mems packaging
TRANSCRIPT
Hosted by Karen Lightman, Managing Director MEMS Industry Group
August 21, 2012
MEMS Industry Group Presents
MEMS Packaging: Transforming the Challenges into Solutions
Presented by: Chuck Richardson, Director of Roadmapping, iNEMI & Bill Bottoms, 3MTS and iNEMI/ITRS & Packaging TWG Chair
With over140 international members and partners, MIG is the trade association advancing MEMS across global markets.
End-users/
Integrators
Device
Manufacturers
Materials
&
Equipment
Suppliers
Foundries
Designers
The MEMS Supply Chain Neutral Forum
Go-To Resource for
MEMS
Voice of the commercial
MEMS community
Online Webinar Series
August 21 – MEMS Packaging: Transforming the Challenges into Solutions
Sept 11 - Health Care is Brimming with Opportunities for MEMS
Oct 3 - 2012 Status of the MEMS Industry
September 19, 2012 - Berkeley, CA
Sweet Dreams and Nightmares
Joint MEMS Commercialization Workshop
January 8-13, 2013 – Las Vegas, NV
MEMS TechZone and Half-Day Conference Session
May 8-9, 2013 – Boston, MA
Annual MIG members’ meeting
MEMS Education Series
Westin Kierland Resort and Spa, Scottsdale, AZ
• Save the date!
• Sponsorships are available.
www.memscongress.com
Amsterdam, The Netherlands
• Dorint Hotel
Chuck Richardson Director of Roadmapping,
iNEMI
Bill Bottoms 3MTS and iNEMI/ITRS & Packaging
Technology Working Group Chair
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About iNEMI
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International Electronics Manufacturing Initiative (iNEMI) is an
industry-led consortium of over 100 global manufacturers, suppliers,
industry associations, government agencies and universities. Working
on advancing manufacturing technology since 1994.
Visit us at www.inemi.org.
5 Key Deliverables:
• Technology Roadmaps
• Collaborative Deployment
Projects
• Research Priorities Documents
• Proactive Forums
• Position Papers
4 Major Focus Areas:
• Miniaturization
• Environment
• Energy
• Medical Electronics
Mission: Forecast and Accelerate improvements in the Electronics
Manufacturing Industry for a Sustainable Future.
iNEMI Scope
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Software Solutions
Marketing Design Manufacturing Order
Fulfillment
Supply Chain Management Information Technology
Logistics Communications
Business Practices
Build to Order
Materials
Components
Customer
Equipment
Materials Transformation
Collaborative Design
Lifecycle Solutions Software
Solutions
Identify and close technology gaps, which includes the development and integration of the electronics industry supply infrastructure.
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Product
Needs
Technology
Evolution
GAP
Analysis/
Technical
Plan
Research
Projects
Implementation
iNEMI Methodology
Competitive
Solutions
Roadmap Project
Completion
Industry Solution
Needed
Academia
Government
iNEMI
Members
No Work
Required or
Outsourced
Available
to Market
Place
Global
Participation
Disruptive
Technology
Roadmap
iNEMI Roadmap
Statistics for the 2011 iNEMI Roadmap
• Roadmaps the needs for 2011-2021
• > 575 participants
• > 310 companies/organizations
• 18 countries from 4 continents
• 21 Technology Working Groups (TWGs)
• 6 Product Emulator Groups (PEGs)
• > 1800 pages of information
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Impact Roadmap used by industry to identify future market & technology needs.
Used by government & research organizations to identify and fund new research initiatives to address industries needs.
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2011 Roadmap Technology Working Groups (TWGs)
Organic PCB Board
Assembly Customer
RF Components &
Subsystems
Optoelectronics Large Area, Flexible Electronics
Energy Storage &
Conversion Systems
Modeling, Simulation,
and Design
Packaging &
Component
Substrates Semiconductor
Technology
Final
Assembly
Mass Storage (Magnetic & Optical)
Passive Components
Information
Management
Test, Inspection &
Measurement
Environmentally
Conscious
Electronics
Ceramic
Substrates
Thermal
Management
Connectors
MEMS/
Sensors
Red=Business Green=Engineering Light Blue=Manufacturing Blue=Component & Subsystem
Solid State Illumination
Photovoltaics
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Roadmap Development
Product Emulator Groups TWGs
Semiconductor Technology
Design Technologies
Manufacturing Technologies
Comp./Subsyst. Technologies
Modeling, Thermal, etc.
Board Assy, Test, etc.
Packaging, Substrates, Displays, etc.
2013 Product Sector Needs Vs. Technology Evolution
Business Processes
Prod Lifecycle Information Mgmt.
Optoelectronics and
Optical Storage
Organic Printed
Circuit Boards
Magnetic and
Optical Storage
Supply Chain
Management
Semiconductors
iNEMI
Information
Management
TWG
iNEMI
Mass Data
Storage TWG
iNEMI / IPC / EIPC
/ TPCA
Organic PWB
TWG
iNEMI / ITRS /
MIG/PSMA
Packaging
TWG
iNEMI
Board
Assembly
TWG
Interconnect
Substrates—Ceramic
iNEMI Roadmap
iNEMI
Optoelectronics
TWG
Fourteen Contributing Organizations
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iNEMI / MIG
/ ITRS
MEMS
TWG
iNEMI
Passives
TWG
www.inemi.org Email contacts:
Chuck Richardson
Bob Pfahl
Grace O’Malley - Europe
Haley Fu - Asia
MEMS Packaging Transforming Challenges into Solutions
Presented by:
W. R. Bottoms
Chairman, 3MTS
The Initial Ideas
At the formative Meeting “NSF 2000 Workshop on Manufacturing of MEMS” in November of 2000 the initial ideas were:
”MEMS will likely follow IC and discrete electronic packaging forms and types…. Semiconductor manufacturers will likely use existing packages and adapt MEMS manufacturing to these well-established commercial form factors “- -Giasolli presentation November 2000.
