document

Customer Designed Carrier Board Production

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Come to COM!

Design Assistance Services• Issue Verification Services

Software Services • BIOS Customization

Consulting Services• Technical Trend• Specification• Schedule

Product Services • Various COMs Offering• Design Documents

Design Assistance Services• Design Library • Schematic Review• Placement/Layout Review

The nature of the embedded market is diversity. As a smart SystemIntegrator, the question is how to differentiate applications with faster solutions. In a dynamic market, technical specifications keep changing, but if you “Come to COM!” it will help you to reduce the time and work involved with designing new COM carrier boards. We seamlessly work with you at each development stage to handle the complexities of technical research which greatly minimizes development times.

Come to COM! Concentrate on your core knowledge!

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Advantech reserves the right to determine, on a case by case basis, whether or not COM Design Support Services are appropriate.

Software Services • Embedded OS Support• Utility Customization

Thermal Solutions • Thermal Analysis• Thermal Solution

Customization

I/O Module Services

Production5Development complete, start production

Integration4Start System Integration

Validation3COM module & carrier boardintegration

Planning1Searching for possible solution

Design2Start the carrier board design

TOCServices Overview

Come to COM! 1

COM Design Support Services 3

BIOS Modularized Services 7

Embedded OS Support 7

Advanced Watchdog 8

Hardware Monitoring 8

Data Security 9

eSOS Emergency 2nd OS 9

Software APIs & Utilities 10

Product Selections

COM-Express 11

COM-Micro 15

ETX 17

XTX 21

COM-Ultra 23

QSeven 25

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CustomerDesign Stage

Advantech Solution

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Schematic Review

Advantech Design Assistance is a review service based on customer carrier board schematic for COM module functions. This

service is preventative, and helps to catch design errors before they happen.

Review Items:

• Expansion: ISA, PCI and PCI-Express • I/O: USB, COM, PS/2 and LPT

• Display: LVDS, TTL and TV • Storage: IDE and SATA

• Others: Power, PCS (Power Control Signals), PMS (Power Management Signals), and MISC (Miscellaneous Signals)

Placement/Layout Review

After the schematic review, Advantech provides a placement & layout review on the customer’s carrier board, with respect

to COM module related functions. These reviews provide suggestions for improving signal quality and anticipate possible

mechanical conflicts.

Review Items:

• Trace Length • Trace Width • Ground Pad • Mechanical Conflict

Design Assistance ServicesDesign Library

Advantech is able to provide customers with a hardware design library for choosing features such as dual LVDS, second Super

IO, and smart battery. Our customer reference library makes it simple to implement features on your own carrier board, saving

overall design and verification effort.

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COM Design Support Services

Consulting ServicesDuring the customer planning phase, Advantech COM design support team

provides various hardware and software suggestions for potential issues

that customers might face, such as technical specifications, and

schedules.

• Technical Trend

• Specification

• Schedule

Planning1

Product ServicesVarious COMs Offering

Various COM modules are available for your application from Advantech such as, COM-Express, COM-Micro, COM-

Ultra, ETX, XTX and Qseven, you can find the “best-fit” COM module option for your project.

Design Documents

Advantech is able to provide plenty of product related information for designing your carrier board such as Design

Guide, Design Check List, Mechanical Drawing, and Thermal Selection Guide. For details please visit the “Download”

page of the COM design support website at www.com.advantech.com

Design2


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Thermal Solution ServicesModularized Thermal Solution

Advantech’s modularized thermal solution provides a flexible way to meet most

thermal requirements. A heatspreader is shipped with COM modules, and we offer

extra semi-heatsinks and semi-coolers as optional items. With this modularized

thermal solution concept, it is not always necessary to change the heatsink or cooler

design when upgrading a COM module because all COM modules all provide the same

flat surface heatspreader.

Benefits:

• Reduced design effort • High flexibility • Easy to upgrade

Customer Designed Carrier Board Production

With our complete COM Design Support Service, Advantech is able to produce customer designed carrier boards which

are assembled and tested with Advantech COM modules. This helps save production, assembly and testing costs for the

customer.

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Production5

I/O Module ServicesPeripheral Modules service provides more innovative solutions for IPC vendors by combining

Advantech’s unique embedded software solutions with newly developed peripheral modules.

Flash Storage Modules

CF, DOM, SSD type with capacites (1 ~ 128 GB) storage modules

Wireless Modules

GPS, GPRS, 3.5 G, WLAN, Bluetooth modules

Customized Thermal Solution

A heatsink customization service is available upon request to meet different application requirements. Advantech can provide

a custom-designed heat-sink or cooler solution based on the modularized thermal solution concept which is quick and cost

effective.

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COM Design Support Services

Validation3

Software Services Embedded OS Support

Advantech is able to provide Embedded OS development support to customers such as COM module drivers, BSP,

Windows XP Embedded and Win CE customization - helping customers to build the exact operating system for their

system.

Utility Customization

Advantech provides a series ready to use utilities such as

watchdog timer, hardware monitor and digital IO, under

Windows XP and Win CE, which helps customers

to link features to their application more easily.

Besides the standard utilities, a customized

utility is also available should the

customer require it.

Integration4

Design Assistance ServicesIssue Verification Services

For unexpected issues during the validation phase, Advantech is

able to allocate an engineer resource to help with those issues, analysis

and suggestions will be provided to the customer for further necessary

action.

• Phenomenon Duplication

• Analysis and Verification

• Solutions and Suggestions

Software Services BIOS Customization

During this phase, Advantech is able to provide COM module BIOS

customization initializing initial IC on carrier boards and other special

functions customization on carrier boards - for example: quick bootup,

bootup logo, extra COM ports, or a second LAN.


