“call for participation” in high speed signaling metrology...

“Call for Participation” In

High Speed Signaling Metrology

andStandard Reliability

QualificationProject Formation

Session 1

Friday, March 14

10:00 am – 11:00 am EDT

iNEMI Connectors Interest Survey

Background

• iNEMI is exploring several electronic connector initiatives

recommended through discussions with leading OEMs and EMS

firms

• The purpose of these projects is to highlight, study, and develop

metrics on potential manufacturing challenges facing the industry's

use of certain connector types as we move forward

2


Background (Continued)

• High Speed Signaling Metrology: as circuit speeds and noise margins approach difficult parameters

Product Examples: Processor Sockets, Memory Sockets, Backplane Connectors, next generation IO Connectors

• Standard Reliability Qualification: Designed to provide predictive MTBFs or other reliability measures for mainstream products and applications

Product Examples: CPU Sockets, DDR4 Memory Sockets, Press-Fit Backplane Connectors, HDD and SSD Connectors, IO Connectors to 100Gbps

• Dynamic Warpage Measurements: Designed to test susceptible products with larger areas, thin/long LCP housings combined with SMT attach

Product Examples: DDR4 Memory Sockets, Processor Sockets > 2,000 Pins

3

iNEMI Connectors Interest SurveyBackground (Continued)

• Key Challenges for Press-Fit Connectors: Designed for high speed applications with short pins - or automotive apps desiring press-fit assembly

Product Examples: Backplane Connectors, Automotive Connectors with short pins

• State of Art Memory Connectors: Designed for future DRAM applications beyond DDR4

Product Examples: Memory Connector surpassing DDR4 requirements > 5Gt/s range

• Emerging Special Needs Automotive Connectors: Perhaps focusing on EV/PHEV electric vehicle HV/motor control interconnects

Product Examples: HV Wiring Harness and Cable Connectors for Hybrid and Electric Vehicle electronics and battery interconnects

4


• Sixty people participated in the survey

• There were a number of responses from 5 OEMs, m 3 EMS firms and only one connector firm

• In addition there were responses from others in the supply chain (such as material suppliers)

• Greatest interest was shown in the following topics (in rank order).

– Standard Reliability Qualification - drive standard reliability test conditions & equipment capabilities

– High-Speed Signaling Metrology - effort to measure socket & connector electrical parameters

– Key Challenges on Press Fit Connectors - address connector development lagging needs

– State of the Art Memory Connectors

5


6


7

Inputs Received

Proposal Potential Leaders

Standard Reliability Qualification - drive

standard reliability test conditions &

equipment capabilities

IBM, Alcatel-Lucent, Intel, IEC Electronics

High-Speed Signaling Metrology - effort to

measure socket & connector electrical

parameters

IBM, Alcatel-Lucent, Intel

Key Challenges on Press Fit Connectors -

address connector development

Cisco, Alcatel-Lucent

State-of-the-Art Memory Connectors -

design and application of DDR3 and DDR4

sockets

Intel, Alcatel-Lucent, , Bull,

8

High Speed Signaling

Metrology

Brent Stone,

Intel


BACKGROUND

• Higher interconnect signaling speeds & bandwidth

requirements driving the need for characterizing signal

integrity of sockets and connectors

• Need for consistent measurement methodologies

PROPOSAL: iNEMI coordinated effort to measure socket & connector

electrical parameters

• Define metrology requirements for time and frequency domain

• Cross-company matching of socket and connector electrical

parameters using predefined test boards and sample units

• Drive common database / data formats of test results for

customers to use

10


• On High Speed Signaling . . . a lot of work has already been done by major connector manufacturers on things like sockets, backplane connectors and high speed IO connectors

• This is done through various modeling and simulation tools. Some mfrs publish Spice models for use by customers online. Molex, TE, FCI, Samtec and other do this

• The current state-of-art in high speed connectors includes: 10-25Gbps backplane, 10-40GbE, 10Gbps Thunderbolt, 4.8 going to 9.6Gbps USB and of course fiber optic solutions

Input - John L MacWilliams Principal: US Competitors LLC

11


Scope of Work

• Develop Industry Survey

• Survey of current existing methods for socket/connector

HSIO measurements

• Benchmark OEM and suppliers socket and connector

electrical parameters using predefined test boards and

sample units

• Develop a standard format (template) for presentation of

test results for use by industry

12

IS / IS NOT AnalysisThis Project IS: This Project IS NOT:

Project 1: XXX

Defining the need for characterizing signal integrity of sockets and connectorsRepeat of prior or

existing work

Defines metrology requirements for time and frequency domain

Definition of and agreement on key metrics & parameters socket/connector HSIO

measurements:

• Frequency domain: S-parameters, insertion/return loss, cross-talk, frequency

range of interest, etc.

