yole developpement

Copyrights © Yole Développement SA. All rights reserved.

1

1

3DIC & 2.5D TSV Interconnect for Advanced Packaging

Advanced Packaging Team

YOLE DEVELOPPEMENT

COLLABORATION

INNOVATION

NEW PERSPECTIVES

FROM TECHNOLOGIES TO MARKET

2014 – Business Update Report


2

2

Yole’s research is focused on:

Applicative Packaging: moving to high performance, low cost, application driven packaging techniques

Advanced Packaging: moving to high performance, low cost, collective wafer level packaging techniques

Semiconductor Packaging

Camera Level Packaging Power Module Packaging MEMS Packaging LED Packaging

Lead-Frame LCC Wirebonding BGA WLCSP 3D WLP SIP

QFN PGA Flip Chip POP FOWLP 2.5D Interposer

2

YOLE

DEVELOPPEMENT

From TECHNOLOGIES to MARKET

Copyright @ Yole Developpement SA.. All rights reserved

FOCUS of this report

3DIC


3



YOLE

DEVELOPPEMENT

3

The Evolution of Semiconductor PackagingA bridging technology between ICs and PCBs

Feature sizes CMOS transistors: 28nm

Feature sizes of PCBs

1970through hole technology

1980Surface mountdevices

De

ve

lop

me

nt

in C

MO

S p

roce

ssin

g c

ap

ab

ilit

ies

De

ve

lop

me

nt

in P

CB

pro

cess

ing

ca

pa

bilit

ies

1990CSPs/BGAsSiPs

2000WLCSPmore SiPsFlip Chip BGAPoP

20103DICTSVFan-out WLCSPCu pillarsSilicon interposers


4



YOLE

DEVELOPPEMENT

4

The Evolution of Semiconductor PackagingA bridging technology between ICs and PCBs

Feature sizes CMOS transistors: 28nm

Feature sizes of PCBs

1970through hole technology

1980Surface mountdevices

De

ve

lop

me

nt

in C

MO

S p

roce

ssin

g c

ap

ab

ilit

ies

De

ve

lop

me

nt

in P

CB

pro

cess

ing

ca

pa

bilit

ies

1990CSPs/BGAsSiPs

2000WLCSPmore SiPsFlip Chip BGAPoP

20103DICTSVFan-out WLCSPCu pillarsSilicon interposers

….across several markets

Mobile:High-end MultimediaSmart-phones / PMP

High-densitySolid State

Storage & µ-Cards

Computing: Notebooks / MID ‘connectivity’ devices

Consumer:Gaming / Graphic

application engines

Industrial: HPC/ Network, Servers

Consumer: High-performance Digital Video

Wireless: Connectivity /

Network Center

Medical Military & AerospaceTransportation:Automotive,Trains,HEV/EV

Renewable Energy:Photovoltains, WindTurbines…

Telecom: PowerSupplies…

Industrial


5



YOLE

DEVELOPPEMENT

5

Silicon / Interconnection trend

500

020406080100

Number I/O per cm²

20.000

10.000

1500

CMOS90 CMOS45CMOS28

CMOS16

CMOS65FinFET

Technology NodeCMOS [nm]

Scaling of Transistor Nodes => I/Os Density

Increase


6



YOLE

DEVELOPPEMENT

6

TSV in a nutshell

Logic Memory

CMOS Image

Sensors

MEMS

Photonics

Others(Power,

LED, RF…)

ThroughSilicon

ViaTSV


7

77

YOLE

DEVELOPPEMENT

7From TECHNOLOGIES to MARKET



8



YOLE

DEVELOPPEMENT

8

Global 3DIC / TSV Activity Worldwide

Broad range of key players involved in 3D Technology from different business models (Fabless, IDMs, OSATs, Foundries...)

http://www.vti.fi/en/

http://www.vti.fi/en/

http://www.globalunichip.com/index.php

http://www.globalunichip.com/index.php

http://www.corning.com/index.aspx

http://www.corning.com/index.aspx


9



YOLE

DEVELOPPEMENT

9

Landscape Via Middle (non exhaustive list)

0

5

10

15

20

25

0 10 20 30 40 50 60 70 80 90 100 110 120 130

Dia

mete

r [µ

m]

Depth [µm]

VIA MIDDLE

2.5D

Interposer

3DIC

…and again much more players

with others TSV features!!!