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Advanced Watchdog

More Than One Action

The watchdog can be set to hang, reboot or shut down the

application or OS; it provides more options than the original

solution.

Enable Before OS Is Active

The watchdog is enabled earlier than the OS; it is able to restart

the system if the OS fails to initialize.

256 Levels

The watchdog is able to count from 0 ~ 255 seconds, based

on the customer’s application.

Hardware Monitoring

The Hardware Monitor is a system health supervisor that inspects certain condition indexes, such as fan speed, temperature

and voltage. Necessary actions can be taken based on the core system information provided by the Hardware Monitor function.

• Voltage Monitor includes: 12 V, 5 V and CMOS battery 3.3 V monitoring

• Smart Fan will monitor 2 fan speeds at the same time.

A watchdog timer (WDT) is a function that performs a specific

operation after a certain period of time if something goes wrong

with the system. A watchdog timer can be programmed to

restart the system after a certain time period when a program or

computer fails to respond or hangs.

The Advanced WatchDog has the following features:

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BIOS Modularized Services

A highly modularized core architecture allows customers to configure BIOS core features for specific vertical market

demands. Customers can easily install or remove specific BIOS features to create a unique and stable BIOS.

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Advantech is the authorized distributor, and major OEM, for Microsoft Windows Embedded in the APAC region. We also

support Ubuntu for environmental testing and verification, and real-time embedded operating systems such as QNX, and

VxWorks as a BSP porting service.

Embedded OS Support


• Enhanced CPU Power Management

• Animated Logo and Sound Effects

• Modularization Core Architecture

• Remote Management

• Smart Battery

• Security Features

• Broad Peripheral Device Support

• Secure SW Protocol & Interface

• Embedded Controller

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eSOS Emergency 2nd OS

This is a small embedded OS called eSOS stored inside the BIOS. In case of a main OS crash, the device will boot to

this OS. eSOS will run pre-defined utilities and email the diagnostic results to the administrator.

• H/W Diagnostic Utility: Diagnoses the CPU temp, fan, voltage, HDD, CF.

• Email Utility: Saves the diagnostic result to a file and mails it to administrator.

• Telnet/FTP Server: Provides remote connection and file upload space.

• Configuration Utility: Network and e-mail address setting.

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Data Security

Secured DataAdvantech provides 64 bytes EEPROM space to store confidential data, all data stored in this area is encrypted.

Secured ApplicationSecure your valuable software by pre-defining a unique Security ID which is encrypted using hash function SHA-1.

Secured StorageStorage Lock is a software mechanism to lock all storage drives such as CF or HDDs with Advantech platforms.

When the Storage Lock feature is enabled, none of the devices can be reconigized by other platform or card readers.

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Software APIs & Utilities


Software APIs

Software Utilities

Control Monitor

Display

General Purpose Input/Output is a flexible parallelinterface that allows a variety of custom connections.Advantech also provides programmable GPIO, which allows developers to dynamically set the GPIO input or output status.

The SMBus API allows a developer to interface with an embedded system environment and transfer serial messages using the SMBus protocols, allowing multiple simultaneous device control.

The I2C API allows a developer to interface an embedded system environment and transfer serial messages using the I2C protocols, allowing multiple simultaneous device control.

The Brightness Control API allows a developer to interface with an embedded device and easily control brightness.

The Backlight API allows a developer to control thebacklight (screen) on/off in an embedded device.

The BIOS Flash utility allows customers to updatethe flash ROM BIOS version, or to back upcurrent BIOS by copying it from the flash chip to afile. It also provides a command line version and API for fast implementation into customized applications.

The embedded application contains valuableintellectual property and design knowledge,but it is easily copied! The Embedded Security IDutility provides functions that allow customersto secure their application data within the embeddedBIOS.

The Monitoring Utility lets the customer monitor thesystem health, including voltage, CPU and system temperature, and fan speed. These items are important; if critical errors happen and are not solved immediately, permanent damage may be caused.

A watchdog timer can be programmed to perform a warm boot (restarting the system) after a certain number of seconds.

The Hardware Monitor (HWM) API is a system health supervision API that inspects certain condition indexes, such as fan speed, temperature and voltage.

The Hardware Control API allows developers to set the PWM (Pulse Width Modulation) value to adjust fan speed or other device options; it can also be used to adjust the LCD brightness.

Power SavingEmploys Intel SpeedStep technology to reducepower consumption. The system will automatically adjust the CPU speed depending on system loading.

The eSOS is a small OS stored in BIOS ROM which will boot up in case of a main OS crash. It will diagnose the hardware status and then send an e-mail to the administrator. The eSOS also provides remoteconnection to a Telnet server and FTP server for anadministrator to rescue the system.

Flash Lock is a mechanism that binds the board and CF card (SQFlash) together. User can “lock” and “unlock” SQFlash via BIOS while booting.A locked SQFlash cannot be read by any card reader or boot from other platforms without going through a BIOS “unlock”.

Refers to a series of methods for reducing power consumption in computers by lowering the clock frequency. This API allows the user to lower theclock frequency in several steps from 87.5% to 12.5%.

