calorimeter engineering review meeting - brookhaven...
TRANSCRIPT
GEM TN-92-240
Calorimeter Engineering Review Meeting - Brookhaven National
Laboratory
November 5, 1992
Abstract:
Agenda, attendees and presentations of the GEM Calorimeter Engineering Review Meeting held at Brookhaven National Laboratory on November 5, 1992.
GEM Detector Collaboration
Calorimeter Engineering Review
November 5, 1992
edited by
Steve Bella.via.
Brookhaven National Laboratory
1
1
2
The following presentations were given at the Calorimeter Engineering Review meet
ing, Nov. 5, 1992 as part of the GEM Detector Collaboration at Brookhaven National
Laboratory.
1.) Cliff Eberle (ORNL) Facility/Assy
2.) Brian Smith (LANL) - Detector Support
3.) Mark Rennich (ORNL) - Scintillating Fiber Hadron Calorimeter
4.) Lyle Mason (Martin-Marietta) - Support Tube, Feedthroughs, Services, Elec-
tronics, Vessels
5.) John Rutherfoord (Univ. of Arizona) - Beam Pipe Issues
6.) Garry Chapman (SSCL) - Vacuum Vessel
7.) Brian Easom (Martin-Marietta) - Modules
8.) Don Makowiecki (BNL) - EM+ Hadronic Fabrication
These were gathered and assembled here by Steve Bellavia, BNL (516)282-3230
2
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Presentation by:
Cliff Eberle
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Brian Smith
11
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FSTIMATED MAX END CAP WEIGHT GIVEN 50% YIELD STRENGTH CRITERIA
CDS CONFIGURATION
Free standing No gussets
Free standing 4 gussets
Free standing 4 gussets
Magnet restraints No gussets
Magnet restraints 4 gussets
Magnet restraints 4 gussets
Free standing 8 gussets
Magnet restraints 8 gussets
Magnet restraints No gussets Legs removed
MAXIMUM WEIGHT (Mt)
300-350
300-350
36~380
45~475
NA
NA
45~475
600
600
CDS MAX CONFIG STRESS
Free stand 25 ks! no gussets
Free stand 24 ks! 4 gussets
~ w::.
Free stand 20 ks! 4 gussets
Magnet restraints 16 ks! no gussets
Magnet restraints 14 ks! 4 gussets
Magnet restraints 12 ksi 4 gussets
ONE END CAP CALORIMETER REMOVED OPPOSITE END CAP LOAD CONCENTRATED
AT END OF TUBE
DISPIACEMENT COMMENTS TUBE END
-38.1 mm (v) Max stress@ calo 25.4 mm (h) membrane interface. 46 mm (r) Stress in membrane@
levels, le 15 ksi.
-21 mm (v) Very localized max stress 10.1 mm (h) @ gusset-membrane 23 mm (r) interface. Bulk material
stress in membrane 2-7 ksi.
-34 mm (v) Max stress localized@ calo-26 mm (h) membrane interface. Bulk 43 mm (r) material stress 2-14 ksi.
-17 mm (v) Max stress @ calo-4.3 mm (h) membrane interface. Bulk 17.5 mm (r) material stress 2-10 ksi.
-8.7 mm (v) Max stress@ membrane-3.5 mm (h) gusset interface. Bulk 9.4 mm (r) membrane stress 2-9 ks!.
-7.1 mm (v) Max stress@ pt. of load 1.0 mm (h) application. Bulk membrane 7.1 mm (r) stress 1.5-4.5 ksi.
---
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Free standing 8 gussets
Magnet restraints 8 gussets
Magnet restraints no gussets legs removed
16 ks!
15 ksi
16 ksi
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-3.2 mm (v) Max stress @ pt. of load 0.75 mm (h) application. Bulk membrane 3.3 mm (r) stress 1.5-3.0 ksi.
-18 mm (v) Max stress@ calo-4.5 mm (h) membrane interface. Bulk 18.5 mm (r) material stress 2-11 ks!.
--
..... ~
SUMMARY OF CDS LOAD SENERIO ( STATIC ONLY)
Removed one 600 Mt end cap calorimeter.
Applied opposite end cap total weight@ end of support tube, z=S.lm.
Maintained barrel weight of lOOOMt
Calculated stress and deflection for several CDS configurations.
Estimated max end cap weight given our allowables •
Presentation by:
Mark Rennich
17
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Presentation by:
Lyle Mason
23
GEM Detector Collaboration
Calorimeter Overview
November 5, 1992
by Lyle Mason
Science Systems Martin Marietta Astronautics Group
Denver, Colorado
25
Overview - GEM Hybrid Calorimeter
Engineering Perspective
1. Boundary Specification a) 3700mm OR xl lOOOmm length b) Ambient surfaces ± TBD degrees C c) Services and cabling access envelope
2. Support Tube Requirements a) Support Tube - 3700mm OR x 5500mm half length
1) Interface with central detector support 2) Interface with calorimeter removal and replacement(R&R) tool 3) Provide interfaces for endcap and barrel installation and endcap R&R
3. Feedthroughs for Noble Liquid Calorimeter a) Barrel feedthrough location b) Endcap feedthrough location c) Feedthrough spacing on vessels d) Feedthrough pin density e) Requirements, reliability, cost
4. Services a) Barrel calorimeter piping access to barrel b) Barrel calorimeter piping to hall a) Endcap calorimeter piping access to barrel b) Endcap calorimeter piping to hall
5. Electronics a) Cable routing for scintillating calorimeter b) Cable routing for barrel calorimeter c) Cable routing for endcap calorimeter d) Driver box locations
6. Vessels a) Noble liquid and vacuum vessels b) Barrel and endcap supports c) Alignment in support tube d) Interface to beam line
7. Modules - Brian Easom
8. Engineering Development a) List of development tasks
9. Schedule
27
GEM HYBRID CALORIMETER
STAINLESS STEEL TU~
l\:)
00
x
TRACKER , ....
