© 2016, amkor technology, inc. 1meptec.org/resources/11 - arcedera.pdf© 2016, amkor technology,...


Standardization of Packaging for the Internet of ThingsAdrian Arcedera l VP of MEMS and Sensor Products


About Amkor TechnologyAmkor Technology, Inc. is one of the world's largest and most accomplished providers of state-of-the-art packaging design, assembly and test services. Founded in 1968, Amkor is a strategic partner to leading semiconductor companies and electronics OEMs. Our operational base encompasses over 5.8M ft2 of volume production, development, sales and support services in Asia, Europe and the US. Our solutions enable our customers to focus on semiconductor design and wafer fabrication while utilizing Amkor as their turnkey provider and, where required, their packaging technology innovator.


The Internet of Things

Semiconductors

Services

Hardware

Software

60%

16%

12%

12%

Value SegmentationIC Insights ($96B) 2018

$57.6B

$15.4B

$11.5B

$11.5B


The Building Blocks of the “Internet of Things”

Internetof

Things


General IoT Packaging Requirements Low cost Low power RF requirements (shielding) Scalable to high volume

manufacturing Small package size

– Discrete solution – Integrated solution

Stimulus delivery


Current Discrete Packaging for IoT

Connectivity Memory Power Management

Microprocessor &Microcontroller

MEMS & Sensor

SOIC/TSSOP *

QFN/TQFP *

Laminate CSP *

WLCSP *Note: *Limited Compatibility


What makes MEMS and SensorPackaging Different?


Growth and Adoption of Automotive MEMS SensorsThe role of government regulations in the MEMS market

1970’s 1980’s 1990’s 2000’s 2010’s 2020’s

Fuel Economy Improvements

Airbags

Tire Pressure Monitoring

Electronic Stability Control

Pedestrian/ Collision

Avoidance?


Rapid Growth in Consumer MEMS

<2004 2004 2007 2009 2010 2012 2013 2014 2015

Color Inkjet

Nintendo Wii

iPhone

iPhone 3GS

iPhone 4 Samsung S4/iPhone 5S

Samsung S3 Samsung S5

Wearables


The Packaging Challenge – Stimulus DeliveryMEMS are NOT ICs!

Source: Yole 2014 MEMS Industry Report

MEMS – Micro Electro Mechanical Systems are tiny structures created in the silicon designed to respond to various stimuli from the “real world”

Bell Labs, US 1947 22 nm Technology Sandia’s, Micromachine (MEMS)

No standard process (CMOS, BiCMOS…) No p-n junction for MEMS And as a consequence, NO ROADMAP

Courtesy Sandia National Laboratories SUMMiT™ Technologies www.mems.sandia.gov


MEMS and Sensor Packaging Requirements

Acc

el/G

yro

Mag

netic

Mic

roph

one

Tem

pera

ture

/H

umid

ity

Pres

sure

/A

ltim

eter

Gas

Ges

ture

IR RF/

BA

W/S

aw/

Osc

illat

or

Bio

/Med

WaferHandling

Capped Wafer Handling Stealth Dicing

StimulusDelivery

Package Port Hole (Top) Package Port Hole (Bottom)

Die AttachOptions

Low Modulus DA Thermal DA Low CTE Substrates Multi Die-Stacked Multi Die-SBS FlipStack® Multi Sensor

Interconnect Options

Wirebond Au Stud Bump Flip Chip TSV* Copper Pillar + COW

*TSV, TGV is at foundry level.


MEMS and Sensor Packaging Requirements

Acc

el/G

yro

Mag

netic

Mic

roph

one

Tem

pera

ture

/H

umid

ity

Pres

sure

/A

ltim

eter

Gas

Ges

ture

IR RF/

BA

W/S

aw/

Osc

illat

or

Bio

/Med

PackageProtection

Overmolded Leadframe

Overmolded Laminate

Lidded Package Lidded + Molded Package

Bio-compatible Lid

Exposed Die

Non-Ferromagnetic

Port Hole Filter

EMI Shielding

Cavity Fill/Die Coat

Black Die Coating

Clear Die Mold

Gel Fill


PackagingInter-connection

MEMS Capping/Interconnect TrendMEMS Wafer Capping

TBD

Through Silicon Vias Overmolded CSP

MEM

S D

evic

e


3D Functional Cap Through Glass Vias

Chip on Chip

Thin Film Capping(RnD Stage)

Pre-Mold/Cavity

Overmolded CSP/MLF®

Cavity Packaging

Glass Cap

Silicon Cap

Hermetic PackagingBare Die

WLCSP

Cavity CSP


MEMS Packaging ComplexityOvermolded or cavity package?

Wirebond or flip-chip?

Die attach material?

EMI shielding?

Laminate or leadframe?

Wire type, loop radiusand gauge?

Molded-in stress?

Leaded or not? Encapsulation?

