sim7600 series hardware design v1.02 comfidential

SIM7600 Series_Hardware Design_V1.02

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Smart Machine Smart Decision

SIM7600 Series _Hardware Design _V1.02 2 2018-4-11

ocument Title SIM7600 Series _Hardware Design

Version 1.02

Date 2018-4-11

Status Released

Document Control ID SIM7600 Series _Hardware Design _V1.02

General Notes SIMCom offers this information as a service to its customers to support the application and engineering efforts that use the products designed by SIMCom. The information provided is based on the requirements specifically from the customers. SIMCom has not undertaken any independent search for additional relevant information, including any information that may be in the customer’s possession. Furthermore, the system validation of the product designed by SIMCom within a larger electronic system remains the responsibility of the customer or the customer’s system integrator. All specifications supplied herein are subject to change without notice. Copyright This document contains the proprietary technical information which is the property of SIMCom Limited, copying of this document, giving it to others, the using or communication of the contents thereof are forbidden without the official authority by SIMCom. Offenders are liable to the payment of the damages. All rights are reserved in the event of grant of a patent or the registration of a utility model or design. All specifications supplied herein are subject to change without notice Copyright © SIMCom Wireless Solutions Co., Ltd. 2018

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Contents

Contents .............................................................................................................................................3

Table Index ........................................................................................................................................5

Revision History ................................................................................................................................7

1 Introduction ................................................................................................................................8

1.1 Product Outline .....................................................................................................................8

1.2 Hardware Interface Overview ...............................................................................................9

1.3 Hardware Block Diagram......................................................................................................9

1.4 Functional Overview ...........................................................................................................10

2 Package Information................................................................................................................12

2.1 Pin Assignment Overview ...................................................................................................12

2.2 Pin Description ....................................................................................................................14

2.3 Mechanical Information ......................................................................................................18

2.4 Footprint Recommendation .................................................................................................19

3 Interface Application ...............................................................................................................20

3.1 Power Supply ......................................................................................................................20

3.1.1 Power Supply Design Guide ........................................................................................21

3.1.2 Recommended Power Supply Circuit ..........................................................................22

3.1.3 Voltage Monitor ............................................................................................................22

3.2 Power on/Power off/Reset Function ....................................................................................23

3.2.1 Power on .......................................................................................................................23

3.2.2 Power off ......................................................................................................................24

3.2.3 Reset Function ..............................................................................................................25

3.3 UART Interface ...................................................................................................................26

3.3.1 UART Design Guide ....................................................................................................26

3.3.2 RI and DTR Behavior ...................................................................................................28

3.4 USB Interface ......................................................................................................................29

3.5 USIM Interface....................................................................................................................29

3.5.1 USIM Application Guide ..............................................................................................30

3.6 PCM Interface .....................................................................................................................32

3.6.1 PCM timing ..................................................................................................................32

3.6.2 PCM Application Guide ...............................................................................................33

3.7 SD Interface ........................................................................................................................34

3.8 I2C Interface........................................................................................................................35

3.9 SDIO Interface ....................................................................................................................35

3.10 SPI Interface ....................................................................................................................35

3.11 Network status .................................................................................................................36

3.12 Flight Mode Control ........................................................................................................36

3.13 Other interface .................................................................................................................37

3.13.1 Sink Current Source ..................................................................................................37

3.13.2 ADC ..........................................................................................................................38

3.13.3 LDO ..........................................................................................................................38

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4 RF Specifications ......................................................................................................................40

4.1 GSM/UMTS/LTE RF Specifications ..................................................................................40

4.2 GSM /UMTS/LTE Antenna Design Guide ..........................................................................42

4.3 GNSS ..................................................................................................................................44

4.3.1 GNSS Technical specification ......................................................................................44

4.3.2 GNSS Application Guide .............................................................................................44

5 Electrical Specifications ...........................................................................................................46

5.1 Absolute maximum ratings .................................................................................................46

5.2 Operating conditions ...........................................................................................................46

5.3 Operating Mode ..................................................................................................................47

5.3.1 Operating Mode Definition ..........................................................................................47

5.3.2 Sleep mode ...................................................................................................................48

5.3.3 Minimum functionality mode and Flight mode ............................................................48

5.4 Current Consumption ..........................................................................................................49

5.5 ESD Notes ...........................................................................................................................51

6 SMT Production Guide ...........................................................................................................52

6.1 Top and Bottom View of MODULE ...................................................................................52

6.2 Label Information ................................................................................................................52

6.3 Typical SMT Reflow Profile ...............................................................................................53

6.4 Moisture Sensitivity Level (MSL) ......................................................................................53

6.5 Stencil Foil Design Recommendation .................................................................................54

7 Packaging ..................................................................................................................................55

Appendix ..........................................................................................................................................57

A. Reference Design ......................................................................................................................57

B. Coding Schemes and Maximum Net Data Rates over Air Interface.........................................58

C. Related Documents ...................................................................................................................60

D. Terms and Abbreviations ..........................................................................................................62

E. Safety Caution ...........................................................................................................................64

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Table Index Table 1: Module frequency bands ........................................................................................................................ 8

Table 2: General features ................................................................................................................................... 10

Table 3: Pin definition ........................................................................................................................................ 13

Table 4: IO parameters definition....................................................................................................................... 14

Table 5: Pin description ...................................................................................................................................... 14

Table 6: VBAT pins electronic characteristic ..................................................................................................... 20

Table 7: Recommended Zener diode list ............................................................................................................ 21

Table 8: Power on timing and electronic characteristic ...................................................................................... 24

Table 9: Power off timing and electronic characteristic ..................................................................................... 25

Table 10: RESET pin electronic characteristic ................................................................................................... 26

Table 11: USIM electronic characteristic in 1.8V mode (USIM_VDD=1.8V) ................................................... 29

Table 12: USIM electronic characteristic 3.0V mode (USIM_VDD=2.95V) .................................................... 30

Table 13: Amphenol USIM socket pin description ............................................................................................ 31

Table 14: PCM format........................................................................................................................................ 32

Table 15: PCM timing parameters ..................................................................................................................... 33

Table 16: MMC/SD electronic characteristic (SD_DATA0-SD_DATA3，SD_CLK and SD_CMD) * ............ 34

Table 17: NETLIGHT pin status ........................................................................................................................ 36

Table 18: FLIGHTMODE pin status .................................................................................................................. 37

Table 19: Sink current electronic characteristic ................................................................................................. 37

Table 20: ADC1 and ADC2 electronic characteristics ....................................................................................... 38

Table 21: Electronic characteristic ..................................................................................................................... 39

Table 22: Conducted transmission power .......................................................................................................... 40

Table 23: Operating frequencies ........................................................................................................................ 40

Table 24: E-UTRA operating bands ................................................................................................................... 41

Table 25: Conducted receive sensitivity ............................................................................................................. 41

Table 26: Reference sensitivity (QPSK) ............................................................................................................ 42

Table 27: Trace loss ........................................................................................................................................... 42

Table 28: Recommended TVS ........................................................................................................................... 44

Table 29: Absolute maximum ratings ................................................................................................................. 46

Table 30: Recommended operating ratings ........................................................................................................ 46

Table 31: 1.8V Digital I/O characteristics* ........................................................................................................ 46

Table 32: Operating temperature ........................................................................................................................ 47

Table 33: Operating mode Definition ................................................................................................................. 47

Table 34: Current consumption on VBAT Pins (VBAT=3.8V) .......................................................................... 49

Table 35: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%) ............................. 51

Table 36: The description of label information .................................................................................................. 53

Table 37: Moisture Sensitivity Level and Floor Life ......................................................................................... 54

Table 38: Tray size ............................................................................................................................................. 56

Table 39: Small Carton size ............................................................................................................................... 56

Table 40: Big Carton size ................................................................................................................................... 56

Table 41: Coding Schemes and Maximum Net Data Rates over Air Interface ................................................... 58

Table 42: Related Documents ............................................................................................................................ 60

Table 43: Terms and Abbreviations .................................................................................................................... 62

Table 44: Safety Caution .................................................................................................................................... 64

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Figure Index

Figure 1: MODULE block diagram ..................................................................................................................... 9

Figure 2: Pin assignment overview .................................................................................................................... 12

Figure 3: Dimensions (Unit: mm) ...................................................................................................................... 18

Figure 4: Footprint recommendation (Unit: mm) ............................................................................................... 19

Figure 5: VBAT voltage drop during burst emission (GSM/GPRS) .................................................................. 20

Figure 6: Power supply application circuit......................................................................................................... 21

Figure 7: Linear regulator reference circuit ....................................................................................................... 22

Figure 8: Switching mode power supply reference circuit ................................................................................. 22

Figure 9: Reference power on/off circuit ........................................................................................................... 23

Figure 10: Power on timing sequence ................................................................................................................ 23

Figure 11: Power off timing sequence ................................................................................................................ 24

Figure 12: Reference reset circuit ...................................................................................................................... 25

Figure 13: UART full modem ............................................................................................................................ 26

Figure 14: UART null modem ........................................................................................................................... 26

Figure 15: Reference circuit of level shift .......................................................................................................... 27

Figure 16: TX level matching circuit ................................................................................................................. 27

Figure 17: RX level matching circuit ................................................................................................................. 27

Figure 18: RI behaviour（SMS and URC report） ........................................................................................... 28

Figure 19: RI behaviour（voice call） .............................................................................................................. 28

Figure 20: USB reference circuit ....................................................................................................................... 29

Figure 21: USIM interface reference circuit ...................................................................................................... 30

Figure 22: Amphenol SIM card socket .............................................................................................................. 31

Figure 23: PCM_SYNC timing .......................................................................................................................... 32

Figure 24: EXT codec to MODULE timing ....................................................................................................... 32

Figure 25: Module to EXT codec timing ........................................................................................................... 33

Figure 26: Audio codec reference circuit ........................................................................................................... 33

Figure 27: SD reference circuit .......................................................................................................................... 34

Figure 28: I2C reference circuit ......................................................................................................................... 35

Figure 29: NETLIGHT reference circuit ............................................................................................................ 36

Figure 30: Flight mode switch reference circuit ................................................................................................. 37

Figure 31: ISINK reference circuit..................................................................................................................... 38

Figure 32: Antenna matching circuit (MAIN_ANT) .......................................................................................... 43

Figure 33: Antenna matching circuit (AUX_ANT) ............................................................................................ 43

Figure 34: Active antenna circuit ....................................................................................................................... 45

