iti mankampur training report

7/31/2019 ITI Mankampur Training Report

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BONAFIDE CERTIFICATE

This is to certify that this summer training report from ITI,Mankapur

submitted to United Institute of Technology Allahabad,is a bonafide

record of work done by Brijesh Kumar Maurya under my supervision

from 15.06.2012 to 14.07.2012

S.S.BISHT

MANAGER(HREDC)

ITI Ltd. MANKAPUR GONDA

Place - MANKAPUR

Date- 14.07.2012


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CONTENT

CMPANY PROFILE

GSM(GLOBAL SERVICE FOR MOBILE COMMUNICATION)

BTS(BASE TRANSCEIVER STATION)

SMT(SURFACE MOUNT TECHNOLOGY) PCB(PRINTED CIRCUIT BOARD)

SIX SIGMA


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COMPANY PROFILE

I.T.I Ltd is the first public sector under taking of government to provide

telecom services.

I.T.I Ltd was established in 1948 ever since as pioneering venture in the field

of telecommunication, it has contributed to 50% of the present national

telecom network.

The company offers a complete range telecom products and total solution

covering the whole spectrum of switching, transmission, access and subscriber

premises equipments.

I.T.I joined the league of world class vendors of global spectrum for mobile

communication(GSM) technology with the inauguration of mobile equipment

manufacturing facilities at its Mankapur and Raebareli Plants in 2005-06. This

ushered new era of indigenous mobile equipments production in the country.

The company is consolidating its diversification into information and

communication technology(ICT) to have its competitive edge in theconvergence market by developing its rich telecom expertise and vast

infrastructure.

Network management system, encryption and networking solution for internal

connectivity are some of the major initiatives taken by the company.


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It have six manufacturing units-

BANGALORE UNIT-

Bangalore unit is the first plant of I.T.I setup in1948 and got acceleration of

ISO 9001. The telecom products manufactured here are digital switches, digital

microwave equipment, optical fibre equipment, satellite communication

equipment, access products and terminal equipments.

NAINI ALLAHABAD UNIT-

This plant was setup in 1971 for the manufacture of transmission equipment.

The major products are optical fibre system of both PDH and SDH and

telephone equipment of various types. It has a R and D centre and modern

facility for assembly and testing with surface mount technology,

Environmental lab, metal parts manufacturing facilities and PCB plant area

are parts of modern infrastructure.

RAE-BARELI UNIT-

Rae-bareli manufacturing unit was setup in 1973 and boast a world class

infrastructure. Presently this unit manufactures GSM network equipments and

CDMA handsets. It has taken a leap to enter broad band equipments G-PON

and WIMAX.


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MANKAPUR UNIT-

Mankapur unit was established in 1983. The plant manufactures large digital

switches and digital trunk exchange in technical collaboration with M/S

ALCATEL. This unit also produces BTS. It has the most modern facility for

PCB manufacturing assembly and automatic testing facility with SMT line and

environmental test lab.

PALAKKAD UNIT-

Palakkad unit was established in 1976 as the national first electronics

switching system manufacturing unit to manufacture large digital switches and

digital trunk exchanges in collaboration with ALCATEL. The plant wasawarded with ISO 9001 and ISO 14000. With world class manufacturing

facilities and international quality standards enjoying self certification. I.T.I

Palakkad is ranked the best among the telecom field industries in india.

SRINAGAR UNIT-

Srinagar plant was setup in 1969 for the supply of components to main plant.

In the year 1981, the status of plant was upgraded to that of a manufacturing

plant for the manufacture of telephone instruments. Its main products are

handset, telephone set, and perform assembling of telephone set.


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MISSION-

The mission of ITI is to be a leader in domestic market. To retain leadership in

manufacturing and supplying of new technology telecom products and also to

regain status of top turn key solution provider.

ITI CUSTOMER-

Bharat Sanchar Nigam Limited(BSNL) Defence Railway Power sector Steel sector

ABOUT ITI Ltd MANKAPUR

It is known as digital city of india. Its construction started from 31st may 1983. Start of production in 1985. Total land ITI Mankapur is 352 acres. Factory covers area 77500 m square. AC space 44300 m square.


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Township of ITI Mankapur consists of 3000 residence, 3 intermediateschools,two banks(SBI and PNB),shopping complex, swimming pool,

auditorium, two clubs.

It has SEA Plant(Switching Exchange Assembly Plant) which is thelargest single root air condition area in Asia.

At starting there were 7088 trees but now there are approximately 35000trees.

Now ITI Mankapur has entered into non-communication field with hisnote counting machine.

Note counting machine, inverter etc are being manufactured. It is the first unit in India which got apparatus to manufacture the BTS in

year 2005.

PRODUCTION OF ITI MANKAPUR

E-10B Exchange. CSN-MM Business Exchange. GSM. SEA Division.


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GSM

Short for Global System forMobile Communications, one of the leading digital

cellular systems. GSM uses narrowband TDMA, which allows eight

simultaneous calls on the same radio frequency.

