automotive power module packaging review...the progress of electric and hybrid electric vehicles...
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©2018 by System Plus Consulting | Automotive Power Module Packaging Comparison 2018 1
22 Bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
Automotive Power Module Packaging Comparison 2018
A Cost Oriented Technical Analysis Review
Power Semiconductor report by Farid HamraniJuly 2018 - Sample
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
©2018 by System Plus Consulting | Automotive Power Module Packaging Comparison 2018 2
SUMMARY
Overview 3
o Executive Summary
o Reverse Costing Methodology
o Analyzed devices
Introduction 7
o Power Module Market
Physical and Manufacturing Cost Analysis 11
o Bosch
Company Profile
T-PM
o Infineon
Company Profile
HybridPACK 2
HybridPACK Drive
HybridPACK Double Side Cooling
CoolIR
o Mitsubishi
Company Profile
J serie T-PM
o Semikron
Company Profile
SKiM
o ST Microelectronic
Company Profile
Tpak
o Toshiba
Company Profile
Case module
o Toyota
Company Profile
Molded DSC
Comparison 110
o o Cost breakdown
o o Cost by Power
o o Cost by Switch
o o Cost by Surface and Volume
Feedback 117
System Plus Consulting services 119
©2018 by System Plus Consulting | Automotive Power Module Packaging Comparison 2018 3
Overviewo Executive Summaryo Reverse Costing
Methodologyo Analyzed devices
Introduction
Physical & Cost Analysis
Comparison
Feedback
About System Plus
Executive Summary
The most recent market forecast by Yole Développement shows the global rise of power devices. The market for power module devices will follow that trend, with a 10.2% compound annual growth rate (CAGR) over the next five years. This will impact the power module packaging market, which will see a 9.5% CAGR, reaching a value of almost $1.8B.
The progress of electric and hybrid electric vehicles (EV/HEVs) is imposing new standards in terms of electrical equipment, pushing electronic components to work in non-conventional environments for longer. That poses the electronics industry new challenges regarding both performance and reliability. To meet these requirements, electronic systems have to be improved at both design and industrialization levels.
Power modules have come a long way since the early stages of car electrification. They are now playing a key role in the power modulation through all EV/HEVs, from inverters to bi-directional converters. Packaging these modules has become critical due to several technical aspects. They must combine good thermal and electrical efficiency while keeping low mass and volume. Also, to remain competitive in an open market, power module makers must deliver high reliability while remaining cost efficient.
In this report we analysed the physical composition and cost of ten modules for automotive applications from seven different manufacturers. We reviewed the different topologies and techniques used for the module packaging in such applications. We describe opening the modules, provide measurements and cross-sections, along with scanning electron microscope (SEM) and optical pictures. We analyse and simulate the cost of manufacturing and compare it to a summary panel.
This report includes comparison of the structures and costs of the different technological choices made by key manufacturers of the automotive industry.
©2018 by System Plus Consulting | Automotive Power Module Packaging Comparison 2018 4
Overviewo Executive Summaryo Reverse Costing
Methodologyo Analyzed devices
Introduction
Physical & Cost Analysis
Comparison
Feedback
About System Plus
Analyzed Devices
The components analyzed are listed it against.
Manufacturer
Bosch T-PM
Infineon
HybridPACK 2 FS600R07A2E3
HybridPACK Drive FS820R08A6P2B
HybridPACK DSC FF400R07A01E3
CoolIR
Mitsubishi T-PM CT300DJG060
Semikron SKiM SKiM306GD12E4
STMicroelectronics TPak
Toshiba Case module
Toyota Prius Molded DSC
©2018 by System Plus Consulting | Automotive Power Module Packaging Comparison 2018 5
Overview
Introductiono Packaging technologyo Power Module Market
Physical & Cost Analysis
Comparison
Feedback
About System Plus
Market Evolution
• This Market forecast by Yole Developpment is showing the rise of the global power market devices.
• It also shows that the market for the Power Module devices will follow that trend with an estimated XXXincrease in the next five years.
