ITI LIMITED DOORVANI NAGAR

BENGALURU

IN-PLANT TRAINING REPORT

Submitted by:

Hemanth Kumar HG

3rd Year B.Tech, CSE

NITK ,Surathkal

Under Guidance of

Mr.Ronny Estiberio[A.O H.R]

ITI Limited,Bengaluru

CONTENTS

SL.NO DEPARTMENTS 1. RESEARCH AND DEVELOPMENT

1. IP ENCRYPTOR AND ACCESS LAB 2. WIRELESS LAB 3. SCADA LAB 4. POWER SUPPLY LAB 5. PCB AND CHEMICAL LAB 6. TERMINAL LAB 7. CAD LAB 8. RELIABILITY LAB

2. TDP 3. QUALITY ASSURANCE 4. INFORMATION TECHNOLOGY 5. SAS AND SAP

F2: SMT LINE (Surface mounting Technology) F3:C-DOT card Repair centre

ACKNOWLEDGEMENT

Apart from the technical knowledge that will be practiced in the college and schools Practical Approach is much more important than the theory. Even though we have the talent and knowledge ,opportunity and right guidance are two very important backups.

In plant training is one of the main aspect of B.Tech or B.E Programme. It is my great honor to go under Training in one of the prestigious company called ITI Limited one of the leading public sector amongst the electronics industries in India . I am thankful to the company for allowing me to do training as per the request sent .

I wish my gratitude to Mr. Ronny Estiberio (AO HR ,ITI Bangalore) and all the employees who has co-operated in sharing the knowledge and allowing me to do training in systematic manner .I am thankful to them for providing their valuable time and necessary information in order to complete the project successfully. I’m thankful to the team members who has helped me to understand the various concepts in the lab .And Finally I want to thank my family for the support and love.

HEMANTH KUMAR HG(3831)

3RD YEAR B.TECH,CSE

NITK SURATHKAL ,MANGALORE

INTRODUCTION

ITI Limited was set up in 1948 in India’s technology capital Bangalore.ITI is the first telecom equipment manufacturer. It has a complete range of Telecom product, value added services and country wide marketing and customer care centre. ITI Limited is one of the premier public sector unit in India with the state of art manufacturing facilities at six locations in India

The company offers a complete range of telecom product covering the whole spectrum of switching premier equipment in line with the pre-valing technology trend.

Indian Telephone Industry is consolidating its diversification into IT and IT enabled services to gain a competitive edge in the convergence market. As a part part of its diversification exercise ITI is in the process of forming joint venture for the manufacturing world class telecom equipment.

1. R &D Department [Research and Development]:

It is the first department visited by our group and we have visited the total of 8 lab’s and gathered lot of information.

The following are the Lab’s under the R&D Department:

1.IP ENCRYPTOR & ACCESS LAB

2.WIRELESS LAB

3.SCADA LAB

4. POWER SUPLLY LAB

5.CHEMICAL LAB

6.TERMINAL LAB

7.PCB AND CAD LAB

8.RELIABILITY LAB

1. IP ENCRYPTOR & ACCESS LAB:

This particular lab explains about the Data communication and Voice communication.

Device shown: PRIMARY MUX

PROPERTIES: I/P -240v, 30 channel, RS 23I IC, Remote monitoring is enabled, Microcontroller, APGI.

ADSL CPE TYPE 1AND TYPE 2 for wifi communication.

Data card and synchronous data cards functionality is explained like these cards are used in ATM security purpose and by the PIC security system we can protect the code even after the controller is lost. Call switching facility like FXO and FXS is shown which consists of Auto Junction, E&M junction circuit. Knowledge of Transmission mode is explained like medium of transmission and their advantages.

2. WIRELESS LAB

This lab explains about the wireless communication and cable connection.

Exchange acts as medium between the telephone in cable connection.

Device Shown: ISM band radio , control card

Properties:2.4 -2.485 Ghz

Data rate-250Kbps

Interface- RF

Uses Transducer

Supports: Indoor (1KM)

Outdoor (10km)

Points to keep in mind:

1.Programs are loaded into flash memory for fast access.

2.PORT switching concept.(Voltage regulator used convert 5 to 3.5 v)

3.Rod Antenna(extends upto 3.2 Km) used for PC to PC communication.

4.ARM controller (32 bit)

3. SCADA LAB (Supervisory control and data acquisition system)

This lab explains about the network tracking facility for Indian Railways. Used in Railway line , Monitoring and control OS line .The signals are sent through the serial communication from RTU to RTC.