GSM was first introduced in 1991. As of the end of 1997, GSM service was

available in more than 100 countries and has become the de facto standard in

Europe and Asia.

GSM (Global System for Mobile Communications, originally Groupe

Spcial Mobile), is a standard set developed by the European

Telecommunications Standards Institute (ETSI) to describe protocols for

second generation (2G) digitalcellular networksused bymobile phones.

The GSM standard was developed as a replacement for first generation (1G)

analog cellular networks, and originally described a digital, circuit switched

network optimized for full duplex voice telephony. This was expanded over

time to include data communications, first by circuit switched transport, then

packet data transport via GPRS (General Packet Radio Services) and EDGE

(Enhanced Data rates for GSM Evolution or EGPRS).

Further improvements were made when the3GPPdeveloped third generation

(3G) UMTS standards followed by fourth generation (4G) LTE Advanced

standards.
http://www.webopedia.com/TERM/C/cellular.htmlhttp://www.webopedia.com/TERM/T/TDMA.htmlhttp://en.wikipedia.org/wiki/European_Telecommunications_Standards_Institutehttp://en.wikipedia.org/wiki/European_Telecommunications_Standards_Institutehttp://en.wikipedia.org/wiki/European_Telecommunications_Standards_Institutehttp://en.wikipedia.org/wiki/2Ghttp://en.wikipedia.org/wiki/2Ghttp://en.wikipedia.org/wiki/Cellular_networkhttp://en.wikipedia.org/wiki/Cellular_networkhttp://en.wikipedia.org/wiki/Cellular_networkhttp://en.wikipedia.org/wiki/Mobile_phonehttp://en.wikipedia.org/wiki/Mobile_phonehttp://en.wikipedia.org/wiki/Mobile_phonehttp://en.wikipedia.org/wiki/1Ghttp://en.wikipedia.org/wiki/Duplex_%28telecommunications%29#Full_duplexhttp://en.wikipedia.org/wiki/Duplex_%28telecommunications%29#Full_duplexhttp://en.wikipedia.org/wiki/Telephonyhttp://en.wikipedia.org/wiki/Telephonyhttp://en.wikipedia.org/wiki/GPRShttp://en.wikipedia.org/wiki/GPRShttp://en.wikipedia.org/wiki/EDGEhttp://en.wikipedia.org/wiki/EDGEhttp://en.wikipedia.org/wiki/3GPPhttp://en.wikipedia.org/wiki/3GPPhttp://en.wikipedia.org/wiki/3GPPhttp://en.wikipedia.org/wiki/3Ghttp://en.wikipedia.org/wiki/3Ghttp://en.wikipedia.org/wiki/3Ghttp://en.wikipedia.org/wiki/UMTShttp://en.wikipedia.org/wiki/UMTShttp://en.wikipedia.org/wiki/4Ghttp://en.wikipedia.org/wiki/4Ghttp://en.wikipedia.org/wiki/LTE_Advancedhttp://en.wikipedia.org/wiki/LTE_Advancedhttp://en.wikipedia.org/wiki/LTE_Advancedhttp://en.wikipedia.org/wiki/4Ghttp://en.wikipedia.org/wiki/UMTShttp://en.wikipedia.org/wiki/3Ghttp://en.wikipedia.org/wiki/3GPPhttp://en.wikipedia.org/wiki/EDGEhttp://en.wikipedia.org/wiki/GPRShttp://en.wikipedia.org/wiki/Telephonyhttp://en.wikipedia.org/wiki/Duplex_%28telecommunications%29#Full_duplexhttp://en.wikipedia.org/wiki/1Ghttp://en.wikipedia.org/wiki/Mobile_phonehttp://en.wikipedia.org/wiki/Cellular_networkhttp://en.wikipedia.org/wiki/2Ghttp://en.wikipedia.org/wiki/European_Telecommunications_Standards_Institutehttp://en.wikipedia.org/wiki/European_Telecommunications_Standards_Institutehttp://www.webopedia.com/TERM/T/TDMA.htmlhttp://www.webopedia.com/TERM/C/cellular.html


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GSM carrier frequencies

Main article: GSM frequency bands

GSM networks operate in a number of different carrier frequency ranges

(separated into GSM frequency ranges for 2G and UMTS frequency bands for

3G), with most 2G GSM networks operating in the 900 MHz or 1800 MHz

bands. Where these bands were already allocated, the 850 MHz and 1900 MHz

bands were used instead (for example in Canada and the United States). In rare

cases the 400 and 450 MHz frequency bands are assigned in some countries

because they were previously used for first-generation systems.

