pacs ibdr 27/28 feb 2002 photoconductor detector arrays1 ibdr hilmar richter antec-gmbh germany...
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Photoconductor Detector Arrays 1
PACS IBDR 27/28 Feb 2002
Photoconductor Detector Arrays
IBDR
Hilmar Richter • ANTEC-GmbH • Germany
Günter Bollmann, Peter Dinges, Otto Frenzl, Heidrun Köppen, Heribert Krüger, Claudia Popp
Photoconductor Detector Arrays 2
PACS IBDR 27/28 Feb 2002Overview
• Modul / Array Interfaces– Optical Interface– Electrical Interface
• Design Implications on Arrays– Detector Stack– Thermal Budget– Cryo Cycling and Vibrational Load
• Achieved Performance– Cut-off Wavelengths– Bias dependency
• PA / QA Activities: Flow Plan• Procurement• Summary
Photoconductor Detector Arrays 3
PACS IBDR 27/28 Feb 2002Optical Interface of the “Red” Array
Radial arrangement of 25 high stress modules in groups of 5 modules. The center of the radial arragement is 240 mm in front of the fore optics in the plane of the pupil.
Photoconductor Detector Arrays 4
PACS IBDR 27/28 Feb 2002Electrical Interface
Interface design• FEE and harness substrate are supported by kapton tubes in order to reduce
thermal load to the module • All wires from interface parts to the module are stainless steel, wires between
interface parts are gold wires• The nano connector of the pigtail harness is glued to the harness substrate• Thermal loads of the interface parts flow through the cooling strap to the 4 K
level
Photoconductor Detector Arrays 5
PACS IBDR 27/28 Feb 2002Detector Stack in the Cavity and Final Bias Design
Ball segment
Detector contact
Ge:Ga crystal
Detector contact
Gold wire 25 µm
Insulator
Final design• Bias concept has been changed to prevent grounding of
detectors by short circuit– Contact diameter decreased at the ball segment
side to prevent grounding of the signal line (2) – Contact diameter increased at the ground side
(this contact is grounded directly to the module (1)
Slits reduced from 30 - 70 µm to 10 - 40 µm and therefore less cross talk
1
2
Detector Stack
Photoconductor Detector Arrays 6
PACS IBDR 27/28 Feb 2002Thermal Budget
4 K
P = 375 µW
P = 624 µW
11 µW 202 µW 162 µW 7 µW 134 µW 108 µW
P = 249 µW
25 High Stress Modules 25 Low Stress Modules2.5 K1.7 K
4 K
16 Detector Wires (Steel)
4 Long FEE + 2 Long Harness Posts (Kapton)
2 Short Harness Posts (Kapton)
Photoconductor Detector Arrays 7
PACS IBDR 27/28 Feb 2002Cryo Cycling and Vibration Load
• Slit of 0.2 mm between kapton tube and support part (no gluing) at the free bearing support posts compensates shrinkage of different materials (module, FEE / harness substrate, kapton tube, etc.) during cool-down.
After cool-down: slit = 0 - 0.05 mm.
• Static tests at LN2 temperatures prove: Kapton tubes withstand deflections of 0.15 mm (0.12 mm) perpendicular (parallel) to the substrate plane. The applied forces correspond to accelerations of 110 g.
• Above support post design passed cryo cycling and vibration tests with qualification load levels.
Free bearing support post
Slit
Photoconductor Detector Arrays 8
PACS IBDR 27/28 Feb 2002Specification Cut-off Wavelength
0 50 100 150 200 250 3000,0
0,2
0,4
0,6
0,8
1,0
1,2 U15mV U30mV U43mV U49mV
Re
l. re
spo
nsiv
ity
(µm)
Specification high stress module: CW > 200 µm @ 40 mV
30 mV
2 4 6 8 10 120
5
10
Specification
Variation ofcutoff wavelength
(
µm)
QM # - HS
Photoconductor Detector Arrays 9
PACS IBDR 27/28 Feb 2002Specification Cut-off Wavelength
12 14 16 18 20 22 24
125
130
135 Min Max
CW
(µm
)
QM # - LS
12 14 16 18 20 22 240
1
2
3
4
5
6
7
8 Variation ofcutoff wavelength
(
µm)
QM # - LS
Specification low stress module: CW <130 µm @ 100 mV
Photoconductor Detector Arrays 10
PACS IBDR 27/28 Feb 2002PA / QA Activities: Flow Plan
KIP
Final check of the completed module before shipping
Cleaning and incoming inspection
of all parts
Detector stack assembly and RSR measurement.
KIP: Check of detector stack
KIP
Final cleaning of the module and check with
UV light
Preparation of FEE / harness substrate
support posts
Gluing of the pigtail harness to the harness substrate and implementation
of connector saver and short circuit connector
Integration of FEE / harness substrate, wiring and fixing of
FO
Photoconductor Detector Arrays 11
PACS IBDR 27/28 Feb 2002Procurement / Assembling
• Status of parts procurement for the integration of QM modules
- Delivery of the Gore cables 19.03.2002
- Tecnologica announced connector savers and short circuit connectors for 10.05.2002
- Delivery of FEE and harness substrates 19.04.2002
- PO for the pigtail harness from Cannon placed 22.02.2002 (delivery time 12 weeks)
• Routinely going on assembly of FM modules at Antec
Time critical: Procurement of pigtail
harness
Photoconductor Detector Arrays 12
PACS IBDR 27/28 Feb 2002Summary
• Interfaces to MPE housing, KT board and IMEC FEE and harness substrate defined
• Module design finished (specifications fulfilled)
• Procurement of integration parts initiated and delivery dates fixed