Liquid Barrel
Krypton Calorimeter
Liquid Endcap
FORWARD CALORIMETE
Argon Calorimeter
~
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fteffmillfl'Y_f/y.PridConcept Dimensions .-e in mm.
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36001 37001 FH
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2575
178 y: 2299 I
2374 "2239
16n ~~ 2327 1702 f :r
1597 1010
247 2500
1077 9 0
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TRACKER
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l 142-- --s18~ -570-· 4 475 - •453·- • 302 ·-- 208 -,
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Preliminary Hybrid Concept Volumes: 2 Endcap Total: Barrel LKr Totala: 2 Forwercl Total: Total LAr Volume: Total LKr Volume:
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2 @4,052• 8104 LEM 2@660• 1320 L FH 2@662•1324 L. FH 2@552•1104 L FH
2@2450 • 5080 L FH 2@332•664LCH 2@ 260 =520 L. CH
2 @ 4Q4.5 • 809 L. CH 18,925 L 9.524 L. Olhe[Areas
28,449 L. Total
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FH 4454L
EM ~ 9648L
TRACKER
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9648 L. EM 1,411 L 4454 L. FH
14,102 L 5.U4 L. Other Areas
19,876Total LKr.
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1320L
EM 8104L
FH 1324L
- -
FH 5080L
FH 1104 L
- -
28,449 L. 2 Endcape 19,8711 L LKr 1.411 L Fwd
29,880 L. LAr 111.m L. LKr
_48,7311 L. Total Uquld
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CH 520L
664 L =
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Prellmlnarv Hvbrld Concept Weights:
I
2 Endc:ep Totlll: 2@22•44MgEM 2@28•56MgFH 2@28•56MgFH
[email protected] • 47 Mg FH 2 @108 • 218 Mg FH [email protected] • 49Mg CH
2@ 19 • 38 Mg CH 2@30• 60MgCH
566Mg 83 Other Mass
649 Mg Total
Barn! Totllla: 54MgEM
185 Mg FH 239Mg 39 Mg Other Mass
278 Mg Total
Other Tcula: 202Mg S.S. Tube
1582 Mg Sc. Elbar 1764Mg
2 Forward Total: 38Mg
~ ~'-'t: ~~ ' ~~' ~ ~' FH .;::;>' '- o>'
FH 158·~~ FH CH
185Mg I/ I 216Mg 60Mg
Total Calorlmatar: 849 Mg 2 Endcape 278 Mg Ban9I
1784 Mg SS & SF 38Mafwd
m111111
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I EM~EM 54Mg «Mg CH
FH FH CH 3BMg
56Mg 47Mg 49Mg f~~i~iil TRACKER ~ FWD
- 18Mg I _.. ii
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Seam1nt1tlon Dhl Ell &llrt Eta End Delta eta tow1r1 Towera Depth Channel• Chann•I• Channel• In eta a1am. ModulH far cal. Hod/Br I
BorralEM .026 bv .026 240 0.00 1.01 1.01 3B.55 9252 3 27756 55511
Total EM Barrol • 55511 I
EndcaoEM .026 bv .026 240 1.12 3.00 1.BB 71.76 17221 2 34443 34442
Total EM/EndcaD • 34442
Total EM= 124397
Fino Hodron .OB by .OB BO o.oo 0.90 0.90 11.25 900 1 900 1BOO Barrel
Total Barrel Had• 1BOO
Fine Hodron .OB bv .OB BO o.Bo 1.11 0.31 3.BB 310 1 310 620 Endo•D 1
Finl Hadron .OB bv .OB BO 1.04 3.20 2.16 27.00 2160 1 2160 4320 Endooo 2
Fin• H1dron .OB by .OB BO 1.21 3.46 2.25 2B.13 2250 1 2250 4500 Endcoo 3
Coar11 Hadron .OB by .OB BO 1.34 3.54 2.20 27.50 2200 1 2200 4400 Endc•D 4
Co1r11 Hadron .OB bv .08 80 1.45 2.51 1.06 13.25 1060 1 1060 2120 E/C I Uno.r
Coar•• H1dron .OB bv .06 BO 2.51 3.12 0.61 7.63 610 1 610 1220 E/C 5 Lower
Total Had/endcaa • 85110 Both EiC 17180
Barrel Each Endcaa EM Channele 55511 34443 Hadron 1800 85110 TOTAL CHANNELS • 143377
Total 57311 Total 43032 +1n z. '-11 .L,,.,-,~ ~-..0110 1<1~~
• Add 10% Barrel FT'a 89 FT FlangH Required per Barrel 7 78 FHdthrue/Barrel
I I Eoch E/C FT'o 52 FT Flange• Required per Endcap 5 57 FHdthrue/Endcap
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For Borrel UH 40 Feodthruo !Thi• rOI rtHnt• 15% utllzotlon of avollobl• Din
KRBarnstable 10/30/92
35 Page 1
c:,,
GEM Barrel Calorimeter Krypton Shell Flat Pattern Showing Port Layout. All dimensions in mm
l+-~~~~~~~~~~14816-~~~~~~~~~~~_.;
0424 Port End of Krypton vessel
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en Each port shown is 424mm (16.75) diameter, two rows of ten ports.