GSM service security

See also:UMTS security

GSM was designed with a moderate level of service security. The system was

designed to authenticate the subscriber using apre-shared keyandchallenge-

response. Communications between the subscriber and the base station can be

encrypted. The development of UMTS introduces an optional UniversalSubscriber Identity Module (USIM), that uses a longer authentication key to

give greater security, as well as mutually authenticating the network and the

user whereas GSM only authenticates the user to the network (and not vice

versa). The security model therefore offers confidentiality and authentication,

but limited authorization capabilities, and nonon-repudiation.
http://en.wikipedia.org/wiki/GSM_frequency_bandshttp://en.wikipedia.org/wiki/GSM_frequency_rangeshttp://en.wikipedia.org/wiki/UMTS_frequency_bandshttp://en.wikipedia.org/wiki/2Ghttp://en.wikipedia.org/wiki/2Ghttp://en.wikipedia.org/wiki/UMTS_securityhttp://en.wikipedia.org/wiki/UMTS_securityhttp://en.wikipedia.org/wiki/UMTS_securityhttp://en.wikipedia.org/wiki/Pre-shared_keyhttp://en.wikipedia.org/wiki/Pre-shared_keyhttp://en.wikipedia.org/wiki/Pre-shared_keyhttp://en.wikipedia.org/wiki/Challenge-response_authenticationhttp://en.wikipedia.org/wiki/Challenge-response_authenticationhttp://en.wikipedia.org/wiki/Challenge-response_authenticationhttp://en.wikipedia.org/wiki/Challenge-response_authenticationhttp://en.wikipedia.org/wiki/Universal_Mobile_Telecommunications_Systemhttp://en.wikipedia.org/wiki/Universal_Mobile_Telecommunications_Systemhttp://en.wikipedia.org/wiki/Universal_Subscriber_Identity_Modulehttp://en.wikipedia.org/wiki/Universal_Subscriber_Identity_Modulehttp://en.wikipedia.org/wiki/Universal_Subscriber_Identity_Modulehttp://en.wikipedia.org/wiki/Non-repudiationhttp://en.wikipedia.org/wiki/Non-repudiationhttp://en.wikipedia.org/wiki/Non-repudiationhttp://en.wikipedia.org/wiki/Non-repudiationhttp://en.wikipedia.org/wiki/Universal_Subscriber_Identity_Modulehttp://en.wikipedia.org/wiki/Universal_Subscriber_Identity_Modulehttp://en.wikipedia.org/wiki/Universal_Mobile_Telecommunications_Systemhttp://en.wikipedia.org/wiki/Challenge-response_authenticationhttp://en.wikipedia.org/wiki/Challenge-response_authenticationhttp://en.wikipedia.org/wiki/Pre-shared_keyhttp://en.wikipedia.org/wiki/UMTS_securityhttp://en.wikipedia.org/wiki/2Ghttp://en.wikipedia.org/wiki/UMTS_frequency_bandshttp://en.wikipedia.org/wiki/GSM_frequency_rangeshttp://en.wikipedia.org/wiki/GSM_frequency_bands


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GSM uses several cryptographic algorithms for security. The A5/1,A5/2and

A5/3stream ciphersare used for ensuring over-the-air voice privacy. A5/1 was

developed first and is a stronger algorithm used within Europe and the United

States; A5/2 is weaker and used in other countries. Serious weaknesses have

been found in both algorithms: it is possible to break A5/2 in real-time with a

ciphertext-only attack, and in January 2007, The Hacker's Choice started the

A5/1 cracking project with plans to use FPGAsthat allow A5/1 to be broken

with a rainbow table attack. The system supports multiple algorithms so

operators may replace that cipher with a stronger one.

GSM open-source software

Severalopen-sourcesoftware projects exist that provide certain GSM features:

gsmd daemon byOpenmoko OpenBTSdevelops aBase transceiver station The GSM Software Project aims to build a GSM analyzer for less than

$1000

OsmocomBB developers intend to replace the proprietary basebandGSM stack with a free software implementation
http://en.wikipedia.org/wiki/A5/1http://en.wikipedia.org/wiki/A5/1http://en.wikipedia.org/wiki/A5/2http://en.wikipedia.org/wiki/A5/2http://en.wikipedia.org/wiki/A5/3http://en.wikipedia.org/wiki/Stream_cipherhttp://en.wikipedia.org/wiki/Stream_cipherhttp://en.wikipedia.org/wiki/Stream_cipherhttp://en.wikipedia.org/wiki/Ciphertext-only_attackhttp://en.wikipedia.org/wiki/Ciphertext-only_attackhttp://en.wikipedia.org/wiki/The_Hacker%27s_Choicehttp://en.wikipedia.org/wiki/The_Hacker%27s_Choicehttp://en.wikipedia.org/wiki/FPGAhttp://en.wikipedia.org/wiki/FPGAhttp://en.wikipedia.org/wiki/Rainbow_tablehttp://en.wikipedia.org/wiki/Rainbow_tablehttp://en.wikipedia.org/wiki/Open_sourcehttp://en.wikipedia.org/wiki/Open_sourcehttp://en.wikipedia.org/wiki/Open_sourcehttp://en.wikipedia.org/wiki/Openmokohttp://en.wikipedia.org/wiki/Openmokohttp://en.wikipedia.org/wiki/Openmokohttp://en.wikipedia.org/wiki/OpenBTShttp://en.wikipedia.org/wiki/OpenBTShttp://en.wikipedia.org/wiki/Base_transceiver_stationhttp://en.wikipedia.org/wiki/Base_transceiver_stationhttp://en.wikipedia.org/wiki/Base_transceiver_stationhttp://en.wikipedia.org/wiki/Base_transceiver_stationhttp://en.wikipedia.org/wiki/OpenBTShttp://en.wikipedia.org/wiki/Openmokohttp://en.wikipedia.org/wiki/Open_sourcehttp://en.wikipedia.org/wiki/Rainbow_tablehttp://en.wikipedia.org/wiki/FPGAhttp://en.wikipedia.org/wiki/The_Hacker%27s_Choicehttp://en.wikipedia.org/wiki/Ciphertext-only_attackhttp://en.wikipedia.org/wiki/Stream_cipherhttp://en.wikipedia.org/wiki/A5/3http://en.wikipedia.org/wiki/A5/2http://en.wikipedia.org/wiki/A5/1