• Time domain: Time domain reflectometry (TDR), time domain transmission

(TDT), cross-talk, rise time range of interest, etc.

Biased towards

specific suppliers,

geographies, or

market segments

Survey of currently existing methods for socket/connector HSIO measurements

Benchmark OEM and suppliers socket and connector electrical parameters using

predefined test boards and sample units

Development of a

specific standard(s)

Develop a standard format(template) for presentation of test results for use by

customers

Summary of equipment required for measurement of agreed upon metrics and

parameters (multi-port PNA, etc.)

Based on interest, participation, and validated capabilities, cross-company

matching of socket/connector HSIO data using pre-defined test boards & sample

units

Output: Publish a white paper on the metrology requirements for time and

frequency domain of High Speed Signaling sockets and connectors. Present the

results of the benchmark using the proposed test result template

Report-out of key findings & recommendations


14

Q1 Q2 Q3 Q4 Q5 Q6 Q7 Q8

Phase 1

Develop Survey

Survey Distribution

Survey Results

Review

Documentation of

survey results

Analysis of survey

results

Outputs

End of Project

Webinar

White Paper

TENTATIVE (18months)



Connector Standard

Reliability Test Recommendations

Project

Anne Ryan,

Alcatel-lucent

Connector Standard Reliability Test

Recommendations• BACKGROUND

– Test capabilities for socket reliability (such as temp cycle and

shock, failure analysis) are different across socket/ connector

manufacturers

– Associated criterion for ‘passing’ is not consistent

• PROPOSAL

– Scope/drive opportunity for industry level standard reliability

test conditions and equipment capabilities, FA capability and

criteria

– Drive common database / data formats of test results for

customers to use

16


Recommendations

Scope of work

Define a standard list of levels for each connector type. Based on the guidelines developed, the project will identify and document these for industry awareness

– Below is an example of the connector levels – but this list varies industry wide, most only define 5 levels

• Level 0: On Chip Interconnects

• Level 1: Chip to Package

• Level 2: Package to Board

• Level 3: PCB mount

• Level 4: Board to Board

• Level 5: Chassis to Chassis

• Level 6: I/O connectors

• Level 7: Intersystem Cabling

• Level 8: Campus/Metropolitan Area

• Level 9: Long Haul Telecom/Datacom

• Level 10: Special Application Connectors

– Input - John L Mac Williams Principal: US Competitors LLC

17


RecommendationsScope of work (Continued)

• Survey Connector supplier’s/OEM list of packaging levels

• Develop connector standard list of packaging levels from outputs of survey

• Develop a guideline set of standard reliability test conditions for connector classes

(as an example apply to one connector class could be achieved in Phase I – others to follow in Phase II)

• Propose recommended Pass/Fail criterion for each test condition

18


RecommendationsScope of work (Continued)

• Propose a standard test report format for presentation of test

results

• Alignment of critical elements that will be included in the connector

reliability report

19

IS / IS NOT AnalysisThis Project IS: This Project IS NOT:

Provide initial analysis of what the Project IS and IS NOT

Drive standard Test Capabilities for socket reliability Development of a specific standard(s)

Create level of uniformity for how socket/connectors can be evaluated

for reliability (stresses, interpretation of electrical targets, and test

structure )

Repeat of prior or existing work

Gap Analysis of test capabilities

Review current classes of connectors and define standard list of levels

for one packaging type(Could be expanded further in Phase II)

Biased towards specific suppliers,

geographies, or market segments

Develop a set of standard reliability test conditions for one class of

connector(Phase I)

Develop Pass/Fail Criterion for each test condition

Step toward aligning a knowledge based connector certification

process

Alignment how to select the appropriate accelerated conditions

Alignment of standard methods for failure analysis

Alignment of critical elements that will be included in connector

reliability report

Output: Proposals for follow-on projects to work on specific solutions

Output: Develop a white paper which would define the levels for each

packaging class of connector, propose the test conditions associated

with one class and associated Pass/Fail criteria.