Figure 35: Passive antenna circuit (Default) ...................................................................................................... 45

Figure 36: Top and bottom view of MODULE .................................................................................................. 52

Figure 37: Label information ............................................................................................................................. 52

Figure 38: The ramp-soak-spike reflow profile of MODULE ........................................................................... 53

Figure 39: packaging diagram ............................................................................................................................ 55

Figure 40: Tray drawing ..................................................................................................................................... 55

Figure 41: Small carton drawing ........................................................................................................................ 56

Figure 42: Big carton drawing ........................................................................................................................... 56

Figure 43: Reference design .............................................................................................................................. 57

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Revision History

Data Version Description of change Author

2017-10-11 1.00 Original Ma Honggang Gao Fan

2017-11-23 1.01

Modify Table2,Table15,Table 8,Table16, Table21, Table 26 Modify Figure 4,Figure 10 Modify 3.13.3 LDO output voltage 2.85V by default. Rename VDD_EXT to VDD_AUX

Gao Fan Yuan Shijie

2018-4-11 V1.02 Modify table 1,2,5,15,22,34 Modify figure 4,36,37 Modify the document name

Yuan Shijie Gao Fan

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1 Introduction This document describes the electronic specifications, RF specifications, interfaces, mechanical characteristics and testing results of the SIMCom MODULE. With the help of this document and other software application notes/user guides, users can understand and use MODULE to design and develop applications quickly. 1.1 Product Outline Aimed at the global market, the MODULE support GSM, WCDMA, LTE-TDD and LTE-FDD. Users can choose the MODULE according to the wireless network configuration. The supported radio frequency bands are described in the following table.

Table 1: Module frequency bands

Standard Frequency SIM7600A SIM7600A-H SIM7600V-H SIM7600E SIM7600E-H SIM7600JC-H SIM7600SA SIM7600SA-H

GSM

850MHz √ √

900MHz √ √ √ √

1800M Hz √ √ √ √

1900M Hz √ √

WCDMA

B1 √ √ √ √

B2 √ √ √ √

B5 √ √ √ √ √ √

B8 √ √ √ √

LTE

FDD B1 √ √ √ √ √

FDD B2 √ √ √ √ √

FDD B3 √ √ √ √ √

FDD B4 √ √ √ √ √

FDD B5 √ √ √ √ √

FDD B7 √ √ √ √

FDD B8 √ √ √ √ √

FDD B12 √ √

FDD B13 √

FDD B18 √

FDD B19 √

FDD B20 √ √

FDD B26 √

FDD B28 √ √

TDD B38 √ √

TDD B40 √ √ √ √

TDD B41 √ √

Category CAT1 CAT4 CAT4 CAT1 CAT4 CAT4 CAT1 CAT4

With a small physical dimension of 30*30*2.9 mm and with the functions integrated, the

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MODULE can meet almost any space requirement in users’ applications, such as smart phone, PDA, industrial handheld, machine-to-machine and vehicle application, etc.

1.2 Hardware Interface Overview

The interfaces are described in detail in the next chapters include: ● Power Supply ● USB Interface ● UART Interface ● MMC/SD Interface ● SDIO Interface ● USIM Interface ● GPIO ● ADC ● LDO Power Output ● Current Sink Source ● PCM Interface ● SPI Interface ● I2C Interface

1.3 Hardware Block Diagram

The block diagram of the MODULE is shown in the figure below.

GSM/UMTS/ LTERF FEM

RF UMTS/LTE PA

RF Transceiver

Baseband

NANDFlash

MMC/SDI2C

PCMInterruptStatus LED

{USB

USIM

Power OnReset

UART

GPIOsADCLDO

VBATVBAT

SPISink Current Source

DDR

GNSS RF

Main Antenna

GNSS Antenna

PowerManagement

Qualcomm Chip

SMT InterfaceUMTS/LTERF FEM

AUX Antenna

SDIO

XO19.2MHz

TX RX

System PowerSGMII

DRX

VBAT

Figure 1: MODULE block diagram

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1.4 Functional Overview

Table 2: General features

Feature Implementation Power supply Single supply voltage 3.4～4.2V Power saving Current in sleep mode : <5mA Radio frequency bands Please refer to the table 1

Transmitting power

GSM/GPRS power class: --GSM850: 4 (2W) --EGSM900: 4 (2W) --DCS1800: 1 (1W) --PCS1900: 1 (1W)

EDGE power class: --GSM850: E2 (0.5W) --EGSM900: E2 (0.5W) --DCS1800: E1 (0.4W) --PCS1900: E1 (0.4W)

UMTS power class: --WCDMA :3 (0.25W)

LTE power class: 3 (0.25W)

Data Transmission Throughput

GPRS multi-slot class 12 EDGE multi-slot class 12 UMTS R99 speed: 384 kbps DL/UL HSPA+: 5.76 Mbps(UL), 42 Mbps(DL) HSDPA/HSUPA: 2.2 Mbps(UL), 2.8 Mbps(DL) LTE CAT 1: 10 Mbps(DL)

5 Mbps(UL) LTE CAT 4 :150 Mbps (DL)

50 Mbps (UL)

Antenna GSM/UMTS/LTE main antenna. UMTS/LTE auxiliary antenna GNSS antenna

GNSS GNSS engine (GPS,GLONASS and BD) Protocol: NMEA

SMS MT, MO, CB, Text and PDU mode SMS storage: USIM card or ME(default) Transmission of SMS alternatively over CS or PS.

USIM interface Support identity card: 1.8V/ 3V

USIM application toolkit Support SAT class 3, GSM 11.14 Release 98 Support USAT

Phonebook management Support phonebook types: DC,MC,RC,SM,ME,FD,ON,LD,EN

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Audio feature Support PCM interface Only support PCM master mode and short frame sync, 16-bit linear data formats

UART interface

A full modem serial port by default Baud rate: 300bps to 4Mbps(default:115200bps) Autobauding baud rate: 9600,19200,38400,57600,115200bps Can be used as the AT commands or data stream channel Support RTS/CTS hardware handshake Multiplex ability according to GSM 07.10 Multiplexer Protocol

MMC/SD Support MMC and SD cards with 2.85 V on SD port

SDIO Support SDIO with 1.8 V only on SDIO port

USB USB 2.0 high speed interface

Firmware upgrade Firmware upgrade over USB interface or FOTA

Physical characteristics Size:30*30*2.9m Weight:5.7 g

Temperature range Normal operation temperature: -30°C to +80°C Extended operation temperature: -40°C to +85°C* Storage temperature -45°C to +90°C

*Note: Module is able to make and receive voice calls, data calls, SMS and make GPRS/UMTS/HSPA+/LTE traffic in -40℃ ~ +85℃. The performance will be reduced slightly from the 3GPP specifications if the temperature is outside the normal operating temperature range and still within the extreme operating temperature range.

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2 Package Information

2.1 Pin Assignment Overview

All functions of the MODULE will be provided through 87 pads that will be connected to the customers’ platform. The following Figure is a high-level view of the pin assignment of the MODULE.

Figure 2: Pin assignment overview SIMCOM C

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Table 3: Pin definition

Pin No. Pin name Pin No. Pin name

1 GND 2 GND

3 PWRKEY 4 RESET

5 GND 6 SPI_CLK

7 SPI_MISO 8 SPI_MOSI

9 SPI_CS 10 GND

11 USB_VBUS 12 USB_DN

13 USB_DP 14 GND

15 VDD_1V8 16 USB_ID

17 USIM_DATA 18 USIM_RST

19 USIM_CLK 20 USIM_VDD

21 SD_CMD 22 SD_DATA0

23 SD_DATA1 24 SD_DATA2

25 SD_DATA3 26 SD_CLK

27 SDIO_DATA1 28 SDIO_DATA2

29 SDIO_CMD 30 SDIO_DATA0

31 SDIO_DATA3 32 SDIO_CLK

33 GPIO3 34 GPIO6

35 HSIC_STROBE 36 HSIC_DATA

37 GND 38 VBAT

39 VBAT 40 GND

41 GND 42 NC (RESERVED)

43 GND 44 VDD_AUX

45 ISINK 46 ADC2

47 ADC1 48 SD_DET

49 STATUS 50 GPIO43*

51 NETLIGHT 52 GPIO41

53 USIM_DET 54 FLIGHTMODE

55 SCL 56 SDA

57 GND 58 GND

59 AUX_ANT 60 GND

61 GND 62 VBAT

63 VBAT 64 GND

65 GND 66 RTS

67 CTS 68 RXD

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69 RI 70 DCD

71 TXD 72 DTR

73 PCM_OUT 74 PCM_IN

75 PCM_SYNC 76 PCM_CLK

77 GND 78 GND

79 GNSS_ANT 80 GND

81 GND 82 MAIN_ANT

83 COEX1* 84 COEX2

85 BOOT_CFG0* 86 COEX3*

87 GPIO77

NOTE: Before the normal power up, GPIO43，COEX1, COEX3 or BOOT_CFG0 cannot be pulled up, otherwise module will not be powered up normally.

2.2 Pin Description

Table 4: IO parameters definition

Pin type Description

PI Power input PO Power output AI Analog input AIO Analog input/output I/O Bidirectional input /output DI Digital input DO Digital output DOH Digital output with high level DOL Digital output with low level PU Pull up PD Pull down

Table 5: Pin description

Pin name Pin No. Default status Description Comment

Power supply

VBAT 38,39, 62,63 PI Power supply, voltage range:

3.4～4.2V.

VDD_AUX 44 PO

LDO power output for other external circuits with Max 150mA current output. Its output voltage is 2.85V by default.（The voltage can be configured from 1.7V to 3.05V by AT command）.

If unused, keep it open.

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VDD_1V8 15 PO

1.8 output with Max 50mA current output for external circuit, such as level shift circuit.

If unused, keep it open.

GND

1,2,5, 10,14,37,40,41,43,57,58,60,61,64,65,77,78,80,81

Ground

System Control

PWRKEY 3 DI,PU System power on/off control input, active low.

The high voltage is 0.8V;

RESET 4 DI, PU System reset control input, active low.

RESET has been pulled up to 1.8V via 40Kohm resistor internally.

SD interface

SD_CMD 21 DO SDIO command

If unused, keep them open.

SD_DATA0 22 I/O

SDIO data

SD_DATA1 23 I/O

SD_DATA2 24 I/O

SD_DATA3 25 I/O

SD_CLK 26 DO SDIO clock

USIM interface

USIM_DATA 17 I/O,PU

USIM Card data I/O, which has been pulled up via a 10KR resistor to USIM_VDD internally. Do not pull it up or down externally.

