embedded die packaging: technology and market trends 2017 - report by yole developpement

© 2016

Embedded Die Packaging:

Technology and Market Trends 2016

November 2016

From Technologies to Market

Report Sample

2©2016 | www.yole.fr | Embedded Die Packaging: Technology and Market Trends 2016 | Sample

REPORT OBJECTIVES

To provide a market overview of the Embedded Die landscape

o Emerging and declining applications

o Forecasts until 2021: Revenue, unit count

o Identify main players and provide supply chain analysis

To provide analysis of technology trends

o Technology roadmap

o Latest technical innovations

To assess the future development of the Embedded Die market

o Outlook on volume growing disruptions: new market drivers, infrastructure, expanding business models, new entries, competing packaging solutions

o Impact on supply chain and technology roadmap

3

REPORT METHODOLOGY

Market segmentation methodology

Market forecast methodology

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REPORT METHODOLOGY

Technology analysis methodology Information collection


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REPORT OUTLINES

Part I/II

Report scope & objectives 6• Scope of the report

• What’s new since last report ?

• Companies cited in this report

• Glossary

Executive summary 16• Key points and take-aways

Market Drivers 31• Advanced Packaging drivers

• Advanced packaging market status

• Advanced packaging platforms

• Technical gaps & positioning of embedded die packaging vs other

packaging platforms

• Embedded Die drivers

• Definition of embedded die

• ED Technology segmentation • Embedded die in substrate

• Embedded die in PCB

• Embedded die in flexible board

• Embedded interconnections in substrate

• Technology trends

Market forecasts for embedded die 63• Market forecasts

• Market forecasts by units breakdown by markets

• Market forecasts by revenues by markets

• Market dynamics

Embedded Die Markets & Applications 74• Market and applications matrix

• Detailed review of applications by market

• Motivations and drivers

• Rationales for adopting embedded die technology

• Cost considerations

Roadmaps 98• Volume production technical roadmap for

• Embedded die in substrate

• Embedded die in PCB

• Embedded die in flexible board

• Challenges in embedding die for volume production

• Overview of R&D programs around Embedded Die packaging


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REPORT OUTLINES

Part II/II

Supply chain & Commercialization 116 • Examples of commercialization of embedded die packaging

• Embedded die packaging main players mapping

• Supply chain 2016

• Key partnerships in 2016

• Challenges related to supply chain

• Embedded die ecosystems

• PCB and substrate makers new position

• Potential new entrants in the ED packaging business

Main technology review by player 133• Key players process flows

• Focus on embedded interconnects in substrate

Conclusions 150• SWOT analysis for embedded die packaging stakeholders

• Conclusions

• Highlight of what is coming next


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Biography & contact

ABOUT THE AUTHORS

Emilie Jolivet

Emilie Jolivet is a Technology & Market Analyst, in the Advanced Packaging and Semiconductor Manufacturing team, at Yole Développement

the "More than Moore" market research and strategy consulting company. She holds a master’s degree Applied Physics specialized in

Microelectronics from INSA Toulouse. After an internship in failure analysis in Freescale, she took the position of R&D engineer for 7 years

in photovoltaic business and co-authored several scientific articles. Strong for this experience, she graduated from a master in Business

Administration at IAE Lyon and then joined EV Group as a business development manager in 3D & Advanced Packaging before joining Yole

Développement in 2016.


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SYNERGIES TO THIS REPORT

Status of the Advanced

Packaging Industry 2017January 2017

Fan-In Packaging:

Business Update 2016November 2016

Status and Prospects for

the Advanced Packaging

Industry in ChinaJuly 2016

3D TSV & 2.5D Interconnect

for Advanced Packaging:

Technologies and Market

TrendsOctober 2016

Thin Wafer Processing

and Dicing Equipment

MarketAugust 2016

Fan-Out Packaging:

Technologies and Market

TrendsSeptember 2016

Status of the CMOS

Image Sensor Industry

2016June 2016

Embedded Die Packaging:

Technology and Market

TrendsNovember 2016

Readiness for Panel

ManufacturingNovember 2015


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THE 2016 EMBEDDED DIE REPORT

New content with respect to previous edition

The 1st standalone edition of Embedded Die Packaging report fromYole Développement brings:

• Focus exclusively on the Embedded Die packaging platform

• Analysis of Embedded Die technology on IC package substrate and board level

• Updated market forecasts, from 2015 to 2021

• Revised technology roadmaps, from 2015 to 2021

• Updated supply chain

• Embedded Die market dynamics and future disruptions

What’s New?

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SCOPE OF THE REPORT

• The industry is using the term embedded die packaging for a broad range of packaging architectures and technologies

• This report covers die embedding in laminate layers, namely IC package substrates and boards

• This report will cover all types of active die embedded in layers of laminate, focusing on products with embedded active diesonly or active dies and passives

• Within the scope of embedding in laminate, this report also covers the emerging technologies involving the embedding ofpassive interconnects

• On the other hand, die embedding in mold compound is termed Fan-Out and is covered in the report « Fan-Out Packaging2016 »

• Yole has reviewed:

Market and applications using embedded die technology today and in the future

Industrial and R&D players and supply chains

Business models and its challenges

Market forecasts

• Market forecasts will take into account embedding active dies in laminate IC package substrates, in printed circuit boards and inflexible printed circuit boards


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EMBEDDED PACKAGING TECHNOLOGIES

Embedded packaging technologies with connections

fanned out of the IC surface

Embedding in organic laminateEmbedding in epoxy mold compound

(Fan-Out WLP/PLP)

CHIP FIRST: CF

CHIP LAST: CL

FACE UP: FU

FACE DOWN: FD

Process typeLamination around

the chip

Cavity dig in

substrate

Interconnections type RDLFoundry

BEOL

Coreless

Substrate

Chip orientation

Encapsulator type

CF / CLCF / CL CL

FU / FD FU / FD

Chip placingScope of the Embedded die report


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Leadframes

QFN,QFP

w/o IC substrates

Fan-in Fan-out

IC substrates-based

Package Substrate

(organic)

W/B BGAFlip Chip

BGA3DIC

Interposer based

(Si, Glass, Org)SiP

Embedded die

(in substrate)

ADVANCED PACKAGING PLATFORMS

Overview of advanced packaging platforms

PCB

(organic board)

Increased functionality, performance…

Interconnect:

Single die

Multiple Dies

Integration:2D 3D

Embedded die

(in substrate or PCB)

Bumping, Pillars, Studs, Through-silicon-via, Bump-less, Embedded Technologies...

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What’s new since our last report

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WHAT’S NEW ON THE MARKET SINCE OUR EMBEDDED DIE 2015 REPORT?

• Mobile segment is slowing down causing a ripple effect of consolidation (M&A) throughout the semiconductor industry

• Attention turns to advanced packaging in attempt to continue the cost reduction curve and increase functionality of devices

• Embedded Die packaging is in the initial stage of market development, in favorable position to catch a part of the new wave

Market dynamics – WW semiconductor industry

• New semiconductor drivers are sought with R&D efforts transitioning to IoT and automotive segments

• Higher emphasis on countries in transition in pursuit of new business opportunities, primarily China

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o Although unit growth has continued, the Embedded Die revenue has decreased from 2015 to 2016 mainly due to decline of higher value camera modules in Embedded Die packaging

o A complete recovery and upward slope is expected from 2018

o The mobile segment might still bring highest volumes and revenues, but also highest uncertainty and competition

o Automotive and Medical segment emerge as significant opportunities for the Embedded Die platform with highest projected growth

o The supply chain continues to mature with more participating players in preparation for new products

o New opportunities arise both for Embedding in board and IC package substrate

WHAT’S NEW ON THE MARKET SINCE OUR EMBEDDED DIE 2015 REPORT?