Source: Yole Développment
©2018 by System Plus Consulting | Automotive Power Module Packaging Comparison 2018 6
Overview
Introduction
Physical & Cost Analysiso Bosch
T-PMo Infineono Mitsubishio Semikrono ST Microelectronicso Toshibao Toyota
Comparison
Feedback
About System Plus
Inverter Module – Views and Dimensions
Xx mm
Bottom ViewTop View
Xx m
m
©2018 by System Plus Consulting | Automotive Power Module Packaging Comparison 2018 7
Overview
Introduction
Physical & Cost Analysiso Boscho Infineon
HybridPACK 2 HybridPACK Drive HybridPACK DSC CoolIR
o Mitsubishio Semikrono ST Microelectronicso Toshibao Toyota
Comparison
Feedback
About System Plus
Infineon Hybridpack 2 – Cross Section
Package Cross-section – MEB View
• With two xxxxµm thick copper plates and an xxxx layer of xxxxµm the total thickness of the DBC is xxxxµm.
• We can see that the copper baseplate and the DBC are connected together by with solder joint of xxxxµm.
©2018 by System Plus Consulting | Automotive Power Module Packaging Comparison 2018 8
Overview
Introduction
Physical & Cost Analysiso Boscho Infineon
HybridPACK 2 HybridPACK Drive HybridPACK DSC CoolIR
o Mitsubishio Semikrono ST Microelectronicso Toshibao Toyota
Comparison
Feedback
About System Plus
HybridPACK DSC – Assembly Cost Analysis
Module Assembly Process Flow
©2018 by System Plus Consulting | Automotive Power Module Packaging Comparison 2018 9
Overview
Introduction
Physical & Cost Analysiso Boscho Infineon
HybridPACK 2 HybridPACK Drive HybridPACK DSC CoolIR
o Mitsubishio Semikrono ST Microelectronicso Toshibao Toyota
Comparison
Feedback
About System Plus
CoolIR – Assembly Cost Analysis
Module Assembly Process Flow
• The total price for the parts & assembly of this module adds to a grand total of $XX.
• This Includes $XXX of external parts (XX% of final price) and $XX of assembly. The losses during the assembly operations come down to $XX.
©2018 by System Plus Consulting | Automotive Power Module Packaging Comparison 2018 10
Overview
Introduction
Physical & Cost Analysiso Boscho Infineono Mitsubishio Semikrono ST Microelectronicso Toshiba
Case Module o Toyota
Comparison
Feedback
About System Plus
Case Module – Cross-Section
Module detail - cross-section view
©2018 by System Plus Consulting | Automotive Power Module Packaging Comparison 2018 11
Overview
Introduction
Physical & Cost Analysis
Comparisono Technical Categorieso Cost Breakdowno Price per Powero Price per Volumeo Price per Surface
Feedback
About System Plus
Package Cost Breakdown Comparison
Above is a representation of the cost breakdown evolution for each studied module packages classified by packaging technologies We can see the impact of external parts (housing leadframes…) the added value (labor, machine cost…) and the cost of losses.The impact of the external parts have can interfere with the final prices. Especially the PinFin baseplate on the modules from Infineon. But this choice from the German manufacturer is to combine this baseplate/radiator for the best thermal efficiency. An additional costthat as to be added at system level for the other configurations.
©2018 by System Plus Consulting | Automotive Power Module Packaging Comparison 2018 12
Overview
Introduction
Physical & Cost Analysis
Comparison
Feedback
About System Pluso Company serviceso Related reportso Contacto Legal
Related Reports
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
POWER• Tesla Model 3 Inverter with SiC Power Module from
STMicroelectronics• Infineon FF400R07A01E3 Double Side Cooled IGBT Module• Infineon FS820R08A6P2B HybridPACK Drive IGBT Module
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
POWER• Power Electronics for EV/HEV 2018• Tesla Model 3 Inverter with SiC Power Module from
STMicroelectronics
The most recent market forecast by Yole
Développement shows the global rise of power
devices. The market for power module devices
will follow that trend, with a 10.2% compound
annual growth rate (CAGR) over the next five
years. This will impact the power module
packaging market, which will see a 9.5% CAGR,
reaching a value of almost $1.8B.