Total of 1575 channels per port. 0424.
Concern about size of flat plate and port diameter. Engineering concept only.
64 channel feedthru
Feedthru Port
c,.,, ....I
NOBLE LIQUID CALORIMETER
Electronic Eeedthrough Cross Section
Vacuum Vessel Wall
± 85 mm Avallable Nominal ± 75 mm Needed at Ambient
9. 5 mm (318") Multiple layer Insulation Between 2 Loops of Cable Bundles
Typical Warm Feedthrough Range
Typical Cold Feed1hrough Range
Argon I Krypton Vessel Wall
Typical Connector 64 Signals -128 Wires
13 mm (1/2") Multiple Layer Insulation
Cable Bundle 4 Cables Per Connector Each @ 2mm Thick Total Thickness~ 8 mm
±228.5 mm
9.Smm (3/8") Multiple layer Insulation
KBarnstable Hybrid FT Details
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LKr/LAr Barrel LKr Head Vessel
LN2 Coo I i ng --------7// Return Typ
0 Endcap Calorimeter
,( __ ~ North Endview
and Vacuum Piping Scintillating Fiber Calorimeter
Barrel Diffusion Pump
0
Endcap Diffusion Pump LN2 Cooling Supply Stainless Steel Tube
South Endview
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GEM LAr/LKr Calorimeter
Program Miiestones
Systems Engineering
Systems
Logistics
"lllities·
Plans/Schedule Development
Documentation/Estimating
QA/Safety.
Design/ Analysis
Calorimetery System
Design and Analysis
Manufacturing Engineering
Full Size EM Module Prototype
Full Size Hadronic Module Prototype
Cryogenic System
Test Support
Program Management/Support
Program Manager: L. Mason 11/03/92
1992 1993 N I D J I F I M I A I M I J I JIAISIOINI D
6. 6,. TOR 6. 6. TOR Draft Preliminary Design Final Dezign
Due Report Report ~ r=n ~ Review Review Review
. . _,' ' I'
• \ .\
Conceptual Design Preliminary Design Final Design
I 6
' , '
. ' "
' ' \
LIST OF POTENTIAL ENGINEERING R & D TASKS
1. Bi-metallic seal test (used for feedthru flanges) • Weld bi-metallic samples together • Perform dye penetrant inspection of welds • Perform radiographic inspection of welds
2. Feedthru assembly verification test • Feedthru flange, bi-metallic fitting & connector configuration proof/leak test • Leak I Pressure test
3. Bellows seal test (used for barrel & endcap LKr/LAr supply lines) • Pull & maintain vacuum on bellows configuration • Verify assembly technique & leak check • Test seal of bi-metallic fitting for fluid piping
4. Testing of the EM & Its components Is to determine the behavior due to the mechanical and thermal loads Involved and may be In the form of one or more of the following: Individual component or element tests, flat plate sandwich coupon tests or final EM accordion sandwich coupon tests. • Lead alloy creep test
• Perform creep tests by applying a low tensile load of constant magnitude to a sample of lead. • Record & plot the creep verses time. • Vary temperature & retest to determine the creep at various temperatures since creep is very temperature dependent.
• EM Composite (EM sandwich) material thermal test • Subject composite to various temperatures to map its axial and radial coefficient of thermal expansion characteristics. • Verify composite material density to ensure radiation absorption capabilities
• EM composite tensile test • Perform tensile test on EM composite • Each test coupon shall be of the same length & cross sectional area. • Load test coupon in tension axially & measure & record the elongation as load is increased. • Perform at various temperatures to determine effects of temperature on the modulus of elasticity. • The results of the previous tensile test and the following equations to develop the stress/strain curves for the EM composite: Normal stress = Applied load/Cross Sectional Area and Strain = Elongation/Length.
5. EM module prototype development • Develop tooling & hardware acceptance criteria. • Prove manufacturability of hardware. • Demonstrate repeatable precise assembly techniques.
6. EM Accordion composite spring back test • Determine the effect of material "memory" on overall assembly of the EM.
7. EM composite adhesion tests • Record load required to separate EM composite materials to verify bond strength.
42
LIST OF POTENTIAL ENGINEERING R & D TASKS (Continued)
8. Cryostat Support Load Testing • Build a high fidelity mockup/prototype & subject to axial and lateral loads to verify load path and support stability.