All lines of USIM interface should be protected against ESD.

USIM_RST 18 DO USIM Reset

USIM_CLK 19 DO USIM clock

USIM_VDD 20 PO

Power output for USIM card, its output Voltage depends on USIM card type automatically. Its output current is up to 50mA.

SPI interface SPI_CLK 6 DO SPI clock output

RESERVED SPI_MISO 7 DI SPI master in/slave out data

SPI_MOSI 8 DO SPI master out/slave in data

SPI_CS 9 DO SPI chip-select output

USB

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USB_VBUS 11 DI,PD Valid USB detection input with 3.0~5.25V detection voltage

USB_DN 12 I/O Negative line of the differential, bi-directional USB signal.

USB_DP 13 I/O Positive line of the differential, bi-directional USB signal.

USB_ID 16 DI High-speed USB ID input Keep it open.

UART interface

RTS 66 DOL Request to send

If unused, keep them open.

CTS 67 DI,PU Clear to Send RXD 68 DI,PU Receive Data RI 69 DOH Ring Indicator DCD 70 DOH Carrier detects TXD 71 DOH Transmit Data DTR 72 DI,PU DTE get ready

I2C interface

SCL 55 DO I2C clock output If unused, keep open, or else pull them up via 2.2KΩ resistors to 1.8V. SDA 56 I/O I2C data input/output

SDIO interface

SDIO_DATA1 27 I/O SDIO data1

If unused, please keep them open.

SDIO_DATA2 28 I/O SDIO data2 SDIO_CMD 29 DO SDIO command SDIO_DATA0 30 I/O SDIO data0 SDIO_DATA3 31 I/O SDIO data3 SDIO_CLK 32 DO SDIO clock HSIC interface

HSIC_STROBE 35

HSIC strobe wakeup

HSIC strobe wakeup If use, please refer to document [27] Otherwise please keep them open. HSIC_DATA 36 I/O HSIC data

PCM interface

PCM_OUT 73 DO PCM data output. If unused, please keep them open.

PCM_IN 74 DI PCM data input. PCM_SYNC 75 DO PCM data frame sync signal. PCM_CLK 76 DO PCM data bit clock. GPIO

NETLIGHT 51 DO LED control output as network status indication.

If unused, keep them open. DO NOT PULL UP GPIO43 DURING NORMAL POWER UP!

FLIGHTMODE 54 DI,PU

Flight Mode control input. High level(or open): Normal Mode Low level: Flight Mode

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STATUS 49 DO

Operating status output. High level: Power on and firmware ready Low level: Power off

GPIO41 52 IO GPIO

GPIO43 50 IO GPIO

GPIO3 33 IO GPIO

GPIO6 34 IO GPIO

SD_DET 48 IO

Default: GPIO Optional: SD card detecting input. H: SD card is removed L: SD card is inserted

USIM_DET 53 IO

Default: GPIO Optional: USIM card detecting input. H: USIM is removed L: USIM is inserted

GPIO77 87 IO GPIO

RF interface

MAIN _ANT 82 AIO MAIN antenna soldering pad

GNSS_ANT 79 AI GNSS antenna soldering pad

AUX_ANT 59 AI Auxiliary antenna soldering pad

Other interface

ISINK 45 PI Ground-referenced current sink.

If unused, please keep them open.

ADC1 47 AI Analog-digital converter input 1

ADC2 46 AI Analog-digital converter input 2

COEX1 83 I/O

RF synchronizing between Wi-Fi and LTE.

If unused, keep them open. DO NOT PULL UP COEX1 AND COEX3 DURING NORMAL POWER UP!

COEX2 84 I/O

COEX3 86 I/O

BOOT_CFG0 85 DI,PD

Boot configuration input. Module will be forced into USB download mode by connect 85 pin to VDD_1V8 during power up.

Do place 2 test points for debug. DO NOT PULL UP BOOT_CFG0 DURING NORMAL POWER UP!

NC 42 No connection. Keep it open

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2.3 Mechanical Information

The following figure shows the package outline drawing of MODULE.

Figure 3: Dimensions (Unit: mm)

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2.4 Footprint Recommendation

Figure 4: Footprint recommendation (Unit: mm)

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3 Interface Application

3.1 Power Supply

The power supply pins of MODULE include 4 pins (pin 62&63, pin 38&39) named VBAT. The 4 VBAT pads supply the power to RF and baseband circuits directly. On VBAT pads, the ripple current up to 2A typically, due to GSM/GPRS emission burst (every 4.615ms), may cause voltage drop. So the power supply for these pads must be able to provide sufficient current up to more than 2A in order to avoid the voltage drop is more than 300mV. The following figure shows the VBAT voltage ripple wave at the maximum power transmit phase.

577us 4.615ms

Burst:2AIVBAT

VBATMax:300mV

Figure 5: VBAT voltage drop during burst emission (GSM/GPRS)

Note: The test condition: The voltage of power supply for VBAT is 3.8V, Cd=100 µF tantalum capacitor (ESR=0.7Ω) and Cf=100nF (Please refer to Figure 6—Application circuit).

Table 6: VBAT pins electronic characteristic

Symbol Description Min. Typ. Max. Unit VBAT Module power voltage 3.4 3.8 4.2 V

IVBAT(peak) Module power peak current in normal mode. - 2 - A

IVBAT(average) Module power average current in normal mode Please refer to the table 34 IVBAT(sleep) Power supply current in sleep mode

IVBAT(power-off) Module power current in power off mode. - - 20 uA

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3.1.1 Power Supply Design Guide

Make sure that the voltage on the VBAT pins will never drop below 3.4V, even during a transmit burst, when current consumption may rise up to 2A. If the voltage drops below 3.4V, the RF performance may be affected. Note: If the power supply for VBAT pins can support up to 2A, more than 300uF capacitors are recommended .Otherwise users must use a total of 1000uF capacitors typically, in order to avoid of the voltage drop more than 300mV. Some multi-layer ceramic chip (MLCC) capacitors (0.1/1uF) with low ESR in high frequency band can be used for EMC. These capacitors should be put as close as possible to VBAT pads. Also, users should keep VBAT trace on circuit board wider than 2 mm to minimize PCB trace impedance. The following figure shows the recommended circuit.

VBAT

VBAT

VBAT

VBAT

62

63

38

39Cf Ce100nF 100uF

61

64GND

GND

37

40GND

GND

MODULE

CbCc

FB101

5.1V500mW100uF1uF

VBAT

Ca100uF

Cd100uF

Figure 6: Power supply application circuit

In addition, in order to guard for over voltage protection, it is suggested to use a zener diode with 5.1V reverse zener voltage and more than 500mW power dissipation. Note: customer could only power pin 62, 63 or only power pin 38, 39, for these pins are connected inside the MODULE.

Table 7: Recommended Zener diode list

No. Manufacturer Part Number Power dissipation Package

1 On semi MMSZ5231BT1G 500mW SOD123

2 Prisemi PZ3D4V2H 500mW SOD323

3 Vishay MMSZ4689-V 500mW SOD123

4 Crownpo CDZ55C5V1SM 500mW 0805

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3.1.2 Recommended Power Supply Circuit

It is recommended that a switching mode power supply or a linear regulator power supply is used. It is important to make sure that all the components used in the power supply circuit can resist a peak current up to 2A. The following figure shows the linear regulator reference circuit with 5V input and 3.8V output.

Vin Vout

GN

D

FB

3

+PWR_CTRL

R102

R101

VBAT

100K

47K

+

U101 MIC29302

5

4

1

2

C101 C102100uF 1uF

DC INPUT

R103470R

On/Off

FUSE

C103

330uF

C104

100nF

Figure 7: Linear regulator reference circuit

If there is a big voltage difference between input and output for VBAT power supply, or the efficiency is extremely important, then a switching mode power supply will be preferable. The following figure shows the switching mode power supply reference circuit.

FUSEVin Vout

FB

U1011 2

3

45

LM2596-ADJ

+100uH

MBR360

L101

C101 +C102D102 C103

R102

R101

FB101

330uF

VBAT

2.2K

1K

100uF 1uFC104

100nF

270 ohm@100Mhz

DC INPUT

PWR_CTRL

GN

DOn/Off

Figure 8: Switching mode power supply reference circuit

Note: The Switching Mode power supply solution for VBAT must be chosen carefully against Electro Magnetic Interference and ripple current from depraving RF performance.

3.1.3 Voltage Monitor

To monitor the VBAT voltage, the AT command “AT+CBC” can be used. For monitoring the VBAT voltage outside or within a special range, the AT command “AT+CVALARM” can be used to enable the under-voltage warning function. If users need to power off MODULE, when the VBAT voltage is out of a range, the AT command “AT+CPMVT” can be used to enable under-voltage power-off function. Note: Under-voltage warning function and under-voltage power-off function are disabled by default. For more information about these AT commands, please refer to Document [1].

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3.2 Power on/Power off/Reset Function

3.2.1 Power on

MODULE can be powered on by pulling the PWRKEY pin down to ground. The PWRKEY pin has been pulled up with a diode to 1.8V internally, so it does not need to be pulled up externally. It is strongly recommended to put a100nF capacitor, an ESD protection diode, close to the PWRKEY pin as it would strongly enhance the ESD performance of PWRKEY pin. Please refer to the following figure for the recommended reference circuit.

4.7K

47K

Turn on / off impulse

PWRKEY Power On / off logic

1.8V

MODULE

100Ω

100nF

The high voltage of PWRKEY is 0.8V

Figure 9: Reference power on/off circuit

Note: Module could be automatically power on by connecting PWRKEY pin to ground via 0R resistor directly. The power-on scenarios are illustrated in the following figure.

STATUS(Output)

TonVBAT

PWRKEY(Input)

Ton(status

)

UART Port Undefined Active

Ton(uart

)

Undefined ActiveUSB Port

Ton(usb)

Ton(vdd_aux)VDD_AUX

Figure 10: Power on timing sequence

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Table 8: Power on timing and electronic characteristic

Symbol Parameter Min. Typ.

