inemi roadmap process & industry collaboration projects...
TRANSCRIPT
iNEMI Roadmap Process & Industry
Collaboration Projects to Close
Roadmap Gaps
Bill Bader, iNEMI CEO
iMAPS Global Business Council
2012 Spring Conference
Fort McDowell Renaissance Resort
March 5, 2012
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• iNEMI Overview
• Members
• Organization
• 2011 Roadmap Process
• Projects and Initiatives
• Research Priorities
• Discussion
Agenda
iNEMI Background
Global Operations
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• iNEMI is headquartered in Herndon, Virginia, USA.
• Started iNEMI China Collaboration in 2003.
• Opened an office in Shanghai and added a team member in Europe in 2007.
• Dr. Haley Fu is leading operations in Asia, based in Shanghai, China.
• Grace O’Malley is representing iNEMI in Europe from her base in Ireland.
Introduction to iNEMI
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International Electronics Manufacturing Initiative (iNEMI) is a non profit industry-led
consortium of around 100 global manufacturers, suppliers, industry associations and
consortia, government agencies and universities. Working on advancing manufacturing
technology since 1994.
Visit us at www.inemi.org.
5 Key Deliverables:
• Technology Roadmaps
• Collaborative Deployment
Projects
• Research Priorities Documents
• Proactive Forums
• Position Papers
4 Major Focuses:
• Environment
• Miniaturization
• Medical Electronics
• Alternative Energy
Mission: Forecast and Accelerate improvements in the Electronics
Manufacturing Industry for a Sustainable Future.
Direct Roadmap Development
iNEMI Organization
Research Committee
Stimulate research to address gaps identified by
iNEMI roadmaps
Technical Committee
Develop & integrate
technology strategies & plans
Drive/coordinate all technical
activities
Board of Directors Set strategic objectives &
priorities
Ensure financial ethics &
responsibility
Product Needs
6 Product Emulator Groups
Technology Needs
21 Technology Working Groups
Focus Area Steering Committees
Drive progress on key
priorities
Ensure membership support
Direct Collaborative R&D
Regional Steering Committees
Help ensure that iNEMI
addresses member needs in
Europe & Asia
The Technical Plan & Gaps are Defined By:
8 Technology Integration Groups
Gap Analysis
Workshop Identified Gaps
Member Identified Needs
Board of Directors
Directors
• Dr. Nasser Grayeli, Exec VP of TMG; Director of Corp Q & R, Intel– Chairman • Dr. Marc Benowitz, Director, Reliability & Eco-Env Eng, Alcatel-Lucent • Dr. B.J. Han, Executive VP & CTO, STATS/ChipPAC • Kevin Keller, Mfg R&D Manager, Delphi Electronics • Kim Hyland, Sr. Director of Mfg. Operations Eng., Cisco Systems • Dr. Sundar Kamath, Senior VP – Customer Eng & Technology, Sanmina-SCI • Dr. Jean-Luc Pelissier, CEO, CBA Group LLC • Rob Shaddock, CTO, Senior VP, Tyco Electronics • Michael Toben, Director, Pkg. & Finishing Technology, Dow Electronic Mtls • Barbara Reed; Senior VP; IBM Corporation
Ex-officio Members
• Bill Bader, CEO, iNEMI
• Dr. James Olthoff, Deputy Director, EEE Laboratory, NIST
• Dr. Robert Pfahl, VP of Global Operations, iNEMI • Dr. Jie Xue, Director, Cisco, Co-chair, iNEMI Technical Committee
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International Members Across The Total Supply Chain
Key Observations Since 1/1/2010
160% Growth in University/Research Institutes 60% Growth in Industry Members Overall Great Global Breadth Added Many Key Industry Segment Leaders
The International Membership Incorporated Location; Number of Members
INEMI Member Business Type North America
Asia Region
Europe Totals
OEM 14 2 2 18
ODM/EMS (inc. pkg. & test services) 4 7 11
Material Suppliers 8 15 10 33
Equipment Suppliers 7 2 2 11
Universities & Research Institutes 8 2 3 13
Organizations/consulting 9 1 2 12
Totals 50 29 19 98
OEM/ODM/EMS Members
Supplier Members
Supplier Members – PWB Supply Chain
Global Research Institutes & Universities
iNEMI Areas of ―Critical Mass‖ • Leading OEMs
– IBM
– HP
– Dell
– Lenovo
– Intel
– Microsoft
– Delphi
– RIM
– Cisco
– Huawei
– Alcatel Lucent
– Juniper Networks
• Packaging Firms
– STATS ChipPAC
– Amkor
– ASE Group
• Laminate/substrate suppliers
– Ibiden
– Samsung Electro Mechanics Co
– NGK/NTK
– Rogers
– Doosan
– Multek
– ITEQ
– Nanya
– Shengyi Sci. Tech.