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EVOLUTION OF GSM STANDARD

1982 : Group special mobile developed GSM 1989 : GSM responsibility transferred to ETSI(European

Telecommunication Instandards Institute)

1990 : Phase 1 of GSM specification published 1991 : Commercial service started 1997 : Commercial services available in 110 countries

OBJECTIVE OF GSM

Good speech quality. Low terminal and service cost. Support for international roaming. Ability to support hand held terminals. Support for range of new services and facilities. ISDN compability. Spectral efficiency. ISDN caused the decline of E10B.


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BTS(BASE TRANSCEIVER STATION)

Base transceiver station(BTS) is the main part of mobile communication. BTS

consists of mainly three cards. Whole system of BTS consists-

Fan unit( it have 9 fans) Rack unit FACB( Fan Control Board)
http://en.wikipedia.org/wiki/File:BS11_BTS.JPG


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A typical BTS tower which holds the antenna. The tower is quite widely

misinterpreted as the BTS itself. The shelter which houses the actual BTS can

also be seen.

A mobile BTS

A BTS mounted on a building
http://en.wikipedia.org/wiki/File:Base_station_on_building.jpghttp://en.wikipedia.org/wiki/File:BaseGSM_Mobile.JPGhttp://en.wikipedia.org/wiki/File:BaseGSM_Mobile.JPGhttp://en.wikipedia.org/wiki/File:Base_station_on_building.jpghttp://en.wikipedia.org/wiki/File:BaseGSM_Mobile.JPGhttp://en.wikipedia.org/wiki/File:BaseGSM_Mobile.JPGhttp://en.wikipedia.org/wiki/File:Base_station_on_building.jpghttp://en.wikipedia.org/wiki/File:BaseGSM_Mobile.JPGhttp://en.wikipedia.org/wiki/File:BaseGSM_Mobile.JPG


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A base transceiver station (BTS) is a piece of equipment that facilitates

wireless communication between user equipment (UE) and a network. UEs are

devices like mobile phones (handsets), WLL phones, computers with wireless

internet connectivity, WiFi and WiMAX devices and others. The network can

be that of any of the wireless communication technologies like GSM, CDMA,

Wireless local loop, WAN, WiFi, WiMAX, etc.

BTS is also referred to as the radio base station (RBS), node B (in 3G

Networks) or, simply, the base station (BS). For discussion of the LTE

standard the abbreviationeNBfor evolved node B is widely used.

Though the term BTS can be applicable to any of the wireless communication

standards, it is generally associated with mobile communication technologies

like GSM and CDMA. In this regard, a BTS forms part of the base station

subsystem (BSS) developments for system management. It may also have

equipment for encrypting and decrypting communications, spectrum filtering

tools (band pass filters), etc. antennas may also be considered as components

of BTS in general sense as they facilitate the functioning of BTS. Typically a

BTS will have several transceivers (TRXs) which allow it to serve several

different frequencies and different sectors of the cell (in the case of sectorised