• Support stanchion thermal Interceptor test • Build mockup of support stanchion thermal intercept • Subject to high & low operating temperatures to verify thermal capability range. • Test individual component thermal conductivity as well as overall system testing
9. Electrical wiring thermal short test • Build mockup of typical wire bundle (including multiple layer insulation) from cold to warm feedthru flange. • Use warm to cold wall separation as planned for the final calorimeter configuration. • Subject cold wall to cryogenic temperatures & monitor the distance the cryogenic (or ambient) temperature is allowed to travel through the cable bundle.
10. Bending tool acceptance testing - Absorber & Sensing Plate • Build mockup/prototype to verify proof of principle • Perform various in line acceptance tests to verify correct EM accordion geometry.
11. Scaled EM support tests • Verify assembly of EM modules through sub-scale models.
12. Cryostat I Vacuum vessel leak test • Prove weld integrity by vacuum & pressure testing to the required operating pressures.
13. Vacuum & Cryostat vessel deflections - Thermal load transfer bumper • Evaluate the performance of a thermal load transfer standoff design configuration • Verify the affect of change in pressure(~P) and change in temperature(~ T) on the vessel walls.
14. ASME welding impacts • Evaluate the heat affected zone due to the ASME weld processes.
15. Development testing for the Hadronic module assembly shell • Optimize the fiberglass shell structure to provide structural integrity for the anticipated handling and assembly loads. • Optimize assembly techniques
16. Active cooling of electronics • Verification of required cooling envelope. • Verify margins for boiling of LKr & LAr
17. Radiation testing • Identify risk of radiation damage for all new materials used within the calorimeter.
43
Presentation by:
John Rutherf oord
45
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Presentation by:
Brian Easom
55
Hadron Module # 2 Strip Lines and Connectors
Ml : Fasteners for Tensioning Shell Six Cells Depth Handling Fixture Interface
Segmentation t.11 x t.q> = 0.08 x 0.08
BO Modules Required,., i../Wf. 1.?<tch Wt. = 2.aa Mf each ~· (J-A1 St b k Each Module Contains · rong ac
: ~V Mother Boards
the Following:
1 - Top Ground Plate Strip Lines, 1 - Bottom Gnd Plate j Set in Recess 5 - Included Gnd Plates 36 - Tile Plates , '! '4.L~~~
Containing 948 Tile 6 - Sensing Plates_,.. T
Containing 256 Tile 1 - Strongback 1 - Structural Shell 2 - End Plates
:2.2rr- Towers with Strip Lines and Electronics X - Mother Boards
01 "1
Fiberglass End Plate
Groove for Radial Insertion and Support of the Module
f·:-.. ,.,
Fiberglass Structural Shell
Projective Path for Strip Lines Between Adjacent Towers
Top and Bollom Ground Plates are Thin
Seven Stack Tile Panels, Middle Panel Sensing, Absorber material is Copper
Eight panels in Continuous Copper Ground
LLMason GEMLAC.HadModDetail 4118192
C.11 00
MODULE ST ACKUP CROSSECTION (Module #2)
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rber Plates ( Six per Cell , Three Above and Below Sensing Plate)
ng Plate (One per Cell)
Ground Plate
COMPOSITE SHELL MODULE CONCEPT (Module #2)
9 degree Included Angle ,,., I Soo 2-Hl6- mm Length
570 mm Depth 2,;rn MT .7
• • ((-., j 80 required '
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Keyway for Alignment and Positioning Load Path for Non Vertical Placement
Al. Strongback Completes Upper Flange of Box Beam
Mother Boards ~ /
0
Holes for Affl6ll /" .~ f' / .. n Communication(Typ)
Shell Structure Pretensioned to Prevent Buckling
'-- Transfer Molded Fiberglass Shell Structure
~ 0
GROUND PLATE (Module #2)
Cutout for Keyway
9 mm Thick Copper Plate (Entrance and Exit Plates May be Thinner)
5 Plates 1 Entrance Plate 1 Exit Plate
locations for button (predrilled)
High Voltage Supply (Not Attached)
Typical Copper Ground Plate
Sensing Wire Stripline Recessed in Groove Following Eta Lines (Ground Line Attached)
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ABSORBER PLATE (Module #2)
Copper High Voltage/Ground Strip Follows the Perimeter of the Plate (Both Sides)
Cutout for Keyway
Acetal (DELRIN) Spacer Button 5.5 mm dia. w/2 mm Pin
'· ., ; Pre11re11 FHler-4,Smm Wide' c
Ground
9mm Cu Plate ,. l f .
