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Material Declaration

Who’s in Charge?

The PlayersEIA, EICTA, JGPSSI, Industry GuideDIN German Norm 19220Solder Products Value CouncilJEDEC, NEMI, IPC CoordinationZVEI German Components Assoc.ECCA European Component Assoc.Lead Free Solder World SummitJIC, JNAC, Jisso Japan, EJCJapan Electronic & Info Tech AssocIEC/ISO-ACET, A

Covers:

Level A Materials

Level B Materials

Set of Data fields

Covers:

Definitions

ProductDeclarationLevels

DIN 19220 also has Suggested Format

ZVEI Component Standard

Infineon Component Sheet

/ Folie 8

Electronic Components Division JIC Hongkong 2004

Speed constantly Speed constantly increases

Metal-Industries

dDe

cl

-Gase

Recycling-Strat.

Electro Industrie

Target of national and european legislation ?? Chemical-Industry

Car-Industry

Eco-Design EUP

Ecolabel

WEEE/ROS

?? Ressource-Strat

ELV

EU-chemical polic

Green Std.

IPP

Electro(nic)-Industry

Target Electro(nic) Industrie ??? (!)

F

Env

P

y

ro

increases

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Electronic Components Division JIC Hongkong 2004

Legislation - ELV (2000/53/EC)

End of Life Vehicles Directive (ELV) - 2000/53/EC , Annex II amended by 2002/525/EC

Current status: EnforcedSubstance bans in force since July 1st, 2003

Problems:Maximum concentration values (MCV) are related to „homogeneous material“ and „not intentionally added“.The definition is impractical in case of electronic assemblies and components; consequence: no implementation measures and marketsurveillance tools for those products are in force at member states up to now. IMDS entries are used as „proof“.

IPC Solder Products Value Council (SPVC)

• Management council formed in August 2001 by the leadership of the global solder manufacturing industry.

Goal of creating programs to benefit both solder manufacturers and their customers.

• Subcommittees: – Lead Free - Patents– Market Research - Environment– Industry Awareness

IPC SPVC Lead Free ResearchMembers

Aim, Inc.Amtech, Inc.AvantecCookson Electronics Assembly MaterialsEFD, Inc.HarimatecHenkel TechnologiesHeraeus, Inc.

Indium CorporationKester SolderKoki CompanyNihon SuperiorP. Kay Metals, Inc.Qualitek Int., Inc.Senju Metal IndustryShenmao Tech.Thai Solder

Lead Free Subcommittee

• Today, several consortia exist that are promoting various alloys to the electronics industry.

• The goal of the SPVC lead-free subcommittee is to reduce the confusion regarding alloy choice and is devoted to achieving a worldwide consensus on the issue.

• It is not the goal of the subcommittee to “invent” an alloy. Rather, the subcommittee is collecting all available data and will make a suggestion based upon the technical merit of the alloy.

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© Siemens AG, CT MM 6, Gamalski, 04/2004H/Daten/IEC_Pb-frei_2.ppt

Materials &MicrosystemsPackaging &Assembly

DIRECTIVE 2002/…./EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of/on waste electrical and electronic equipment (WEEE), 2000/0159 (COD); C5-0487/2002; PE-CONS 3662/02; Brüssel 8. November 2002

Categories of electrical and electronic equipment

covered by this Directive

1. Large household appliances

2. Small household appliances

3. IT and telecommunications equipment

4. Consumer equipment

5. Lighting equipment

6. Electrical and electronic tools (with the exception of large -sca le stationary

industrial tools)

7. Toy s, leisure and sports equipment

8. Medical devices (with the exception of all implanted and infected products)

9. Monitoring and control instruments

10. Automatic dispensers

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Considerations for the Usage of Lead-free Solders

Pad-Metallisation ofSubstrate (e.g. PCB)

Metallization of ComponentsTermination / Composition of Solder

Bumps (BGA/CSP) 1)

Lead-free Solders for Wave-Reflow- and Rework Soldering

Parameters for SolderingProcess in Manufacturing

Reliability of Electronic Assemblies (First- und Second-Level)

Electrical Functionof the Components

Metallurgy of Solder Joints

Mechanical Propertiesof Solder Joints

1) Dependent onSupplier

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Lead-free Solder - Alloys

Low-melting Pb-free solders

SnIn52118°C

SnBi58138°C

SnZn9199°C

High-melting Pb-free solders

SnCu0,7227°C

SnAg3,5221°C

SnAg3,8Cu0,7217°C

SnPbtoxic

SnPb37;183°C

SnBiSnIn SnZn SnCuSnAgCu SnAg

High cost (In),

limited resources

Low temp.ability

Low-meltingphases

TS = 96°C

Corrosion

-

No problems with corrosionbetter electr. + therm. conductivity than SnPbrelative cheap, lower density than SnPb

no influence of Pb expected

higher melting point related to SnPb

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Datenmaterial Pb-freie Lote

Anspruch an breitere, universitäre Forschung zur Schliessung der Wissens-lücken grundlegender metallurgischer, physikalisch/chemischer EigenschaftenSAC im globalen Massstab (u. a. AIF / DVS – Unterstützung universitärerForschung; Initiativprogramm)