Mobile

=> Mobile segment is still driving Embedded Die production, however, high uncertainty and competition leads to

Automotive and Medical segments as more stable opportunities with highest projected market growth

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GAP IN INTEGRATED PACKAGING FOR MIDDLE AND HIGH POWER APPLICATIONS

Filled in by embedding the die in the PCB

Embedded die packaging already offerssolution bothfor ultra-lowand middle power applications

POWER

(Watt)

PACKAGING

INTEGRATION

Ultra-low Low Middle High

Laminate - Embedded die package - PCB

Flip-Chip BGA

panel

wafer

WL-CSP

SMD

QFN & Leadframe (advanced, ceramic, …)

WLP (Fan-out)

3D-ICA gap to fill in

0,01 1 1 000 100 000

Discrete/ Module

10 00010 100

TO package

Power module

Need more integration


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Embeddingdie packaging

platforms

Embedded die in laminate (substrate)

A die packaged betweenlayers of laminate which is

attached to a final PCB

Embedded die in PCB

A die packaged betweenlayers of laminate forming

the final PCB

Embedded die in flexible substrate

A die packaged betweenlayers of FLEXIBLE laminate

forming the final PCB

Embedded interconnections in

substrate

A silicon bridge is embeddedacting as die-to-die

interconnect

EMBEDDED DIE TECHNOLOGIES SEGMENTATION

Definitions

EMIB technology from INTEL

WABE technology from Fujikura

Courtesy of AT&S

ACTIVE &

PASSIVE DICE

PASSIVE

INTERCONNECT


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KEY PLAYER’S ACTIVITY SUMMARY

Pioneers have paved the way from incubation to volume

PLAYER PRODUCTION STATUS HISTORY PCBASSEMBLY &

TESTTECHNOLOGY MARKET POSITIONING

ASE (TW) middle volume own technology but also produced for external

companies (Infineon)internal internal aEASI Mobile, Consumers

AT&S (AT) middle volume own technology and partnered with UTAC internal UTAC ECPMobile, Automotive, Medical, AD and

Industry

Fujikura (JP) low volume own technology internal NA WABE Medical

General Electric (US) currently licensing own technology and acquired Imbera and

licensed to Taiyo Yuden and ShinkoShinko and TY Shinko and TY POL Automotive, Mobile, Consumers

Infineon (GE) middle volume outsourced to ASE own technology and partnered with ASE ASE ASE Dr Blade ICT, Automotive, Mobile, Consumers

Microsemi (US) low volume acquired Zarlink internal internal NA Medical and power electronic

Schweizer (GE) not started yet own technology internal to be determined P² Pack Automotive

Shinko (JP) high volume own technology internal internal MCeP Mobile

Taiyo Yuden (JP) high volume already proven technology EOMIN and licensing from GE

venturesinternal internal EOMIN Mobile, Consumers

TDK-EPCOS (JP) middle volume own technology and partnered with ASE internal ASE SESUB Mobile, Consumers


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MOTIVATIONS AND DRIVERS FOR EMBEDDING COMPONENTS

By applications

Form factor

Shorterinterconnections

Highercomponents integration

Protection against harshenvironment

Thermal management

Design flexibility

Wireless module

Digital and processor module

Wireless module


Lighting module

Power management module

Power management unit

Power management unit

Wireless module

Sensor module

Wireless module

Lighting module

Sensor module



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EMBEDDED DIE MARKET

Mobile

Consumers

Information Communication &

Technology

Automotive

Medical

A&D and

Industry

Thanks to its diversity,

embedded die packaging

serves different markets,

which are not submitted

to the same business

cycles. Initially present in

mobile market, ED

packaging have

penetrated ICT and

medical market

demanding on customed

solutions


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EMBEDDED DIE ACTIVITY MARKET FORECAST

Breakdown by market: revenues analysis (1/2)