. 5 r:i;;;. Prepreg Layer Resistive Coating To Sensing
Plate
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6 Cell Depths ....3S.-ResisW.•11 Coating Templates _36--Plates--
High Voltage/Ground Pad Resistive Coating (Both Sides)
Sensing Stripline Supplies Ground to One Side of Plate
High Voltage Supply (Attached to Copper Strip Redundant Supply on Opposite Corner, One Side Only)
Typical Tiled Absorber Plate
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SENSING PLATE (Module #2)
Copper High Voltage Strip, Follows the Perimeter of the Plate (Both Sides)
Cutout for Keyway
+Voltage Acetal (DELRIN) Spacer Button 5.5 mm dia. w/2 mm Pin
1 w ~Prepreg Filler 4.5mm Wide
\ Sensing Wires Attached to Stripline 9mm Cu Plate
.5mm Prepreg Layer Resistive Coating
+Voltage
_,,.., High Voltage Pad Resistive Coating
6 Cell Depths 6 Resistive Coating Templates 6 Plates
Stripline Attached to Copper Sensing Plates
High Voltage Supply (Attached to Copper Strip, Redundant Supply on Opposite Corner, Attached to Both Sides of Plate)
Typical Tiled Sensing Plate
~ ~
ASSEMBLY POSITION (Module #2)
Entrance Ground Plate -
End Plates or Fixture In Place for Assembly Typ (Not Shown)
Strongback '---- (Supported Fully)
~ Strip Lines In Grooves
Plates are shown in fixtured position
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Exploded view of a Hadronic Plate
0. 5mm GlO plate
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9mm Copper Plate
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Lx Figure 1-1 Barrel EM Module Assembly
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Figure 1-6. Close View of Module
Channel
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Pb Absorber
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DISPLACEMENT SUPPORT CASE 1 (l.Og x dir) BASELINE LAY-UP(l.9mm)
DISPLACEMENT - X MIN: -0. 466??1 MAX: 0. 001915
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Note: 40 °/o more contraction In y direction than that · based on simple m.aterial contraction
t=in ...... 1.R R"o:PllnP Absorber Accordion Thermal Contraction
\ DEfDAMED
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HALF BARREL CALORIMETER .,
PARTIAL ASSEMBLED BARREL CALOR;·~~;R HA~ Partial View of Modules assembled in Halves
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ALIGNMENT PINS OUTER MODULE FASTENERS
OUTER SP ACER BAR ·INNER SPACER BAR
Figure 1-3b Structural and Massive Components of Module Lx
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Top view of Endcap Accordion EM showing only the towers
3 cells per tower 3 Absorber plates 3 sensing plates 6 Argon gaps
0.16667 deg rotation each cell 0.5 deg rotation between towers All rays cross exactly 2 towers
Absor r Plots Sensor Plate
C10 Stiffener
Motl'lerboarcl
...
Flonge rotated 90 deg for clarity
Al I dimensions ore mi 11 imeters
Figure 1-18 Endcap Accordion EM
81
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82
Barrel calorlmeter add'! AHvbred no ore·radlator Info
Inner radius Pre-Radiator Cryostat Vessels
Vacuum wall Vacuum Space K .. • ... ton Wall
Pre-Radiator EM Module
Inner EM alactronlcs 55 Strip lino Krypton Gap Motherboard Krypton Gap Tab (mostly G10)
EM cm/radiation length 2.081 No. of radiation lengths 25 outer EM alae1ronlca 55
Tab (mostly G10) Krypton Gap Motherboard Krypton Gap Strip lino
outer EM coolina Stav 1ST Hadron Module
degrees/module, a 9 cm/cell 9.5042 number of cells 8.5 gap for tolerance,LKr ~·
G10 Plate SS Plata Hadron depth Hadron S/8 Krypton Gap Motherboard ll'ru...ton Gao
Extra Scace for Utllltv Acces' Cryostat Vessels
Krypton Vessel Flange
Vacuum space Vacuum Vessel Installation Space Scintillator Inner structure
Sclntlllatlng Fiber Calorlmeter Scintillator outer structure
Ahybrid barrel v6.1
Absorbtion Depth, Radius Radius to Lenaths. cm mm mm corner. m"
950 950.0 0 950.0
39.4 1 0 980.0 p
50 1010.0 39.4 12 1022.0 p
0 1022.0
81.65 8 p 59.57 20 p
53.06 2.5 p 59.57 6.5 1057.0 p 53.06 20 1077.0 p 37.88
520.3 1597.3 A
53.06 20 1817.3 p 59.57 8.5 p 53.08 2.5 p 59.57 20 p 81.85 8 1852.3 p 59.57 25 1877.3 p 39.4 10 1887.3 p
18.33
59.57 5.0 1892.3 1697.5 p 53.08 5.5 1897.8 1703.0 p 18.51 4 1701.8 1707.0 p
817.8 2319.5 2326.7 A 38.40 12.7 2332.2 2338.4 p 58.57 6.5 2338.7 2348.0 p 53.08 2.5 2341.2 2348.5 p 83.7 25.4 2388.8 2373.9 p
32 2405.9
39.4 22 2427.9 p 0 2427.9
50 2477.8 39.4 22 2499.9 p
70 2569.8 18.85 0 2589.9 p 16.52 1030.0 3599.9 A 16.85 100 3699.9 p
3699.9 Total Active Absorbtlon lengths•
Total P111lve Abaorbtlon langtha • Total Abaorbtlon lengths •
83
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Total Absorb. Lennths
0.025
0.030
0.010 0.034 0.005 0.011 0.038
1.381
0.038 0.011 0.005 0.034 0.010 0.042 0.025
0.008 0.010 0.022 3.370 0.032 0.011 0.005. 0.030
0.056
0.056
o.ooo 8.238 0.800
10.88 1.14
12.13
Comments
10*.S&mm
start of Tab start active EM
I and active EM
end outer Tab
10*.56mm
Rl•Rf/cos(a/2)
&: ~:2 ;>f., • .:.. I ~) .. s ~ ~z.. ;~.,~
Ro·Rf/cos'a/2'
I
Printed 1112/12 10:01 PM
Endcep celorlmeter .......... _ ... Encl---
Front Face Poeltlon Qy01tat v .... 11
Vacuum wall Vacuum Sp1e9 a .... on Wall
EMModu~
Pff.Aldlator lnMr EM •19Ctronlce
Stnp llM
Noon GI!> Motl'lerboarcl
Noon GI!> Toll (moolly G10)
EM crn/l'adlatlon 1.ngth No. of radiation ten;ttia
acc:onllon EM -out. EM •i.ctronlce
Tab (mo1tly G10) Argon Gap M01t•••board Argon Gap Strip liM
outer EM coollnn w ....... 1ST H9dron Module
Gap for toleranc.,LAr G10 SSP ...