The progress of electric and hybrid electric
vehicles (EV/HEVs) is imposing new standards
in terms of electrical equipment, pushing
electronic components to work in non-
conventional environments for longer. That
poses the electronics industry new challenges
regarding both performance and reliability. To
meet these requirements, electronic systems
have to be improved at both design and
industrialization levels.
Power modules have come a long way since
the early stages of car electrification. They are
now playing a key role in the power modulation
through all EV/HEVs, from inverters to bi-
directional converters. Packaging these
modules has become critical due to several
technical aspects. They must combine good
thermal and electrical efficiency while keeping
low mass and volume. Also, to remain
competitive in an open market, power module
makers must deliver high reliability while
remaining cost efficient.
In this report we analyzed the physical
composition and cost of ten modules for
automotive applications from seven different
manufacturers. We reviewed the different
topologies and techniques used for the module
packaging in such applications. We describe
opening the modules, provide measurements
and cross-sections, along with scanning
electron microscope (SEM) and optical
pictures. We analyze and simulate the cost of
manufacturing and compare it to a summary
panel.
This report includes comparison of the
structures and costs of the different
technological choices made by key
manufacturers of the automotive industry.Title: Automotive Power Module Packaging Comparison 2018
Pages: 110
Date: July 2018
Format: PDF & Excel file
Price: EUR 4,490
Automotive Power Module PackagingComparison 2018
IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY
A cost-oriented review of power module packaging technologiesfor the automotive market.
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
COMPLETE TEARDOWN WITH
• Detailed photos
• Precise measurements
• Manufacturing process flow
• Manufacturing cost analysis
• Technological and cost comparison
AUTOMOTIVE POWER MODULE PACKAGING COMPARISON 2018
TABLE OF CONTENTS
Overview/Introduction
• Executive Summary
• Reverse Costing Methodology
• Analyzed Devices
• Power Module Market
Physical and Manufacturing Cost Analysis
• Bosch
Company profile
T-PM
• Infineon
Company profile
HybridPACK 2
HybridPACK drive
HybridPACK double side cooling
CoolIR
• Mitsubishi
Company profile
J serie T-PM
AUTHORS
• Semikron
Company profile
SKiM
• ST Microelectronics
Company profile
Tpak
• Toshiba
Company profile
Case module
• Toyota
Company profile
Molded DSC
• Module Comparison
• Cost Breakdown
• Cost by Power
• Cost by Switch
• Cost by Surface and Volume
Tesla Model 3 Inverter with SiC Power Module from STMicroelectronicsThe first SiC power module in commercialized electric vehicles.June 2018 - EUR 3,490*
Infineon FF400R07A01E3 Double Side Cooled IGBT ModuleDiscover Infineon‘s first double sided cooling power module for automotive. January 2018 - EUR 3,490*
Infineon FS820R08A6P2B HybridPACK Drive IGBT ModuleThe newest HybridPACK Drive power module from Infineon with EDT2 IGBT technology.June 2017 - EUR 3,490*
RELATED REPORTS
Farid Hamranijoined SystemPlus Consulting in2016 as a systemcost engineer.
He’s in charge of systems reversecost analysis with a focus onembedded systems. He pre-viously worked in the high-reliability packaging field. Faridholds a master degree inmicroelectronics and materialfrom the University of Nantes.
Véronique LeTroadec has joinedSystem Plus Con-sulting as a labora-tory engineer.
Coming from Atmel Nantes, shehas extensive knowledge in failureanalysis of components and indeprocessing of integratedcircuits.
tory of System Plus Consulting.He previously worked during 25years in Atmel NantesTechnological Analysis Labor-atory as fab support in physicalanalysis, and 3 years at HirexEngineering in Toulouse, in aDPA lab.
Yvon Le Goff hasjoined System PlusConsulting in2011, in order tosetup the labora-
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©2018 by System Plus Consulting | Automotive Power Module Packaging Comparison 2018 14
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Comparison
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About System Pluso Company serviceso Related reportso Contacto Legal
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©2018 by System Plus Consulting | Automotive Power Module Packaging Comparison 2018 15
Overview
Introduction
Physical & Cost Analysis
Comparison
Feedback
About System Pluso Company serviceso Related reportso Contacto Legal
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