base stations). A BTS is controlled by a parent base station controller via the

base station control function (BCF). The BCF is implemented as a discrete unit

or even incorporated in a TRX in compact base stations.
http://en.wikipedia.org/wiki/Wirelesshttp://en.wikipedia.org/wiki/User_equipmenthttp://en.wikipedia.org/wiki/Mobile_phonehttp://en.wikipedia.org/wiki/Wireless_local_loophttp://en.wikipedia.org/wiki/Computershttp://en.wikipedia.org/wiki/Wireless_internethttp://en.wikipedia.org/wiki/Wireless_internethttp://en.wikipedia.org/wiki/WiFihttp://en.wikipedia.org/wiki/WiMAXhttp://en.wikipedia.org/wiki/GSMhttp://en.wikipedia.org/wiki/CDMAhttp://en.wikipedia.org/wiki/Wireless_local_loophttp://en.wikipedia.org/wiki/Wide_area_networkhttp://en.wikipedia.org/wiki/WiFihttp://en.wikipedia.org/wiki/WiMAXhttp://en.wikipedia.org/wiki/Node_Bhttp://en.wikipedia.org/wiki/Node_Bhttp://en.wikipedia.org/wiki/3Ghttp://en.wikipedia.org/wiki/3GPP_Long_Term_Evolutionhttp://en.wikipedia.org/wiki/EnodeBhttp://en.wikipedia.org/wiki/EnodeBhttp://en.wikipedia.org/wiki/EnodeBhttp://en.wikipedia.org/wiki/Wireless_communicationhttp://en.wikipedia.org/wiki/GSMhttp://en.wikipedia.org/wiki/CDMAhttp://en.wikipedia.org/wiki/Base_station_subsystemhttp://en.wikipedia.org/wiki/Base_station_subsystemhttp://en.wikipedia.org/wiki/Encryptinghttp://en.wikipedia.org/wiki/Antennashttp://en.wikipedia.org/wiki/Base_station_controllerhttp://en.wikipedia.org/wiki/Base_station_controllerhttp://en.wikipedia.org/wiki/Antennashttp://en.wikipedia.org/wiki/Encryptinghttp://en.wikipedia.org/wiki/Base_station_subsystemhttp://en.wikipedia.org/wiki/Base_station_subsystemhttp://en.wikipedia.org/wiki/CDMAhttp://en.wikipedia.org/wiki/GSMhttp://en.wikipedia.org/wiki/Wireless_communicationhttp://en.wikipedia.org/wiki/EnodeBhttp://en.wikipedia.org/wiki/3GPP_Long_Term_Evolutionhttp://en.wikipedia.org/wiki/3Ghttp://en.wikipedia.org/wiki/Node_Bhttp://en.wikipedia.org/wiki/WiMAXhttp://en.wikipedia.org/wiki/WiFihttp://en.wikipedia.org/wiki/Wide_area_networkhttp://en.wikipedia.org/wiki/Wireless_local_loophttp://en.wikipedia.org/wiki/CDMAhttp://en.wikipedia.org/wiki/GSMhttp://en.wikipedia.org/wiki/WiMAXhttp://en.wikipedia.org/wiki/WiFihttp://en.wikipedia.org/wiki/Wireless_internethttp://en.wikipedia.org/wiki/Wireless_internethttp://en.wikipedia.org/wiki/Computershttp://en.wikipedia.org/wiki/Wireless_local_loophttp://en.wikipedia.org/wiki/Mobile_phonehttp://en.wikipedia.org/wiki/User_equipmenthttp://en.wikipedia.org/wiki/Wireless


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General architecture

A BTS in general has the following parts:

Transceiver (TRX)

Quite widely referred to as the driver receiver (DRX), DRX are either in

the form of single (sTRU), double(dTRU) or a composite double radio

unit (DRU). It basically does transmission and reception of signals. It

also does sending and reception of signals to and from higher network

entities (like thebase station controllerin mobile telephony).

Power amplifier (PA)

Amplifies the signal from DRX for transmission through antenna; may

be integrated with DRX.

Combiner

Combines feeds from several DRXs so that they could be sent out

through a single antenna. Allows for a reduction in the number of

antenna used.

Duplexer

For separating sending and receiving signals to/from antenna. Does

sending and receiving signals through the same antenna ports (cables

to antenna).
http://en.wikipedia.org/wiki/Base_station_controllerhttp://en.wikipedia.org/wiki/Base_station_controllerhttp://en.wikipedia.org/wiki/Base_station_controllerhttp://en.wikipedia.org/wiki/Base_station_controller


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Antenna

This is the structure that lies underneath the BTS; it can be installed as

it is or disguised in some way (Concealed cell sites).

Alarm extension system

Collects working status alarms of various units in the BTS and extends

them to operations and maintenance (O&M) monitoring stations.

Control function

Controls and manages the various units of BTS, including any software.

On-the-spot configurations, status changes, software upgrades, etc. are

done through the control function.
http://en.wikipedia.org/w/index.php?title=Concealed_cell_sites&action=edit&redlink=1http://en.wikipedia.org/w/index.php?title=Concealed_cell_sites&action=edit&redlink=1http://en.wikipedia.org/w/index.php?title=Concealed_cell_sites&action=edit&redlink=1http://en.wikipedia.org/w/index.php?title=Concealed_cell_sites&action=edit&redlink=1


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SURFACE-MOUNT TECHNOLOGY

Surface-mount technology (SMT) is a method for constructing electronic

circuits in which the components are mounted directly onto the surface of

printed circuit boards (PCBs). An electronic device so made is called a

surface-mount device (SMD). In the industry it has largely replaced the

through-hole technology construction method of fitting components with wire

leads into holes in the circuit board. Both technologies can be used on the same

board for components not suited to surface mounting such as transformers and

heat-sinked power semiconductors.