Hadron d9pth , CITl/0911 numHr of c.11•
Strong Back Noon GI!> Mothlrboard Argon Gap for~ cooMn"
w ...... 2nd Hldron Module
Gap for tOl•ran09,LAr G10 SSP1att
Hadron d9P1h , Cm/0911 numb9r of mH1
Strong Back Argon GIP Moth91'board
Noon Gap !Of oob• coollnn
w ....... 3rd Hadron Module (lnrwr)
Oap for toleran09,lAr G10 SSP,...
Hldron d•pth , cm/call number of c:.111
Strong Back Argon Gap Motlwrboltd Argon Oap for cabl11 coolln"'
w ....... 4th Hadron Modul• (Inner)
Oap for toleran09,LAr G10
SS-Hadron d9P1h , cm/0911 numt.r of Cllll
Strong Back Noon Gap Motlwrbom'd Argon Oap for Cl.bl•• c::ooHn"
Udl Aooou Cryoetat v .... 11
a.;onv...., v.cuum apace v.cuum velMI
AHvtmd EndcaQ v8.1
llddltional Abaorbtlon D•pth, Z-potltlon Act./Pu1 .
Info L•n ... h cm mm mm Int L•n..th 2000.0
39.4 25 2025.0 p ., 2075.0 39.4 .. 2123.0 p
0 2123.0
83.7 0 p 83.7 12 p
53.04 ... p
83.7 8.5 p
53.04 20 221•.o p 2.207
28 •0.02 818 2832.0 A
53.04 20 p 83.7 ••• p
53.04 2.5 p 83.7 82 p 83.7 0 2823.0 p 83.7 0 2923.0 p
39.4 •• 2958.0 p 831.852
83.7 • 2983.0 p 53.04 ••• 2188.5 p
18.8&-'04 • 2972.5 p 9.5CM2
• 18.81 570.3 35•2.8 A 53.04 12.7 3555.& p
83.7 u 3582.0 p
53.04 ... 3584.5 p 83.7 25.• 3589.9 p 83.7 25.4 3815.3 p
39.4 0 3815.3 p &38.81
83.7 • 3820.3 p 53.04 ••• 38211.8 p
18.85404 • 3829.8 p 9.5042
• 18.81 •75.2 4105.0 A 53.04 12.7 4117.7 p
83.7 ••• 4124.2 p 53.04 2.5 4128.7 p
83.7 25.4 4152.1 p 83.7 •• 4177.1 p
31.4 0 4177.1 p 515.81
83.7 • 4182. 1 p 53.04 ••• 4187.8 p
18.85404 • 4191.8 p 15. 104
3 18.98 453.1 4844.7 A 53.04 12.7 4857.4 p
83.7 8.5 4883.9 p 113.04 2.! 4888.4 p
83.7 25.4 4891.8 p 83.7 0.88 4892.7 p
39.4 •• 4727.7 p &40.12
83.7 • 4732.7 p 53.04 ••• 4738.2 p
18.85404 • 4742.2 p 111. 104
3 18.98 453.1 151111.3 A 13.04 12.7 5208.0 p
83.7 8.5 5214.5 p 53.04 ... 5217.0 p
83.7 25.4 5242.4 p 83.7 25.4 5287.8 p 83.7 0 5287.8 p
39.4 50 5317.8 p 107 5424.8
38.4 75 5489.8 p
&418.8 Total Actl._.. Ab9orbtlon lengthl •
Total Pua!w !aorbtlon llngthl • Total Abaorbtlon ltngthl
84.