Model Name SOM-5760 SOM-5761

Form Factor COM-Express COM-Express

Processor System

CPU Intel ATOM Z510P 1.1 GHz, Z530P 1.6 GHz processor Embedded Intel ATOM N270 1.6 GHz processor

Front Side Bus 400/533 MHz 533 MHz FSB

System Chipset Intel System Controller Hub US15W WP Intel 945GSE/ ICH7M

BIOS AWARD™ 8 Mbit Flash BIOS AWARD 8 Mbit Flash BIOS

Memory

Technology DDR2 400/533 MHz DDR2 400/533 MHz

Max. Capacity Up to 2 GB Up to 2 GB

Socket 1 x 200-pin SODIMM socket 1 x 200-pin SODIMM socket

Display

Graphics Intel Graphics Media Accelerator 500 DirectX 9ExSupport H.264, MPEG2 and MPEG4 hardware decoder

Intel GMA950, Microsoft DirectX* 9.1

LCD 24-bit LVDS 36-bit LVDS

VGA Up to 1600 x 1200 Up to 2048 x 1536

DVI - -

TV Out -Supports NTSC/PAL, S-Video and Composite Output interfaces

SDVO SDVO Port is alternative by VGA function 1 SDVO Port

Dual Display CRT + LCDCRT + LCD, TV out + LCD, TV out + CRT (Note: SDVO function is supported by customized BIOS)

EthernetChipset Intel 82551QM 10/100Mbps Ethernet Intel 82574L Gigabit Ethernet

Speed 10/100 Mbps 10/100/1000 Mbps

WatchDog Timer 256 levels 0 ~ 255 sec/min 256 levels 0 ~ 255 sec/min

Expansion LPC, 1 PCIe x 1, 3 PCI master, 4-bit SDIO1.1 LPC, SMBUS, 3 PCIe x 1 or 1 PCIe x 4, 4 PCI master

I/O

PATA 1 x EIDE (UDMA 100) 1 x EIDE (UDMA 100)

SATA - 2 x SATA, data transfer rates up to 150 MB/s

USB 8 x USB 2.0 8 x USB 2.0

Audio High definition audio interface AC97/ High definition audio interface

GPIO 8-bit GPIO 8-bit GPIO

COM - -

FDD/LPT - -

SSD - -

Power

Power Type ATX, AT ATX, AT

Power Supply Voltage +12 V and +5 VSB for ATX, +12V for AT +12 V and +5 VSB for ATX, +12 V for AT

Power Consumption (Typical)

TBD Typical: (1 GB DDRII 533)+12 V @ 0.62 A

Power Consumption (Max, test in HCT)

TBD Max: (1 GB DDRII 533)+12 V @ 0.9 A

Environment Operating Temperature

0 ~ 60° C (32 ~ 140 F) 0 ~ 60° C (32 ~ 140 F)

Embedded Software Services Programmable GPIO, Watchdog, H/W Monitor, Backlight on/off

Programmable GPIO, Watchdog, H/W Monitor, backlight on/off

Selection Table

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COM-Express is the latest COM 125mm x 95mm form-factor which

brings several new high-speed interfaces to carrier boards, such as

PCIe graphics, PCIe, PCI, SATA, and SDVO. COM-Express is the official

standard of PICMG that provides next generation technology on COM

modules. It is

designed with high performance applications in mind.

Major Specific FeaturesSupports High Speed Graphic Interface (PCIe x16)

Supports LCD, CRT, TV-out and SDVO for multi-display solution

Supports PCIe x4 or x1 for high speed data transmission

Gigabit Ethernet capacity for high speed connection

Supports up to 2 slot of DDR2 or DDR 3 SoDIMM memory.

Supports HD Audio Interface

Up to 4 SATA interface for data storage

Up to 8 x USB 2.0, 2 x ExpressCard, PCI and LPC Interface

Board size: 125 mm x 95 mm

COM-Express

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Model Name SOM-5781 SOM-5782 SOM-5786 SOM-5787

Form Factor COM-Express COM-Express COM-Express COM-Express

Processor System

CPU AMD Turion/ Sempron processor Intel Core 2 Duo/ Celeron M Processor Intel Core 2 Duo/ Celeron M Processor Intel Core 2 Duo/ Celeron M Processor

Front Side Bus 800 MHz 533/667 MHz 533/800 MHz 533/800 MHz

System Chipset AMD M690E/SB600 Intel 945GME GMCH/ ICH7-MDH Intel GME965 GMCH/ICH8-M Intel GS45 ICH9M

BIOS AWARD 4 Mbit Flash BIOS AWARD 4 Mbit Flash BIOS AWARD 4 Mbit Flash BIOS AWARD 4 Mbit Flash BIOS

Memory

Technology DDR2 533/667/800 MHz DDR2 533/667 MHz DDR2 533/667 MHz DDR3 800/1066 MHz

Max. Capacity Up to 4 GB Up to 2 GB Up to 4 GB Up to 8 GB

Socket 2 x 200-pin SODIMM sockets 1 x 200-pin SODIMM socket 2 x 200-pin SODIMM sockets 2 x 200-pin SODIMM sockets

Display

Graphics Mobile AMD X1250 3D/2D engine Mobile Intel GMA 950 3D/2D engine Mobile Intel GMA X3100 3D/2D engine Intel GS45

LCD 2 x 24-bit LVDS 2 x 18-bit LVDS 2 x 24-bit LVDS 2 x 24-bit LVDS

VGA Up to 2048 x 1536 Up to 2048 x 1536 Up to 2048 x 1536 Up to 2048 x 1536

DVI - - - -

TV Out - - - -

SDVO - 2 SDVO Ports 2 SDVO Ports 2 SDVO Ports

Dual Display CRT + LCD, LCD + DVI, CRT + DVICRT + LCD (Note: SDVO function is supported by customized BIOS)

CRT + LCD (Note: SDVO function is supported by customized BIOS)