– Endicott Interconnect Tech.
– Elec & Eltek
– Dyconex
– AT&S
• ODM/EMS firms
– Celestica
– Quanta
– Sanmina SCI
– Plexus
– Flextronics
– Foxconn
• Test Firms
– Agilent
– Asset
– Corelis
– TRI
– Teradyne
• Chemical/Metals
- Dow -- NMC
- Henkel -- Heraeus
- Indium --Cookson
- Nihon Superior
Highlights of iNEMI 2011 Year to Date • Added 12 new members in 2011 after 24 additions in 2010
• The 2011 iNEMI Technology Roadmap published, and RM webinars held on
3/29 with 284 registered attendees worldwide.
• The top 4 Packaging projects all completed Phase 1 and are now into
Phase 2 development.
• All critical Environmental projects are on track to schedule and
deliverables and we have 5 new environmental research proposals moving
forward.
• Executed a Medical Electronics Workshop.
– Three new medical electronics teams have been initiated, two more will follow
shortly.
• Held a workshop on MEMS.
• The 2011 Technical Plan & Research Priority Documents were published in
August 2011.
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Summary of iNEMI Benefits for Members • The iNEMI strength in technology roadmap development creates
clarity of industry gaps and needs.
• iNEMI membership and methodologies are very focused on
delivering results oriented collaborative R&D.
• We have growth in development projects, research projects, and
in membership.
• Organizations that get excellent ROI from iNEMI membership
commit their resources to multiple collaborative R&D projects.
• Opportunity to partner with key suppliers and technical peers.
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iNEMI Roadmap
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Some Definitions…
• TWG - Technical Working Group
– Develops the roadmap technology chapters
– Presently 21 groups
• TIG - Technology Integration Group
– Develops Technology Plans/ Identifies/Prioritizes Research Needs
• Identifies project priorities:
– Based on roadmap findings and gap analysis
• PEG – Product Emulator Group
– ―Virtual Product‖: future product attributes plus key cost and density drivers
• Portable / Consumer
• Office / Large Business Systems
• Netcom Systems
• Medical Products
• Automotive
• Aerospace & Defense
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Roadmap Development
Product Emulator Group Drivers TWGs
Med
ical P
rod
ucts
Au
tom
oti
ve
Defe
nse a
nd
Ae
rosp
ace
Semiconductor Technology
Design Technologies
Manufacturing Technologies
Comp./Subsyst. Technologies
Modeling, Thermal, etc.
Board Assy, Test, etc.
Packaging, Substrates, Displays, etc.
Product Sector Needs (PEGs) Vs. Technology Evolution (TWGs)
Business Processes
Prod Lifecycle Information Mgmt.