0.083
0.122
0.000 0.014 0.005 0.008 0.038
1.&44
0.038 0.008 0.005 0.074 o.ooo 0.000 0.089
0.008 0.010 0.02•
3.014 0.024 0.008 0.005 0.030 0.030 0.000
0.008 0.010 0.024
2.114 0.024 0.008 0.005 0.030 0.030 0.000
0.008 0.010 0.024
2.871 0.024 0.008 0.00& 0.030 0.001 0.089
0.008 0.010 0.024
1.871 0.024 0.008 0.005 0.030 0.030 o.ooo
0.127
0.180
11.10 1.415
13.11
Commonte
800
01
91
91.0
74.3
Cell boundrlM 4813.23 1044.27 5115.31 5348.35 5497.39
prtntec1 1113111 a:11 i-M
Presentation by: •
Don Makowiecki
85
!Jo() M,
EM and Hadronic St~ck (Conceptual Design Report)
•EM Stack - Absorber Plates - Bending Machine - Press and Molding - Signal Electrode
• Hadronic Stack - Electrostatic Transformer
. - Connection Scheme
November 5th, 1992
87
Channel
Motherboard
R835.0
·······
Al i9,....nt Pin
Fiaure I -3a. Typical Mod.ile Lay-up in Section 017 88
30 5219
30 5217
00
"' R1315.SO
1332..-4117
138.366'
... N ~ "?, ~
16
r 1365.0
' ", . ~~~""~..i..:., ..
47.7.101
·-
Ni r4.2 r1.8
/"
· kapton
0,1
1.9 Hexel •
2,2
01 I
. £,nox
4.8 leacl 90
F!g.4. "Art1sts v1ew of prototype structure.
Conceptual Drawing Absorber Plate
...... c-------·-~·---~ 4312.000
= I j I 0.6 mm Lead 1.0 mm Lead 1
11 0.6 mm Lead ·,
'\,_
\
\
"B staged" prepreg (filler material)
705.000
t DSM 10/21/92
Curing Cycle for . Prep reg
140 - ...
100 --
60 ---- - - ...... .. --- .. ·-·-······ ... ······ ··-·- -
40 -------····------······ ------------------------······· ----- . ----------------------- .. ···------------------ ---------- ... ----- ----- ···- -- ..... ------------- ---------
20 ------------- -- ------ --····-··------······ ------------ . .. . ---------- . ---- ----- .. . ..... ..... . ..... --- . .. .. . . ...... ······--···· ... -----------
0'--~~~~~~~~~~~~-"
. 0 20 40 60 80 100 120 140 160
. I-Time (min) I DSM
92
EM CALORIMETER (Design Specifie11tions)
ABSORBER
I) Stainless steel cladding a) type 304 annealed b) tolerance 109/e of thickness or+/- .0008 inch c) dimensions
2) Prepreg adhesive a) type of weave b) adhesive material c) thickness of clotl1 d) amount of adhesive e) staging of adhesive (percentage of cure) f) radiation damage g) curing cycle
3)Precision rolled lead a) additives (.065% calcium, 0.5% tin) b) tolerances(+/- .03 mm) c) width required (max widfu 685 mm)
4) Filler material a) type of material ("B staged prepreg") b) thickness and tolerance
5) Ground connectiou a) conceptual design
93
DSM
94
rl <!)
ill ..., {.r)
" " ill rl c ..... (fj ...., ij)
:: ..
. .
0
0
0
0
0
95 /
96
! • :. :.
--·-··- U I
.... 97
' -.
I
~----·
PLAN VIEW
PIVOT ARM
PIVOT ARM
ELEVATION VIEW
BENT SHEET
§ U) t- U)
oW ca: 0 a.. ~
"' tu~ w a: :i: w Cl) Cl tz <{ wa: al~
Cl)
1000Ton PRESS
STORAGE RACK---1-,
.. ..
w ...J al
i! a: .. w IL Cl) z <{ a: I-
t
• t - - -I I
w I ...J I
' al <{ I-
• a: w lL • Cl) • z <{ I
• !!' • '- -- ...
MOLDS OR BENDING MACHINE
"' 1-0 w< wa: z .. :i: w w Cl) Cl >
0 I- <{
:5 a: IL~
~~o~'ii~ .____.....____.._ TRANSFER o==i
TABLE
c U) 0 U) t-w oa: ~a..
FLAT SHEET STORAGE RACK
Fig. 3.6 Bending, Molding and Transfer & Storage Handling Scheme (Single Grumman Press)
98
-
99
LEAD ABSORBER THERMAL CYCLE
temp. (deg.C) 250
/ \ I ' ' i
..... i..... '-- . ~
. 1'...
""'"- ..... J
..._
200
.,. i-J .r k'
/ 150 - ) ·; .
I
J I/ .
J 100 - l j
I J
I I) ) - '
50 - . :I . . . .
I/ Lt I/
. :... l,.;
,
\ 20 I 40 60 0
- (.3h1,,_.
time (min)
January 29, 1992 100
101
g E 0 I.()
:?: ci
·")
"'"" 0 r..;
HOT Oil
160-,:C)
\. SUPPLY
RETURN
SUPPLY
RETURN . C:UPPI Y
I - ·-·-· -HOT OIL
COOL OIL
(llOM,C)
HEATING COILS/ COOLING COi~
PUMP MANIF"OLD L
-··-·
MOLD
Heating I Cooling Absorber Plates
' •
•• (, 9 c 9 G>< Q
T
--
I 103 I
·-
104
EM CALORIMETER (Design Specifications)
SIGNAL ELECTRODE
1) Dielectric Material a) kapton b) other materials c) thickness
2) Cladding a) copper b) electro deposited or rolled (vacuum deposition or adhesive) c) thickness (I oz or 112 oz) c) silk screened electrodes using conductive ink?