RTU(Remote terminal unit) RTC(Remote terminal centre) MMI(Main Machine Interface)

RTU server is used in remote areas and in order to communicate 1 modem is installed in RTU and RCC .RTU server rack consists of various compartments and in each row the functionally differs. First one is PSU rack which consists of AC and DC module. Second Rack consists of I/P card ,I/O card, Duo card ,CPU card, IF card. And the last rack is Relay circuits of different channel. Main Rack consist of Transducer (analog to digital conversion) which is divided into two one is voltage and other is current Transducer. SCADA RTU is slave device and it is operates on 240v AC .

4. POWER SUPPLY LAB

This lab explains about the different power supply and protection circuit/

1.Linear Power supply(LPS)

2.Switch mode power supply(SMPS)

LPS:

Disadvantages:

1.High cost

2.Failure more

3.Size more.

Protection circuits :

1.UV/OV

2.BMI/EMC

REGULATOR DC OUTPUT

FILTER RECTIFIER STEPDOWN TRANSFORMER

230V AC

50 HZ

3.SPIKE

4.LED /ALARM

SMPS:

EMI testing and Bread Board testing is also done in this lab.

5. PCB AND CHEMICAL LAB

In this lab we learnt about the PCB’s properties, manufacturing of Board cleaning , pasting, drilling, filling and other processes involved in making the PCB’s.In ITI four layer PCB’s are manufactured .The manufacturing is done by PCB machineries.

The proper process involved in the double sided PCB:

1.Copper clad cut to size

2.CNC drilling

3.Debur and cleaning

RECTIFIER FILTER

SDT SWITCHING

CIRCUIT

RECTIFIER AC

50 HZ

REGULATOR DC OUTPUT

4.Platted through hole 15.cut to final size

5.Lamination 16.Bare board Testing

6.Allign and expose circuit 17.Legend marking

7.Developing

8.Electro copper Plating

9.Tin Plating

10.Film stripping

11.Etching

12.Tin stripping

13.Solder masking

14.expose developing

The process involved for multilayer Boards :

1.Copper clad cub to size 9.Prepreg

2.Initial Drilling 10.Copper fail

3.Photo film lamination 11.Booking of layer

4.Align and expose 12.Pressing

5.Developing

6.Etching

7.Film stripping

8.Black Oxide

6. CAD (COMPUTER AIDED DESIGN)

PCB is designed using CAD .The software used in zuken cadstar for designing 2,4,6,8.. layer PCB via interconnection between top and bottom.

Top layer :Horizontal layer

Bottom layer: Vertical layer

Ground : Analog to digital ground

VCC : Analog to digital vcc

Filming is done using black plastic paper thereafter BBT testing is done then lastly Assembling is done before going to the PCB machine.

7. TERMINAL LAB

This lab tells about the advanced technology used in the telephone device in the filed of defence .Trainee showed all the types of telephone from first telephone to the latest telephone.

Different phases of telephone technology are:

1. Rotatory dial phone 2. Cardless phone 3. ISDN 4. IP Phone 5. Caller ID 6. Executive telephone

The First electric telephone was designed in 1980 this phone consists of

1.Dailer IC

2.Ringer IC

3.Speech IC

The electronic telephone requires 48v supply and 25hz frequency.

Thunder, humidity and different climate are some of the problems that we need to overcome .

Dialler IC: This IC is present in the keypad to detect the key pressing

Two modes used in this telephone are :

1.Pulse mode

2.Tone mode

8. RELIABILITY LAB

Reliability means how the equipment works under the stressed condition and dependability of the machine and trust worthy.

ITI has many chambers to check the reliability at an instrument under various condition like humidity, temperature , volume ,pressure etc.

These are some of the chambers used are:

Thermotron: Volume :30lt

Temperature :70 c to 150 c

WEISS Tecnik 1000SB Climate Chamber : ( Durability test)

Temp : -15c to 100c

Humidity: 20% to 95%

Volume : 10,000lt

Tenny 64 climate chamber: Volume : 1800lt

Temperatre: -40 c to 100c

Humidity : 50% to 95%

BEMED ALTITUDE CHAMBER:

Volume : 1800lt

Temp: -60c to 100c

TABAI: Volume :90lt

Temp: 200c

2. TDP (TELEPHONE DEFENCE PRODUCTS) DEPT:

In this particular department there are 2 types of Telephones which are manufactured and replaced .