Max. Unit

Ton The time of active low level impulse of PWRKEY pin to power on MODULE

100 500 - ms

Ton(status) The time from power-on issue to STATUS pin output high level(indicating power up ready )

12 13 - s

Ton(uart) The time from power-on issue to UART port ready 11 12 - s

Ton(vdd_aux) The time from power-on issue to VDD_AUX ready 2.5 - s

Ton(usb) The time from power-on issue to USB port ready 11 12 - s

VIH Input high level voltage on PWRKEY pin 0.6 0.8 1.8 V

VIL Input low level voltage on PWRKEY pin -0.3 0 0.5 V

3.2.2 Power off

The following methods can be used to power off MODULE. ● Method 1: Power off MODULE by pulling the PWRKEY pin down to ground. ● Method 2: Power off MODULE by AT command “AT+CPOF”. ● Method 3: over-voltage or under-voltage automatic power off. The voltage range can be set by

AT command “AT+CPMVT”. ● Method 4: over-temperature or under-temperature automatic power off. Note: If the temperature is outside the range of -30~+80℃, some warning will be reported via AT port. If the temperature is outside the range of -40~+85℃, MODULE will be powered off automatically.

For details about “AT+CPOF” and “AT+CPMVT”, please refer to Document [1].

These procedures will make MODULE disconnect from the network and allow the software to enter a safe state, and save data before MODULE be powered off completely. The power off scenario by pulling down the PWRKEY pin is illustrated in the following figure.

(Output)

Toff

( Input )

Toff(status)

UART Port UndefinedActive

Toff(uart)

Ton

Toff-on

USB Port UndefinedActive

Toff(usb)

PWRKEY

STATUS

Figure 11: Power off timing sequence

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Table 9: Power off timing and electronic characteristic

Symbol Parameter Time value

Unit Min. Typ. Max.

Toff The active low level time pulse on PWRKEY pin to power off MODULE

2.5 -- -- s

Toff(status) The time from power-off issue to STATUS pin output low level(indicating power off )*

25 26 - s

Toff(uart) The time from power-off issue to UART port off 14 15 - s

Toff(usb) The time from power-off issue to USB port off 27 28 - s

Toff-on The buffer time from power-off issue to power-on issue 0 - - s

*Note: The STATUS pin can be used to detect whether MODULE is powered on or not. When MODULE has been powered on and firmware goes ready, STATUS will be high level, or else STATUS will still low level.

3.2.3 Reset Function

MODULE can be reset by pulling the RESET pin down to ground.

Note: This function is only used as an emergency reset, when AT command “AT+CPOF” and the PWRKEY pin all have lost efficacy. The RESET pin has been pulled up with a 40KΩ resistor to 1.8V internally, so it does not need to be pulled up externally. It is strongly recommended to put a100nF capacitor and an ESD protection diode close to the RESET pin. Please refer to the following figure for the recommended reference circuit.

4.7K

47K

Reset Impulse RESET Reset Logic

40K

1.8V

MODULE

100Ω

100nF

Treset

Figure 12: Reference reset circuit

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Table 10: RESET pin electronic characteristic

Symbol Description Min. Typ. Max. Unit

Treset The active low level time impulse on RESET pin to reset MODULE

50 100 500 ms

VIH Input high level voltage 1.17 1.8 2.1 V

VIL Input low level voltage -0.3 0 0.8 V

3.3 UART Interface

MODULE provides a 7-wire UART (universal asynchronous serial transmission) interface as DCE (Data Communication Equipment). AT commands and data transmission can be performed through UART interface.

3.3.1 UART Design Guide

The following figures show the reference design.

TXDRXDRTSCTSDTRDCDRI

TXDRXDRTSCTSDTRDCDRING

MODULE ( DCE) HOST ( DTE)

UARTUART

Figure 13: UART full modem

MODULE ( DCE) HOST ( DTE)

UARTUART

TXDRXDRTSCTSDTRDCDRI

TXDRXDRTSCTSDTRDCDRINGInterrupt

Wake up host

Figure 14: UART null modem

The MODULE UART is 1.8V voltage interface. If user’s UART application circuit is 3.3V voltage interface, the level shifter circuits should be used for voltage matching. The TXB0108RGYR

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provided by Texas Instruments is recommended. The following figure shows the voltage matching reference design.

TXDRXDRTSCTSDTRDCD

RI A7

A1A2A3A4A5A6

MODULETXB0108RGYR

UART portA8

B7

B1B2B3B4B5B6

B8

VCCAOE

VDD_1V8 or External 1V8

100nF

3.3V

100nFVCCB

GNDTXD_3.3VRXD_3.3VRTS_3.3VCTS_3.3VDTR_3.3VDCD_3.3VRI_3.3V

47K 47K

Figure 15: Reference circuit of level shift

customers can use another level shifter circuits as follow

VDD_1V8

4.7K

47K

TXD

4.7K

Module

VDD_1V8

RXD

VDD

DTE

Figure 16: TX level matching circuit

VDD_1V8

4.7K

47K4.7K

DTE

RXD

Module

VDD_1V8

TXD

VDD

Figure 17: RX level matching circuit

To comply with RS-232-C protocol, the RS-232-C level shifter chip should be used to connect MODULE to the RS-232-C interface, for example SP3238ECA, etc.

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Note1: User need to use high speed transistors such as MMBT3904. Note2: MODULE supports the following baud rates: 300, 600, 1200, 2400, 4800, 9600, 19200, 38400, 57600, 115200, 230400, 460800, 921600, 3200000, 3686400, 4000000bps. The default band rate is 115200bps.

3.3.2 RI and DTR Behavior

The RI pin can be used to interrupt output signal to inform the host controller such as application CPU. Normally RI will keep high level until certain conditions such as receiving SMS, or a URC report coming, and then it will change to low level.

IdleHIGH

LOW

Receiving SMS and any URC report coming. AT+CFGRI=1

RI

IdleHIGH

LOW

Receiving SMS . AT+CFGRI=0

RI

Figure 18: RI behaviour（SMS and URC report）

Normally RI will be kept at a high level until a voice call, then it will output periodic rectangular wave with 5900ms low level and 100ms high level. It will output this kind of periodic rectangular wave until the call is answered or hung up.

HIGH

LOW Idle Ring Establish the call

Hang up the call

Idle

RI 100ms5900ms

Figure 19: RI behaviour（voice call）

Note: For more details of AT commands about UART, please refer to document [1] and [22].

DTR pin can be used to wake MODULE from sleep. When MODULE enters sleep mode, pulling down DTR can wake MODULE.

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3.4 USB Interface

The MODULE contains a USB interface compliant with the USB2.0 specification as a peripheral, but the USB charging function is not supported. MODULE can be used as a USB device. MODULE supports the USB suspend and resume mechanism which can reduce power consumption. If there is no data transmission on the USB bus, MODULE will enter suspend mode automatically, and will be resumed by some events such as voice call, receiving SMS, etc.

USB_VBUS

USB_DN

USB_DPGND

USB USB

VBUS

D-

D+

GNDD2D1

0Ω

USB_ID D3

MODULE HOST

Figure 20: USB reference circuit

Because of the high bit rate on USB bus, more attention should be paid to the influence of the junction capacitance of the ESD component on USB data lines. Typically, the capacitance should be less than 1pF. It is recommended to use an ESD protection component such as ESD9L5.0ST5G provided by On Semiconductor (www.onsemi.com ). D3 is suggested to select the diode with anti-ESD and voltage surge function, or customer could add a ZENER diode for surge clamping. The recommend diodes please refer to table 7. Note：The USB_DN and USB_DP nets must be traced by 90Ohm+/-10% differential impedance.

3.5 USIM Interface

MODULE supports both 1.8V and 3.0V USIM Cards.

Table 11: USIM electronic characteristic in 1.8V mode (USIM_VDD=1.8V)

Symbol Parameter Min. Typ. Max. Unit

USIM_VDD LDO power output voltage 1.75 1.8 1.95 V

VIH High-level input voltage 0.65*USIM_VDD - USIM_VDD +0.3 V

VIL Low-level input voltage -0.3 0 0.35*USIM_VDD V

VOH High-level output voltage USIM_VDD -0.45 - USIM_VDD V

VOL Low-level output voltage 0 0 0.45 V

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Table 12: USIM electronic characteristic 3.0V mode (USIM_VDD=2.95V)


USIM_VDD LDO power output voltage 2.75 2.95 3.05 V

VIH High-level input voltage 0.65*USIM_VDD - USIM_VDD +0.3 V

VIL Low-level input voltage -0.3 0 0.25*USIM_VDD V

VOH High-level output voltage USIM_VDD -0.45 - USIM_VDD V


3.5.1 USIM Application Guide

It is recommended to use an ESD protection component such as ESDA6V1W5 produced by ST (www.st.com ) or SMF15C produced by ON SEMI (www.onsemi.com ). Note that the USIM peripheral circuit should be close to the USIM card socket. The following figure shows the 6-pin SIM card holder reference circuit.

Module

TVS

USIM_VDD

USIM_CLK

USIM_DATA

USIM_RST VCC GNDRST VPPCLK I/O

22Ω

100nF

C707 10M006 512

USIM Socket

22Ω

22Ω

22pF_NM

22pF_NM

22pF_NM

Figure 21: USIM interface reference circuit

Note: USIM_DATA has been pulled up with a 10KΩ resistor to USIM_VDD in MODULE. A 100nF capacitor on USIM_VDD is used to reduce interference. For more details of AT commands about USIM, please refer to document [1].USIM_CLK is very important signal, the rise time and fall time of USIM_CLK should be less than 40ns, otherwise the USIM card might not be initialized correctly.

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Recommended USIM Card Holder

It is recommended to use the 6-pin USIM socket such as C707 10M006 512 produced by Amphenol. User can visit http://www.amphenol.com for more information about the holder.

Figure 22: Amphenol SIM card socket

Table 13: Amphenol USIM socket pin description

Pin Signal Description C1 USIM_VDD USIM Card Power supply. C2 USIM_RST USIM Card Reset. C3 USIM_CLK USIM Card Clock. C5 GND Connect to GND. C6 VPP C7 USIM_DATA USIM Card data I/O.

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3.6 PCM Interface

MODULE provides a PCM interface for external codec, which can be used in master mode with short sync and 16 bits linear format.

Table 14: PCM format

Note: For more details about PCM AT commands, please refer to document [1].

3.6.1 PCM timing

MODULE supports 2.048 MHz PCM data and sync timing for 16 bits linear format codec.