Differences between MEMS and IC packaging requirements were quickly recognized
At the NSF 2000 Workshop on Manufacturing of MEMS conclusions were: ” Though the electronics manufacturing industry has a robust and viable infrastructure, direct application of electronics packaging techniques to most MEMS parts is not feasible because of the complexities of their operational structure and domain. For example, packaging should allow some moving parts to interact with other components through optical, electrical, thermal, mechanical and chemical interfaces. As a result, many MEMS packaging problems are new to most of electronic packaging engineers.”
Differences between MEMS and IC packaging Requirements were quickly recognized
Examples cited at the meeting included:
• Vacuum packaging needed when viscous damping is important
• Die-attachment might affect the pressure measured through thermal stresses
• Thermal strains might affect the performance of piezoresistive or membrane devices.
• Moisture could cause stiction problems. • There are no effective thermal paths for thin micro-
mirrors for heat transfer. • There are no accelerated tests since most of failure
mechanisms for the moving parts are unknown.
The cost of MEMS dropped dramatically with volume and cost came down the
learning curve.
Packaging cost did not scale and today it is typically between 50 and 90% of MEMS
component cost. “Packaging also has been identified as one of the major technical barriers that might hamper the growth of MEMS. It strongly affects a MEMS device's performance and reliability through mechanical, thermal, electrical, or chemical interactions. The full range of MEMS reliability techniques also need to be developed…”
The Challenges identified at the Workshop in 2000 remain
A Typical MEMS package and its function from the November 2000 Workshop
The Challenges identified at the Workshop in 2000 remain
It is a multidisciplinary challenge
Goals and Objectives
A workshop aimed initially at identifying the difficult challenges for MEMS Packaging
is our initial goal.
A follow on activity to identify potential solutions is our objective.
What are the difficult challenges
Our initial focus will be on a limited number of devices that represent the technical requirements for MEMS and are produced in volume today.
Selected MEMS in SiP • Relays • Pressure sensors • Accelerometers • Microfluidics
Difficult Challenges for MEMS relay Packaging
The reduction in size increases density but results in significant challenges:
– Reduced isolation
– Reduced tolerance to electrostatic discharge
– Reliability
– Operation with voltage differences across the relay
– Stiction and thermal “welding”
– Cost (hermitic package required)
– Flexing in the substrate causing distortion
– EMI shielding
Difficult Challenges for MEMS relay Packaging
What other issues pose difficult challenges for MEMS relays?
Difficult Challenges for MEMS Pressure Sensor Packaging
The reduction in size increases density but often increases environmental sensitivity :
– Package induces stress with temperature variation
– High temperature operation (automotive)
– Reliability at high temperature and pressure
– Testing and calibration of the packaged device (particularly for harsh environments)
– Special needs for acoustic signaling (MEMS microphone)
– EMI shielding
– Bio compatibility
– Open to the environment
High volume Applications for MEMS Pressure Sensor Packaging
Difficult Challenges for MEMS pressure sensor Packaging
What other issues pose difficult challenges for MEMS pressure sensors?
Difficult Challenges for MEMS accelerometer Packaging
The reduction in size should result in a reduction in cost.
Difficult Challenges for MEMS accelerometer Packaging
The reduction in size increases density but results in significant challenges:
• Testing
• Cost
• Stress in the sensor
• Temperature sensitivity
• Size (consumer apps)
Cost is a major factor for automotive and consumer markets
Difficult Challenges for MEMS accelerometer Packaging
What other issues pose difficult challenges for MEMS accelerometers?
Difficult Challenges for MEMS Microfluidic Packaging
Microfluidics are complex
• Flow rate Sensor
• Fluid in/out
• Electrical interface
• Flow control valves
Difficult Challenges for MEMS Microfluidic Packaging
Microfluidics challenges are also complex • Compatibility with wide range of fluids • Particulate contamination in fluid • Testing • Open to the environment • Potentially wide range of temperature and pressure • By-pass for high flow rate applications • Reliability in use case • Operation in high vibration environments • Bio compatibility
Difficult Challenges for MEMS Microfluidic Packaging
What other issues pose difficult challenges for MEMS microfluidics?
Summary The modern smart phone can be considered to be a complex SiP. Today it contains all of the elements discussed with the one exception of microfluidics. The consumer and automotive markets dominate MEMS demand today. These markets share some challenges:
– High levels of vibration and shock – Low cost demands
Some challenges are unique: – Bio compatibility – Extremes of temperature
New materials, new architectures and new processes will be required to continue progress against these challenges as we integrate more MEMS components into SiP electronics.
Summary
Meeting these difficult challenges will result in accelerated growth of the MEMS
markets as new applications become technically and economically viable .
Your input on the difficult challenges will help focus the collective efforts of industry and
academia on the potential solutions .
THANK YOU