CRT + LCD (Note: SDVO function is supported by customized BIOS)

EthernetChipset Realtek 8110SC Gigabit Ethernet Intel 82562GZ 10/100 M or 82573L Gigabit Ethernet Intel 82566MM Gigabit Ethernet Intel 82567 Gigabit Ethernet

Speed 10/100/1000 Mbps 10/100 or 10/100/1000 Mbps 10/100/1000 Mbps 10/100/1000 Mbps

WatchDog Timer 256 levels 0 ~ 255 sec/min 256 levels 0 ~ 255 sec/min 256 levels 0 ~ 255 sec/min 256 levels 0 ~ 255 sec/min

Expansion LPC, PCIe x8, 4 PCIe x1, 4 PCI master LPC, PCIe x16, 5 PCIe x1, 4 PCI master LPC, PCIe x16, 5 PCIe x1, 4 PCI master LPC, PCIe x16, 5 PCIe x1, 4 PCI master

I/O

PATA 1 x EIDE (UDMA 100) 1 x EIDE (UDMA 100) 1 x EIDE (UDMA 100)

SATA 4 x SATAII 2 x SATA 3 x SATAII 4 x SATAII

USB 8 x USB 2.0 8 x USB 2.0 8 x USB 2.0 8 x USB 2.0

Audio High definition audio interface AC97/High definition audio interface High definition audio interface High definition audio interface

GPIO 8-bit GPIO 8-bit GPIO 8-bit GPIO 8-bit GPIO

COM - - - -

FDD/LPT - - - -

SSD - - - -

Power

Power Type ATX, AT ATX, AT ATX, AT ATX, AT

Power Supply Voltage +12 V and +5 VSB for ATX, +12V for AT +12 V and +5 VSB for ATX, +12V for AT +12 V and +5 VSB for ATX, +12V for AT +12 V and +5 VSB for ATX, +12V for AT


Typical: (1 GB DDR2 667) +12 V @ 1.23 A (AMD Turion TL-62) +12 V @ 0.91 A (AMD Sempron 2100+)

Typical: (1 GB DDR2 667) +12 V @ 1.58 A (Intel Core Duo T2500) +12 V @ 1.13 A (Intel Core Duo LV L2400) +12 V @ 1.03 A (Intel Celeron M 423)

Typical: (1 GB DDR2 667) +12 V @ 1.22 A (Intel Core 2 Duo U7500) +12 V @ 1.56 A (Intel Core 2 Duo T7500)

TBD


Max: (1 GB DDR2 667) +12 V @ 2.88 A (AMD Turion TL-62) +12 V @ 1.29 A (AMD Sempron 2100+)

Max: (1 GB DDR2 667) +12 V @ 2.10 A (Intel Core Duo T2500) +12 V @ 1.58 A (Intel Core Duo LV L2400) +12 V @ 1.26 A (Intel Celeron M 423)

Max: (1 GB DDR2 667)+12 V @ 1.64 A(Intel Core 2 Duo U7500)+12 V @ 3.03 A(Intel Core 2 Duo T7500)

TBD

Environment Operating Temperature 0 ~ 60° C (32 ~ 140 F) 0 ~ 60° C (32 ~ 140 F) 0 ~ 60° C (32 ~ 140 F) 0 ~ 60° C (32 ~ 140 F)

Embedded Software Services Programmable GPIO, Watchdog, H/W MonitorProgrammable GPIO, Watchdog, H/W Monitor, H/W control, Backlight on/off, Brightness

Programmable GPIO, Watchdog, H/W MonitorProgrammable GPIO, Watchdog, H/W Monitor, H/W control, Backlight on/off, Brightness

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Selection Table

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SOM-AB5710Mini-ITX form factorDisplay type: VGA, LVDS, DVI, TV outExpansion: 1 x PCI, 1 mini PCI express, 1 x Mini PCI4 SATA ports, 4 x USB 2.0, IDE, LPT, KB/MS, CF, 4 COM ports (2 X RS-232, 2 xRS232/422/485)

Development Board

SOM-DB5700ATX form factorDisplay type: LVDS, VGA, TV outExpansion: 1 PCIe x16, 3 PCIe x1, Express Card, 2 PCI master,1 MiniPCI, 1 ISA bus slot4 SATA ports, EIDE, FDD, LPT, KB/MS, 8 x USB 2.0, audio, 2 COM ports (1 xRS-232, 1 x RS-232/422/485)

Coming Soon


Form Factor COM-Micro COM-Micro

Processor System

CPU Intel Atom eMenlow processor Z510 1.1 GHz, Z530 1.6 GHz Intel ATOM N270 1.6 GHz processor

Front Side Bus 400/533 MHz 533 MHz

System Chipset Intel System Controller Hub US15W Intel 945GSE/ ICH7M

BIOS AWARD 4 Mbit Flash BIOS AWARD 8 Mbit Flash BIOS

Memory Technology DDR2 400/533 MHz, Device widths of x16 DDR2 400/533 MHz

Max. Capacity up to 2 GB up to 2 GB


Display Graphics Intel Graphics Media Accelerator 500 DirectX 9Ex Support H.264, MPEG2 and MPEG4 hardware decoder

Intel GMA950, Microsoft DirectX* 9.1

LCD 24-bit LVDS 36-bit LVDS

VGA Up to 1600 x 1200 @ 24-bit Up to 2048 x 1536

DVI - -

TV Out - Supports NTSC/PAL, S-Video and Composite Output interfaces

SDVO SDVO Port is alternative by VGA function 1 SDVO Port

Dual DisplayCRT + LCD

CRT + LCD, TV out + LCD, TV out + CRT (Note: SDVO function is supported by customized BIOS)