Database for Solder Properties with Emphasis on New Lead-free Solders

National Institute of Standards and Technology

& Colorado School of Mines

Properties of Lead-Free Solders

Release 4.0

Dr. Thomas Siewert National Institute of Standards and Technology

Dr. Stephen Liu

Colorado School of Mines

Dr. David R. Smith National Institute of Standards and Technology

Mr. Juan Carlos Madeni

Colorado School of Mines

Colorado, February 11, 2002

Japan

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Distribution of Purchase Volume for PCB – Assemblies

Total: 100%

IC´cConnectorsConsumable Mat.Power SuppliesPCB´sPassive Comp.Discrete Comp.

Costs for Consumable Materials: appr. 1% of the toal Purchase Volume !

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Ag

Sn

Cu

3.5

7.7

1.0

4.0IOWA

Senju/Matsushita

0.5

3.03.0

5.0

SN96CI

0.021,5

0,01

1,5

Cookson

0.5

6,0

0,5

3,0

Oatey

SN97C

SnAg2,5Cu0,5Bi

SACX

Marking, Symbols and Labels for Identification of Lead-Free

and Other Reportable Materials in Lead-Free Assemblies, Components and Devices

April 21, 2004

Goals and Objectives

• Common terminology for marking schemes across the industry

Any solution must be global• Communicate materials of concern within

the supply chain• Support manufacturing, repair, and recycling• Not intended for RoHS border compliance• Maximum simplicity

Reduce the chances of producer and administrative quality errors

• Minimum size necessary Component labeling desired

• Manufacturability

IEC Advisory Committee on Environmental Aspects –

ACEA:

Work on test methods for absence of lead (& other

substances)

Project plan as proposed by ACEAin March 2004

...TCPublish the combined (or product-specific) standard n

2005-12WGProduce Committee Draft for Vote of the analytical standard8

2005-03WGProduce Committee Draft of the analytical standard7.

2004-11WGProduce Working Draft of the analytical standard6.

2004-06GB+Conv.Involve members of TCs in the analytical group5.

2004-05GB (RoHS text: UK)

Identify important TCs to take part: A = directly concerned by the RoHS categories; B = others involved; C = not involved

4.

2004-05MStutzConsolidate methods, ideas, collect all existing material contributing to the first draft

3.

GBarta,SMBCarry out consultations on procedure and TC to use for development and publication of analytical standard

2.

2004-04MStutz, GBartaSet up the group for the analytical part (incl. secretariat) — Convenor M.Stutz

1.

By whenWhoWhat

Importance for Setting Standard Testing Methods

Compliance checks have to be performed in a consistent and reliable manner

Need for detailed specifications of standard methods to verify with the regulations

Standard compliance methods need to be implementable by laboratories all around the world

International standard methods encourage trade of products by avoiding technical barriers

Harmonisation of compliance and enforcement methods is essential for a proper functioning of the global market

Scope of Standard Testing Method

The standard testing methods need to:Cover all RoHS substances (Pb, Hg, Cd, Cr VI, PBB, PBDE)Target electronic and electrical equipment (EEE), including components thereofAllow testing which is simple, fast, of high quality, and cost effective

Standard Testing Methods Content

Analytical methods (material dependent)Sample preparationAnalytical instrument definitionReference methods

Laboratory implementation: Including elements for:Quality assuranceProviding consistent resultsDocumentation[=> GLP and/or accreditation to (inter-)national systems (e.g. ISO)]

Standard RoHS Test ProcedurePBB/PBDE

Pb > 750 ppm

Cr > 750 ppmSamples

Homogenious Materials

MetalsPlastics

PWB/Components

Screening

EDXRF

RoHS Compliant

Br, Cr, Hg, Pb < 750 ppm

Cd < 75 ppm

Br > 750 ppm IR, HPLC

Diphenyl-carbazide Cr VI

Hg > 750 ppmHgAAS

EDXRF, ICP-AES Pb

Cd > 75 ppm EDXRF, ICP-AES Cd

Standard Testing Methods Depending on Material Type

None commercially available,

In-house references

Commercial Soild Metal Standards

None commercially available,

In-house references

References

EDXRF (Br, Sb)

ICP-AES (all other elements)

EDXRF (all elements heavier than Na)

Diphenylcarbazidemethod (Cr VIspeciation)

EDXRF (Pb, Br, Cr, Cd, Hg)

HPLC/UV (PBB, PBDE)

FT-IR (PBB, PBDE)

Diphenylcarbazide method (Cr VIspeciation)