An SMT component is usually smaller than its through-hole counterpart

because it has either smaller leads or no leads at all. It may have short pins or

leads of various styles, flat contacts, a matrix of solder balls (BGAs), or

terminations on the body of the component.
http://en.wikipedia.org/wiki/Electronicshttp://en.wikipedia.org/wiki/Printed_circuit_boardhttp://en.wikipedia.org/wiki/Through-hole_technologyhttp://en.wikipedia.org/wiki/Lead_%28electronics%29http://en.wikipedia.org/wiki/Ball_grid_arrayhttp://en.wikipedia.org/wiki/Ball_grid_arrayhttp://en.wikipedia.org/wiki/Lead_%28electronics%29http://en.wikipedia.org/wiki/Through-hole_technologyhttp://en.wikipedia.org/wiki/Printed_circuit_boardhttp://en.wikipedia.org/wiki/Electronics


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Assembly techniques

Assembly line with SMT placement machines,Where components are to be

placed, the printed circuit board normally has flat, usually tin-lead, silver, or

gold plated copper pads without holes, called solder pads. Solder paste, a

sticky mixture offlux and tiny solder particles, is first applied to all the solder

pads with a stainless steel or nickel stencil using a screen printing process. It

can also be applied by a jet-printing mechanism, similar to an inkjet printer.

After pasting, the boards then proceed to the pick-and-place machines, where

they are placed on a conveyor belt. The components to be placed on the

boards are usually delivered to the production line in either paper/plastic

tapes wound on reels or plastic tubes. Some large integrated circuits are

delivered in static-free trays. Numerical control pick-and-place machines

remove the parts from the tapes, tubes or trays and place them on the PCB.
http://en.wikipedia.org/wiki/Tinhttp://en.wikipedia.org/wiki/Copperhttp://en.wikipedia.org/wiki/Solder_pastehttp://en.wikipedia.org/wiki/Flux_%28metallurgy%29http://en.wikipedia.org/wiki/Screen_printinghttp://en.wikipedia.org/wiki/Inkjet_printerhttp://en.wikipedia.org/wiki/SMT_placement_equipmenthttp://en.wikipedia.org/wiki/Numerical_controlhttp://en.wikipedia.org/wiki/File:Juki_KE-2080L_by_Megger.jpghttp://en.wikipedia.org/wiki/Numerical_controlhttp://en.wikipedia.org/wiki/SMT_placement_equipmenthttp://en.wikipedia.org/wiki/Inkjet_printerhttp://en.wikipedia.org/wiki/Screen_printinghttp://en.wikipedia.org/wiki/Flux_%28metallurgy%29http://en.wikipedia.org/wiki/Solder_pastehttp://en.wikipedia.org/wiki/Copperhttp://en.wikipedia.org/wiki/Tin


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Advantages

The main advantages of SMT over the older through-hole technique are:

Smaller components. As of 2012 smallest was 0.2 0.1 mm (0.01 in

0.005 in: 01005). Much higher component density (components per unit area) and many

more connections per component.

Lower initial cost and time of setting up for production. Fewer holes need to be drilled. Simpler and faster automated assembly. Some placement machines are

capable of placing more than 136,000 components per hour.* Small

errors in component placement are corrected automatically as the

surface tension of molten solder pulls components into alignment with

solder pads.

Components can be placed on both sides of the circuit board.

DISADVANTAGE OF SMT

More heat generation. Small clearance makes cleaning difficult. Visual inspection difficult. Air conditioned required.


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PRINTED CIRCUIT BOARD

A printed circuit board or PCB, is used to mechanically support and

electrically connect electronic components using conductive pathways, tracks

or signal traces etched from copper sheets laminated onto a non-conductive

substrate. It is also referred to as printed wiring board (PWB) or etched

wiring board. Printed circuit boards are used in virtually all but the simplest

commercially produced electronic devices.

A PCB populated with electronic components is called a printed circuit

assembly (PCA), printed circuit board assembly or PCB Assembly

(PCBA). In informal use the term "PCB" is used both for bare and assembled

boards, the context clarifying the meaning.