Po
rtab
le / C
on
su
mer
Off
ice / L
arg
e S
yste
ms
Netc
om
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2011 Roadmap Technology Working Groups (TWGs)
Organic PCB Board
Assembly Customer
RF Components &
Subsystems
Optoelectronics Large Area, Flexible Electronics
Energy Storage &
Conversion Systems
Modeling, Simulation,
and Design
Packaging &
Component
Substrates Semiconductor
Technology
Final
Assembly
Mass Storage (Magnetic & Optical)
Passive Components
Information
Management
Test, Inspection &
Measurement
Environmentally
Conscious
Electronics
Ceramic
Substrates
Thermal
Management
Connectors
MEMS/
Sensors
Red=Business Green=Engineering Light Blue=Manufacturing Blue=Component & Subsystem
Solid State Illumination
Photovoltaics
Optoelectronics and
Optical Storage
Organic Printed
Circuit Boards
Magnetic and
Optical Storage
Supply Chain
Management
Semiconductors
iNEMI
Information
Management
TWG
iNEMI
Mass Data
Storage TWG
iNEMI / IPC / EIPC
/ TPCA
Organic PWB
TWG
iNEMI / ITRS /
MIG/PSMA
Packaging
TWG
iNEMI
Board
Assembly
TWG
Interconnect
Substrates—Ceramic
iNEMI Roadmap
iNEMI
Optoelectronics
TWG
Fourteen Contributing Organizations
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iNEMI / MIG
/ ITRS
MEMS
TWG
iNEMI
Passives
TWG
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Statistics for the 2011 Roadmap • > 575 Participants
• > 310 Companies/organizations
• 18 Countries from 4 Continents
• 21 Technology Working Groups (TWGs)
• 6 Product Emulator Groups (PEGs)
• More than 7 Man-years of Labor Expended
• Over 1800 Pages of Information
• Roadmaps the needs for 2011-2021
• > 60 Research Needs Identified
• > 155 Technical Gaps Identified
Impact Roadmap used by industry to identify future market &
technology needs.
Used by government & research organizations to identify and fund new research initiatives to address industries needs.
21 21
2013 Roadmap Schedule
• 3Q2011 - Recruit Product Sector Champions, teams and refine data
charts/begin 2013 Roadmap Newsletter & send 2011 PEG chapters
• 3/4Q11 - Product Sector Champions develop emulators
• March 1-2, 2012 PEG Workshop/TWG Kick-off APEX, San Diego, CA.
– Product Sector Tables Complete – PEG Chapter rough drafts written
• Q2 2 2012 Open Roadmap Workshops in US, Asia and Europe
• September 21, 2012 - Final chapters of roadmap due
• October 10, 2012 - Council of iNEMI Members briefing – WebEx session
• November 20, 2012 – Go to ―press‖
• December 5, 2012 – Ship free to members
• April 2013 – Global industry roadmap presentations via N.A./EU & Asian
webinars – Roadmap available for purchase by non members
Projects and Initiatives
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2011 Technical Plan = Projects
2011
Technical
Plan Plus
Key
Workshops
Collaborative
R&D
Deployment
Projects
Active Projects Board Assembly TIG
1. Characterization of Pb-Free Alloy Alternatives – Phase 2
2. Creep Corrosion – Phase 3
3. Pb-Free Early Failure
4. Surface Mount Assembly & Rework
Test TIG
5. Structural Test of External Memory Devices (Boundary Scan
Adoption, Phase 2)
6. BIST Program - BIST Use Case Investigation – Phase 2
Active Projects
Environmentally Conscious Electronics TIG
7. Eco-Impact Evaluator for ICT Equipment – Phase 2
8. HFR-Free PCB Materials
9. Rare Earth Metals Assessment and Supply Chain Actions
Optoelectronics TIG
10. Connector Particle Thickness Investigation
Organic PCB TIG
11. BFR-Free High-Reliability PCB
Active Projects Packaging TIG
12. Advanced Si-node Pb-free Underfill Reliability, Phase 1
13. Copper Wire Bonding Reliability, Phase 2
14. Wiring Density for Organic Packaging Substrates; Phase 2 in
Definition
15. Primary Factors in Component Warpage Phase 1
16. Warpage Qualification Criteria for Second Level Assembly –
Phase 2 in Definition
17. Pb-free Component & Board Finish Reliability
Initiatives Under Development (1/2) Focus Area TIG Project / Initiative Title Chair
MEDICAL
ELECTRONICS
Medical
Electronics
01 - Medical Define
Requirements and Development
of Specifications for Reliability
of Implantable Products
Chairs: John McNulty, Exponent: &
Erik Jung, IZM – Sign Up Open
MEDICAL
ELECTRONICS
Medical
Electronics
02 - Medical Common