Analytical instrument definition

Acid DigestionDirect measurement,

grinding

Direct measurement,

Powder measurement, thin foils

Sample preparation

PWBsMetalsPlastics

Shaded row: Most important testing standard

Standard RoHS Test Method Documentation

Sample Type and Sample Preparation

Test Instrumentation and

Operation

Result

Reference Samples

Reference Methods

Validation

Standard RoHS Test Method Documentation

International Standard Methods Status

DIN 38.414, EPA 3050B, EPA 3052: Digestion and determination of heavy metals in printed wiring boards

Form the development base for new standards developments for PWB sample preparation, instrument definition, and calibration

EN 1122:2001: Determination of Cd in plasticsForms the development base for new standards developments for plastic sample preparation, instrument definition, and calibration

NIST (National Institute of Standards, US) and, BCR (Community Bureau of Reference, EU): Traceable material references

Forms the development base for new standards developments for reference materials development

Review & Support for Testing Procedure and Processes

AeA (American Electronics Association) Meeting Phoenix (Feb 2004):15 US companies reviewed & supported testing procedure & process

USITO (US International Trade Organization):Presented to testing procedure & process Chinese Ministry (MII) for RoHS testing

EICTA/Orgalime/AeA Europe/JBCE:Reviewed testing procedure & process for submission to EU TAC for RoHS

JISSO Concept Definition

Interface and Solution technology betweenuser and suppliers for Interconnecting,assembling, packaging, mounting andintegrating system design.

- This contains both functional and physical technology.

JISSO Levels Concept

4-Electronic Unit

3-Electronic ModulePropertybeforeJisso

1-Electronic Element

2-Electronic PackageJisso Level0

JISSOProduct

Level

Functional and Physical State

4

JISSOInterface

Level

Functional State Physical

State

Electronic System

Jisso Level5

3

21

UserSuppliers

Definition of Basic Jisso Levels• Level 0 - Property before Jisso

– Includes standards, patents and proprietary methodology• Jisso Product Level 1 – Electronic Element

– Bare die/Wafer ready to be mounted, semi-finished component• Jisso Product Level 2 – Electronic Package

– Electronic, Optoelectronic, Mechanical MEMS, Includes finished components

• Jisso Product Level 3 – Electronic Module – Electronic, Optoelectronic, Mechanical MEMS

• Jisso Product Level 4 – Electronic Unit – Electronic, Optoelectronic, Mechanical MEMS

• Level 5 – Electronic System– Electronic, Optoelectronic, Mechanical, Backplane, Housing or

Cabling

Level 0 – Property before Jisso The intellectual property of an item pertains to the idea or intelligence imported or described in a formal document (protocol, standards and/or specifications), design entity or patent disclosure.-The information may be in hard or soft copy and can include computer code or data format as a part of the descriptive analysis.

-The characteristics are described as to their physical, chemical, electrical, mechanical, electromechanical, environmental, and/or hazardous properties.

Level 1 – Electronic Element

Uncased bare die or discrete components (resistor , capacitor, diode, transistor, inductor, fuse), with metallization or termination ready for mounting. -This can be an IC, or discrete electrical, optical or MEMS element. -Individual elements cannot be further reduced without destroying their stated function.

Level 2 – Electronic Package

A container for an Individual Electronic Element or Elements which protects the contents and provides terminals for making connections to the rest of the circuit. -The Package outline is generally standardized or meets guideline standards. -The Package may function as electronic, optoelectronic, or Micro-Electro-Mechanical-Systems, and may in the future include Bio-electronic sensors.

IC Component Package Examples

Single Die Package

Pyramid Stacked DiePackage

Same Size Stack Die Package

Jisso Level 2 - Electronic Packages

Exact description of products to be determined

For discussion and consideration-

Level 3 – Electronic Module

A sub-assembly with functional blocks which consist of Individual Electronic Elements and /or Component Packages.- An individual module having an application specific purpose including Electronic, Optoelectronic or Mechanical (MEMS).- The module generally provides protection of its elements and packages, depending on the application.

Jisso Level 3- Electronic Modules

Exact description of products to be determined

For discussion and consideration-

Electronic Module Categorized by Interface

Wired ModuleA module which has electrical interface(Current Majority)

Wireless ModuleA module which has wireless interface

Opto-electrical ModuleA module which has optical interface

Cyber-Gate ModuleA module which has transducer between real and virtual

world information

Sensor ModuleA module which can input real world information

Realizing ModuleA module which can output real world information

Module Registration by Function

Data Processing CPU ModuleCamera ModuleTV ModuleTelephone Module

Real world information I/OSensor ModuleDisplay Module

OtherCard Module

Power GeneratingPower ModuleVRM

High FrequencyRF ModuleVCO Module

Data StorageMemory Module

NetworkSwitching Module

MaterialDeclarationIssues

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