Ethernet Chipset Intel 82551QM 10/100 Mbps Ethernet Intel 82574L Gigabit Ethernet

Speed 10/100Mbps 10/100/1000 Mbps


Expansion LPC, 1 PCIe x1, 3 PCI master, 4-bit SDIO1.1

LPC, SMBUS, 3 PCIe x1 or 1 PCIe x 4, 4 PCI master

I/O PATA 1 x EIDE (UDMA 100) 1 x EIDE (UDMA 100)

SATA - 2 x SATA, data transfer rates up to 150 MB/s


Audio High definition audio interface High definition audio interface

GPIO 8-bit GPIO 8-bit GPIO

COM - -

FDD/LPT - -

SSD - -

Power Power Type ATX, AT ATX, AT

Power Supply Voltage

+12 V, +V5_SB for ATX, +12V and +5V (+5V connecting to +5 VSB) for AT

+12 V and +5 VSB for ATX, +12V for AT


Typical: (1 GB DDR2 667) +12 V @ 0.477A, 5VSB @ 0.455A (Intel Z510 1.1G) +12 V @ 0.477A, 5VSB @ 0.453A (Intel Z530 1.6G)

Typical: (1 GB DDR2 533) +12 V @ 0.62A


Max: (1 GB DDR2 667) +12 V @ 0.769A, 5VSB @ 0.456A (Intel Z510 1.1G) +12 V @ 0.898A, 5VSB @ 0.456A (Intel Z530 1.6G)

Max: (1 GB DDR2 533) +12 V @ 0.9A


0 ~ 60° C (32 ~ 140° F) 0 ~ 60° C (32 ~ 140° F)

Embedded Software Services Programmable GPIO, Watchdog, H/W Monitor

Programmable GPIO, Watchdog, H/W Monitor, backlight on/off, eSOS

Selection Table

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Advantech COM-Micro series products are all designed with low power

consumption processors. They perform the same functions and same

pin definitions as the COM-Express Type 2 standard but with smaller

board dimensions of 95 x 95 mm. It is the best solution for low power

consumption mobile applications.

Major Specific FeaturesPowered by lower power consumption processors

Supports high speed graphic interface (PCIe x16)


Supports PCIe x4 or x1 for high speed data transmission

Gigabit Ethernet capacity for high speed connection

Supports up to 2 slots of DDR2 or DDR 3 SoDIMM memory

Supports HD audio interface

Up to 4 SATA interface for data storage

Up to 8 x USB 2.0, 2 x ExpressCard, PCI and LPC Interface


COM-Micro

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SOM-AB5710Mini-ITX form factorDisplay type: VGA, LVDS, DVI, TV outExpansion: 1 x PCI, 1 mini PCI express, 1 x Mini PCI4 SATA ports, 4 x USB 2.0, IDE, LPT, KB/MS, CF , 2 COM ports (1 X RS-232, 1 xRS232/422/485)

SOM-DB5700ATX form factorDisplay type: LVDS, VGA, TV outExpansion: 1 PCIe x16, 3 PCIe x1, Express Card, 2 PCI master, 1 MiniPCI, 1 ISA bus slot4 SATA ports, EIDE, FDD, LPT, KB/MS, 8 x USB 2.0, audio, 2 COM Ports(1 X RS-232, 1 x RS-232/422/485)

Development Board

Selection Table of ETX


Form Factor ETX 3.0 ETX

Processor System

CPU Intel Pentium M/Celeron M Processor Intel Celeron M Processor

Front Side Bus 533/400 MHz 400 MHz

System Chipset Intel 915GME (910GMLE) GMCH/ICH6M Intel 852GM GMCH/ICH4

BIOS AWARD 4 Mbit Flash BIOS AWARD 4 Mbit Flash BIOS

Memory Technology DDR2 400/533 MHz DDR200/ 266 MHz

Max. Capacity Up to 2 GB Up to 1 GB


Display Graphics Mobile Intel GMA900 3D/2D engine Mobile Intel 852GM integrated 3D/2D engine

LCD 2 x 18-bit LVDS (48-bit by customized BIOS) 2 x 24-bit LVDS

VGA Up to 2048 x 1536 Up to 1600 x 1200

DVI - -

TV Out - -

SDVO - -

Dual Display CRT + LCD CRT + LCD

Ethernet Chipset Intel 82562GZ 10/100 Mbps Ethernet Intel 82562GZ 10/100 Mbps Ethernet

Speed 10/100 Mbps 10/100 Mbps


Expansion 4 x PCI master, ISA 4 x PCI master, ISA

I/O PATA 1 x EIDE (UDMA 100) 2 x EIDE (UDMA 100)

SATA 2 x SATA (On ETX CPU module) -


Audio Realtek ALC203 AC97 Codec support Line-in/out, MIC-in

Realtek ALC203 AC97 Codec support Line-in/out, MIC-in

GPIO 1-bit GPIO, 2-bit GPE 1-bit GPIO, 2-bit GPE

COM 2 COM ports 2 COM ports

FDD/LPT 1 x FDD or LPT 1 x FDD or LPT

SSD - -

Power Power Type ATX, AT ATX, AT

Power Supply Voltage +5 V only (+5 VSB needs for ATX) +5 V only (+5 VSB needs for ATX)