Figure 23: PCM_SYNC timing

Figure 24: EXT codec to MODULE timing

Characteristics Specification

Line Interface Format Linear(Fixed)

Data length 16bits(Fixed)

PCM Clock/Sync Source Master Mode(Fixed)

PCM Clock Rate 2048 KHz (Fixed)

PCM Sync Format Short sync(Fixed)

Data Ordering MSB

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Figure 25: Module to EXT codec timing

Table 15: PCM timing parameters

Parameter Description Min. Typ. Max. Unit

T(sync) PCM_SYNC cycle time – 125 – μs

T(synch) PCM_SYNC high level time – 488 – ns

T(syncl) PCM_SYNC low level time – 124.5 – μs

T(clk) PCM_CLK cycle time – 488 – ns

T(clkh) PCM_CLK high level time – 244 – ns

T(clkl) PCM_CLK low level time – 244 – ns

T(susync) PCM_SYNC setup time high before falling edge of

PCM_CLK – 122 – ns

T(hsync) PCM_SYNC hold time after falling edge of PCM_CLK – 366 – ns

T(sudin) PCM_IN setup time before falling edge of PCM_CLK 60 – – ns

T(hdin) PCM_IN hold time after falling edge of PCM_CLK 60 – – ns

T(pdout) Delay from PCM_CLK rising to PCM_OUT valid – – 60 ns

T(zdout) Delay from PCM_CLK falling to PCM_OUT HIGH-Z – – 60 ns

3.6.2 PCM Application Guide

The following figure shows the external codec reference design.

MODULE

PCM_IN

PCM_SYNCPCM_CLK

PCM_OUT

100pF

ADCOUT

FSBCLK

DACIN

MCLK

VDD_1V8

2.2K2.2K

SCLKSDIO

SCLSDA

VDDA

VDDSPK

VDDD

3.3V 3.8V VDD_1V8

MIC+MIC-

MICBIAS

MOUT

MIC

SPKNAU8810

1.3K

1.3K

1uF1uF

47uF

47uF

Figure 26: Audio codec reference circuit

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3.7 SD Interface

MODULE provides a 4-bit SD/MMC interface with clock rate up to 200 MHz, The voltage of MMC/SD interface is 2.85V, which is compatible with SDIO Card Specification (version 3.0) and

Secure Digital (Physical Layer Specification, version 3.0).It supports up to 32GB SD cards.

Table 16: MMC/SD electronic characteristic (SD_DATA0-SD_DATA3 ， SD_CLK and SD_CMD) *


VIH High-level input voltage 0.65*2.85 - 2.85+0.3 V

VIL Low-level input voltage -0.3 0 0.25*2.85 V

VOH High-level output voltage 2.85-0.4 2.85 2.85 V


Note: * SD_DET is 1.8V operation voltage ,which is different from SD_DATA0-SD_DATA3，

SD_CLK or SD_CMD. Customer should provide 2.85V for SD card and the current should more than 350mA. ESD/EMI components should be arranged beside SD card socket. Refer to the following application circuit.

Module

SD Card

VCC

GND

CMDD3

SD_CMDSD_DATA3

SD_DATA1

SD_DATA2

TVS

SD_DATA0

SD_CLK

TVS

TVS

TVS

TVS

TVS

100n

F

4.7u

F

D2

D1

D0

CLK

GND

2.85V

Figure 27: SD reference circuit

SD card layout guide lines: ● Protect other sensitive signals/circuits from SD card signals. ● Protect SD card signals from noisy signals (clocks, SMPS, etc.). ● Up to 200 MHz clock rate, 50 Ω nominal, ±10% trace impedance ● CLK to DATA/CMD length matching < 1 mm ● 15–24 Ω termination resistor on clock lines near MODULE ● Total routing length < 50 mm recommended ● Routing distance from MODULE clock pin to termination resistor < 5 mm

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● Spacing to all other signals = 2x line width ● Bus capacitance < 15 pF

3.8 I2C Interface

MODULE provides a I2C interface compatible with I2C specification, version 5.0, with clock rate up to 400 kbps. Its operation voltage is 1.8V. The following figure shows the I2C bus reference design.

Module

SDA

MCU

SDA

GNDGND

SCL SCL

VDD_1V8

2.2K2.2K

Figure 28: I2C reference circuit

Note：SDA and SCL do not have pull-up resistors in MODULE. So, 2 external pull up resistors are needed in application circuit.

“AT+CRIIC and AT+CWIIC” AT commands could be used to read/write register values of the I2C peripheral devices. For more details about AT commands please refer to document [1].

3.9 SDIO Interface

MODULE provides a 4 bit 1.8V SDIO interface for WLAN solution with W58 module. Note: Special software version for CAT4 MODULEs support this function.

3.10 SPI Interface

MODULE provides a SPI interface as a master only. Its operation voltage is 1.8V, and its clock rate is up to 26 MHz. Note：This function is reserved. For detail information please contact with FAE.

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3.11 Network status

The NETLIGHT pin is used to control Network Status LED, its reference circuit is shown in the following figure.

Module

NETLIGHT

VBAT

4.7K

47K

R

Figure 29: NETLIGHT reference circuit

Note: The value of the resistor named “R” depends on the LED characteristic.

Table 17: NETLIGHT pin status

NETLIGHT pin status Module status

Always On Searching Network; Call Connect(include VOLTE,SRLTE)

200ms ON, 200ms OFF Data Transmit; 4G registered;

800ms ON, 800ms OFF 2G/3G registered network

OFF Power off ;Sleep

Note: NETLIGHT output low level as “OFF”, and high level as “ON”.

3.12 Flight Mode Control

The FLIGHTMODE pin can be used to control MODULE to enter or exit the Flight mode. In Flight mode, the RF circuit is closed to prevent interference with other equipments and minimize current consumption. Bidirectional ESD protection component is suggested to add on FLIGHTMODE pin, its reference circuit is shown in the following figure.

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4.7K

4.7K

Switch

1.8V

Module

FLIGHTMODE

Figure 30: Flight mode switch reference circuit

Table 18: FLIGHTMODE pin status

FLIGHTMODE pin status Module operation Input Low Level Flight Mode: RF is closed

Input High Level AT+CFUN=0: RF is closed AT+CFUN=1:RF is working

3.13 Other interface

3.13.1 Sink Current Source

The ISINK pin is VBAT tolerant and intended to drive some passive devices, such as LCD backlight and white LED, etc. Its output current can be up to 40mA and be set by the AT command “AT+ CLEDITST”.

Table 19: Sink current electronic characteristic

Symbol Description Min. Typ. Max. Unit VISINK Voltage tolerant 0.5 - VBAT V

IISINK Current tolerant 0 - 40 mA

ISINK is a ground-referenced current sink. The following figure shows its reference circuit.

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MODULE

ISINK

ISINK pin is VBAT tolerant-suitable for driving

white LEDs

Current Controls

Passive device

+

-

VBAT

Figure 31: ISINK reference circuit

Note: The sinking current can be adjusted to meet the design requirement through the AT command “AT+ CLEDITST =<0>, <value>”.The “value” ranges from 0 to 8, on behalf of the current from 0mA to 40mA by 5mA step.

3.13.2 ADC

MODULE has 2 dedicated ADC pins named ADC1 and ADC2.They are available for digitizing analog signals such as battery voltage and so on. These electronic specifications are shown in the following table.

Table 20: ADC1 and ADC2 electronic characteristics

Characteristics Min. Typ. Max. Unit Resolution – 15 – Bits Conversion time – 442 – ms Input Range 0.1 1.7 V Input serial resistance 1 – – MΩ

Note: “AT+CADC” and “AT+CADC2” can be used to read the voltage of the ADC1 and ADC2 pins, for more details, please refer to document [1].

3.13.3 LDO

MODULE has a LDO power output, named VDD_AUX. its output voltage is 2.85V by default, Users can switch the LDO on or off by the AT command “AT+CVAUXS” and configure its output voltage by the AT command “AT+CVAUXV”.

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Table 21: Electronic characteristic

Symbol Description Min. Typ. Max. Unit

VVDD_AUX Output voltage 1.7 2.85 3.05 V

IO Output current - - 150 mA

Note：For more details of AT commands about VDD_AUX, please refer to document [1].

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4 RF Specifications

4.1 GSM/UMTS/LTE RF Specifications

Table 22: Conducted transmission power

Frequency Power Min. GSM850 33dBm ±2dB 5dBm ± 5dB EGSM900 33dBm ±2dB 5dBm ± 5dB DCS1800 30dBm ±2dB 0dBm ± 5dB PCS1900 30dBm ±2dB 0dBm ± 5dB GSM850 (8-PSK) 27dBm ±3dB 5dBm ± 5dB EGSM900 (8-PSK) 27dBm ±3dB 5dBm ± 5dB DCS1800 (8-PSK) 26dBm +3/-4dB 0dBm ±5dB PCS1900 (8-PSK) 26dBm +3/-4dB 0dBm ±5dB WCDMA B1 24dBm +1/-3dB <-50dBm WCDMA B2 24dBm +1/-3dB <-50dBm WCDMA B5 24dBm +1/-3dB <-50dBm WCDMA B8 24dBm + 1/-3dB <-50dBm LTE-FDD B1 23dBm +/-2.7dB <-40dBm LTE-FDD B3 23dBm +/-2.7dB <-40dBm LTE-FDD B4 23dBm +/-2.7dB <-40dBm LTE-FDD B5 23dBm +/-2.7dB <-40dBm LTE-FDD B7 23dBm +/-2.7dB <-40dBm LTE-FDD B8 23dBm +/-2.7dB <-40dBm LTE-FDD B12 23dBm +/-2.7dB <-40dBm LTE-FDD B13 23dBm +/-2.7dB <-40dBm LTE-FDD B18 23dBm +/-2.7dB <-40dBm LTE-FDD B19 23dBm +/-2.7dB <-40dBm LTE-FDD B20 23dBm +/-2.7dB <-40dBm LTE-FDD B26 23dBm +/-2.7dB <-40dBm LTE-FDD B28 23dBm +/-2.7dB <-40dBm LTE-TDD B38 23dBm +/-2.7dB <-40dBm LTE-TDD B40 23dBm +/-2.7dB <-40dBm LTE-TDD B41 23dBm +/-2.7dB <-40dBm

Table 23: Operating frequencies

Frequency Receiving Transmission GSM850 869～894MHz 824～849 MHz EGSM900 925～960MHz 880～915 MHz DCS1800 1805～1880 MHz 1710～1785 MHz PCS1900 1930~1990 MHz 1850~1910 MHz WCDMA B1 2110～2170 MHz 1920～1980 MHz WCDMA B2 1930~1990 MHz 1850~1910 MHz WCDMA B5 869～894 MHz 824～849 MHz WCDMA B8 925～960 MHz 880～915 MHz The LTE Operating frequencies are shown in the following table 24.

