pacs ibdr 27/28 feb 2002 pacs cre1 pacs cre development ybe creten, patrick merken, jan putzeys, vic...

PACS CRE 1

PACS IBDR 27/28 Feb 2002

PACS CRE development

Ybe Creten, Patrick Merken, Jan Putzeys, Vic Fonderie, Chris Van Hoof

IMEC

PACS CRE 2


Overview

• CRE and FEE design and design status• CRE/FEE Schedule and milestones• CRE and FEE Problems and possible solutions• PA/QA: AIV plan and activities• PA/QA: Key Inspection Points• Conclusions

PACS CRE 3


CRE design and design status

• At IIDR:– CRE input stage in spec (in terms of gain/debiasing, noise

and power)

– smallest Cint not functional but solution identified

– linearity of output stage out of spec but solution identified on separate buffer

• QM CRE design iteration– CRE122000 linearity of output stage

– CRE032001 smallest Cint

– CRE102001 increased dynamic range

PACS CRE 4


CRE design and design status (ctd)

• Status of CRE122000/CRE032001 – meet key CRE specifications:

• gain/debiasing, noise, power consumption

• linearity of output buffer

– do not meet• dynamic range (<2V, marginally

acceptable)• starting point of integration ramp

• smallest Cint linearity (“integrates”)

– results of IMEC confirmed by CSL

AVG slope @ 4K Vcascp = 3.0V Vcascn = 1.9V Outbias 10uA 4.1pF 2G/200mVExpected Slope : 1.3 V / 17 samples

2

2.5

3

3.5

4

4.5

5

0 5 10 15 20

0.00%

0.05%

0.10%

0.15%

0.20%

0.25%

Measured 02-10

lin trend

Non lin

PACS CRE 5


CRE design and design status (ctd)

• Status of CRE102001:– in addition meets dynamic range requirement

– shows smallest Cint approaching linearity spec (absolute value tbc)

CRE032001 CRE102001

AC_ARRAY(10-2001) A1 Iin 0.02nA 0.1pF LvL 1.8V 4K

0.00

1.00

2.00

3.00

4.00

5.00

6.00

0 5 10 15 20

0.00%

0.50%

1.00%

1.50%

2.00%

2.50%

PACS CRE 6


CRE Substrate design and design status

• QM_1 without shortcircuit resistors (baseline design)

• QM_2 model (featuring additional resistors)– Two production runs

• with BCB (adhesion deficient)• without BCB (_NB) to deliver sufficient assemblies

• QM_3 model made (to accommodate interface changes) – Available (no BCB version)

PACS CRE 7


Harness Substrate design and design status

• Harness QM_1 (baseline design)• Harness QM_2 model (and QM_2NB without BCB)

• Harness QM_3 model in preparation = FM model additional reference lines and reduced (3) temperature

sensor connections ; FM harness substrates scheduled for April 2002

PACS CRE 8


FEE status• Multiple FEE assemblies made

– QM_1 FEE delivered 6 July 2001 • 8 CRE082000 on QM_1 substrate delivered

– QM_2 FEE failed• 6 CRE032001 on QM_2 substrate shorted during bonding

– QM_2 FEE recovery• 3 CRE032001 on QM_2 substrate tested and delivered to MPE in November

2001• 3 CRE032001 on QM_2_NB substrate in stock (different R_mirror)• 13 CRE032001 on QM_2_NB assembled, tested and delivered to CSL

(December 2001)

– QM_3 FEE• 25 CRE102001 on QM_3 substrate (29 in process)• plan: phased assembly/test/delivery until Jan. 2002• 29 assembled in February 2002• Presently in test• Full delivery mid March 2002

