ams’ direct tof proximity sensor · 2019. 4. 18. · ©2019 by system plus consulting |...

©2019 by System Plus Consulting | ams’ Direct Time-of-Flight Detection SPAD-Based Proximity Sensor 1

22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

ams’ Direct ToF Proximity SensorFirst SPAD Time-of-Flight from ams in the Huawei Mate 20 Pro

IMAGING report by Stéphane ELISABETHApril 2019 – Sample

REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

http://www.systemplus.fr/http://www.systemplus.fr/


Table of Contents

Overview / Introduction 4

o Executive Summary

o Reverse Costing Methodology

Company Profile 8

o ams

o 3D Depth Sensing market

o 3D Depth Sensing Technology

o Time-of-Flight Technology

o D-ToF Architecture

o Huawei Mate 20 Pro Teardown

o D-ToF Proximity Sensor System Architecture

Physical Analysis 27

o Summary of the Physical Analysis 28

o Package Assembly 30

Module Views & Dimensions

Module Opening

Module Cross-Section: Adhesive, PCB, Lens, FoV

o VCSEL Die 43

VCSEL Die View & Dimensions

VCSEL Die Cross-Section

VCSEL Die Process Characteristic

o SPAD Detector Die 59

Die View & Dimensions

Die Overview & Active Area:

SPADs, Breakdown Voltage Detection

Die Delayering & main Blocs

Die Process

Die Cross-Section: Filter, Metal Layers, SPADs

Die Process Characteristic

Comparison with STMicroelectronics Custon d-ToF 95

o Comparison with Apple iPhone 8 plus and X/Xr/Xs’ Proximity Sensor:

Package, FoV, Optical Blocking Package, SPAD Detector & VCSEL, SPADs

Manufacturing Process 102

o Global Overview

o SPAD Sensor Die Front-End Process & Fabrication Unit

o Filter Front-End Process Flow

o VCSEL Die Front-End Process Flow & Fabrication Unit

o Final Test & Packaging Fabrication unit

Cost Analysis 116

o Summary of the cost analysis 117

o Yields Explanation & Hypotheses 119

o SPAD Sensor die 121

Sensor Die & Filter Front-End Cost

Sensor Die Probe Test, Thinning & Dicing

Sensor Die Wafer & Die Cost

o VCSEL Die 125

VCSEL Die Front-End Cost

VCSEL Front-End Cost per process steps

VCSEL Die Probe Test, Thinning & Dicing

VCSEL Wafer & Die Cost

o Component Cost 132

Packaging Cost

Back-End: Final Test

Component Cost

Selling price 134

Feedbacks 138

SystemPlus Consulting services 140



Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Related Reports

About System Plus

Executive Summary

This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling priceof the ams’ Proximity Sensor in the Huawei Mate 20 Pro.

In the Huawei Mate 20 Pro, the front optical hub is packaged in one metal enclosure featuring several cameras and sensors. The complete system features a red/green/blue (RGB) camera module, an ambient light sensor, a near-infrared (NIR) global shutter (GS) camera module, a flood illuminator, a proximity sensor and a dot projector.

This report focusses on analyzing the proximity sensor. Located in the front around the main speaker, the proximity sensor iscontained in a Land Grid Array (LGA) package. The device is probably a custom version of the new TMF8701 component made specifically for Huawei, and is the first on the market from ams. The component includes a SPAD detector featuring a 15 µm-wide SPAD, with 128 pixel resolution, and a single Vertical Cavity Surface Emitting Laser (VCSEL). The structure uses innovativeoptical LGA packaging with polymer lenses produced using a transfer molding process.

This complete analysis of the proximity sensor includes detailed analyses of the SPAD detector and the VCSEL, along with a cost analysis and price estimation for the module. It also includes a physical and technical comparison with the custom proximity sensor from STMicroelectronics in the Apple iPhone 8 and iPhone X/XR/XS.



Overview / Introduction

Company Profile & Supply Chain o amso 3D Sensing Marketo 3D Sensing Technologyo Huawei Mate 20 Pro Teardowno ams’ d-ToF Proximity Sensor

Physical Analysis

Physical Comparison


Cost Analysis


Related Reports

About System Plus

Huawei Mate 20 Pro Teardown

Huawei Mate 20 Pro Back View – Opening ©2019 by System Plus Consulting

Huawei Mate 20 Pro Front View – Sensing module©2019 by System Plus Consulting

Flood Illuminator

Notification LEDProximity Sensor

ALS




Company Profile & Supply Chain o amso 3D Sensing Marketo 3D Sensing Technologyo Huawei Mate 20 Pro Teardowno ams’ d-ToF Proximity Sensor