Typical: (1 GB DDR2 533)+5 V @ 3.66 A (Intel Pentium M 760, 2.0 G) (915GME)+5 V @ 2.63 A (Intel Pentium M LV 738, 1.4 G) (915GME)+5 V @ 2.40 A (Intel Celeron M 373, 1.0 G) (910GMLE)+5 V @ 2.37 A (Celeron M 373 0KB, 1.0 G) (910GMLE)+5 V @ 2.23 A (Celeron M 600 MHz) (910GMLE)

Typical: (1GB DDR 266) +5 V @ 2.01 A (Intel Celeron M 600 MHz)+5 V @ 2.34 A (Intel Celeron M ULV 373 0 KB 1.0 G)


Max: (1 GB DDR2 533)+5 V @ 6.12 A (Intel Pentium M 760, 2.0 G) (915GME)+5 V @ 3.84 A (Intel Pentium M LV 738, 1.4 G) (915GME)+5 V @ 3.13 A (Intel Celeron M 373, 1.0 G) (910GMLE)+5 V @ 3.08 A (Celeron M 373 0KB, 1.0 G) (910GMLE)+5 V @ 2.82 A (Celeron M 600 MHz) (910GMLE)

Max: (1 GB DDR 266) +5 V @ 2.40 A (Intel Celeron M 600 MHz) +5 V @ 2.86 A (Intel Celeron M ULV 373 0 KB 1.0 G)

Environment Operating Temperature 0 ~ 60° C (32 ~ 140° F) 0 ~ 60° C (32 ~ 140° F)

Embedded Software ServicesWatchdog, H/W Monitor, Backlight on/off

Watchdog, H/W Monitor, Backlight on/off,H/W control, Backlight on/off

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In a basic form factor of 114 mm x 95 mm, the ETX CPU module provides

a scalable solution that meets advanced CPU application

development needs and reduces time-to-market. ETX has great I/O

capacity and meets both ISA and PCI needs, while supporting the

Computer On Module concept for plug-in CPU modules. With a wide

range of processors available, Advantech ETX CPU module gives

application engineers powerful CPU platform choices, streamlining the

product development process and reducing time-to-market.

Major Specific FeaturesSupports LCD, CRT, TV-out and multi-display solution

Supports PCI and ISA technology for data transmission

Provides 10/100Mbps Ethernet capacitor for high speed connection

Supports up one SoDIMM slot for DDR, DDR2 memory

Up to 4 x IDE and 2 x SATA (ETX3.0) interfaces for data storage

Provides up to 4 x USB 2.0, 2 x COMs ports


ETX

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Model Name SOM-4481 SOM-4461 SOM-4455 SOM-4430

Form Factor ETX ETX 3.0 ETX 3.0 ETX

Processor System

CPU Intel Pentium M/ Celeron M Processor Intel ATOM N270 1.6 GHz processor AMD Geode LX800 Advantech EVA-X4300 SOC

Front Side Bus 400 MHz 533 MHz 33 MHz 33 MHz

System Chipset Intel 855GME GMCH/ICH4 Intel 945GSE/ ICH7M AMD Geode LX800/CS5536 Advantech EVA-X4300 SOC

BIOS AWARD 4 Mbit Flash BIOS AWARD 8 Mbit Flash BIOS AWARD 4 Mbit Flash BIOS AWARD 4 Mbit Flash BIOS

Memory Technology DDR 200/266/333 MHz DDR2 400/533 MHz DDR 200/266/333/400 MHz DDR2

Max. Capacity Up to 1 GB Up to 2 GB Up to 1 GB On board 128/64MB

Socket 1 x 200-pin SODIMM socket 1 x 200-pin SODIMM socket 1 x 200-pin SODIMM socket -

Display Graphics Mobile Intel 855GME integrated 3D/2D engine Intel 945GSE AMD CS5536 2D engine SMI 712

LCD 2 x 24-bit LVDS 36-bit LVDS 24-bit LVDS or 18-bit TTL 18-bit TTL

VGA Up to 1600 x 1200 Up to 2048 x 1536 Up to 1024 x 768 Up to 1024 x 768

DVI - - - -

TV Out -Supports NTSC/PAL, S-Video and Composite Output interfaces

- -

SDVO - 1 SDVO Port - -

Dual Display CRT + LCDCRT + LCD, TV out + LCD, TV out + CRT (Note: SDVO function is supported by customized BIOS)

CRT + LCD (Simultaneous mode) CRT + LCD (Simultaneous mode)

Ethernet Chipset Intel 82562GZ 10/100 Mbps Ethernet Intel 82562GZ 10/100Mbps Ethernet Intel 82551ER 10/100 Mbps Ethernet -

Speed 10/100 Mbps 10/100 Mbps 10/100 Mbps -

WatchDog Timer 256 levels 0 ~ 255 sec/min256 levels timer interval, from 0 to 255 sec or min setup by software, jumperless selection, generates system reset

256 levels 0 ~ 255 sec/min 24 bits, 30.5µ sec ~ 512sec

Expansion 4 x PCI master, ISA 4 x PCI master, ISA, 4 x PCI master (3 x PCI master for SATA version), ISA

4 PCI master, ISA

I/O PATA 2 x EIDE (UDMA 100) 1 x EIDE (UDMA 100) 1 x EIDE (UDMA 100) (2 x EIDE for SATA version) 1 x EIDE (UDMA 100)

SATA - 2 x SATA (On ETX CPU module) 2 x SATA on ETX CPU module (For SATA version) -

USB 4 x USB 2.0 4 x USB 2.0 4 x USB 2.0 4 x USB 2.0

Audio Realtek ALC203 AC97 Codec support Line-in/out, MIC-in Realtek ALC203 AC97 Codec support Line-in / out, MIC-inRealtek ALC203 AC97 Codec support Line-in/out, MIC-in

