design and implementation of vlsi systems (en1600) lecture02 sherief reda division of engineering,...

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esign and Implementation of VLSI System (EN1600) lecture02 Sherief Reda Division of Engineering, Brown University Spring 2008 [sources: Weste/Addison Wesley – Rabaey Pearson]

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Page 1: Design and Implementation of VLSI Systems (EN1600) lecture02 Sherief Reda Division of Engineering, Brown University Spring 2008 [sources: Weste/Addison

Design and Implementation of VLSI Systems(EN1600)lecture02

Sherief RedaDivision of Engineering, Brown University

Spring 2008

[sources: Weste/Addison Wesley – Rabaey Pearson]

Page 2: Design and Implementation of VLSI Systems (EN1600) lecture02 Sherief Reda Division of Engineering, Brown University Spring 2008 [sources: Weste/Addison

Impact of doping on silicon resistivity

dope with phosphorous or arsenic

n-type

dope with boron

p-type

silicon4.9951022 atoms in cm3

Resistivity 3.2 105 Ωcm

1 atom in billion 88.6 Ωcm1 atom in million 0.114 Ωcm1 atom in thousand 0.00174 Ωcm

1 atom in billion 266.14 Ωcm1 atom in million 0.344 Ωcm1 atom in thousand 0.00233 Ωcm

Electrons are more mobile/faster than holes

Page 3: Design and Implementation of VLSI Systems (EN1600) lecture02 Sherief Reda Division of Engineering, Brown University Spring 2008 [sources: Weste/Addison

What happens if we sandwich p & n types?

n

p

A

B

Al

One-dimensionalrepresentation

In equilibrium, the drift and diffusion components of current are balanced; therefore the net current flowing across the junction is zero.

Page 4: Design and Implementation of VLSI Systems (EN1600) lecture02 Sherief Reda Division of Engineering, Brown University Spring 2008 [sources: Weste/Addison

PN-junction regions of operation

In reverse bias, the width of the depletion region increases. The diode acts as voltage-controlled capacitor.

A forward bias decreases the potential drop across the junction. As a result, the magnitude of the electric field decreases and the width of the depletion region narrows.

Page 5: Design and Implementation of VLSI Systems (EN1600) lecture02 Sherief Reda Division of Engineering, Brown University Spring 2008 [sources: Weste/Addison

nMOS and pMOS transistors

n+

p

GateSource Drain

bulk Si

SiO2

Polysilicon

n+

SiO2

n

GateSource Drain

bulk Si

Polysilicon

p+ p+

nMOS transistor pMOS transistor

Each transistor consists of a stack of a conducting gate, an insulating layer of silicon dioxide and a semiconductor substrate (body or bulk)

Body is typically grounded Body is typically at supply voltage

n+ n+

p-type body

W

L

tox

SiO2 gate oxide(good insulator, ox = 3.9)

polysilicongate

Page 6: Design and Implementation of VLSI Systems (EN1600) lecture02 Sherief Reda Division of Engineering, Brown University Spring 2008 [sources: Weste/Addison

nMOS transistor

n+

p

GateSource Drain

bulk Si

SiO2

Polysilicon

n+

g=0: When the gate is at a low voltage (VGS < VTN): p-type body is at low voltage source and drain-junctions diodes are OFF transistor is OFF, no current flows

g=1: When the gate is at a high voltage (VGS ≥ VTN): negative charge attracted to body inverts a channel under gate to n-type transistor ON, current flows, transistor can be viewed as a resistor

Page 7: Design and Implementation of VLSI Systems (EN1600) lecture02 Sherief Reda Division of Engineering, Brown University Spring 2008 [sources: Weste/Addison

nMOS pass ‘0’ more strongly than ‘1’

n+

p

GateSource Drain

bulk Si

SiO2

Polysilicon

n+

• Why does ‘1’ pass degraded?

Page 8: Design and Implementation of VLSI Systems (EN1600) lecture02 Sherief Reda Division of Engineering, Brown University Spring 2008 [sources: Weste/Addison

pMOS transistor

SiO2

n

GateSource Drain

bulk Si

Polysilicon

p+ p+

g=0: When the gate is at a low voltage (VGS < VTP): positive charge attracted to body inverts a channel under gate to p-type transistor ON, current flows

g=1: When the gate is at a high voltage (VGS ≥ VTP): negative charge attracted to body source and drain junctions are OFF transistor OFF, no current flows

Page 9: Design and Implementation of VLSI Systems (EN1600) lecture02 Sherief Reda Division of Engineering, Brown University Spring 2008 [sources: Weste/Addison

pMOS pass ‘1’ more strongly than ‘0’

SiO2

n

GateSource Drain

bulk Si

Polysilicon

p+ p+

• Why does ‘0’ pass degraded?

Page 10: Design and Implementation of VLSI Systems (EN1600) lecture02 Sherief Reda Division of Engineering, Brown University Spring 2008 [sources: Weste/Addison

An nMOS and pMOS make up an inverter

pMOS + nMOS = CMOS

Page 11: Design and Implementation of VLSI Systems (EN1600) lecture02 Sherief Reda Division of Engineering, Brown University Spring 2008 [sources: Weste/Addison

More CMOS gates

What is this gate function?

B

B

A

F = AB

0

What’s wrong about this design?

Page 12: Design and Implementation of VLSI Systems (EN1600) lecture02 Sherief Reda Division of Engineering, Brown University Spring 2008 [sources: Weste/Addison

3-input NANDs

What are the advantages of CMOS circuit style?

Page 13: Design and Implementation of VLSI Systems (EN1600) lecture02 Sherief Reda Division of Engineering, Brown University Spring 2008 [sources: Weste/Addison

Series-Parallel Combinations

Page 14: Design and Implementation of VLSI Systems (EN1600) lecture02 Sherief Reda Division of Engineering, Brown University Spring 2008 [sources: Weste/Addison

What are the transistor schematics of the NOR gate?

Page 15: Design and Implementation of VLSI Systems (EN1600) lecture02 Sherief Reda Division of Engineering, Brown University Spring 2008 [sources: Weste/Addison

AOI

Page 16: Design and Implementation of VLSI Systems (EN1600) lecture02 Sherief Reda Division of Engineering, Brown University Spring 2008 [sources: Weste/Addison

Transmission gate