Schedule with Milestones

2014 2015

Q1 Q2 Q3 Q4 Q5 Q6 Q7 Q8

Task Phase 1

Phase 1.1 Survey supplier/OEM list of packaging

levels

Phase 1.2 Develop connector standard list of

package levels

Phase 1.3 Develop a standard reliability test

condition and criteria for one packaging

level

Phase 1.4 Propose Pass/Fail Criteria

Project Outputs

White Paper

Project Webinar


Details on Objective of Project Formation

Team

23

Outline of Statement of Work (SOW)

1. Background to work

2. Scope of project

3. Purpose of project

4. What the project IS/IS NOT

5. Business Impact

6. Previous/current related work

7. Outcome of project

8. Prospective Participants

– (Generic – nonspecific list)

9. Project Schedule with Milestones

10. Resources required from project participants

11. Project monitoring plan

12. General and administrative guidelines

24

Initiative Timeline

• First 1-3 meetings:

– Define overall project goal

– Break into project phases

– Engage key participants needed for project planning

•Second 3-6 meetings:

– Refine Statement of Work

– Prepare resource requirements

– Prepare project schedule

25

Outline of Statement of Work (SOW)

•Background to work

•Scope of project

•Purpose of project

•What the project IS/IS NOT

•Business Impact

•Previous/current related work

•Outcome of project

•Prospective Participants

•Project Schedule with Milestones

•Resources required from project participants

•Project monitoring plan

•General and administrative guidelines.

26

iNEMI Statement of Work – Basic Information

• Scope of Work – definition of what is to be done

– Describe what work will be done

– State the major goals of the project at the end of project deliverables

– Provide an approximate timeframe for major phases of the project and for completion

• Purpose of Project

– Explain how the project aligns to the roadmap and what gaps will be filled

– Will the project provide a complete solution or be part of a complex solution?

– List anticipated benefits to participants, to the iNEMI membership in general, and the industry

27

iNEMI Statement of Work (SOW)

•Business Impact – Provide information on what impact this project will have on

• Participating organization

• iNEMI member companies

• Industry as a whole

•Outcome of Project – List addressed issues that are expected to addressed and/or

resolved, e.g., identify gaps, report(s) on results of any testing, etc.

– List expected deliverables and project milestones

– Sharing Project Results: To be determined by the project team on what information will be shared outside of the team.

NOTE: All changes to SOW must be approved by TC

iNEMI Project Process

29

IS / IS NOT Analysis

30

• Address knowledge gap(s) of industry:– Common problem

– Best solved by working together

– Timed success that aligns to business needs

– Best manifested on complex far reaching issues

– Often includes reliability testing & verification

• Requires teamwork across multiple levels of the supply

chain:– Ensures efficient alignment of goals and investments of the

varied team players;

– Supports the company’s commercial interests.

• Delivers a coordinated industry wide response and capability

set. – OEM/ODM/EMS/Suppliers at multiple levels.

Successful iNEMI Projects

31

INPUT

SELECTION

DEFINITION

PLANNING

EXECUTION / REVIEW

CLOSURE

1

2

3

4

5

The Project Development Process - 5 Steps

“ Project”

Limited to committed Members

“ Initiative”

Open for Industry input

---------------------------------------------------------------------------------

0

32

− Organization

− Stakeholders

− Background

− Objectives

− Deliverables

− Benefits

− Skills required

− Risks

− Scope

− CostsAPPROVAL TO PROCEED

• Is it still valid?

• Is the market forecast valid?

• Do we have resources?

• What is current priority?

• What are the consequences of aborting now?

2 Definition

Decision after Review

TC

33

Planning

− Time estimates

− Initial schedule

− Resource analysis

− Optimization

− Risk review

− Issue resolution

− Prepare to implement

• Is the schedule acceptable to participating member companies?

• Are resources committed?

• Do we still want to do it?

• Is current priority correct?

3

Decision after Review

APPROVAL TO PROCEED

TC

34

Output of Planning Process

− Project Leadership

− SOW (Statement of Work)

− Document Describing the Project

− PS (Project Statement)

− Document Defining:

− What each Firm Will Contribute

− The rules for the Project

− Firm Commitment from Management

SOW and PS are described at www.inemi.org

3

APPROVAL TO PROCEEDTC

35

Potential Project Structure

1. Current Situation Analysis Phase

– Understand current systems and gaps/issues

– Defines Next Phase

– Builds participants Trust

2. Development Phase

– Drafts Tentative Requirements

– Validate effectiveness

3. “Marketing” Phase

– Work with all Stakeholders to obtain acceptance

“call for participation” in high speed signaling metrology...

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