Specifications for Electronic
Components in Medical
Products
Chairs: Diganta Das, CALCE &
Peter Lampacher, Vibrant Med-El
Sign Up Open
MEDICAL
ELECTRONICS
Medical
Electronics
03 - Medical Drive progress in
medical supply chain alignment
and capabilities
Chairs: Alen Mayar, Kemet; & Ed
Suckow, Fairchild Semi
MEDICAL
ELECTRONICS
Medical
Electronics
04 - Medical Reliability
Performance Qualification
Methods for Portable Devices
Chairs: Jack Zhu, Boston Scientific
& Grady White, NIST
Sign Up Open
MEDICAL
ELECTRONICS
Medical
Electronics
06 - Medical MRI/X-ray and
Implantable Compatibility
Chairs: Bill Burdick, GE; iNEMI
Staff
Initiatives Under Development (2/2) Focus Area TIG Project / Initiative Title Chair
MINIATURIZATION Board Assembly Counterfeit Electronic Components
Assessment
Chair: Colm Nolan IBM
Co Chair: Sally Arno Plexus
Sign Up Complete
MINIATURIZATION Test Structural Test of External Memory
- Extension
Chair: Phil Geiger, Dell
Co-chair: Steve Butkovich,
Cisco
MINIATURIZATION Test BIST "Use Case" Function
Classification Project (Phase 3) Chair: Zoe Conroy, Cisco
MINIATURIZATION Test Board Flexure Standardization -
White Paper
Chair: Jagadeesh
Radhakrishnan, Intel
MINIATURIZATION Member
Requested
Convergence of Safety
Requirements for Semiconductor
Packaging Equipment
Chair: Jeff Pettinato, Intel
MINIATURIZATION Packaging Package Warpage Qualification
Criteria – Phase 2 Chairs: iNEMI Staff, TBD
MINIATURIZATION Other
Update and simplify PCB UL
Certification testing requirements;
co chaired by UL and an iNEMI
member
Co-chairs: Greg Monty, UL; TBD
Approach to Drive iNEMI Focus Areas
• Steering Committees in place in all four areas of focus.
• Each of these focused teams are represented by an
active Board of Director and Technical Committee
member - in addition to iNEMI senior staff.
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Miniaturization (Packaging)
iNEMI Packaging Leadership Steering Committee
• BoD: Byung Joon Han – STATS ChipPAC
• Co-Chairs: Hamid Azimi – Intel; Jie Xue – Cisco
• Leader: Bob Pfahl – iNEMI
• John Savic – Cisco
• Mahadevan Iyer– Texas Instruments
• Charan Gurumurthy – Intel
• Jim Wilcox, IBM
• Sheldon Schwandt & Willie Henderson, RIM
• Bernd Appelt – ASE
• Lee Smith – Amkor
• IBIDEN
• NTK
• Rolf Aschenbrenner, Fraunhofer IZM
• Eric Beyne, imec
STRATEGIC GAP ANALYSIS for Packaging from 2011 iNEMI Technical Plan
Package Scaling, Design, Architecture
1. Package Design Rule Scaling ------------------
2. IO Density to meet the Demand ---------------
3. Tolerance Control Spec Definition ------------
4. Vertical Interconnect Definition to support Scaling ------------------------------------------------
5. Novel Architecture to Support various Si Sizes --------------------------------------------------
6. Alternative architecture to C4 FLI --------------
Materials
• New Material to support tolerance spec ------
• Materials to support tight pitch VI --------------
• Material to Support High Current Density ----
• Material to support tighter Trace Pitch -------
Manufacturing
• Capability to manufacture multiple Substrate arch on same line -----------------------------------
• Supporting lower cost trend with increased complexity -------------------------------
2011 2013 2015 2017
Green = No Gap Issues or Resolved
Yellow = Known Gap Mitigation Techniques
Red = No Known Solution – Development Required
Wiring Density for Organic Packaging
Substrates
Chair:
Jim Arnold, iNEMI;
Co-Chair:
Islam Salama, Intel
Wiring Density for Organic Packaging Substrates
Co-Chair: Luis Rivera (Texas Instruments)
Co-Chair: Islam Salama (Intel)
Project Status: TC approved Nov 23 - 06 Dec – 21 Jan 2011 Open Enrollment
Objectives:
• To identify next generation packaging substrate technology that focuses on
the following prioritized aspects(technology elements) to achieve maximized
wiring density at minimal cost, including Material Set, Low Cost Patterning
(Lithography, Laser and Imprinting / Printing), Plating and Inspection and Test
Business Impact:
• Integration of available information on alternative approaches to meet
roadmap wiring density requirements opportunity to provide the most
accurate possible assessment.