• In 2021, ED packaging revenues will reach50 million dollars

* These revenues do not include revenues from MCeP packaging from Shinko

0

10 000 000

20 000 000

30 000 000

40 000 000

50 000 000

60 000 000

2015 2016 2017 2018 2019 2020 2021 CAGR

Emb

edd

ed D

ie P

acka

gin

g R

even

ue

($)

Embedded Die Packaging REVENUE FORECAST2015 - 2021

MOBILE CONSUMERS MEDICAL AUTOMOTIVE ICT A&D and INDUSTRY TOTAL


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Breakdown by market: units analysis (1/2)


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Forecasts including MCeP


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EMBEDDED DIE MARKET AND APPLICATIONS MATRIX

MODULES

MARKETS APPLICATIONS Wireless module Power Management Sensor module Digital & Processor

moduleLighting module

MOBILE Smartphone & Tablet x x x x

MEDICAL

Medical implants xx

Medical wearables x

AEROSPACE AND DEFENSE

Commercial aircraft x

Military communication x

Security x x

AUTOMOTIVE Vehicles x x

CONSUMERS Wearables x x

INFORMATION AND

COMMUNICATION TECHNOLOGY

Telecommunication x

High-end computing x


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Middle performance

component for mobile

and power electronics

for automotive

Low-end

component for

mobile market

High-end

component

available in

premium mobile

market

EMBEDDED DIE PACKAGING COST CONSIDERATIONS

Year

Packaging cost(Assembly, Test & Yield loss)

Cooled power switch

transistor

DC-DC converter

Power

Management

2011 2016

Microprocessor

for smartphone

Cost

available

in report

$$$$$

$$$$

$


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VOLUME PRODUCTION TECHNICAL ROADMAP FOR EMBEDDED DIE IN LAMINATE

Key parameters

2020


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IN BOARD 2013 2014 2015 2016 2017 2018 2019 2020

Pad pitch on die 250 µm 200 µm 150 µm 120 µm 80 µm 50 µm

Nb of chips embedded 1 2*

Line/space 25/25 µm 15/15 µm

Min package thickness 800 µm 650 µm 400 µm

Copper layer thickness(Min-Max)

Build-up layers 4 (standard app)

Max I/O numbers 40 100

VOLUME PRODUCTION TECHNICAL ROADMAP FOR EMBEDDED DIE IN RIGID PCB

Key parameters


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IN FLEXIBLE 2013 2014 2015 2016 2017 2018 2019 2020

Pad pitch on die 150 µm 125 µm

Number of chips stacked Stacked by folding

Line/space 50/50 µm 25/25 µm 20/20 µm

Min package thickness 800 µm 650 µm 400 µm 320 µm

Chip thickness (Min-Max) 150 – 350 µm 80 – 100 µm 30 – 80 µm

Build-up layers 4 (standard) 6 (available)

Max I/O (die) numbers 80 120

VOLUME PRODUCTION TECHNICAL ROADMAP FOR EMBEDDED DIE IN FLEXIBLE SUBSTRATE

Key parameters


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EMBEDDED DIE PACKAGING MAIN PLAYERS MAPPING

Passives manufacturers

Substrate & PCB mnf

OSAT companies

Fabless companies

Component & IDM

Research institutes &

Governmental agencies


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EXAMPLES OF BUSINESS ECOSYSTEM

CASE 1: OSAT as prime contractor

OSATResponsible for yield

& delivering final

component

Customer(final product maker/

end-user)

Laminate &

PCB supplier

In charge of :

- SMT assembly

- product level assembly

- Singulation and final

testing

Subcontractor

In charge of :

- Final finish of wafers

(copper pads)

In charge of :

- PCB manufacturing

- Die placement

- Build-up

- Circuitization

- PCB design (optional)

In charge of :

- Die specifications

- PCB design (optional)

Wafer foundry

In charge of :

- Die design

- Wafer production

- KGD testing

- Final finish of wafers

(copper pads)


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Chip PassivesLaminate &

board makerOSAT

Components & IDM

Fabless Final products End-users

EMBEDDED DIE PACKAGING SUPPLY CHAIN

Examples of commercial and development partnerships


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Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media in addition to corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing (technology or process), Yole Développement group has expanded to include more than 50 associates worldwide covering MEMS, Compound Semiconductors, LED, Image Sensors, Optoelectronics, Microfluidics & Medical, Photovoltaics, Advanced Packaging, Manufacturing, Nanomaterials and Power Electronics. The group supports industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business.