3) Adhesive (inter-layer) a) polyimide ? b) radiation damage c) curing cycle
4) Through plating a) through plating copper or conductive ink
5) Resistive ink a) epoxy based or alcohol based b) resistivity (ohms per square) c) curing cycle
6) Electrical connections a) wire wrap posts ?
7)Artwork a) software limitations b) plotter limitations
105
DSM
"""" 0 ~
No M
MODULE TOLERANCE ST ACKUP All Olmenslons·ln mm
Mother Board 1st Fine Hadronic Module:
Exit Ground Plate
0.038
ed by Two Cells>. 9.00: O 1 e
Ix per Cel I, Three Above and Thre~ el, 10.00: 0.1
erCelll, 10.00:01
te )
GI 0 ~ S.S., 9.50 : 0. I
Figure 2-2. First Fine Hadron Module Showing Stack Height and Element Tolerances KRBarnstaole Mcoule Toi F H •Fig2-2
'"'"I ""'E----- CELL --~.--' Real
()\' !
LJ > HVElect~···· .. ~_._~ ........ ~~+-~.._~....._
HVBus Cu Tile
.......
Hadronic Configuration with Electrostatic Transformer
107
.05mm G-10
DSM
GROUND
ABSORBER
ABSORBER
-
SIGNAL ELECTRODE ~ O ABSORBER
~ ABSORBER
GROUND
ABSORBER
Mylar separator
MODULE \
c:::I
c:::I
Cl
/~ '
Conceptual Drawing
MODULE
=
1::::::1
1::::::1
9mm
--y_~:v- ,,,;i, II 11 0
-]
,--: ------ ==l-=t-t:\t; I
2mm
~===t==li==+==~-- Signal Connections
J _ ·-"\-11 ""-11•c-LI --------.,
~
Stripline cable (kapton dielectric)
-, / Ground Connections
Signal Connections Hadronic Module DSM
Top View Hadronic Module
-~u .... - 3.ooo
~ Resistive Ink
Conceptual Drawing
109
UV & Ground Connections
Signal Connections
DSM
HADRON CALORIMETER (Desip Specifications)
1) Copper (9mm) a) purity (99o/o pure, oxygen free, alloy 10 l) b) thickness tolerance(+/- .002 inch) c) sheet size (max available 3ft. X 8ft.) d) price and delivery e) hardness (half hard)
2) Tiles a) minimum size of tiles b) water knife (undercutting) c) alternate cutting methods eg. saw, shear d) dimensional tolerance (.02 inch) e) programming (can we do this ourselves)?
3) Filler Material a) dielectric constant less then 1.6 (argon) b) use thin wall tubing filled with ionizing liquid) ..
4) G-10 Material a) material thickness b) can we use other materials that are less expensive? c) can we use FR-4?
5) High Voltage Electrodes a) are high voltage electrodes copper or conductive ink? b) low cost conductive inks ( eg silver coated copper microspheres) b) use ESI epoxy based resistive inks or alcohol-water based inks. b) resistance value in ohms per square
110
Hadron Calorimeter (Design SpecificatiNs)
6) Electrical Connections a) can we use copper or brass flat head screws b) how much room between modules do we have for electrical connections?
7) Signal Cable a) stripline or microstrip b) impedance of cable c) connections to mother board
8) Mother Board a) use EM type layout b) can we afford rigid flex assemblies?
111
D. Makowicdd 26 Cll:l 1992
STRIP LINE CABLE
. OUTER JACKET r-- 6mm ~ 6mm ' I COPPER SHIELD I
,
KAPTON DIELECTRIC ·1 SIGNAL TRACES
KAPTON DIELECTRIC "- I
"" OUTER JACKET ------- 3048 mm
COPPER SHIE~ ~
SPECIFICATIONS
DIELECTRIC: KAPTON I POLYESTER
DIELECTRIC THICKNESS: 6mm
COPPER SHIELD: 1 oz copper
SIGNAL TRACE (thickness): 2oz copper
SIGNAL TRACE (width): 0.254 mm
SIGNAL TRACE (pitch): 2.54mm
NUMBER OF TRACES: 25
OUTER JACKET: mylar 0.08mm
FEB. 13, 1992 112
c:
GRUMMAN. , MODEL SUBJECT
ANALYST
~-1.3~/lavtri
,,-( <.) '-
.s ..,._
"" !:: q)
-.I
... >:
'1
'GC 5'37 FIEV. 2 2-86
160
l'l 0
l~O
100
go
,0
~o
~o
WEIGHT & MASS PROPERTIES ANALYSIS
$7/l,tPL 1fl/E. 11£flT (oJV fJVC T/ON CHE CKE~ ANALYSIS DATE
11 Is l'f J.
-1'0. ~
so%cu. c"'.. .0$0;11sp •la o.
·~
.30% ° Cv 1 • IOo ""' s /J
•OJ'l) iit 3p
'1 8 10 '" '" !leaf (walls)/ qoo Ch
INDEX
PAGE NO.
.oo
REPORT
DATE