• Opportunity for analysis and re-solution of interactions between different
technology elements, that might remain unaddressed without an integrated
approach
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Copper Wire Bonding Reliability
Chair:
Peng Su,
Cisco Systems
Project Chair: Project Co-Chair:
Strategy Tactics Start: End:
Issues Graphics
Focus Area:
Mar-12 TIG:
Goal: Understand key issues and concerns regarding reliability of Cu wire bonding for semiconductors
Miniaturization
Packaging
Copper Wire Bonding Reliability – Phase 2
-- Peng Su, Cisco
Phase 2
1. Finalize DOE
2. Procure Materials
3. Package Assembly
4. Reliability Tests
5. Failure Analysis
6. Summary
• 2-phased project. The first phase will focus on collecting information from the industry regarding the key processing and reliability issues pertaining to Cu wire bonding. The second phase of the project will perform necessary experimental work in the areas as defined by Phase 1
• Copper bond wires are increasingly being used for a wide variety of components.
• Reliability needs to be collectively assessed by the industry in a quantitative manner.
• Standard reliability test methods and durations for Au wire device may not be sufficient for Cu
12-11 12-12
More information at: http://www.inemi.org/project-page/copper-wire-bonding-reliability
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Phase 2 Experiment Plan
Package Type Wire type Wire diameter EMC Surface finish
2 3 1 1 for Au,
2 for Cu 3 types
BGA
QFN
Au (control)
Bare Cu
Pd-coated Cu
0.8mil Material A
Material B
Material C
Electrolytic NiAu
(for Au as control)
ENEP
ENEPIG
Acceleration tests
– MSL3 260 C
– 5 Biased-HAST test (double standard test duration)
• 130 C/85RH
• 110 C/85RH
• 85 C/85RH
• 130 C/55RH
• 110 C/55RH
– HTS (175 C)
– AATC (-55-125 C, 2 cycles /hr)
Package & material variations
Focus Area:
Mar-12 TIG:
Project Members
Packaging
Cu Wire Bonding Reliability - Phase 2
Advanced Si-node Pb-free Underfill
Reliability, Phase 1
Chair: Robert Carson, Cisco
Strategy Issues Graphics
Project Lead:
Project Co-Lead:
Tactics Milestones and/or Deliverables Plan Actual
Focus Area:
Mar-12 TIG:
Goal: Establish repeatable and correlated measurement methods to evaluate the reliability of short cycle heating
and cooling around Tj associated with the power cycles used in advanced Si-node flip chip packages.
• 3-phased project. The first phase will focus on
determining what relevant work has been
performed and where gaps may exist between
environmental testing routines and the working
environment(s) for high duty cycle flip chip BGA’s
that may impact long-term reliability, and design
the experiments for the 2nd phase.
• Advanced Si nodes (40nm and below) run at increasingly higher Tj. As Tj approaches the underfill Tg, flip chip stress distribution changes radically
• At temperatures between Underfill Tg and Substrate Tg all Si/substrate CTE mismatch and warpage stress is carried through the bump structure and potentially fragile silicon ELK layers.
Robert Carson, Cisco Systems, Inc.