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FIELDS OF EXPERTISE

Yole Développement’s 30 analysts operate in the following areas

MEMS & Sensors

LED

Compound

Semi.

Imaging

Photonics

MedTech

Manufacturing

Advanced

Packaging

Batteries / Energy

Management

Power

Electronics

Displays

RF

Devices &

Techno.

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4 BUSINESS MODELS

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A GROUP OF COMPANIES

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technology and

strategy

consulting

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Cost simulation tools

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Patent assessment

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OUR 2016 REPORTS PLANNING (1/2)

MARKET AND TECHNOLOGY REPORTS

by Yole Développement

o MEMS & SENSORS

− Gas Sensor Technology and Market 2016

− Status of the MEMS Industry 2016

− Sensors for Cellphones and Tablets 2016

− Inkjet Printhead Market & Technology Trends 2016

− Sensors for Biometry and Recognition 2016

− Finger Print Sensors Market and Technologies 2016

− Silicon Photonics 2016

− Emerging Non Volatile Memories 2016

o IMAGING & OPTOELECTRONICS

− Status of the CMOS Image Sensor Industry 2016

− Uncooled Infrared Imaging Technology & Market Trends 2016

− Imaging Technologies for Automotive 2016

− Sensors for Drones & Robots: Market Opportunities and Technology

Evolution 2016

− Silicon Photonics 2016

o MEDTECH

− BioMEMS: Microsystems for Healthcare Applications 2016

− Point of Need Testing 2016: Application of Microfluidic Technologies

o ADVANCED PACKAGING

− Fan-Out WLP: Technology Trends and Business Update 2016

− Embedded Die Packaging: Technologies and Markets Trends 2016

− 2.5D & 3D IC Business Update 2016

− Status and Prospects for the Advanced Packaging Industry in China 2016

− Fan-in Wafer Level Packaging: Market and Technology Trends 2016

o MANUFACTURING

− Thinning & Dicing Equipment for Advanced Packaging, MEMS, Photovoltaics,

LED, CMOS 2016


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OUR 2016 REPORTS PLANNING (2/2)

o COMPOUND SEMICONDUCTORS

− Power SiC 2016: Materials, Devices, Modules, and Applications

− GaN Modules, Devices and Substrates for Power Electronics 2016

− Sapphire Applications & Market 2016: from LED to Consumer Electronics

− GaN RF Devices Market: Applications, Players, Technology, and Substrates

2016 – 2022

− RF components and modules for cellphones 2016**

o LED

− Sapphire Applications and Market 2016: From LED to Consumer Electronics

− Thermal Management for LED and Power 2016

− LED Packaging 2016

− Microdisplays and MicroLEDs 2016**

− UV LEDs - Technology, Manufacturing and Application Trends

− OLED for Lighting - Technology, Industry and Market Trends 2016

− Automotive Lighting: Technologies, Industry and Market Trends 2016

o POWER ELECTRONICS

− Power Electronics for EV/HEV 2016: Market, Innovations and Trends

− Status of Power Electronics Industry 2016

− Passive Components Technologies and Market Trends for Power Electronics

2016

− Power SiC 2016: Materials, Devices, Modules, and Applications

− GaN Modules, Devices and Substrates for Power Electronics 2016

− Inverter Technologies Trends & Market Expectations 2016

− Opportunities for Power Electronics in Renewable Electricity Generation

2016

− Thermal Management for LED and Power 2016

− GaN RF Devices Market: Applications, Players, Technology, and Substrates

2016 - 2022

o BATTERY

− Stationary Storage and Automotive Li-ion Battery Packs

− Beyond Li-ion Batteries: Present and Future Li-ion Technology Challengers

PATENT ANALYSIS by Knowmadeo Patent Infringement (crossed analysis based on Knowmade and System Plus