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Note: Operating frequencies of LTE TDD B41 for the MODULE is 100MHz BW, 2555～2655 MHz GPS 1574.4 ～1576.44 MHz - GLONASS 1598 ～1606 MHz - BD 1559 ～1563 MHz

Table 24: E-UTRA operating bands

E-UTRA Operating Band

Uplink (UL) operating band

Downlink (DL) operating band

Duplex Mode

1 1920 ~1980 MHz 2110 ~2170 MHz FDD

2 1850~1910 MHz 1930~1990 MHz FDD

3 1710 ~1785 MHz 1805 ~1880 MHz FDD

4 1710~1755MHz 2110~2155MHz FDD

5 824～849 MHz 869～894MHz FDD

7 2500~2570MHz 2620~2690MHz FDD

8 880 ~915 MHz 925 ~960 MHz FDD

12 699~716MHz 728~746MHz FDD

13 777~787MHz 746~757MHz FDD

18 815~830MHz 860~875MHz FDD

19 830~845MHz 875~890MHz FDD

20 832~862MHz 791~ 821MHz FDD

26 814~849MHz 859~894MHz FDD

28 703~748MHz 758~803MHz FDD

38 2570 ~2620 MHz 2570 ~2620 MHz TDD

40 2300 ~2400 MHz 2300 ~2400 MHz TDD

41 2496 ~2690 MHz 2496 ~2690 MHz TDD

Note: Operating frequencies of LTE TDD B41 for the SIM7600X-PCIE is 100MHz BW, 2555～2655 MHz

Table 25: Conducted receive sensitivity

Frequency Receive sensitivity(Typical) Receive sensitivity(MAX) GSM850 < -109dBm 3GPP

EGSM900 < -109dBm 3GPP

DCS1800 < -109dBm 3GPP

PCS1900 < -109dBm 3GPP

WCDMA B1 < -110dBm 3GPP




LTE FDD/TDD See table 26. 3GPP

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Table 26: Reference sensitivity (QPSK)

E-UTR

A band

1.4 MHz

Standard

3 MHz

Standard

5 MHz

Standard

10 MHz

Standard

5 MHz Test

Resort

15 MHz

Standard

20 MHz

Standard

Duplex

Mode

1 - - -100 -97 -101 -95.2 -94 FDD

2 -102.7 -99.7 -98 -95 -99 -93.2 -92 FDD

3 -101.7 -98.7 -97 -94 -99 -92.2 -91 FDD

4 -104.7 -101.7 -100 -97 -101 -95.2 -94 FDD

5 -103.2 -100.2 -98 -95 -99 FDD

7 -98 -95 -97 -93.2 -92 FDD

8 -102.2 -99.2 -97 -94 -102 FDD

12 -101.7 -98.7 -97 -94 -99 FDD

13 -97 -94 -99 FDD

18 -100 -97 -101 -95.2 FDD

19 -100 -97 -101 -95.2 FDD

20 -97 -94 -98 -91.2 -90 FDD

26 -102.7 -99.7 -97.5 -94.5 -99 -92.7 FDD

28 -100.2 -98.5 -95.5 -99 -93.7 -91 FDD

38 - - -100 -97 -101 -95.2 -94 TDD

40 - - -100 -97 -101 -95.2 -94 TDD

41 - - -99 -96 -101 -94.2 -93 TDD

4.2 GSM /UMTS/LTE Antenna Design Guide

Users should connect antennas to MODULE’s antenna pads through micro-strip line or other types of RF trace and the trace impedance must be controlled in 50Ω. SIMCom recommends that the total insertion loss between the antenna pads and antennas should meet the following requirements:

Table 27: Trace loss

Frequency Loss

700MHz-960MHz <0.5dB

1710MHz-2170MHz <0.9dB

2300MHz-2650MHz <1.2dB

To facilitate the antenna tuning and certification test, a RF connector and an antenna matching circuit should be added. The following figure is the recommended circuit.

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RF connector

R2C1

MODULE

82MAIN_ANT

GND C241R1

Matching circuit

MAIN ANT

D1

Figure 32: Antenna matching circuit (MAIN_ANT)

In above figure, the components R1, C1, C2 and R2 are used for antenna matching, the values of components can only be achieved after the antenna tuning and usually provided by antenna vendor. By default, the R1, R2 are 0Ω resistors, and the C1, C2 are reserved for tuning. The component D1 is a TVS for ESD protection, and it is optional for users according to application environment. The RF test connector is used for the conducted RF performance test, and should be placed as close as to the MODULE’s MAIN_ANT pin. The traces impedance between MODULE and antenna must be controlled in 50Ω.

R4C3

MODULE

59AUX_ANT

GND C458R3

Matching circuit

Diversity antenna

D2

Figure 33: Antenna matching circuit (AUX_ANT)

In above figure, R3, C3, C4 and R4 are used for auxiliary antenna matching. By default, the R3, R4 are 0Ωresistors, and the C3, C4 are reserved for tuning. D2 is a TVS for ESD protection, and it is optional for users according to application environment. Two TVS are recommended in the table below.

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Table 28: Recommended TVS

Package Part Number Vender 0201 LXES03AAA1-154 Murata 0402 LXES15AAA1-153 Murata

Note：SIMCom suggests the LTE auxiliary antenna to be kept on, since there are many high bands in the designing of LTE-TDD, such as band38, band40 and band41. Because of the high insert loss of the RF cable and layout lines, the receiver sensitivity of these bands above will have risk to meet the authentication without the diversity antenna. For more details about auxiliary antenna design notice, please refer to document [25].

4.3 GNSS

MODULE merges GNSS (GPS/GLONASS/BD) satellite and network information to provide a high-availability solution that offers industry-leading accuracy and performance. This solution performs well, even in very challenging environmental conditions where conventional GNSS receivers fail, and provides a platform to enable wireless operators to address both location-based services and emergency mandates.

4.3.1 GNSS Technical specification

Tracking sensitivity: -159 dBm（GPS）/-158 dBm（GLONASS）/-159 dBm（BD） Cold-start sensitivity: -148 dBm Accuracy (Open Sky): 2.5m (CEP50) TTFF (Open Sky) : Hot start <1s, Cold start<35s Receiver Type: 16-channel, C/A Code GPS L1 Frequency: 1575.42±1.023MHz GLONASS: 1597.5~1605.8 MHz BD: 1559.05~1563.14 MHz Update rate: Default 1 Hz GNSS data format: NMEA-0183 GNSS Current consumption : 100mA (GSM/UMTS/LTE Sleep ,in total on VBAT pins) GNSS antenna: Passive/Active antenna

Note: If the antenna is active type, the power should be given by main board because there is no power supply on the GPS antenna pad. If the antenna is passive, it is suggested that the external LNA should be used.

4.3.2 GNSS Application Guide

Users can adopt an active antenna or a passive antenna to MODULE. If using a passive antenna, an external LNA is a must to get better performance. The following figures are the reference circuits.

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80

MODULE

79GNSS_ANT

GND 78

GND Matching circuit

GNSS Active ANT

L1

C1

47nH

C2

L2

10 ohm

33pF

VDD

Figure 34: Active antenna circuit

80

MODULE

79GNSS_ANT

GND 78

GND Matching circuit

L1

C1

L2

LNA

GNSS Passive ANT

SAWL3

V_LNA

Figure 35: Passive antenna circuit (Default)

In above figures, the components C1, L1 and L2 are used for antenna matching. Usually, the values of the components can only be achieved after antenna tuning and usually provided by antenna vendor. C2 is used for DC blocking. L3 is the matching component of the external LNA, and the value of L3 is determined by the LNA characteristic and PCB layout. Both VDD of active antenna and V_LNA need external power supplies which should be considered according to active antenna and LNA characteristic. LDO/DCDC is recommended to get lower current consuming by shutting down active antennas and LNA when GNSS is not working. GNSS can be tested by NMEA port. NMEA sentences can be obtained through UART or USB automatically. NMEA sentences include GSV, GGA, RMC, GSA, and VTG. Before using GNSS, user should configure MODULE in proper operating mode by AT command. Please refer to related documents for details. MODULE can also get position location information through AT directly. Note: GNSS is closed by default and can be started by AT+CGPS. The AT command has two parameters, the first is on/off, and the second is GNSS mode. Default mode is standalone mode. AGPS mode needs more support from the mobile telecommunication network. Please refer to document [24] for more details.

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5 Electrical Specifications

5.1 Absolute maximum ratings

Absolute maximum rating for digital and analog pins of MODULE are listed in the following table:

Table 29: Absolute maximum ratings

Parameter Min. Typ. Max. Unit Voltage at VBAT -0.5 - 6.0 V Voltage at USB_VBUS -0.5 - 5.85 V Voltage at digital pins (RESET,SPI,Keypad,GPIO,I2C,UART,PCM) -0.3 - 2.1 V

Voltage at digital pins (SD,USIM) -0.3 - 3.05 V Voltage at PWRKEY -0.3 - 1.8

5.2 Operating conditions

Table 30: Recommended operating ratings

Parameter Min. Typ. Max. Unit Voltage at VBAT 3.4 3.8 4.2 V Voltage at USB_VBUS 3.0 5.0 5.25 V

Table 31: 1.8V Digital I/O characteristics*

Parameter Description Min. Typ. Max. Unit

VIH High-level input voltage 1.17 1.8 2.1 V

VIL Low-level input voltage -0.3 0 0.63 V

VOH High-level output voltage 1.35 - 1.8 V

VOL Low-level output voltage 0 - 0.45 V

IOH High-level output current(no pull down resistor) - 2 - mA

IOL Low-level output current(no pull up resistor)

- -2 - mA

IIH Input high leakage current (no pull down resistor) - - 1 uA

IIL Input low leakage current(no pull up resistor) -1 - - uA

*Note: These parameters are for digital interface pins, such as SPI, GPIOs (NETLIGHT,

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FLIGHTMODE, STATUS, USIM_DET, SD_DET), SDIO, I2C, UART, PCM, COEXn, and BOOT_CFG0. The operating temperature of MODULE is listed in the following table.

Table 32: Operating temperature

Parameter Min. Typ. Max. Unit Normal operation temperature -30 25 80 ℃ Extended operation temperature* -40 25 85 ℃ Storage temperature -45 25 +90 ℃ *Note: Module is able to make and receive voice calls, data calls, SMS and make GSM/ UMTX/LTE traffic in -40℃ ~ +85℃. The performance will be reduced slightly from the 3GPP specifications if the temperature is outside the normal operating temperature range and still within the extreme operating temperature range.