TBD
Phase 1: Literature Review and Test Development
• Existing Literature and data Review
• Test Vehicle Design
• Experimental Thermal Mechanical Test Design
• White paper
• Phase 2 planning
Phase 2: Testing
Phase 3: Additional Work
Miniaturization
Packaging
Advanced Si-node Underfill Reliability Project
Project Launch Date
Literature review
White paper
Plan DoE for phase 2
Phase 2 open for sign up
May-12
Apr-12
Mar-12
Dec-11
Oct-11
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More information at: http://www.inemi.org/project-page/advanced-si-node-pb-free-underfill-reliability
Tg<Tj
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Project members Advanced Si-node Underfill Reliability Phase 1
•Cisco
•IBM
•HP
•Namics
•Henkel
•StatsChip PAC
•Amkor
•ASE
•DfR Solutions
Package Warpage Qualification
Criteria for Second Level Assembly –
Phase 1
Chair:
Wei Keat Loh, Intel;
Co-chair:
Robert Carson, Cisco Systems
Project Chair: Project Co-Chair:
Strategy Tactics Start: End:
Issues Graphics
Focus Area:
Mar-12 TIG:
Goal: Identify primary factors that can contribute to the warpage performance for selected components during typical SMT processes
Miniaturization
Packaging
Package Warpage Qualification Criteria for
Second Level Assembly – Phase 1
Robert Carson, Cisco Systems Wei Keat Loh, Intel
• Identify & assess applicability of existing standards and test methods
• Develop methodology and format for criteria e.g. sample size, preconditioning, variations of material and processes
• Prepare plan for Phase 2
• Phase 1: Establish technical gap assessment to define improved warpage qualification criteria
• Phase 2: Demonstrate the improved warpage qualification framework
• Phase 3: Extend the applicability of warpage qualification to emerging technologies e.g. Package on Package BGA packages; TSV with BGA packages, Embedded chip BGAs
• Current qualification criteria and standards are not adequate to predict good yield results at 1st and 2nd level HVM assembly
• Measurement methods (dimensional and test) not common nor up-to-date
12-10 10-11
Package ShapesPlanar
Saddle /Complex
Convex ½ Pipe Concave ½ Pipe
DomeBowl
Saddle /Complex
Focus Area:
Mar-12 TIG:
Project Members
Energy & Environment
Packaging
Package Warpage Qualification Criteria for
Second Level Assembly – Phase 1
Examples of Additional iNEMI
projects
Project Chair: Project Co-Chair:
Strategy Tactics Start: End:
Issues Graphics
Focus Area:
Mar-12 TIG:
Goal: To collect the environmental pollution related creep corrosion failures from the global electronics industry
Miniaturization
Board Assembly
Creep Corrosion – Phase 3
Mason Hu, Cisco; Simon Lee, Dow Xiaodong Jiang, Alcatel-Lucent
• Due to RoHS transition, the SnPb based PWB finish will move to Pb-free compatible finishes
• Corrosion of electronics in many areas in Asia
• However, there is very little agreement on the test methods and conditions
• This project seeks to establish a standard test methodology to facilitate further investigation of this problem.
• Survey of the occurrence of creep corrosion in the industry
• Inclusive of global applications
• Investigation of environmental conditions related to creep corrosion (temperature, relative humidity, atmospheric concentration of sulfide)
• Investigation of the surface finishes related to creep corrosion
• Investigation of manufacturing factors related to the incidence of creep corrosion (e.g. flux, processing, operations)
• Due to RoHS transition, the SnPb based PWB finish will move to Pb-free compatible finishes
• Corrosion of electronics in many areas in Asia
• However, there is very little agreement on the test methods and conditions
• This project seeks to establish a standard test methodology to facilitate further investigation of this problem
4-11 3-12
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Miniaturization
Board Assembly
Creep Corrosion Phase 3
Project Chair: Project Co-Chair:
Strategy Tactics Start: End:
Issues Graphics
Focus Area:
Mar-12 TIG:
Goal: Perform accelerated thermal cycle experiments on new Pb-free alloys
Miniaturization
Board Assembly
Characterization of Pb-Free Alloy Alternatives
Stephen Tisdale, Intel Greg Henshall, HP
• Make Pb-free alloy choice easier to manage
• Reduce the complexity in selecting Pb-free alloys
• Develop a set of material test requirements for new Pb-free solder alloys.
