electrical on-chip resonators

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    B. Boser 1

    Electrical On-Chip Resonators

    Bernhard E. BoserBerkeley Sensor & Actuator Center

    Dept. of Electrical Engineering and Computer Sciences

    University of California, Berkeley

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    B. Boser 2

    Outline

    Tunable Capacitors

    3-Dimensional Inductors

    Application:Voltage-Controlled Oscillator (VCO)

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    B. Boser 3

    Tunable Capacitors parallel plate Aluminum

    200x200 m2, 1.5 m gap IC compatible processing

    2pF + 15% for 3V tuning voltage

    Q=60 at 1GHz

    Comparison with junction capacitors:

    +large signal operation (no forward biasing)

    +excellent linearity- special packaging

    - Brownian motion noise

    Ref: D. Young et al, Hilton-Head 1996.

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    B. Boser 4

    Tuning Range Pull-in voltage

    +50% max

    Vp = 4V for fr=40kHz

    Parasitics

    CBP = C0 CTP < 0.1 C0

    (larger in this design)

    C0

    CBP

    CTP

    Rtether

    23

    0

    027

    8r

    AlP txV

    =

    X0=

    t=

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    B. Boser 5

    Fabrication Process

    1m sputtered Al Sacrificial photoresist

    Tmax = 150oC

    (plasma etch) Stiction / welding no

    problem

    (residual resist?)

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    B. Boser 6

    Coil Inductors Electroplated copper

    50x5m2 traces 10-cm Silicon substrate Coil:

    Increased L, Q Reduced substrate loss

    Increased self-resonance

    Reduced area

    500 m

    650 m

    Ref: D. Young et al, IEDM 1997.

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    B. Boser 7

    Inductor Fabrication

    Passivation oxide

    Seed mask

    5m electroplated Cu

    for bottom traces(50m trace width)

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    B. Boser 8

    Fabrication (cont.)

    Alumina core

    Electroplated photoresist

    Laser lithography

    Electroplated Cu

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    B. Boser 9

    Inductor Performance

    Turns Q (1GHz) L fself

    1 30 5nH >10GHz

    4 16 14nH >5GHz

    low substrate losses

    loss limited by bottom contact

    (higher Q possible?)

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    B. Boser 10

    Voltage-Controlled Oscillator

    VCO (136dBc, f=3MHz)

    Meets GSM noise specs MOS Colpitts oscillator

    Ref: Solid-State Sensor and ActuatorWorkshop, 1998.

    Vbias

    4pF

    1pF

    8.2nH

    50pF Ctune

    Rx

    VDD

    Vtune

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    B. Boser 11

    Power versus Q

    Phase noise (relative to carrier):(Leesons Equation - simplified)

    Increased Q Lower Power Psig

    2

    0

    2

    2

    0

    1

    2

    2

    11

    2)(

    +=

    f

    f

    QP

    TFk

    f

    f

    QP

    TFkfN

    sig

    B

    sig

    B

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    B. Boser 12

    Power versus Q (cont.)

    E.g. F=100,

    fo=1GHz,

    f=3MHz,N(f)=136dBc/Hz

    Q=16 Psig= 5mW

    Q= 4 Psig= 125mW

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    B. Boser 13

    Brownian Motion Noise

    Inertial forces compensated by PLL

    Brownian motion displacement noise:

    ( )2

    2

    22

    2

    11

    14

    +

    =

    rr

    rBn

    f

    f

    Qf

    fmQ

    Tkfx

    0 2 4

    20

    0

    10

    30

    x frel 1,( )

    x frel 10,( )

    50 frel

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    B. Boser 14

    FM Modulation

    Resonant frequency shift

    FM Modulation

    ( ) +=

    += 1

    21

    10

    0

    0x

    x

    LCr

    |Vosc|

    0 0+noise0-noise

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    B. Boser 15

    Ambient Pressure

    Atmospheric pressure Vacuum (20mT)

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    B. Boser 16

    Oscillator Phase Noise

    Brownian noise

    insignificant beyond fr

    Increasing Q concentratesnoise at fr

    Increasing mass reducesnoise, but increases tuningvoltage

    Large Cp reduces noisef

    Selectrical

    Smechanical

    -20dB/dec

    -60dB/dec

    -30dB/dec

    f1/f fr

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    B. Boser 17

    Results

    -136-1943 MHz-105-105100 kHz

    -85-6410 kHz

    Sel

    [dBc/Hz]Smech

    [dBc/Hz]f

    atmospheric pressure (low Qmech)

    mechanical noise dominates close to carrier not significant problem in most applications

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    B. Boser 18

    Inductor / Resonator Applications

    Stand-alone components Impedance Matching (e.g. LNA)

    Noise-less loads

    Transformers, Baluns

    Filters

    Voltage-Controlled Oscillators