gemini® fb xt - ev group · 2020. 11. 20. · gemini® fb xt automated production wafer bonding...
TRANSCRIPT
EV Group Europe & Asia/Pacific GmbHDI Erich Thallner Strasse 14782 St. Florian am InnAustria+43 7712 5311 0
Contact
www.EVGroup.com
Prin
ted
on p
aper
from
sus
tain
able
sou
rces
. Dat
a, d
esig
n an
d sp
ecifi
catio
ns m
ay n
ot s
imul
tane
ousl
y ap
ply;
or d
epen
d on
indi
vidu
al e
quip
men
t con
figur
atio
n, p
roce
ss c
ondi
tions
and
mat
eria
ls a
nd m
ay v
ary
acco
rdin
gly.
EVG
rese
rves
the
right
to c
hang
e da
ta, d
esig
n an
d sp
ecifi
catio
ns w
ithou
t prio
r not
ice.
All
trad
emar
ks, l
ogos
, web
site
add
ress
es o
r equ
ipm
ent n
ames
are
regi
ster
ed tr
adem
arks
and
/or t
he p
rope
rty
of E
V G
roup
or t
heir
resp
ectiv
e ow
ners
. ©
EV
Gro
up (E
VG).
All
right
s re
serv
ed. V
20/0
1
■ New SmartView® NT3 face-to-face bond aligner with sub 50 nm wafer-to-wafer alignment accuracy
■ Up to six pre-processing modules like: - Clean module - LowTemp™ plasma activation module - Alignment verification module - Debond module
■ XT Frame concept for highest throughput with EFEM (Equipment Frontend Module)
■ Optional features: - Debond module - Thermocompression bond module
Features
Integrated platform for high precision alignment and fusion bonding
Vertical stacking of semiconductor devices has become an increasingly viable approach to enabling continuous improvements in device density and performance. Wafer-to-wafer bonding is an essential process step to enable 3D stacked devices. EVG’s GEMINI FB XT integrated fusion bonding system extends current standards and combines higher productivity with improved alignment and overlay accuracy for applications such as memory stacking, 3D systems on chip (SoC), backside illuminated CMOS image sensor stacking, and die partitioning. The system features the new SmartView NT3 bond aligner, developed specifically for fusion and hybrid wafer bonding alignment requirements of < 50 nm.
Introduction
GEMINI® FB XTAutomated ProductionWafer Bonding System
Technical DataWafer diameter (substrate size) 200, 300 mm
Max. number of process modules 6 + SmartView® NT
Optional features Debond moduleThermocompression bond module