Sep-14 1

Taking the Stress out of Packaging Adrian Arcedera l Sr. Director, MEMS and Sensor Products

Sep-14 2

About Amkor Technology

Amkor Technology, Inc. is one of the world's largest and most

accomplished providers of state-of-the-art packaging design, assembly

and test services. Founded in 1968, Amkor is a strategic partner to

leading semiconductor companies and electronics OEMs. Our

operational base encompasses over 5.8M ft2 of volume production,

development, sales and support services in Asia, Europe and the

United States. Our solutions enable our customers to focus on

semiconductor design and wafer fabrication while utilizing Amkor as

their turnkey provider and, where required, their packaging technology

innovator.

Sep-14 3

MEMS and Sensor Experience

1980s 1990s 2000 2002 2005 2008 2009 2011 2012 2013

CCD

Sensor

Ceramic/

Hermetic

Package

ChipArray® BGA, MLF®,

Fingerprint, SOIC

Cavity MEMS, In-Frame

MLF®, Cavity SOIC

Laminate

to Laminate

Film Assist

SOIC

MLF®,

Cavity

MEMS

Polymer Lid

Sep-14 4

Growth and Adoption of Automotive MEMS Sensors The role of government regulations in the MEMS market

1970’s 1980’s 1990’s 2000’s 2010’s 2020’s

Fuel Economy

Improvements

Airbags

Tire Pressure

Monitoring

Electronic

Stability

Control

Pedestrian/

Collision

Avoidance?

Sep-14 5

Rapid Growth in Consumer MEMS

<2004 2004 2007 2009 2010 2012 2013 2014 2015

Color Inkjet

Nintendo Wii

iPhone

iPhone 3GS

iPhone 4 Samsung S4/iPhone 5S

Samsung S3 Samsung S5

Wearables

Sep-14 6

MEMS Packaging Challenge

Controlling stresses to the

MEMS structure

Allowing the stimuli to

reach the MEMS structure

Protecting the MEMS and

ASIC devices

More stringent device

package protection

Customized requirements

Quick turn-around time

Highly reusable

packaging

Miniaturization roadmap

Automotive Market Consumer Market General Requirements

Sep-14 7

MEMS Packaging Complexity

Overmolded or Cavity Package?

Wirebond or flip-chip?

Die attach material?

EMI shielding?

Laminate or leadframe?

Wire type, loop radius

and gauge?

Molded-in stress?

Leaded or not? Encapsulation?

Stacked die or side-by-side?

How/what to test?

Sep-14 8

MEMS/Sensor

Performance Package Type

Molded MLF®

Molded

ChipArray® LGA

Cavity MLF®

Cavity Ceramic/Hermetic

Good

Better

Best

Packaging Technology is a Differentiator

Overmolded MLF® Cavity MLF®

Sep-14 9

Materials Help Manage Die Stress

From material datasheets From simulation results

0

500

1000

1500

2000

2500

Epoxy - C Film Epoxy - NC Silicone1 Silicone2

Mo

du

lus -

MP

a

Die Attach Adhesives

0

0.001

0.002

0.003

0.004

0.005

0.006

0.007

FR5 Ceramic FR5-1 FR5-2

S1 P

rin

cip

al S

tress -

MP

a

Substrate Thickness/Material

Thin

Thick

Sep-14 10

Focusing on Cavity Package

Standard on the outside,

custom on the inside

Sensor fusion ready, multiple

MEMS/sensor dice

Multiple stimuli opening/ports

Low stress bill of materials

Applicable to leadframes and

laminates

Sep-14 11

MEMS Package Evolution

Overmolded Exposed Die Surface Cavity Package

SOIC

MLF®/QFN

ChipArray®

LGA/BGA

Sep-14 12

MEMS Package – Next Generation

Cavity Package Hybrid Cavity Package

MLF®/QFN

ChipArray®

BGA

Sep-14 13

Packaging

Inter-connection

MEMS Capping/Interconnect Trend

MEMS Wafer Capping

TBD

Through Silicon Vias Overmolded CSP

ME

MS

De

vic

e

*TSV, TGV is at foundry level.

3D Functional Cap Through Glass Vias

Chip on Chip

Thin Film Capping (RnD Stage)

Pre-Mold/Cavity

Overmolded CSP/MLF®

Cavity Packaging

Glass Cap

Silicon Cap

Hermetic Packaging Bare Die

WLCSP

Cavity CSP

Sep-14 14

Packaging

Inter-connection

Sensor Fusion Trend

MEMS Wafer Capping

Overmolded CSP

Through Silicon Vias

WLCSP ME

MS

Se

ns

ors

*TSV, TGV is at foundry level.

3D Functional Cap

Chip on Chip

Capped, Uncapped Sensors

Flip Chip, Stacked

Wirebond, Side by Side, Stacked Cavity Packaging

Overmolded CSP

Cavity CSP

Sep-14 15

MEMS and Sensor Standard Platforms

*Not compatible

Accelerometers Gyroscopes

Magnetometers

Overmolded Packaging ChipArray® BGA MLF® Dual

Cavity Packaging Hermetic/Ceramic Cavity Laminate/LF Cavity

Wafer Level Package

Microphone Pressure Sensors

Overmolded Packaging ChipArray® BGA MLF® Dual

Cavity Packaging Ceramic Cavity Laminate Cavity

Wafer Level Package

Temperature & Humidity Sensors

Overmolded Packaging ChipArray® BGA MLF® Dual

Cavity Packaging Ceramic Cavity Laminate Cavity Exposed Die Surface

Wafer Level Package

Bio-metric Bio-medical

Overmolded Packaging ChipArray® BGA MLF®

Dual

Cavity Packaging Laminate or LF Cavity Ceramic Cavity Exposed Die Surface

Wafer Level Package

Microbolometers Displays

Overmolded Packaging ChipArray® BGA MLF® Dual

Cavity Packaging Laminate or LF Cavity Ceramic Cavity Exposed Die Surface

Wafer Level Package

RF Switch Oscillators

Overmolded Packaging ChipArray® BGA MLF® Dual

Cavity Packaging Ceramic Cavity Laminate/LF Cavity

Wafer Level Package

Sep-14 16

In Summary

MEMS Sensor Market is Growing…

– Wide array of consumer applications driven by “smart devices”

– The automotive MEMS sensor market continues to grow with worldwide mandates on

safety, efficiency and driver assistance

Standard Platforms = Faster Development

– Faster introduction of new products

– Lower development cost

Amkor Experience

– Dedicated MEMS Team

– Constantly updating the MEMS Toolbox with investments on new equipment and

materials and leveraging other core technologies like TSV, Cu Pillar

Sep-14 17

Contact Amkor For Further Information

Amkor Corporate Amkor Euroservices

1900 South Price Road Immeuble Alliance

Chandler, AZ 85286 Batiment C

USA Archamps, Archamps 74160

Phone: 1.480.821.5000 France

Phone: 33.4.50.31.88.00

Sep-14 18

Thank You!