10



YOLE

DEVELOPPEMENT

10

Logic

CMOS Image

Sensors

MEMS

Photonics

Others(Power,

LED, RF…)

Memory

TSV in a nutshell

Memory

ThroughSilicon

ViaTSV


11



YOLE

DEVELOPPEMENT

11

DRAM Technology Trends2010 2011 2012 2013 2014 2015 2016 2017 2018 2019

From JEDEC specifications

LPDDR1

DDR3

LPDDR2

LPDDR3

Wide I/O

DDR4

LPDDR4 / Wide I/O2

Tech

no

log

y(d

en

sity

/ba

nd

wit

hp

er

die

)

Depending on requirements in voltages and data transfer speeds differenttypes of DDR memory are being developed to fulfill the future needs


12



YOLE

DEVELOPPEMENT

12

2010 2011 2012 2013 2014 2015 2016 2017 2018 2019

Mobile DRAM Memory Trends

PC DRAM DDR3 DDR4

GraphicsDRAM GDDR5 HBM

3D MobileDRAM Wide I/O1 Wide I/O2

MobileDRAM LPDRR2 LPDRR3 LPDRR4

3D Technology

From JEDEC specifications


13



YOLE

DEVELOPPEMENT

13

Markets Demand: High Performance, Lower Power Consumption

High Performance Computing (HPC)•Game Consoles•Microprocessors•Networking

Networking, Wired Applications•Servers, Storage•Graphics•Digital TV Networking

Consumer, Wireless, Mobile Computing•Smartphones•Tablets•Portable Consumer


14



YOLE

DEVELOPPEMENT

14

Logic

MEMS

Photonics

Others(Power,

LED, RF…)

Memory

TSV in a nutshell

ThroughSilicon

ViaTSV

CMOS Image

Sensors


15



YOLE

DEVELOPPEMENT

15

Main Trends in CMOS Image SensorFrom FSI to BSI to 3D Stacked

SOC FSI Imager

I/Os

I/Os

I/O

s

I/O

s

Power Management

An

alo

g

Analog

BSI Imager

Readout circuit

Hybridization

I/Os

I/Os

I/O

s

I/O

s

Power Management

An

alo

g

Analog

BSI is a key enabling technology to go to 3D integration• Pads of the read-out layer are located on the same side of the image sensor processing chip (DSP).

• That configuration makes the integration easier by having direct access to each pixel site.

With FSI sensors, the 3D integration would be very difficult because TSVs should crossthrough the whole active pixel array.

End of 2012, Sony released the first stacked image sensor (see right picture).

In the future, 3D stacking will become more used as more functionalities will berequired.

Mainstream since the 2000s

All BSI players since 2009 October 2012: Sony to release the first hydrid CIS “EXMOR

RS”


16



YOLE

DEVELOPPEMENT

16

CMOS Image Sensor Evolution

FSI BSI 3D Stacked BSI

20122008

TSV Hole to replace shellcase approach

Wafer Level PackagingInterconnection

Trench TSVBEOL Interconnection

TSV BEOL and DSP Interconnection

« Real 3D »

TSV

Cro

ss-s

ect

ion

SEM

TSV

Ne

ed

sIn

teg

rati

on

Sch

em

e


17



YOLE

DEVELOPPEMENT

17

Comparison with previous 8Mp sensorsSignificant Improvement brought by Sony

Phone Ref. (Year)CIS Manufacturer

Resolution/Techno

Pixel sizePixel ArrayArea

CIS AreaDies per wafer(12-inch)

Motorola Razor (2011) Omnivision 8Mp/BSI 1.4µm 16mm² 43mm² 1,500

Apple iPhone 4S (2011) Sony 8Mp/BSI 1.4µm 16mm² 35.4mm² 1,816

Samsung Galaxy SII (2011) Samsung 8Mp/BSI 1.4µm 16mm² 34.2mm² 1,884

Apple iPhone 5S (2013) Sony 8Mp/BSI 1.5µm 18mm² 28.5mm² 2,268

Courtesy System Plus Consulting

~50% ~60% ~60% ~90%

Increase of pixel area


18

18

Our Global Presence

Yole Inc.