-

GPIO 1-bit GPIO, 2-bit GPE 2-bit GPIO (Support by customized BIOS) 1-bit GPIO, 2-bit GPE -

COM 2 COM ports 2 COM ports 2 COM ports 2 COM ports

FDD/LPT 1 x FDD or LPT 1 x FDD or LPT 1 x FDD or LPT LPT only

SSD - - 1 x Type II CF slot -

Power Power Type ATX, AT ATX, AT ATX, AT AT

Power Supply Voltage

+5 V only (+5 VSB needs for ATX) +5V only (+5VSB needs for ATX) +5V only (+5VSB needs for ATX) +5 V only


Typical: (1 GB DDR 333) +5 V @ 2.48 A (Intel Pentium M 745, 1.8 G) +5 V @ 2.34 A (Intel Pentium M LV 738, 1.4 G) +5 V @ 2.00 A (Intel Pentium M LV 1.1 G) +5 V @ 2.56 A (Intel Celeron M 370) +5 V @ 2.30 A (Intel Celeron M 370, 1.5 G) +5 V @ 1.92 A (Intel Celeron M 600 MHz)

Typical: (1 GB DDRII 533) +5 V @ 1.15 ATypical: (1 GB DDR 333) +5 V @ 1.80 A (AMD LX800)

-


Max: (1 GB DDR 333) +5 V @ 5.04 A (Intel Pentium M 745, 1.8 G) +5 V @ 3.53 A (Intel Pentium M LV 738, 1.4 G) +5 V @ 3.17 A (Intel Pentium M LV 1.1 G) +5 V @ 3.58 A (Intel Celeron M 370, 1.5 G) +5 V @ 3.21 A (Intel Celeron M ULV 373, 1.0 G) +5 V @ 2.38 A (Intel Celeron M 600 MHz)

Max: (1 GB DDRII 533)+5 V @ 1.98 AMax: (1 GB DDR 333) +5 V @ 2.01 A (AMD LX800) Max: +5 V @ 0.7 A


0 ~ 60° C (32 ~ 140° F) 0 ~ 60° C (32 ~ 140° F) 0 ~ 60° C (32 ~ 140° F) 0 ~ 60° C (32 ~ 140° F)

Embedded Software Services Watchdog, H/W Monitor, Backlight on/off,H/W control, Backlight on/off

Programmable GPIO, Watchdog, H/W MonitorWatchdog, H/W Monitor, H/W control, Backlight on/off

-

Selection Table

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SOM-DB4700ATX form factorDisplay type: LVDS, VGA, TV outExpansion: 3 PCI, 1 MiniPCI, 1 ISA bus slotEIDE, FDD, LPT, KB/MS, 4 x USB 2.0, audio, CF, 4 COM ports (3 x RS-232, 1 x RS-232/422/485)

Development Board

Model Name SOM-4780

Form Factor XTX 1.0

Processor System CPU Intel Core 2 Duo / Celeron M Processor

Front Side Bus 533/667 MHz

System Chipset Intel 945GME GMCH/ ICH7-MDH

BIOS AWARD 4 Mbit Flash BIOS

Memory Technology DDR2 533/667 MHz

Max. Capacity Up to 2 GB

Socket 1 x 200-pin SODIMM sockets

Display Graphics Mobile Intel GMA 950 3D/2D engine

LCD 2 x 18-bit LVDS

VGA Up to 2048 x 1536

DVI -

TV Out -

SDVO 2 SDVO Ports

Dual Display CRT + LCD (Note: SDVO function is supported by customized BIOS)

Ethernet Chipset Intel 82562GZ 10/100 M Ethernet

Speed 10/100 Mbps

WatchDog Timer 256 levels 0 ~ 255 sec/min

Expansion LPC, 4 PCIe x1, 4 PCI master

I/O PATA 1 x EIDE (UDMA 100)

SATA 2 x SATA

USB 6 x USB 2.0

Audio AC97/ High definition audio interface

GPIO 1-bit GPIO, 2-bit GPE

COM 2 COM ports

FDD/LPT 1 FDD or LPT

SSD -

Power Power Type ATX, AT

Power Supply Voltage +5 V only (+5VSB needs for ATX)


Typical: (1 GB DDRII 533) +5 V @ 2.34 A (L2400)


Max: (1 GB DDRII 533) +5 V @ 3.80 A (L2400)


0 ~ 60° C (32 ~ 140° F)

Embedded Software Services Programmable GPIO, Watchdog, H/W Monitor, H/W control, Backlight on/off

Selection Table

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With the same board dimensions and connectors as ETX, the XTX form-

factor provides two extra USB 2.0 ports, a PCIe slot, LPC, and by removing

the ISA interface, high definition audio, allowing current customers to

upgrade their ETX based system for higher CPU performance and I/O

transmission capacity. It is the most efficient way to extend

application capability to a higher level —via minimum modifications to an

existing carrier board.