Analysis expertise)

o Patent Investigation (crossed analysis based on Knowmade & Yole Développement

expertise)

o Patent Landscape

TEARDOWN & REVERSE COSTING by System Plus

ConsultingMore than 30 teardowns and reverse costing analysis and cost simulation tools to be

published in 2016.


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OUR 2015 PUBLISHED REPORTS LIST

o MEMS & SENSORS

− Sensors and Data Management for Autonomous Vehicles

− Sensors for Wearable Electronics And Mobile Healthcare

− Status of the MEMS Industry

− Uncooled Infrared Imaging Technology & Market Trends

− Infrared Detector Technology & Market Trends

− High-End Gyroscopes, Accelerometers and IMUs for Defense, Aerospace &

Industrial

− Emerging Non Volatile Memory (NVM) Technology & Market Trends

o IMAGING & OPTOELECTRONICS

− Camera Module Industry

− Uncooled Infrared Imaging Technology & Market Trends

− Status of the CMOS Image Sensors

− Infrared Detector Technology & Market Trends

o MEDTECH

− Sample Preparation Automation Through Emerging Microfluidic Technologies

− 2015 Microfluidic Applications in the Pharmaceutical, Life Sciences, In-Vitro

Diagnostic, and Medical Device Markets

− Sensors for Wearable Electronics And Mobile Healthcare

o COMPOUND SEMICONDUCTORS


− SiC, GaN, and other Wide Band Gap (WBG) materials for power electronics

applications

− GaN and SiC Devices for Power Electronics Applications

o LED

− LED Lighting Module Technology, Industry and Market Trends 2015

− UV LED - Technology, Manufacturing and Application Trends

− Phosphors & Quantum Dots 2015: LED Downconverters for Lighting & Displays


o POWER ELECTRONICS

− Power Packaging Technology Trends and Market Expectations

− Energy Management for Smart Grid, Cities and Buildings: Opportunities for Battery

Electricity Storage Solutions

− Status of Chinese Power Electronics Industry

− New Technologies and Architectures for Efficient Data Center

− IGBT Market and Technology Trends

− Status of Power Electronics Industry

− SiC, GaN, and other Wide Band Gap (WBG) materials for power electronics

applications

− GaN and SiC Devices for Power Electronics Applications

o ADVANCED PACKAGING

− Status of the Advanced Packaging Industry

− Supply Chain Readiness for Panel Manufacturing in Packaging

− Fan-in Wafer Level Packaging: Market and Technology Trends

− Flip Chip: Technologies and Markets Trends

− Fan-Out and Embedded Die: Technologies & Market Trends

o MANUFACTURING

− Photolithography Equipment and Materials for Advanced Packaging, MEMS and

LED Applications

− Emerging Non Volatile Memory (NVM) Technology & Market Trends


http://www.yole.fr/

http://www.yole.fr/

40

CONTACT INFORMATION

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• Consulting and Specific Analysis

• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: [email protected]

• Japan & Asia: Takashi Onozawa, Representative Director, Yole KKEmail: [email protected]

• RoW: Jean-Christophe Eloy, CEO & President, Yole DéveloppementEmail [email protected]

• Report business

• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: [email protected]

• Europe: Lizzie Levenez, EMEA Business Development ManagerEmail: [email protected]

• Japan & Asia: Takashi Onozawa, Representative Director, Yole KK.Email: [email protected]

• Greater China: Mavis Wang, Business Development DirectorEmail: [email protected]

• Financial services

• Jean-Christophe Eloy, CEO & PresidentEmail: [email protected]

• General

• Email: [email protected]


http://www.yole.fr/

http://www.yole.fr/

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