Stacked die or side-by-side?

How/what to test?


Materials Help Manage Die Stress

From material datasheets From simulation results

0

500

1000

1500

2000

2500

Epoxy - C Film Epoxy - NC Silicone1 Silicone2

Mod

ulus

-M

Pa

Die Attach Adhesives

0

0.001

0.002

0.003

0.004

0.005

0.006

0.007

FR5 Ceramic FR5-1 FR5-2

S1 P

rinci

pal S

tres

s -M

Pa

Substrate Thickness/Material

Thin

Thick


Packaging Technologies and Material Sets are the Performance Differentiator

0

2

4

6

8

10

12

1 2 3 4 5 6 7 8 9 10 11V

ertic

al H

eigh

t

Series1

Series2

Series3


MEMS/Sensor Package Standardization


Standard Platforms Enable Faster Developmentfor MEMS/Sensor Discrete Packaging


Overmolded ExposedDie Surface

CavityPackage

SOIC

QFN

LaminateLGA/FPBGA

Evolution Towards Standardizationfor MEMS/Sensor Packaging


Die Top StressHigh

Low

Pack

age

Cos

t

High

Low

Overmolded Exposed Die Pre-Mold & Cavity

Ceramic Package

Cost vs. Performance Comparison


Market Acceptance

Overmolded ExposedDie Surface

CavityPackage

SOIC Widely accepted in the automotive market Cavity package used in automotive pressure sensors

QFN Smaller footprint than SOIC, well suited for consumer market Available “wettable flank” enables more automotive applications

LaminateLGA/FPBGA

Small size and design flexibility make it favorable for sensor fusion and IoT applications for the consumer market

Laminate + cavity package provides very good flexibility Gaining traction in automotive markets


Today’s Sensor Clusters

http://i-micronews.com/component/hikashop/product/camera-module-industry-report.html?Itemid=0

http://i-micronews.com/component/hikashop/product/camera-module-industry-report.html?Itemid=0


PackagingInter-connection

Sensor Fusion Trend

MEMS Wafer Capping

Overmolded CSP

Through Silicon Vias

WLCSP

MEM

S Se

nsor

s


3DFunctional Cap

Chip on Chip

Capped, Uncapped Sensors

Flip Chip, Stacked

Wirebond, Side by Side, Stacked Cavity Packaging

Overmolded CSP

Cavity CSP


Adding IoT Blocks to MEMS/Sensor Package

Bluetooth RadioLGA Package

Pkg Size ~ 3mm sq

Connectivity MEMS/Sensor

Inertial SensorLGA Package

Pkg Size ~ 3.5 mm sq

8-bit Microcontroller

LGA Package

Pkg Size ~ 5 mm sq

Microcontroller LGA PackagePkg Size ~ 6 mm sq

IOT Package


Adding IoT Blocks to MEMS/Sensor Package

Cavity Package Hybrid Cavity Package

MLF®/QFN

LaminateLGA/FPBGA


Discrete vs. Integrated IoT Solutions

Integrated Discrete Prospects Smaller body size, smaller motherboard space Packaging cost reduction Less complex SMT process Less inventory (for IoT blocks)

Prospects Widely available, existing assembly and test

infrastructure Flexible sources of IoT blocks/components Known good IoT block/component binning

Potential Concerns Known good IoT block/components MEMS/Sensor die stress management Compounded yield, multi test and sensor

trimming

Potential Concerns Larger motherboard space Limited package size reduction


In Summary Integration is happening at the front-end to complete the building blocks

of IoT The discrete packaging solutions are available today, but Integration

and the IoT module assembly is needed to push IoT into more applications

MEMS/Sensor device packaging standardization can be applied to IoTmodule assembly to offer a single package solution without sacrificing performance

Standard IoT platforms = faster development – Faster introduction of new products – IoT monetization


What will you integrate?

Connectivity + Memory + Microprocessor/Microcontrollers

PowerManagement

+ MEMS/Sensors =

=IoT


Next Steps to Standard Packaging and Test… “Standard package platforms will help speed up

integration and monetize IoT” What will you integrate? Standard Packaging

for IoT– What are the priority MEMS / Sensor devices?– Will it be MEMS + Connectivity or MEMS +

Microcontroller + Connectivity? Etc.– Standard Pre-mold Package Outlines?– Special features needed - Antenna? Shielding?

Tester and Handler Development– How can we minimize Test time and reduce the

number of insertion?


Thank You


Contact Amkor for Further InformationSan Jose Sales Office25 Metro DriveSuite 700San Jose, CA 95110 USA

Tel: 408.496.0303Email: [email protected]

Corporate Headquarters2045 East Innovation CircleTempe, AZ 85284 USA

Tel: 480.821.5000Email: [email protected]


Q & A

© 2016, amkor technology, inc. 1meptec.org/resources/11 - arcedera.pdf© 2016, amkor technology,...

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