PACS CRE 9


Schedule and MilestonesID Task Name Duration Start Finish

1 Start project #### Fri 9/1/00 Fri 9/1/00

2 FEE QM (Phase I) #### Fri 9/1/00 Fri 9/28/01

3 Design FEE QM #### Fri 9/1/00 Tue 10/31/00

4 Manufacture FEE QM #### Tue 10/31/00 Sat 12/30/00

5 Evaluation/Test FEE QM #### Sat 12/30/00 Wed 2/28/01

6 First FEE QM available #### Wed 2/28/01 Wed 2/28/01

7 Redesign FEE QM #### Tue 10/31/00 Mon 1/29/01

8 Manufacture FEE QM #### Mon 1/29/01 Fri 3/30/01

9 Evaluation/Test FEE QM #### Fri 3/30/01 Tue 5/29/01

10 FEE QM available #### Tue 5/29/01 Tue 5/29/01

11 ECP: QM_2 substrate redesign #### Tue 5/29/01 Mon 9/3/01

12 Milestone after ECP1 #### Fri 9/28/01 Fri 9/28/01

13 Detector Test Feedback #### Wed 2/28/01 Tue 8/14/01

14 Review and Acceptance all Phase I deliverables#### Tue 8/14/01 Tue 8/14/01

15 FEE PFM (Phase II) / FM (Phase III) #### Wed 2/28/01 Fri 4/11/03

16 Design FEE PFM #### Wed 2/28/01 Tue 7/3/01

17 ECP2: circuit redesign #### Mon 6/25/01 Fri 9/28/01

18 Manufacture FEE PFM #### Fri 9/28/01 Fri 11/23/01

19 ECP2: QM_3 assembly and gradual delivery #### Sun 12/2/01 Fri 2/15/02

20 Evaluation/Test FEE PFM #### Fri 11/23/01 Sat 3/2/02

21 Review and Acceptance Phase II #### Sat 3/2/02 Sat 3/2/02

22 Milestone after ECP2 #### Fri 3/15/02 Fri 3/15/02

23 ECP3: Design FEE FM #### Thu 7/11/02 Tue 10/29/02

24 Manufacture/pretest FEE FM #### Tue 10/29/02 Thu 2/6/03

25 Pretest FEE FM #### Thu 2/6/03 Mon 4/7/03

26 FEE FM available #### Fri 4/11/03 Fri 4/11/03

27 Review and Acceptance Phase III #### Fri 4/11/03 Fri 4/11/03

28 FEE FS (Phase IV) #### Fri 4/11/03 Wed 10/8/03

29 Manufacture FEE FS #### Fri 4/11/03 Thu 7/10/03

30 FEE FS available #### Thu 7/10/03 Thu 7/10/03

31 Evaluation/Test FEE FS #### Thu 7/10/03 Wed 10/8/03

32 Review and Acceptance Phase IV #### Wed 10/8/03 Wed 10/8/03

9/1

2/28

5/29

9/28

8/14

3/2

3/15

4/11

4/11

7/10

10/8

Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q32001 2002 2003 2004

Delayed start date TBC

M1 met

M2 met

M3 met 12/2001

M4 moves to 03/2002

M5 moves to 04/2003

PACS CRE 10


Schedule: Implications of FM delivery date

11/04/036/02/0329/10/0211/07/02

CREFM design

1 monthCRE

pretest

2 monthsFEE

assembly/test

today

• Counting back from FM delivery date

Answers needed to several questions !- absolute value Cint and background- Iout and Coutput adapation/redesign- latch-up tests on 12 modules- QM test results

06/01/03

FM tapeout

2 monthsCRE

production

PACS CRE 11


(Possible+Encountered) Problems and possible solutions

Componentaffected

Problemdescription

Possible solutions

FEE Bond strength onunpassivated MCM

Al vs Au bond wiresDestructive test on additional modules

CRE Radiation tolerancetesting

- Gamma and protons tested at RT- Cryogenic irradiation setup in progress (testing at LLN

and ESTEC)- Indirect evidence: scaled technologies are more rad-

tolerant

CRE Absolute value ofCint

Design iteration if needed

CRE Parasitic Cpara atdetector input andInput leakage current

Known after detector integrationInput bond pad with reduced ESD

PACS CRE 12


PA/QA: AIV and Test plan

• A general overview of the manufacturing of the FEE and Harness substrates: document PACS-IM-PL-001.

• Incoming inspection of parts and materials which are used during the manufacturing/assembly of the FEE and Harness substrates: document PACS-IM-PL-002.

• The assembly of the FEE substrates: document PACS-IM-PL-004 (draft).

• Verification of the performance of the FEE: document PACS-IM-PR-001.

• Critical items list: input provided

• FMECA: input provided

PACS CRE 13


PA/QA: AIV and Key Inspection Points

• FEE: each FEE is tested at room temperature and at 4 Kelvin. This test will indicate any error in bonding, resistor value, electrical connectivity, etc.

• Harness substrate: Each harness substrate will be visually

inspected before packaging (‘packing’).

Visual inspection

Substratemanufacturing flow

Functional Tests

FEE assembly

Packing

IC manufacturingflow

Harness Substrate

Packing

KIP

KIP

PACS CRE 14


Conclusions• FEE deliveries

– 3 FEE on QM_2 delivered for detector tests

– 13 FEE on QM_2NB delivered for module tests

– 25 FEE on QM_3 delivery pending (assembled and partially tested/accepted)

• ‘Forced’ delay in start of FEE FM design. No ‘idle time’ due to this delay:– design/test:

• of QM FEE in sufficient detail

• for correction/change of Cint

– assembly/inspection: • destructive bond-strength testing on spare FEE modules

• ECP for modified CRE substrate and harness substrate

– verification: cryogenic radiation setup and testing

• AIV and test plans available

pacs ibdr 27/28 feb 2002 pacs cre1 pacs cre development ybe creten, patrick merken, jan putzeys, vic...

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