1. E7S-04

2. D7S

1. EXECUTIVE TELEPHONE SYSTEM

2. DEFENCE TELEPHONE SYSTEM

Telephones which are manufactured are tested here and the main concentration of this department is on field telephone testing which is 1 to 1 connection. Second one is Electromechanical which is used for 2 line communication purpose .

RANGE : 40KM

The dial parameter are measured using a device called as 1088[ pulse switch telephone analyzer]

FIELD AUTO TELEPHONE 2A:

This particular type of telephone is used in RR vehicle (radio relay vehicle). In RR vehicle the Antenna is mounted on top the vehicle which enables it to extract the signal. This type of Telephone consists of Number pad.

MAGNETO PHONE:

In this phone the conversion of magnetic pulses into electrical voltage takes place. No frequency is used here ,used for 1 to 1 communication.

VOLTAGE RANGE : 80V to 110V

SOUND POWER TELEPHONE(BULK HEAD)

1. Used in Indian naval ship for good communication system.

2. It does not require any external power supply

3. One-to-one Communication

4. Consists of Generator, when we crank it 24v to 26v will be generated.

5. RANGE: 55KM

D7S PHONE [2A]

The main feature of this phone is one to many communication facility.

Used in INS (space and sea level communication purpose) .It consists of HF Generators (900hz). Output will be in range of 20-27v. Unlike other defense telephone provides 1 to 1 communication.

Different modes are available in this phone :

1. Ratio mode

2. Auto CB mode

3. Magneto mode.

4. Sine mode.

In sine mode phone is connected to over exchange line via exchange. Auto CB phone used for one to one communication. Ratio mode is used for wireless communication.

Executive telephone service: used in office(I/P = +1.5v)

Auto test, simulation test , step by step testing is done in TDP division. All the device here are 32 channel of Input =40V .

3. QUALITY ASSURANCE (METAL LAB)

Any devices that comes to this plant are qualitatively checked before its going to deliver until or unless it is checked in both electrical and mechanical testing manner .

1.Electrical checks

2.Mechanical checks

In this dept various testing are done through different machine depending on the material and subjected to different electrical test which can measure the electrical parameters.(LCR meter ,LCZ meter, Dual DC power supply, AC/DC high Voltage Test, Micro Ohm meter. These are test conducted under Electrical.

Mechanical checks the properties of device like Elongation, Tensile, Hardness . For different types of devices different types of testing is done.

Checking under Mechanical checks:

1.Load testing

2.Thermoplast Checking

3. Tensile Stress Checking.

4.Bending test.

5.Cross Breaking Test.

6.Shearing Test.

7.Cross Breaking Test.

UTM :

Universal Testing machine is used to check the device load capacity 50,000kg is the max load that can be tested in this machine. In tensile stress machine min weight is 500gm to max of 50kg is tested. Similarly in Bending testing the device is tested whether it consists of power or scratches . Different machines will have different units example in some tensile testing machine the units used are Newton and in some machine weight is used .Mechanical Strength is applied on the particular in order to check the durability of the device in case if it breaks. Similarly for the wires elongation testing is done using the machines .

1.Izode Impact test machine.

2.Oven Machine

3.Hawkwell machine(Hardness testing machine)

“ONE TEST IS WORTH A THOUSAND EXPERT OPINION”.

4. INFORMATION TECHNOLOGY DEPARTMENT

Several Industries are associated with information technology, such as computer hardware, software, electronics, semiconductors, internet, telecom equipment, e-commerce and computer related services.

IT department takes care of information transmissions and communication between different systems in the industry and with other industries. It basically deals with application of telecommunication equipment and computers to storing, transmitting, receiving and manipulating data often in context of business or other enterprises.

In order to communicate within the company, with different departments and divisions, EPR application is being used. This application helps employees to pass the messages related to orders and other information to each other. It also allows administrator to monitor activity of each employees and it reduces the human labour to transfer paper written order details and it also helps to faster the putting order and delivering the products.

Now a days, every company needs its own website, where it can put details about the company and related news. Designing website is also work of IT department and maintaining it also requires a lot of works, because of dynamic nature of websites. For designing website we need to design the layout of webpages and it involves knowledge of web designing aspects.

Various aspects used in designing a website for the company:

• Content Modelling • Presentation Modelling • Behaviour Modelling • Designing Architecture • Designing Content

In order to control every activity related to internet, we need computer which will be performing the task of controlling and monitoring the system. There are two kinds of OS, server side OS and client side OS.