Alternatives to PCBs include wire wrap and point-to-point construction. PCBs

must initially be designed and laid out, but become cheaper, faster to make,

and potentially more reliable for high-volume production since production and

soldering of PCBs can be automated. Much of the electronics industry's PCB

design, assembly, and quality control needs are set by standards published by

the IPC organization.
http://en.wikipedia.org/wiki/Electronic_componenthttp://en.wikipedia.org/wiki/Electrical_conductorhttp://en.wikipedia.org/wiki/Industrial_etchinghttp://en.wikipedia.org/wiki/Copperhttp://en.wikipedia.org/wiki/Laminatedhttp://en.wikipedia.org/wiki/Substrate_%28electronics%29http://en.wikipedia.org/wiki/Wire_wraphttp://en.wikipedia.org/wiki/Point-to-point_constructionhttp://en.wikipedia.org/wiki/Mass_productionhttp://en.wikipedia.org/wiki/IPC_%28electronics%29http://en.wikipedia.org/wiki/IPC_%28electronics%29http://en.wikipedia.org/wiki/Mass_productionhttp://en.wikipedia.org/wiki/Point-to-point_constructionhttp://en.wikipedia.org/wiki/Wire_wraphttp://en.wikipedia.org/wiki/Substrate_%28electronics%29http://en.wikipedia.org/wiki/Laminatedhttp://en.wikipedia.org/wiki/Copperhttp://en.wikipedia.org/wiki/Industrial_etchinghttp://en.wikipedia.org/wiki/Electrical_conductorhttp://en.wikipedia.org/wiki/Electronic_component


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Manufacturing

Materials

A PCB as a design on a computer (left) and realized

as a board assembly populated with components

(right). The board is double sided, with through-hole

plating, green solder resist, and white silkscreen

printing. Both surface mount and through-hole

components have been used.
http://en.wikipedia.org/wiki/File:Mouse_printed_circuit_board_both_sides_IMG_0959a.JPGhttp://en.wikipedia.org/wiki/File:PCB_design_and_realisation_smt_and_through_hole.pnghttp://en.wikipedia.org/wiki/File:Mouse_printed_circuit_board_both_sides_IMG_0959a.JPGhttp://en.wikipedia.org/wiki/File:PCB_design_and_realisation_smt_and_through_hole.png


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A PCB in a computer mouse. The Component Side (left) and the printed side

(right).

The Component Side of a PCB in a computer mouse; some examples for

common components and their reference designations on the silk screen.

Component and solderside

Conducting layers are typically made of thin copper foil. Insulating layers

dielectric are typically laminated together with epoxy resin prepreg. The

board is typically coated with a solder mask that is green in color. Other colors

that are normally available are blue, black, white and red.
http://en.wikipedia.org/wiki/Electronic_symbols#Reference_designationshttp://en.wikipedia.org/wiki/Electronic_componenthttp://en.wikipedia.org/wiki/Solderhttp://en.wikipedia.org/wiki/Dielectrichttp://en.wikipedia.org/wiki/Epoxy_resinhttp://en.wikipedia.org/wiki/Prepreghttp://en.wikipedia.org/wiki/Solder_maskhttp://en.wikipedia.org/wiki/File:Splatine.jpghttp://en.wikipedia.org/wiki/File:Mouse_printed_circuit_board_component_side_IMG_0952_-_d.JPGhttp://en.wikipedia.org/wiki/File:Splatine.jpghttp://en.wikipedia.org/wiki/File:Mouse_printed_circuit_board_component_side_IMG_0952_-_d.JPGhttp://en.wikipedia.org/wiki/Solder_maskhttp://en.wikipedia.org/wiki/Prepreghttp://en.wikipedia.org/wiki/Epoxy_resinhttp://en.wikipedia.org/wiki/Dielectrichttp://en.wikipedia.org/wiki/Solderhttp://en.wikipedia.org/wiki/Electronic_componenthttp://en.wikipedia.org/wiki/Electronic_symbols#Reference_designations


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There are quite a few different dielectrics that can be chosen to provide

different insulating values depending on the requirements of the circuit. Some

of these dielectrics are polytetrafluoroethylene (Teflon), FR-4, FR-1, CEM-1

or CEM-3.

Well known prepreg materials used in the PCB industry are FR-2 (Phenolic

cotton paper), FR-3 (Cotton paper and epoxy), FR-4 (Woven glass and epoxy),

FR-5 (Woven glass and epoxy), FR-6 (Matte glass and polyester), G-10

(Woven glass and epoxy), CEM-1 (Cotton paper and epoxy), CEM-2 (Cotton

paper and epoxy), CEM-3 (Non-woven glass and epoxy), CEM-4 (Woven

glass and epoxy), CEM-5 (Woven glass and polyester). Thermal expansion is

an important consideration especially with ball grid array (BGA) and naked die

technologies, and glass fiber offers the best dimensional stability.

FR-4 is by far the most common material used today. The board with copper

on it is called "copper-clad laminate".
http://en.wikipedia.org/wiki/Polytetrafluoroethylenehttp://en.wikipedia.org/wiki/FR-2http://en.wikipedia.org/wiki/FR-4http://en.wikipedia.org/wiki/Ball_grid_arrayhttp://en.wikipedia.org/wiki/Ball_grid_arrayhttp://en.wikipedia.org/wiki/FR-4http://en.wikipedia.org/wiki/FR-2http://en.wikipedia.org/wiki/Polytetrafluoroethylene


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SIX SIGMA

Six Sigma is a business management strategy, originally developed by

Motorola in 1986.Six Sigma became well known after Jack Welch made it a

central focus of his business strategy at General Electric in 1995, and today it

is widely used in many sectors of industry.