Yole Europe30%

40%

30% Yole Korea

Yole KK Japan

YOLE

DEVELOPPEMENT



Offices in Lyon (HQ),

Nantes, Nice & Paris

4


19



YOLE

DEVELOPPEMENT

19

MEDIANews feed / Webcasts

Technology Magazines

www.yole.fr

FINANCEM&A / Valuation / Due Diligence /

Technology brokerage

www.yolefinance.fr

www.i-micronews.com

REPORTSMarket & technology

Patent Investigation

Reverse costing

CONSULTINGMarket research

Technology & Strategy

Patent Investigation

Reverse costing

WORKSHOPSFocused seminars

Yole Group Activities

5%


20

20

The company is involved in the following areas:

30 full time global analysts with technical, marketing and management background

35000 interviews per year

Field of Research

Advanced Packaging Photovoltaics LED & Compound Semi Power Electronics

Microfluidics & Bio Tech MEMS & Sensors Semiconductor Manufacturing: Equipment & Materials

20

YOLE

DEVELOPPEMENT


Copyright @ Yole Developpement SA.. All rights reserved5


21



YOLE

DEVELOPPEMENT

21

Overview of Our Main Services

Technical comparison of new processes at material or device level

Detailed analysis of the cost structure of a specific technology

Analysis of technology evolutions and industrial implementation

Identification of new applications, services and markets

Set-up market segmentation a

Proposal of marketing and action plans

Market research & marketing analysis

Technical & reverse

costing analysis

Strategic analysis

Business Development

Specific Services for

Investors

Media &Communi-

cations

Analysis of positioning to create value

Development of action plans to improve company performance

Support in implementation and fund raising

Contact with interesting companies and possible partners

Set up meetings (face to ace of by phone)

Follow up in order to implement the decision taken

Evaluation and analysis of business plans

Evaluation of production infrastructure

Expertise and due diligence before M&A

Technology brokerage

Providing forum and journalistic support with publishing articles

Organizing and coordinating webcasts

Providing journalistic help and coordination with focused on multiple action magazines

On-line Advertisement on i-Micronews website


22



YOLE

DEVELOPPEMENT

22

Breadth of the analysis

De

pth

of

the

an

aly

sis

Yole Custom Analysis

YoleAnnual Actions

Yole Standard Reports

Multiple reports(> 3) offer can be acquired through

annual subscription offer

Direct access to Yole’s analyst to discuss and obtain specific information quickly throughout the year

Custom projects are designed to meet your specific needs: Business development, Teardown reverse engineering & costing analysis, IP analysis, Strategic analysis, new product marketing analysis and segmentation of your market, due diligence, M&A, etc.

Workshops

YoleWorkshops

Q&A Services

Instead of buying 3-5 different reports to cover yourlist of questions, Yole analysts can prepare a“custom presentation” to be presented face-to-faceto your company

http://www.yole.fr/pagesAn/products/Report_sample/3DIC.pdf

http://www.yole.fr/pagesAn/products/Report_sample/3DIC.pdf


23



YOLE

DEVELOPPEMENT

23

Yole Developpement consultants provide market analysis, technology evaluation, and business plan along the entire value chain

Institutions, Investors

and Advocates

Materialsand

EquipmentSuppliers

Component and

Device Makers

Integrators and

End Users

Serving the Entire Value Chain


24



YOLE

DEVELOPPEMENT

24

….Some of our Customers


25



YOLE

DEVELOPPEMENT

25

Our team Thibault Buisson, Technology and Market AnalystThibault is a member of the Advanced Packaging team at Yole Développement. He graduated from INPG with aMaster of Research in Micro and Nano electronics and from Polytech’ Grenoble with an engineering degree inMaterial Sciences. He then joined NXP semiconductors as R&D process engineer in the thermal treatment areato develop CMOS technology node devices from 65 to 45nm. Afterwards, he joined IMEC Leuven and worked formore than 5 years as process integration engineer in the field of 3D technology. During this time, he has workedon several topics from TSV to micro-bumping and stacking. He has authored or co-authored fifteen internationalpublications in the semiconductor field.

Rozalia Beica, CTO and Business Unit DirectorRozalia Beica is the CTO and Business Unit Director leading Advanced/3D Packaging and SemiconductorManufacturing activities within Yole Développement. For more than 15 years she has been involved in theresearch, strategic marketing and application of WLP and 3D/TSV at materials (Rohm and Haas), equipment(Semitool, Applied Materials, Lam Research) and device manufacturing (Maxim IC) organizations. Rozalia hasauthored over 50 papers and publications and she is actively participating in several 3D & Advanced PackagingCommittees worldwide. Rozalia has a M.Sc in Chemical Engineering (Romania), a M. Sc. In Management ofTechnology (USA) and a GXMBA from IE University (Spain).

Amandine Pizzagalli, Technology and Market AnalystAmandine Pizzagalli is in charge of equipment & material fields for the Advanced Packaging & Manufacturingteam at Yole Développement after graduating as an engineer in Electronics, with a specialization inSemiconductors and Nano Electronics Technologies. She worked in the past for Air Liquide with an emphasis onCVD and ALD processes for semiconductor applications.