5.3 Operating Mode

5.3.1 Operating Mode Definition

The table below summarizes the various operating modes of MODULE product.

Table 33: Operating mode Definition

Mode Function

Nor

mal

ope

ratio

n

GSM /UMTS/LTE Sleep

In this case, the current consumption of MODULE will be reduced to the minimal level and the MODULE can still receive paging message and SMS.

GSM/UMTS/LTE Idle

Software is active. Module is registered to the network, and the MODULE is ready to communicate.

GSM/UMTS/LTE Talk

Connection between two subscribers is in progress. In this case, the power consumption depends on network settings such as DTX off/on, FR/EFR/HR, hopping sequences, and antenna.

GPRS/EDGE/ UMTS/LTE Standby

Module is ready for data transmission, but no data is currently sent or received. In this case, power consumption depends on network settings.

GPRS/EDGE/ UMTS/LTE Data transmission

There is data transmission in progress. In this case, power consumption is related to network settings (e.g. power control level); uplink/downlink data rates, etc.

Minimum functionality mode

AT command “AT+CFUN=0” AT+CSCLK=1 can be used to set the MODULE to a minimum functionality mode without removing the power supply. In this mode, the RF part of the MODULE will not work and the USIM card will not be accessible, but the serial port and USB port are still accessible. The power consumption in this mode is

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lower than normal mode.

Flight mode

AT command “AT+CFUN=4” or pulling down the FLIGHTMODE pin can be used to set the MODULE to flight mode without removing the power supply. In this mode, the RF part of the MODULE will not work, but the serial port and USB port are still accessible. The power consumption in this mode is lower than normal mode.

Power off

Module will go into power off mode by sending the AT command “AT+CPOF” or pull down the PWRKEY pin, normally. In this mode the power management unit shuts down the power supply, and software is not active. The serial port and USB are is not accessible.

5.3.2 Sleep mode

In sleep mode, the current consumption of MODULE will be reduced to the minimal level, and MODULE can still receive paging message and SMS. Several hardware and software conditions must be satisfied together in order to let MODULE enter into sleep mode: 1. UART condition 2. USB condition 3. Software condition Note: Before designing, pay attention to how to realize sleeping/waking function and refer to Document [26] for more details.

5.3.3 Minimum functionality mode and Flight mode

Minimum functionality mode ceases a majority function of MODULE, thus minimizing the power consumption. This mode is set by the AT command which provides a choice of the functionality levels. ● AT+CFUN=0: Minimum functionality ● AT+CFUN=1: Full functionality (Default) ● AT+CFUN=4: Flight mode If MODULE has been set to minimum functionality mode, the RF function and USIM card function will be closed. In this case, the serial port and USB are still accessible, but RF function and USIM card will be unavailable. If MODULE has been set to flight mode, the RF function will be closed. In this case, the serial port and USB are still accessible, but RF function will be unavailable. When MODULE is in minimum functionality or flight mode, it can return to full functionality by the AT command “AT+CFUN=1”.

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5.4 Current Consumption

The current consumption is listed in the table below.

Table 34: Current consumption on VBAT Pins (VBAT=3.8V)

GNSS GNSS supply current (AT+CFUN=0,with USB connection)

@ -140dBm，Tracking Typical:35mA

GSM sleep/idle mode GSM/GPRS supply current (GNSS off，without USB connection)

Sleep mode@ BS_PA_MFRMS=2 Typical: 2.8mA Idle mode@ BS_PA_MFRMS=2 Typical: 18mA

UMTS sleep/idle mode WCDMA supply current (GNSS off，without USB connection)

Sleep mode @DRX=9 Typical: 3.3mA Idle mode @DRX=9 Typical: 17.5mA

LTE sleep/idle mode LTE supply current (GNSS off，without USB connection)

Sleep mode Typical: 4.6mA Idle mode Typical: 17.5mA

GSM Talk GSM850 @power level #5 Typical: 220mA EGSM900 @ power level #5 Typical: 230mA DCS1800 @power level #5 Typical: 162mA PCS1900 @power level #5 Typical: 190mA UMTS Talk WCDMA B1 @Power 24dBm Typical: 540mA

WCDMA B2 @Power 24dBm Typical: 470mA

WCDMA B5 @Power 24dBm Typical: 530mA

WCDMA B8 @Power 24dBm Typical: 385mA GPRS GSM850( 1 Rx,4 Tx ) @power level #5 Typical: 480mA EGSM900( 1 Rx,4 Tx ) @power level #5 Typical: 230mA DCS1800( 1 Rx,4 Tx ) @power level #0 Typical: 195mA PCS1900( 1 Rx,4 Tx ) @power level #0 Typical: 390mA GSM850( 3Rx, 2 Tx ) @power level #5 Typical: 330mA EGSM900( 3Rx, 2 Tx ) @power level #5 Typical: 370mA DCS1800( 3Rx, 2 Tx ) @power level #0 Typical: 275mA PCS1900( 3Rx, 2 Tx ) @power level #0 Typical: 245mA EDGE GSM850( 1 Rx,4 Tx ) @power level #8 Typical: 340mA EGSM900( 1 Rx,4 Tx ) @power level #8 Typical: 400mA DCS1800( 1 Rx,4 Tx ) @power level #2 Typical: 300mA PCS1900( 1 Rx,4 Tx ) @power level #2 Typical: 330mA GSM850( 3Rx, 2 Tx ) @power level #8 Typical: 280mA EGSM900( 3Rx, 2 Tx ) @power level #8 Typical: 320mA DCS1800( 3Rx, 2 Tx ) @power level #2 Typical: 230mA PCS1900( 3Rx, 2 Tx ) @power level #2 Typical: 268mA

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HSDPA data WCDMA B1 @Power 24dBm Typical: 478mA WCDMA B2 @Power 23dBm Typical: 475mA WCDMA B5 @Power 24dBm Typical: 480mA WCDMA B8 @Power 24dBm Typical: 430mA LTE data

LTE-FDD B1 @5Mbps 22.3dBm Typical: 577mA @10Mbps 22.4dBm Typical: 590mA @20Mbps 22.4dBm Typical: 630mA

LTE-FDD B2 @5Mbps 22.1dBm Typical: 515mA @10Mbps 22.4dBm Typical: 544mA @20Mbps 22.3dBm Typical:575mA





LTE-FDD B8 @5Mbps 22.8dBm Typical: 644mA @10Mbps 22.8dBm Typical: 646mA








LTE-TDD B38 @5Mbps 21.8dBm Typical: 370mA @10Mbps 21.8dBm Typical: 380mA @20Mbps 21.8dBm Typical: 403mA



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5.5 ESD Notes

MODULE is sensitive to ESD in the process of storage, transporting, and assembling. When MODULE is mounted on the users’ mother board, the ESD components should be placed beside the connectors which human body may touch, such as USIM card holder, audio jacks, switches, keys, etc. The following table shows the MODULE ESD measurement performance without any external ESD component.

Table 35: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%)

Part Contact discharge Air discharge VBAT,GND +/-6K +/-12K

Antenna port +/-5K +/-10K

USB +/-4K +/-8K

UART +/-3K +/-6K

Other PADs +/-3K +/-6K

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6 SMT Production Guide

6.1 Top and Bottom View of MODULE

Figure 36: Top and bottom view of MODULE

6.2 Label Information

Figure 37: Label information

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Table 36: The description of label information

No. Description

A LOGO

B Module part number

C Project name

D Serial number

E International mobile equipment identity

F QR code

6.3 Typical SMT Reflow Profile

SIMCom provides a typical soldering profile. Therefore the soldering profile shown below is only a generic recommendation and should be adjusted to the specific application and manufacturing constraints.

Figure 38: The ramp-soak-spike reflow profile of MODULE

Note: For more details about secondary SMT, please refer to the document [21].

6.4 Moisture Sensitivity Level (MSL)

MODULE is qualified to Moisture Sensitivity Level (MSL) 3 in accordance with JEDEC J-STD-033. If the prescribed time limit is exceeded, users should bake MODULE for 192 hours in drying equipment (<5% RH) at 40+5/-0°C, or 72 hours at 85+5/-5°C. Note that plastic tray is not heat-resistant, and only can be baked at 45° C.

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Table 37: Moisture Sensitivity Level and Floor Life

Moisture Sensitivity Level (MSL)

Floor Life (out of bag) at factory ambient≤30°C/60% RH or as stated

1 Unlimited at ≦30℃/85% RH

2 1 year

2a 4 weeks

3 168 hours

4 72 hours

5 48 hours

5a 24 hours

6 Mandatory bake before use. After bake, it must be reflowed within the time limit specified on the label.

NOTE: IPC / JEDEC J-STD-033 standard must be followed for production and storage.

6.5 Stencil Foil Design Recommendation

The recommended thickness of stencil foil is more than 0.15mm.

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7 Packaging MODULE support tray packaging.

Figure 39: packaging diagram

Module tray drawing：

Figure 40: Tray drawing

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Table 38: Tray size

Length（±3mm） Width（±3mm） Number

242.0 161.0 15

Small carton drawing：

Figure 41: Small carton drawing

Table 39: Small Carton size

Length（±10mm） Width（±10mm） Height（±10mm） Number

270 180 120 15*20=300

Big carton drawing：

Figure 42: Big carton drawing

Table 40: Big Carton size

Length（±10mm） Width（±10mm） Height（±10mm） Number

380 280 280 300*4=1200

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Appendix

A. Reference Design

Refer to < SIM7600 Reference Design V1.X.pdf > for the details.