Windows NT is a server side OS and it is equipped with much faster processor and has much higher value of RAM and storage. For server we need a system with much higher value of cache memory and Windows NT if a better option for that. Windows is one of the popular OS and it is available with INTEL core processor, again which is very famous and costly compared to other processors. AMD is the best and more reliable processor available in the market. Unlike AMD, INTEL processors support only Windows OS. But AMD supports all the OS available in the market. Even though, Windows is the most popular OS and it is available with INTEL processor, But 45% of market is owned by AMD.

MAC was the first OS with GUI and it was developed by Bill Gates.

After MAC, Windows became most popular OS and it was also developed by Bill Gates. There are many other OS available in the market like DOS, UNIX, UBUNTU, LINUX, FEDORA etc.

MAC is most costly OS available in the market and LINUX is free. There are many versions available for LINUX in market and is most secure and reliable operating system. It is also multitasking and

compared to other operating systems it is more user friendly and easy to use because its user interface is very simple.

VIRUS stands for Virtual Information Resource Under Seize. These are small macros or programs which can affect the system by so many ways like filling up the memory with junk files, creating shortcut foe every files and folders in the system, deleting the OS programs or crashing the system.

Like VIRUS, there are many more programs which can harm the system like TROJAN, ADWARE or MALWARE. All these threats works only when their .exe files are run on the system. So all anti-virus or other software mainly try to stop them from running in the system. They identify the files and delete them.

Employees working in IT Department, also have to take care that nobody hack the systems and steal the data. So they need to make sure that no VIRUS can attack the system and if attacked, they should be able to remove it from the system.

5. SAP & SAS (Switching and access products):

OCB-CSN TESTING:

OCB(organ de command) is the main part of the exchange and this module is tested in this particular department.

The function handled by OCB are:-

1.Alarm management.

2.Billling.

3.Call Handling.

One single OCB line can handle upto 5 million Telephone lines.

83 processors are used in this OCB. OCB 283 is the technology used in this department. Normally one OCB is sufficient for an exchange for a typical sized area.

Types of cards in an OCB Module:-

1.Line card.

2.Power card.

3.CSN.

1.Line card divided into 16 portion each of which each of which corresponds to a 1 subscriber.

2.This type of card provides power to the module ,it has various power supply voltages. The voltage on the line from the exchange is -48v which is standard voltage.

CSN: Numerical satellite concentrator

This type of machine is connected to the OCB for distribution of lines to the subscribers. A typical CSN can be accessed by 2000 subscribers. If CSN is directly connected to the OCB then it is called local connection. If CSN is connected to the another separate exchange then it is called distinct connection.

F3:C-DOT card Repair centre :

Centre for development of Telematics .It gives design and prototype to the manufacturers.

SBM-XL:

It is a single base module which is used for telephone exchange. XL signifies extra large. It contains various cards:

1.Line cards.

2.Power cards.

2024 subscribers are possible by single SBM 2 line module.

The SBM is connected to the TDP which is a terminal used to see the status of the system.SBM deals with both analog and digital.

Any fault in the cards are tested using Jiggs. RAX (Rural area exchange)-256 is the type of SBM used for village subscribers and the capacity is 240 subscribers. Similarly, RAX-128 is used for 120 to 140 subscribers. 16 lines per card is used in the CSN at this department.

F2: SMT LINE (Surface mounting Technology)

This type of technique is used to measure the quality of soldering , accuracy, speed. Multi-layer Boards are manufactured using Surface Mounting. It is the conventional way of approach.

Process stages in SMT Line are:

1.STENCIL PRINTER

2.GLUTE DISPENSER

3.CHIP SHOOTER

4.FINE FLACER

5.SHINDENSHI AO 1

6.RESEARCH MICRLO REFLOW OVEN

7.FUJI PCB UNLOADER.

These are machine used in this particular department for mounting the PCB’s.

Points to be noted during this process:

Stainless steel is used. Paste applied on the PCB in Glute dispenser consists of

lead,tin,silver. Flux is used for cleaning , Sliver is used for contact. Chip Shooter consists of 20 Turrets and each has 6 nossils and

each nossils functionality is assigned by the particular machine software. Apprx 11components/sec is placed on the PCB.

IC placer FIP 3 0.03mm for tape comp@6,545cph . 0.025mm for IC’s @1,440cph In reflow oven temp maintained in the range of 150 to 300

degree.It Includes 7 chamber. Visual Inspection is the main part because sometimes due the

machine Inaccuracy components are placed wrongly on the PCB’S so this method is final stage of the SMT process.