Jérôme Azémar, Technology and Market AnalystJérôme Azémar is a member of the Advanced Packaging & Manufacturing team. Upon graduating from INSAToulouse with a master’s in Microelectronics and Applied Physics, he joined ASML and worked in Veldhoven forthree years as an Application Support Engineer, specializing in immersion scanners. During this time he acquiredPhotolithography skills which he then honed over a two year stint as a Process Engineer at STMicroelectronics.While with ST he developed new processes, co-authored an international publication and worked on metrologystructures embedded on reticules before joining Yole Développement in 2013.

orDer forM3DIC & 2.5D TSV Interconnect for Advanced Packaging – 2014 Business Update

ABOUT YOLE DEVELOPPEMENT

SHIPPING CONTACT

First Name:

Email:

Last Name:

Phone:

PAYMENTBY CREDIT CARD Visa Mastercard Amex

Name of the Card Holder:

Credit Card Number:

Card Verification Value (3 digits except AMEX: 4 digits):

Expiration date:

BY BANK TRANSFERBANK INFO: HSBC, 1 place de la Bourse, F-69002 Lyon, France, Bank code: 30056, Branch code : 00170Account No: 0170 200 1565 87, SWIFT or BIC code: CCFRFRPP, IBAN: FR76 3005 6001 7001 7020 0156 587

RETURN ORDER BY • FAX: +33 (0)472 83 01 83• MAIL: YOLE DÉVELOPPEMENT, Le Quartz,

75 Cours Emile Zola, 69100 Villeurbanne/Lyon - France

SALES CONTACTS

• North America: David Jourdan - [email protected]

• Asia: Takashi Onozawa - [email protected]

• Europe & RoW: Jean-Christophe Eloy - [email protected]

• Korea: Hailey Yang - [email protected]

• General: [email protected]

(1) Our Terms and Conditions of Sale are available at www.yole.fr/Terms_and_Conditions_of_Sale.aspx The present document is valid 24 months after its publishing date: July 8th, 2014.

/

Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media in addition to corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing (technology or process), Yole Développement group has expanded to include more than 50 associates worldwide covering MEMS, Compound Semiconductors, LED, Image Sensors, Optoelectronics, Microfluidics & Medical, Photovoltaics, Advanced Packaging, Manufacturing, Nanomaterials and Power Electronics. The group supports industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business.

ConSUlTIng• Market data & research, marketing

analysis• Technology analysis• Reverse engineering & costing services• Strategy consulting• Patent analysisMore information on www.yole.fr

fInAnCIAl SerVICeS• Mergers & Acquisitions• Due diligence• Fundraising• Coaching of emerging companies• IP portfolio management & optimizationMore information on www.yolefinance.com

rePorTS• Collection of technology & market reports• Manufacturing cost simulation tools• Component reverse engineering and costing analysis• Patent investigationMore information on www.i-micronews.com/reports

MeDIA & eVenTS• i-Micronews.com, online disruptive technologies website• @Micronews, weekly e-newsletter• Technology Magazines dedicated to MEMS, Advanced Packaging,

LED and Power Electronics• Communication & webcasts services• Events: Yole Seminars, Market Briefings…More information on www.i-micronews.com

ConTACTSFor more information about :• Consulting Services: Jean-Christophe Eloy ([email protected])• Financial Services: Géraldine Andrieux-Gustin ([email protected])• Reports: David Jourdan ([email protected]) • Corporate Communication: Sandrine Leroy ([email protected])

BILL TO

Name (Mr/Ms/Dr/Pr):

Job Title:

Company:

Address:

City:

State:

Postcode/Zip:

Country*:

*VAT ID Number for EU members:

Tel:

Email:

Date:

PRODUCT ORDERPlease enter my order for above named report : one user license*: euro 3,990 Multi user license: euro 5,990*One user license means only one person at the company can use the report. Please be aware that our publication will be watermarked on each page with the name of the recipient and of the organization (the name mentioned on the PO). This watermark will also mention that the report sharing is not allowed.

For price in dollars, please use the day’s exchange rate. All reports are delivered 20% for VAT

I hereby accept Yole Développement’s Terms and Conditions of Sale(1)

Signature:

3dic & 2.5d tsv interconnect for advanced packaging 2014 report by yole developpement

Technology

e d e v e

o p p e

rights reserved y o

yole developpement sa

rights reserved focus

d technology

market copyright

d interposer