Six Sigma seeks to improve the quality of process outputs by identifying and

removing the causes of defects (errors) and minimizing variability in

manufacturing and business processes. It uses a set of quality management

methods, including statistical methods, and creates a special infrastructure of

people within the organization ("Black Belts", "Green Belts", etc.) who areexperts in these methods. Each Six Sigma project carried out within an

organization follows a defined sequence of steps and has quantified financial

targets (cost reduction and/or profit increase).

Methods

Six Sigma projects follow two project methodologies inspired by Deming's

Plan-Do-Check-Act Cycle. These methodologies, composed of five phases

each, bear the acronyms DMAIC and DMADV.

AIC is used for projects aimed at improving an existing business process.
http://en.wikipedia.org/wiki/Strategic_managementhttp://en.wikipedia.org/wiki/Jack_Welchhttp://en.wikipedia.org/wiki/General_Electrichttp://en.wikipedia.org/wiki/Statistical_dispersionhttp://en.wikipedia.org/wiki/Manufacturinghttp://en.wikipedia.org/wiki/Business_processhttp://en.wikipedia.org/wiki/Quality_managementhttp://en.wikipedia.org/wiki/Statisticshttp://en.wikipedia.org/wiki/W._Edwards_Deminghttp://en.wikipedia.org/wiki/PDCAhttp://en.wikipedia.org/wiki/PDCAhttp://en.wikipedia.org/wiki/W._Edwards_Deminghttp://en.wikipedia.org/wiki/Statisticshttp://en.wikipedia.org/wiki/Quality_managementhttp://en.wikipedia.org/wiki/Business_processhttp://en.wikipedia.org/wiki/Manufacturinghttp://en.wikipedia.org/wiki/Statistical_dispersionhttp://en.wikipedia.org/wiki/General_Electrichttp://en.wikipedia.org/wiki/Jack_Welchhttp://en.wikipedia.org/wiki/Strategic_management


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DMADV is used for projects aimed at creating new product or processdesigns.[15]DMADV is pronounced as "duh-mad-vee" ().

DMAIC

The DMAIC project methodology has five phases:

Define the problem, the voice of the customer, and the project goals,specifically.

Measure key aspects of the current process and collect relevant data. Analyze the data to investigate and verify cause-and-effect

relationships. Determine what the relationships are, and attempt to

ensure that all factors have been considered. Seek out root cause of the

defect under investigation.

Improve or optimize the current process based upon data analysis usingtechniques such as design of experiments, poka yoke or mistake

proofing, and standard work to create a new, future state process. Set

up pilot runs to establish process capability.
http://en.wikipedia.org/wiki/Six_Sigma#cite_note-juran-14http://en.wikipedia.org/wiki/Six_Sigma#cite_note-juran-14http://en.wikipedia.org/wiki/Six_Sigma#cite_note-juran-14http://en.wikipedia.org/wiki/Design_of_experimentshttp://en.wikipedia.org/wiki/Poka_yokehttp://en.wikipedia.org/wiki/Process_capabilityhttp://en.wikipedia.org/wiki/Process_capabilityhttp://en.wikipedia.org/wiki/Poka_yokehttp://en.wikipedia.org/wiki/Design_of_experimentshttp://en.wikipedia.org/wiki/Six_Sigma#cite_note-juran-14


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Origin and meaning of the term "six sigma process"

The term "six sigma process" comes from the notion that if one has six

standard deviations between the process mean and the nearest specification

limit, as shown in the graph, practically no items will fail to meet

specifications.This is based on the calculation method employed in process

capability studies.

Capability studies measure the number of standard deviations between the

process mean and the nearest specification limit in sigma units. As process

standard deviation goes up, or the mean of the process moves away from the

center of the tolerance, fewer standard deviations will fit between the mean and

the nearest specification limit, decreasing the sigma number and increasing the

likelihood of items outside specification.
http://en.wikipedia.org/wiki/Standard_deviationhttp://en.wikipedia.org/wiki/Meanhttp://en.wikipedia.org/wiki/Process_capabilityhttp://en.wikipedia.org/wiki/Process_capabilityhttp://en.wikipedia.org/w/index.php?title=File:6_Sigma_Normal_distribution.svg&page=1http://en.wikipedia.org/wiki/Process_capabilityhttp://en.wikipedia.org/wiki/Process_capabilityhttp://en.wikipedia.org/wiki/Meanhttp://en.wikipedia.org/wiki/Standard_deviation


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OBJECTIVE OF SIX SIGMA

Six sigma as agoal. Six sigma as a bench mark. Six sigma as a vision. Six sigma as a philosophy. Six sigma as a business policy. Six sigma as a tool. Six sigma as a method. Six sigma as a strategy. Six sigma as a metric.

PRINCIPLE OF SIX SIGMA

Elinghtment. Acceptance. Tool. Development. Result. renewable.


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PROCESS ELEMENTS

Analysis of variation. Disciplined approach. Quantitative measures. Statistical methods. Process improvement.

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