stmicroelectronics tof proximity sensor · stmicroelectronics tof proximity sensor time-of-flight...
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©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 1
21 rue la Noue Bras de Fer44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
STMicroelectronics ToF Proximity SensorTime-of-Flight Proximity Sensor in Apple iPhone 7 PlusIMAGING report by Stéphane ELISABETHMarch 2017
©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 2
Table of Contents
Overview / Introduction 3
o Executive Summary
o Reverse Costing Methodology
Company Profile 7
o STMicroelectronics
o FlightSense TM Technology
o FlightSense TM Supply Chain
o STMicroelectronics Smartphone Market
o Apple iPhone 7 Plus Teardown
Physical Analysis 19
o Synthesis of the Physical Analysis
o Physical Analysis Methodology
o Package 22
Package Views & Dimensions
Package Opening
Wire Bonding Process
Package Cross-Section :
Adhesives, PCB, Filters, FOV
o VCSEL Die 36
View & Dimensions
Wire Bonding, Cavity
Cross-Section
Process Characteristics
o ASIC Die 51
View, Dimensions & Marking
Die Overview: Active Area, SPADs technology
Die Delayering, Main Blocks ID & Process
Cross-Section : Metal Layers, SPADs
Process Characteristics
Physical Comparison 76
o STMicroelectronics Portfolio
Package, Functions, FOV, Optical Blocking Package, ASIC & VCSEL, SPADs
Manufacturing Process Flow 83
o Global Overview
o ASIC Front-End Process
o ASIC Wafer Fabrication Unit
o VCSEL Process Flow
o VCSEL Wafer Fabrication Unit
o Packaging Process Flow
o Final Assembly Unit
Cost Analysis 91
o Synthesis of the cost analysis
o Yields Explanation & Hypotheses
o ASIC Die 96
ASIC Front-End Cost
ASIC Back-End 0 : Probe Test & Dicing
ASIC Wafer & Die Cost
o VCSEL Die 99
VCSEL Front-End Cost
VCSEL Front-End Cost per process steps
VCSEL Back-End 0 : Probe Test & Dicing
VCSEL Wafer & Die Cost
o Component 103
Back-End : Packaging Cost
Back-End : Packaging Cost per Process Steps
Back-End : Final Test Cost
Component Cost
Estimated Price Analysis 108
Company services 112
©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 3
Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Executive Summary
• Located in the front above the main speaker, the proximity sensor is packaged using optical LGA. TheiPhone 7 Plus features the smallest Time of Flight sensor provided by STMicroelectronics.
• As always, Apple has ordered a custom version of the device. Compared to STMicroelectronics’s portfolio,the custom device is two time smaller (2.80 x 2.40 mm) than the actual proximity sensor proposes by thefirm. The sensor is based on FlighSenseTM technology that featured an illumination device which is aVertical-Cavity Surface-Emitting Laser (VCSEL) and a collector which is based on the Single PhotonAvalanche Diode (SPAD) developed by STMicroelectronics.
• To provide such device, STMicroelectronics has made some improvement on the SPADs and the VCSELfrom the actual devices that are studied and detailed in the report. The report featured also a function anda field-of-view comparison with the VL53L0X and VL6180X.
©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 4
Overview / Introduction
Company Profile & Supply Chain o STMicroelectronicso Apple iPhone 7 Plus Teardown
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Apple iPhone 7 Plus Opened view
Apple iPhone 7 Plus Teardown
Apple iPhone 7 Plus Top Flex PCB – Top View
Apple iPhone 7 Plus Top Flex PCB – Bottom View
Front Camera
Microphone
ALS
Speaker
Proximity Sensor
©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 5
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo VCSEL Dieo ASIC Die
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Synthesis of the Physical Analysis
©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 6
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo VCSEL Dieo ASIC Die
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Package View & Dimensions
©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 7
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo VCSEL Dieo ASIC Die
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Package Cross-Section
©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 8
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo VCSEL Dieo ASIC Die
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
VCSEL Die View & Dimensions
©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 9
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo VCSEL Dieo ASIC Die
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
VCSEL Die – Cross-Section
©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 10
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo VCSEL Dieo ASIC Die
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
VCSEL Die – Cross-Section
©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 11
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo VCSEL Dieo ASIC Die
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
ASIC Die View & Dimensions
©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 12
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo VCSEL Dieo ASIC Die
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
ASIC Die – Active Area
©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 13
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo VCSEL Dieo ASIC Die
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
ASIC Die – SPADs
©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 14
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo VCSEL Dieo ASIC Die
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
ASIC Die – Die Cross-Section
©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 15
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison o Packageo Functiono FOVo Optical Blocking Packageo ASIC & VCSELo SPADs
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Comparison with STMicroelectronics Portfolio – Package
©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 16
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison o Packageo Functiono FOVo Optical Blocking Packageo ASIC & VCSELo SPADs
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Comparison with STMicroelectronics Portfolio – SPADs
©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 17
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flowo Global Overviewo ASIC Front-End Processo VCSEL Front-End Processo Packaging Process
Cost Analysis
Selling Price Analysis
About System Plus
Global Overview
©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 18
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Synthesiso Supply Chaino Yieldso ASIC Wafer & Die Costo VCSEL Wafer & Die Costo Back-End Costo Component Cost
Selling Price Analysis
About System Plus
ASIC Front-End Cost
©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 19
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Synthesiso Supply Chaino Yieldso ASIC Wafer & Die Costo VCSEL Wafer & Die Costo Back-End Costo Component Cost
Selling Price Analysis
About System Plus
VCSEL Front-End Cost
©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 20
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Synthesiso Supply Chaino Yieldso ASIC Wafer & Die Costo VCSEL Wafer & Die Costo Back-End Costo Component Cost
Selling Price Analysis
About System Plus
Component Cost
©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 21
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Pluso Company serviceso Feedbackso Contacto Legal
MARKET AND TECHNOLOGY REPORTS - YOLE SÉVELOPPEMENT
• Status of the CMOS Image Sensor Industry 2016
PATENT ANALYSIS - KNOWMADE
• Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
Related Reports
• Lenovo Phab2Pro 3D ToF Camera• Maxim Integrated MAX30102 Optical Heart-Rate Sensor• SCiO Molecular Sensor from Consumer Physics: Mobile
Spectrometer Dongle
©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 22
COMPANYSERVICES
©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 23
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Pluso Company serviceso Feedbackso Contacto Legal
Business Models a Fields of Expertise
Custom Analyses(>130 analyses per year)
Reports(>40 reports per year)
Costing Tools
Trainings
©2017 System Plus Consulting | STMicroelectronics Time of Flight Proximity Sensor in Apple iPhone 7 Plus 24
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Pluso Company serviceso Feedbackso Contacto Legal
Contact
Headquarters21 rue La Noue Bras de Fer44200 NantesFRANCE+33 2 40 18 09 [email protected]
Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGERMANY+49 151 23 54 41 [email protected]
America Sales OfficeSteve [email protected]
www.systemplus.fr
Asia Sales OfficeTakashi [email protected]
Mavis WANGGREATER [email protected]
NANTESHeadquarter
FRANKFURT/MAINEuropa Sales Office
LYONYOLE HQ
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GREATER CHINAYOLE
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