Major Specific FeaturesSupports LCD, CRT, TV-out and multi-display solution

Supports PCIe x1 and PCI for data transmission

Provides 10/100Mbps Ethernet capacitor for high speed connection

Supports up one SoDIMM slot for DDR, DDR2 memory


Up to 4 x IDE and 2 x SATA interface for performing data storage

Up to 6 x USB 2.0, 2 x COMs ports, LPC interface


XTX

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SOM-DB4700ATX form factorDisplay type: LVDS, VGA, TV outExpansion: 2 express cards, 2 PCI, 1MiniPCI, 1 ISA bus slot4 SATA ports, EIDE, FDD, LPT, KB/MS,6 x USB 2.0, audio, CF, 4 COM ports) 3 x RS-232, 1 x RS-232/422/485)

Development Board

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Model Name SOM-7562

Form Factor COM-Ultra, Module Pin-out Type I

Processor System CPU Future Intel® Atom™Processor-based mobile platform

Front Side Bus 667 MHz FSB

System Chipset ICH8M

BIOS AMI 16 Mbit Flash BIOS

Memory Technology DDR2 667 MHz

Max. Capacity Onboard 512MB, up to 1 GB

Socket -

Flash Capacity 2GB Flash onboard, 4GB optional by request

Display Chipset Future Intel® Atom™ chipset

Graphic Engine Intel Gen 3.5 DX9, MPEG2 Decode in HW

LVDS 18-bit LVDS

VGA Future Intel® Atom™Processor-based mobile platform

DVI -

TV Out -

SDVO -

Dual Display CRT + LVDS

Ethernet Chipset Intel 82567V Gigabit Ethernet

Speed 10/100/1000 Mbps

WatchDog Timer 256 levels timer interval, from 0 to 255 sec or min setup by software, jumperless selection, generates system reset

Expansion LPC, 5 PCIe x1 (1 PCIe x4)

I/O PATA -

SATA 3 x SATAII (300 MB/s)

USB 8 x USB 2.0

Audio High definition audio interface

GPIO 8-bit GPIO


Power Supply Voltage 5V – 14V wide range (5V standby optional for ATX function)


TBD


TBD


0 ~ 60° C (32 ~ 140° F)

Embedded Software Services Programmable GPIO, Watchdog, H/W Monitor, H/W control, Backlight on/off, Brightness

24

COM-Ultra

With a mere 84 x 55 mm board size, the Advantech COM-Ultra series

are the most compact COM modules. They are compliant with the COM

Express Type 1 standard pin definition, and with a slight modification are

able to share with current COM-Express or COM-Micro carrier boards.

They are the most suitable solution for personal handheld applications.

Major Specific FeaturesPowered by low power consumption processors


Supports PCIe x1 up to 6 ports for high speed data

transmission

Provides Gigabit Ethernet capacity for high speed connection.


Up to 4 SATA interfaces for data storage

Provides up to 8 x USB 2.0, 2 x ExpressCard, and LPC Interface


23

SOM-AB5710Mini-ITX form factorDisplay type: VGA, LVDS, DVI, TV outExpansion: 1 x PCI, 1 mini PCI express, 1 x Mini PCI4 SATA ports, 4 x USB 2.0, IDE, LPT, KB/MS, CF, 4 COM ports (2 X RS-232, 2 xRS232/422/485)

SOM-DB5700ATX form factorDisplay type: LVDS, VGA, TV outExpansion: 1 PCIe x16, 3 PCIe x1, ExpressCard, 2 PCI master,1 MiniPCI, 1 ISA bus slot4 SATA ports, EIDE, FDD, LPT, KB/MS,8 x USB 2.0, Audio, 2 COM ports (1 xRS-232, 1 x RS-232/422/485)

Development BoardComing Soon

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Selection Table

Advantech Model # SOM-3560

Form Factor Qseven

Processor System CPU Intel ATOM Z530 1.6 GHz or Z510 1.1 GHz

Front Side Bus 533/400 MHz FSB

System Chipset Intel US15W

BIOS AMI 16 Mbit Flash BIOS

Memory Technology DDR2 533/400 MHz

Max. Capacity Onboard 512MB, up to 1 GB

Socket -

Flash Capacity 2GB Flash onboard, 4GB optional

Display Chipset Intel US15W

Graphic Engine Intel GMA 500 DX9, MPEG2, H.264, VC1 Decode in HW

LVDS 24-bit LVDS

VGA -

DVI -

TV Out -

SDVO 1 port

Dual Display -

Ethernet Chipset Realtek 8111 Gigabit Ethernet

Speed 10/100/1000 Mbps

WatchDog Timer 256 levels timer interval, from 0 to 255 sec or min setup by software, jumperless selection, generates system reset

Expansion LPC, 1 PCIe x1

I/O PATA -

SATA 1 x SATA

USB 8 x USB 2.0

Audio High definition audio interface

GPIO -


Power Supply Voltage 5V (5V standby optional for ATX function)


TBD


TBD

Environment Operating Temperature 0 ~ 60° C (32 ~ 140° F)

Operation Humidity 0% ~ 90% relative humidity, non-condensing

Mechanical Dimension 70 x 70 mm (2.76” x 2.76”)

26

QSeven

Qseven is a new concept in ultra-small COM form-factors; instead of using

traditional board-to-board connectors as other COM form-factors do,

the Qseven module transfers all the major signals and interface to the

carrier board via golden fingers at the PCB edge. This is easier to install

and saves the cost of a board-to-board connector. And at 70mm x 70mm

board dimensions, the Qseven module offers the best cost / performance

solution for mobile and handheld applications.

Major Specific FeaturesSupports LCD, and SDVO multi-display solution

Supports PCIe x1 up to 4 ports for data transmission

Provides Gigabit Ethernet capacity for high speed connection

Supports on board DDR2, DDR3 memory


Supports 1 SDIO interface

Up to 2 x SATA interface for performing data storage

Provides up to 8 x USB 2.0, 1 x ExpressCard, LPC interface


25

Coming Soon

document

Documents

com module functions

overall design

design errors

new com carrier boards

hardware design library

com module related functions

customers carrier board

bios modularized services