C103C102C101

VBATVBAT

AUX_ANTPower supply

100uF 100uF 1uF

TXDRXD

CTSRTSRIDCDDTR

C109220nF

USIM_VDDUSIM_RSTUSIM_CLKUSIM_DATA

62

63

59

Power supply

R101

61

64GND

GND

41GND

POWERKEY

RESET

3

4Reset impulse

4.7K

47KTurn on/off impulse

UART_TXDUART_RXD

UART_CTSUART_RTS

UART_RIUART_DCDUART_DTR

71686766697072

23

1 GNDGND

0R

C107C106

Main Antenna

NC NC

MAIN_ANT82

58GND

GND

57C108

GNSS Antenna

33pF

GNSS_ANT 79

78GND

GND

77 NCL101

NCL102

GND 80GND60

SIM_DATA

SIM_VDDSIM_RSTSIM_CLK

ESDA6V1W5

SD_DATA3SD_CLKSD_DATA2SD_DATA1

SD_CMDSD_DATA0

2426252221

FLIGHTMODE

USB_VBUS

RF ON/OFF1112

NETLIGHT

10K

10K300R

LEDNetwork

Status

USB_DP 13

30

USB_DNUSB_VBUSUSB_DNUSB_DP

272829

313233

3534

36

SDIO_DATA1

SDIO_CLKGPIO3

HSIC_STROBEGPIO6

HSIC_DATA

76

747573

67

98

45

PCM_IN

PCM_OUTPCM_SYNC

PCM_CLK

SPI_CLKSPI_MISO

SPI_CSSPI_MOSI

ISINK

Audio CODEC Chipor

DSP

51

54

VDD_AUXVDD_AUX 44

SCL I2C_SCL55

SDA I2C_SDA56

ADC1 ADCInput range:0.1~1.7VADC2

4746

VDD_1V8USB_ID

1516

NC

17191820

42

STATUS52535048

49

GPIO41USIM_DETGPIO43SD1_DET

5 GNDGND

2

1014 GND

GND40 GND

GND

37

43

SIM7600E

LDO Output:1.7-3.05V

R102

R103

R104

R105

R106

R107

TVS

If USB interface is used， Connect USB_VBUS to 3.0V-5.25V

0R

C104 C105

Div Antenna

NCNC

VBAT 3839

GND65

VBAT

C112C111

Power supply

100uF

VBAT

100uF

VBAT

8385

8486

COEX1COEX2COEX3

BOOT_CFG0 Test Points

81 GND

C113100nF

VBAT

SDIO_DATA2SDIO_CMD

SDIO_DATA0SDIO_DATA3

GPIO77 87

TVSLXES15AAA1-153

Figure 43: Reference design

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B. Coding Schemes and Maximum Net Data Rates over Air Interface

Table 41: Coding Schemes and Maximum Net Data Rates over Air Interface

Multislot definition(GPRS/EDGE)

Slot class DL slot number UL slot number Active slot number

1 1 1 2 2 2 1 3 3 2 2 3 4 3 1 4 5 2 2 4 6 3 2 4 7 3 3 4 8 4 1 5 9 3 2 5 10 4 2 5 11 4 3 5 12 4 4 5 GPRS coding scheme Max data rata（4 slots） Modulation type

CS 1 = 9.05 kb/s / time slot 36.2 kb/s GMSK




EDGE coding scheme Max data rata（4 slots） Modulation type

MCS 1 = 8.8 kb/s/ time slot 35.2 kb/s GMSK




MCS 5 = 22.4 kb/s/ time slot 89.6 kb/s 8PSK





HSDPA device category Max data rate（peak） Modulation type

Category 1 1.2Mbps 16QAM,QPSK








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Category 11 0.9Mbps QPSK


Category 13 17.6Mbps 64QAM



Category 16 28Mbps 16QAM









HSUPA device category Max data rate（peak） Modulation type







LTE-FDD device category

(Downlink) Max data rate（peak） Modulation type

Category 1 10Mbps QPSK/16QAM/64QAM




LTE-FDD device category

(Uplink) Max data rate（peak） Modulation type

Category 1 5Mbps QPSK/16QAM




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C. Related Documents

Table 42: Related Documents

NO. Title Description

[1] SIM7500_SIM7600 Series_AT Command Manual_V1.xx AT Command Manual

[2] ITU-T Draft new recommendationV.25ter Serial asynchronous automatic dialing and control

[3] GSM 07.07 Digital cellular telecommunications (Phase 2+); AT command set for GSM Mobile Equipment (ME)

[4] GSM 07.10 Support GSM 07.10 multiplexing protocol

[5] GSM 07.05

Digital cellular telecommunications (Phase 2+); Use of Data Terminal Equipment – Data Circuit terminating Equipment (DTE – DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS)

[6] GSM 11.14

Digital cellular telecommunications system (Phase 2+); Specification of the SIM Application Toolkit for the Subscriber Identity Module – Mobile Equipment (SIM – ME) interface

[7] GSM 11.11 Digital cellular telecommunications system (Phase 2+); Specification of the Subscriber Identity Module – Mobile Equipment (SIM – ME) interface

[8] GSM 03.38 Digital cellular telecommunications system (Phase 2+); Alphabets and language-specific information

[9] GSM 11.10 Digital cellular telecommunications system (Phase 2) ； Mobile Station (MS) conformance specification； Part 1: Conformance specification

[10] 3GPP TS 51.010-1 Digital cellular telecommunications system (Release 5); Mobile Station (MS) conformance specification

[11] 3GPP TS 34.124 Electromagnetic Compatibility (EMC) for mobile terminals and ancillary equipment.

[12] 3GPP TS 34.121 Electromagnetic Compatibility (EMC) for mobile terminals and ancillary equipment.

[13] 3GPP TS 34.123-1 Technical Specification Group Radio Access Network; Terminal conformance specification; Radio transmission and reception (FDD)

[14] 3GPP TS 34.123-3 User Equipment (UE) conformance specification; Part 3: Abstract Test Suites.

[15] EN 301 908-02 V2.2.1

Electromagnetic compatibility and Radio spectrum Matters (ERM); Base Stations (BS) and User Equipment (UE) for IMT-2000. Third Generation cellular networks; Part 2: Harmonized EN for IMT-2000, CDMA Direct Spread (UTRA FDD) (UE) covering essential requirements of article 3.2 of the R&TTE Directive

[16] EN 301 489-24 V1.2.1

Electromagnetic compatibility and Radio Spectrum Matters (ERM); Electromagnetic Compatibility (EMC) standard for radio equipment and services; Part 24: Specific conditions for IMT-2000 CDMA Direct Spread (UTRA) for Mobile and portable (UE) radio and ancillary equipment

[17] IEC/EN60950-1(2001) Safety of information technology equipment (2000)

[18] 3GPP TS 51.010-1 Digital cellular telecommunications system (Release 5);

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Mobile Station (MS) conformance specification [19] GCF-CC V3.23.1 Global Certification Forum - Certification Criteria

[20] 2002/95/EC

Directive of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS)

[21] Module secondary-SMT-UGD-V1.xx

Module secondary SMT Guidelines

[22] SIM7X00 Series_UART_Application Note_V1.xx

This document describes how to use UART interface of SIMCom modules.

[23]

SIM7100_SIM7500_SIM7600 Series_USB AUDIO_Application Note_V1.xx

USB AUDIO Application Note

[24] SIM7X00 Series_GPS_Application Note_V1.xx

GPS Application Note

[25] Antenna design guidelines for diversity receiver system

Antenna design guidelines for diversity receiver system

[26] SIM7100_SIM7500_SIM7600_Sleep Mode_Application Note_V1.xx

Sleep Mode Application Note

[27] 7600CE-LAN-Reference Design V1.0

HSIC Application Note

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D. Terms and Abbreviations

Table 43: Terms and Abbreviations

Abbreviation Description ADC Analog-to-Digital Converter ARP Antenna Reference Point BER Bit Error Rate BTS Base Transceiver Station CS Coding Scheme CSD Circuit Switched Data CTS Clear to Send DAC Digital-to-Analog Converter DRX Discontinuous Reception DSP Digital Signal Processor DTE Data Terminal Equipment (typically computer, terminal, printer) DTR Data Terminal Ready DTX Discontinuous Transmission EFR Enhanced Full Rate EGSM Enhanced GSM EMC Electromagnetic Compatibility ESD Electrostatic Discharge ETS European Telecommunication Standard EVDO Evolution Data Only FCC Federal Communications Commission (U.S.) FD SIM fix dialing phonebook FDMA Frequency Division Multiple Access FR Full Rate GMSK Gaussian Minimum Shift Keying GNSS Global Navigation Satellite System GPRS General Packet Radio Service GPS Global Positioning System GSM Global Standard for Mobile Communications HR Half Rate HSPA High Speed Packet Access I2C Inter-Integrated Circuit IMEI International Mobile Equipment Identity LTE Long Term Evolution MO Mobile Originated MS Mobile Station (GSM engine), also referred to as TE MT Mobile Terminated NMEA National Marine Electronics Association PAP Password Authentication Protocol PBCCH Packet Switched Broadcast Control Channel PCB Printed Circuit Board PCS Personal Communication System, also referred to as GSM 1900 RF Radio Frequency

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RMS Root Mean Square (value) RTC Real Time Clock SIM Subscriber Identification Module SMS Short Message Service SPI serial peripheral interface SMPS Switched-mode power supply TDMA Time Division Multiple Access TE Terminal Equipment, also referred to as DTE TX Transmit Direction UART Universal Asynchronous Receiver & Transmitter VSWR Voltage Standing Wave Ratio SM SIM phonebook NC Not connect EDGE Enhanced data rates for GSM evolution HSDPA High Speed Downlink Packet Access HSUPA High Speed Uplink Packet Access ZIF Zero intermediate frequency WCDMA Wideband Code Division Multiple Access VCTCXO Voltage control temperature-compensated crystal oscillator USIM Universal subscriber identity module UMTS Universal mobile telecommunications system UART Universal asynchronous receiver transmitter

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E. Safety Caution

Table 44: Safety Caution

Marks Requirements

When in a hospital or other health care facility, observe the restrictions about the use of mobiles. Switch the cellular terminal or mobile off, medical equipment may be sensitive and not operate normally due to RF energy interference.

Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is switched off. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. Forgetting to think much of these instructions may impact the flight safety, or offend local legal action, or both.

Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any electrical equipment in potentially explosive atmospheres can constitute a safety hazard.

Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment.

Road safety comes first! Do not use a hand-held cellular terminal or mobile when driving a vehicle, unless it is securely mounted in a holder for hands free operation. Before making a call with a hand-held terminal or mobile, park the vehicle.

GSM cellular terminals or mobiles operate over radio frequency signals and cellular networks and cannot be guaranteed to connect in all conditions, especially with a mobile fee or an invalid SIM card. While you are in this condition and need emergent help, please remember to use emergency calls. In order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency call if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may have to deactivate those features before you can make an emergency call. Also, some networks require that a valid SIM card be properly inserted in the cellular terminal or mobile.

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Contact us: Shanghai SIMCom Wireless Solutions Ltd. Add: SIM Technology Building, No.633, Jinzhong Road, Changning District, Shanghai P.R. China 200335 Tel：+86 21 3235 3300 Fax：+86 21 3235 3020 URL：www.simcomm2m.com

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