sra: spreading resistance analysis...sra: spreading resistance analysis (two-point probe system)...

1
SRA: Spreading Resistance Analysis (Two-Point Probe system) Probing Fig.2 Example of SRA on a beveled sample Fig.3 : Optical profilometer view of SRA on a beveled sample Fig.1 Birds eye view of SRA sample and probes Spreading Resistance Analysis (SRA) is a technique used to analyze resistivity versus depth in semiconducting samples as a function of position. Two metal probes spaced about 20 μm apart are pressed against the bevel surface of the semiconductor and the resistance between these probes is measured. carrier concentration : 10 13 10 20 carrier / cm 3 Measurable range depth : 100nmmm order resistivity : 10 -3 10 3 cm minimum area size : sub mm square ApplicationCMOS (P-channel Source-Drain) Fig.4 : Shallow profile near the source-drain Fig.5 Steeper profiles (plotted on 2 depth scales) of the N-Well, Epi, and Substrate carrier concentration /cc carrier concentration /cc carrier concentration /cc Evaluation of the junction depth and depth profile of carriers is possible! depth-microns depth-microns depth-microns substrate : Si, Ge, and SiGe Toray Research Center, Inc. P00413表面科学第2研究室20061227 STC:開(20071205)

Upload: others

Post on 08-Oct-2020

6 views

Category:

Documents


0 download

TRANSCRIPT

Page 1: SRA: Spreading Resistance Analysis...SRA: Spreading Resistance Analysis (Two-Point Probe system) Probing Fig.2 Example of SRA on a beveled sample Fig.3 : Optical profilometer view

SRA: Spreading Resistance Analysis(Two-Point Probe system)

Probing

Fig.2 Example of SRA on a beveled sample

Fig.3 : Optical profilometer view of SRA on a beveled sample

Fig.1 Birds eye view of SRA sample and probes

Spreading Resistance Analysis (SRA) is a technique used to analyze resistivity versus depth in semiconducting samples as a function of position. Two metal probes spaced about 20 μm apart are pressed against the bevel surface of the semiconductor and the resistance between these probes is measured.

carrier concentration : 1013~1020 carrier / cm3

Measurable range

depth : 100nm~mm orderresistivity : 10-3~103 Ω・cm

minimum area size : sub mm square

Application: CMOS (P-channel Source-Drain)

Fig.4 : Shallow profile near the source-drain Fig.5 Steeper profiles (plotted on 2 depth scales) ofthe N-Well, Epi, and Substrate

carr

ier

con

cent

ratio

n /c

c

carr

ier

con

cent

ratio

n /c

c

carr

ier

con

cent

ratio

n /c

c

Evaluation of the junction depth and depth profile of carriers is possible!

depth-microns depth-microns depth-microns

substrate : Si, Ge, and SiGe

Toray Research Center, Inc.P00413表面科学第2研究室20061227

STC:開(20071205)