Physical Analysis

Physical Comparison


Cost Analysis


Related Reports

About System Plus

d-ToF Proximity Sensor System Architecture



**



Physical Analysis o Package Assembly

o Views & Dimensionso Cross-Section

o VCSEL Dieo Views & Dimensionso Die Cross-section

o SPAD Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section

Physical Comparison


Cost Analysis


Related Reports

About System Plus

Summary of the Physical Analysis



**







Physical Comparison


Cost Analysis


Related Reports

About System Plus

Package View & Dimensions



**







Physical Comparison


Cost Analysis


Related Reports

About System Plus

Package Cross-Section



**







Physical Comparison


Cost Analysis


Related Reports

About System Plus

Package Cross-Section – Lens



**







Physical Comparison


Cost Analysis


Related Reports

About System Plus

VCSEL Die View & Dimensions



**







Physical Comparison


Cost Analysis


Related Reports

About System Plus

VCSEL Die – Cross-Section



**







Physical Comparison


Cost Analysis


Related Reports

About System Plus

SPAD Detector Die View & Dimensions



**







Physical Comparison


Cost Analysis


Related Reports

About System Plus

SPAD Detector Die – Active Area



**







Physical Comparison


Cost Analysis


Related Reports

About System Plus

SPAD Detector Die – Die Cross-Section – Filter



**







Physical Comparison


Cost Analysis


Related Reports

About System Plus

SPAD Detector Die – Die Cross-Section – SPADs





Physical Analysis

Physical Comparisono STMicroelectronics Custom

d-ToF


Cost Analysis


Related Reports

About System Plus

Comparison with STMicroelectronics Custom d-ToF – Package





Physical Analysis

Physical Comparisono STMicroelectronics Custom

d-ToF


Cost Analysis


Related Reports

About System Plus

Comparison with STMicroelectronics Custom d-ToF – SPADs





Physical Analysis

Physical Comparison

Manufacturing Process Flowo SPAD Die Front-End Processo SPAD Fabrication Unito VCSEL Die Front-End Processo VCSEL Fabrication Unito Final Test & Assembly Unit

Cost Analysis


Related Reports

About System Plus

Global Overview





Physical Analysis

Physical Comparison

Manufacturing Process Flowo SPAD Die Front-End Processo SPAD Fabrication Unito VCSEL Die Front-End Processo VCSEL Fabrication Unito Final Test & Assembly Unit

Cost Analysis


Related Reports

About System Plus

VCSEL Wafer Front-End process Flow (1/3)





Physical Analysis

Physical Comparison


Cost Analysiso Cost Analysis Summaryo Yields Explanation &

Hypotheseso SPAD Sensor Costo VCSEL Die Costo Component Cost


Related Reports

About System Plus

SPAD Detector Front-End Cost





Physical Analysis

Physical Comparison





Related Reports

About System Plus

VCSEL Wafer & Die Cost





Physical Analysis

Physical Comparison





Related Reports

About System Plus

Component Cost





Physical Analysis

Physical Comparison


Cost Analysis

Selling Price Analysiso Definition of Priceso Manufacturer Financialso Component Price

Feedbacks

About System Plus

Estimated Manufacturer Price





Physical Analysis

Physical Comparison


Cost Analysis


Related Reports

About System Plus

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

PACKAGING• VCSEL in Smartphone – Comparison 2019• Sony’s 3D Time-of-Flight Depth Sensing Camera Module• STMicroelectronics’ Time of Flight Proximity Sensor & Flood Illuminator in the Apple iPhone X• ams’ Spectral Sensor Portfolio: the AS726X Series• STMicroelectronics Time of Flight Proximity Sensor in the Apple iPhone 7 Plus

Related Reports

MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT

ADVANCED PACKAGING• VCSELs – Technology, Industry and Market Trends 2018• 3D Imaging & Sensing 2018

http://www.systemplus.fr/http://www.systemplus.fr/https://www.systemplus.fr/reverse-costing-reports/stmicroelectronics-time-of-flight-proximity-sensor-flood-illuminator-in-the-apple-iphone-x/https://www.systemplus.fr/reverse-costing-reports/stmicroelectronics-time-of-flight-proximity-sensor-flood-illuminator-in-the-apple-iphone-x/https://www.systemplus.fr/reverse-costing-reports/vcsel-in-smartphone-comparison-2019/https://www.systemplus.fr/reverse-costing-reports/sonys-3d-time-of-flight-depth-sensing-camera-module/https://www.systemplus.fr/reverse-costing-reports/stmicroelectronics-time-of-flight-proximity-sensor-flood-illuminator-in-the-apple-iphone-x/https://www.systemplus.fr/reverse-costing-reports/ams-spectral-sensor-portfolio-the-as726x-series/https://www.systemplus.fr/reverse-costing-reports/stmicroelectronics-time-of-flight-proximity-sensor-in-the-apple-iphone-7-plus/https://www.systemplus.fr/reverse-costing-reports/sonys-3d-time-of-flight-depth-sensing-camera-module/https://www.systemplus.fr/reverse-costing-reports/sonys-3d-time-of-flight-depth-sensing-camera-module/https://www.i-micronews.com/produit/vcsels-technology-industry-and-market-trends/https://www.i-micronews.com/produit/3d-imaging-sensing-2018/https://www.i-micronews.com/produit/3d-imaging-sensing-2018/https://www.i-micronews.com/produit/3d-imaging-sensing-2018/https://www.i-micronews.com/produit/vcsels-technology-industry-and-market-trends/https://www.i-micronews.com/produit/vcsels-technology-industry-and-market-trends/https://www.systemplus.fr/reverse-costing-reports/vcsel-in-smartphone-comparison-2019/https://www.systemplus.fr/reverse-costing-reports/vcsel-in-smartphone-comparison-2019/


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ams’ direct tof proximity sensor · 2019. 4. 18. · ©2019 by system plus consulting |...

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