• Work with IPC and the IPC Solder Products Value Council to establish standard test methods
• Identify test methods to reduce impact on manufacturing
• Provide thermal cycle reliability data on a variety of commercially and scientifically important alloys
• Provide data from which thermal fatigue acceleration models can be derived for a range of alloy
• Validate the impact of Ag concentration in the range of 0 to 4% on thermal fatigue resistance
• Evaluate the impact of commercially common dopants
• Assess how alloy composition affects the acceleration behavior
• Provide basic thermal fatigue data for several of the most common alternate alloys
• Pprovide an opportunity to assess the performance of 16 New Pb Free Alloys
• The increasing number of Pb-free alloys provides opportunities to address shortcomings of near-eutectic SAC alloys, such as:
– Poor mechanical shock performance
– Alloy cost
– Copper dissolution
– Poor mechanical behavior of joints in bending
08-09 Q1 12
48
Temperature ( C) 270
235300
285215
225
Current HP
Pb-Free
Wave Process
Window
Margin
Margin
Process Failure
Process Failure
Points of process failure
Process Success Metric
Risk of
thermal
damage
issues
Risk of
unnecessary
rework
Example of
risky alloy
18 companies; 53 individuals Solder alloy suppliers, component suppliers, EMS providers, OEMs
Miniaturization
Board Assembly
Characterization of Pb-Free Alloy Alternatives
2011 Research Priorities
2011 Research Priorities
2011
Research
Priorities
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The Research Committee
Alan Rae, TPF Enterprises Chair
Bob Pfahl, iNEMI Secretary
Carol Handwerker , Purdue Co-Chair
Charles Richardson, iNEMI Ex-Officio
Barbara Goldstein, NIST Member
Lili Deligianni, IBM Member
D.H.R. Sarma, Delphi Member
Jie Xue, Cisco Member
Ravi Mahajan, Intel Member
Voya Markovich, EIT Member
Bob Hilty, Tyco Member
Rolf Aschenbrenner, IZM Member
Rao Tummala, GIT Member
Haley Fu, iNEMI Ex-Officio
Grace O’Malley, iNEMI Ex-Officio
53
2011 Research Agenda Process
• Step 1:
– Traditional Process of Technology Chapters Accountable for identifying Research Needs.
– Extraction of those needs by the iNEMI Research Committee.
– Utilize focused workshops to further identify needs: 1. Electronics and Medical Packaging WS – Berlin Oct 2010
2. Environmental Research Stakeholders – Vienna Nov 2010
3. Alternative Energy WS – Santa Clara – Oct 2010
4. Environmental Leaders WS – Phoenix – Feb 2011
5. Medical Electronics WS – Santa Clara – May 2011
6. MEM’s WS – Brighton England – Sept 2011
• Step 2:
– Roll up all inputs and prioritize critical needs
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Step 3: Group & Prioritize Similar Needs
55
Step 4 ; Create Research Proposals;
Environmental Examples
1. Establishing Shared, peer reviewed, data bases (Elsa Olivetti; MIT)
2. Simplified LCA For Key Product Segments
3. Simplified LCA For Electronic Materials (Carol Handwerker; Purdue)
4. Developing Sample Business Cases on Sustainability
5. Improved Knowledge of User Behavior
6. Eco-Reliability (Nils Nissen; IZM, Colin Fitzpatrick; Limerick University)
7. Environmental Evaluation of alternative biopolymers (Nils Nissen; IZM)
8. White List of Acceptable Polymeric Materials
9. Material Hazard Informatics (Julie Schoenung; University of California Davis)
Expect additional proposals in the next few months - One at RIT on Eco Design and one at IMEC on halogen free molding compounds in process
56
• Through Webinars Starting in 1H 2012
• Predefined targeted industry and Research Institute
partners
• Include the game plan for Public and Private Funding
• Submit proposals to public funding agencies for
approval.
• Determine priority and support levels for iNEMI industry
membership funding support
Step 5; Present Proposals to iNEMI Membership; Create
Academic & Industry Partnerships
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Summary and Closure
• iNEMI has delivered 9 Editions of the Industries broadest
set of Technology Roadmaps.
• Content is derived from a global set of inputs from the
experts around the world
• The critical outputs include gap identification that lead
to:
– Effective Results Oriented Collaborative Projects on
Critical Pre Competitive Challenges where Supply
Chain Partnership is Needed.
– And the identification of longer team research needs
and a process to drive integrated teams on the highest
priorities.
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We Encourage You to:
• Participate in 2013 Roadmap Development
• Get Involved in iNEMI Projects and Initiatives.
And I Thank You for Your Attention!!
www.inemi.org Email contacts:
Bill Bader
Bob Pfahl
Grace O’Malley - Europe
Haley Fu - Asia