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Nitride Deposition SOP of 14 Revision 7-051211

Nitride Deposition SOP

1 Scope

1.1 This document provides the procedures and requirements to deposit silicon nitride films, using the Canary LPCVD furnace.

2 Table of Contents

1 Scope ............................................................................................................................................................. 1 2 Table of Contents .......................................................................................................................................... 1 3 Reference Documents ................................................................................................................................... 2

3.1 Referenced within this Document .......................................................................................................... 2 3.2 External Documents ............................................................................................................................... 2

4 Equipment and/or Materials ......................................................................................................................... 2 5 Safety............................................................................................................................................................. 2 6 Setup Procedures .......................................................................................................................................... 3

6.1 Enable Furnace ....................................................................................................................................... 3 6.2 Turn on Burn Box .................................................................................................................................... 3 6.3 Vent Furnace........................................................................................................................................... 3 6.4 Remove Boat .......................................................................................................................................... 3 6.5 Select Program and Temperature .......................................................................................................... 3 6.6 Set Gas Flows .......................................................................................................................................... 4 6.7 Set Pressure ............................................................................................................................................ 4 6.8 Load Program ......................................................................................................................................... 4 6.9 Set Deposition Time ................................................................................................................................ 5 6.10 Load Sample Wafers ............................................................................................................................... 5

7 Film Deposition Procedures .......................................................................................................................... 6 7.1 Load Furnace .......................................................................................................................................... 6 7.2 Start Program/Verify Door Closure ........................................................................................................ 6 7.3 Leak Check .............................................................................................................................................. 6 7.4 Verify Burn Box ....................................................................................................................................... 7 7.5 Deposition Pressure Check ..................................................................................................................... 7 7.6 Unload .................................................................................................................................................... 7 7.7 Process Measurement ............................................................................................................................ 8 7.8 Burn Box Off ........................................................................................................................................... 8 7.9 Place System in Standby ......................................................................................................................... 8 7.10 Disable Furnace ...................................................................................................................................... 8

8 Process Notes and Characterization ............................................................................................................. 8 8.1 Typical Film Characteristics .................................................................................................................... 8 8.2 Gas Flow Setpoint Conversions ............................................................................................................ 10 8.3 Pressure Controller Setpoints ............................................................................................................... 10 8.4 Auto-Sequencer Output Assignments .................................................................................................. 11 8.5 Temperature Controller Recipes .......................................................................................................... 11 8.6 Auto-Sequencer Programs.................................................................................................................... 12

9 Revision History ........................................................................................................................................... 14


Figure 1, Nitride Gas Controller ................................................................................................................................. 4 Figure 2, Pressure Controller ..................................................................................................................................... 4 Figure 3, Nitride Boat Loading Diagrams ................................................................................................................... 5 Figure 4, Push Rod Alignment .................................................................................................................................... 6 Figure 5, Furnace DMM Switch .................................................................................................................................. 6 Table 1, Nitride Programs ....................................................................................................................................... 3 Table 2, Nitride Gas Flow Setpoint Conversions ................................................................................................ 10 Table 3, Nitride Pressure Controller Setpoint ..................................................................................................... 10 Table 4, Nitride Auto-Sequencer Output Assignments ...................................................................................... 11 Table 5, Nitride Temperature Controller Setup.................................................................................................. 11 Table 6, Nitride Auto-Sequence Controller Setup .............................................................................................. 12

3 Reference Documents

3.1 Referenced within this Document 3.1.1 Ecosys Burn Box SOP

3.1.2 Canary Furnace SOP

3.2 External Documents 3.2.1 None

4 Equipment and/or Materials

4.1 Ammonia (NH3), 99.9% or better

4.2 Dichlorosilane (SiCl2H2), Electronic Grade 2 (99.9%) or better

NOTE: Dichlorosilane is often identified as DCS.

4.3 Canary LPCVD Furnace

4.4 Nitride quartz boat

4.5 Quartz push rod with mark at 26” from hook

4.6 Heat-resistant gloves

4.7 Monitor wafers (bare silicon <100>)

5 Safety

5.1 Follow all Nanofab safety procedures.

5.2 Do NOT open the element door (danger of high voltage).

5.3 This system uses hazardous gases, specifically Dichlorosilane (SiCl2H2) and Ammonia (NH3). Refer to MSDS for more detail.

5.3.1 Do NOT adjust any regulators or valves for any gases.

5.4 Do NOT store flammable solvents (e.g., squeeze bottles, etc.) near the furnace or loading station.


5.5 Do NOT touch quartz boats with your hands. They may be hot. Use only a clean quartz boat holder or high temperature gloves.

5.6 Do NOT touch quartz or wafers with wipes, gloves, teflon, plastic, etc.

5.7 Place quartz only on dedicated quartz carriers, quartz surfaces, or stainless steel surfaces.

6 Setup Procedures

6.1 Enable Furnace 6.1.1 In Coral, enable the furnace and complete all required data entry.

NOTE: Enabling the furnace will release the interlock and provide access to the keypad.

6.2 Turn on Burn Box 6.2.1 Follow the procedures in the Ecosys Burn Box SOP to ensure the burn box is on.

6.2.2 Write your name, date, and equipment name on the Burn Box User white board.

6.3 Vent Furnace 6.3.1 Following the procedures in Canary Furnace SOP, load and start the Vent program (see Table

1, Nitride Programs).

Table 1, Nitride Programs

Program Description

Loop Counter Step for

Deposition Time

Setpoint Approx. Run Time (min)

NH3 (V)

DCS (V) Press Pre-Dep Deposition Post-Dep

0 Low-Stress Nitride (825°C) 6 0.25 3.00 250 44 User defined 21 1 Stoichiometric Nitride (780°C) 16 2.00 1.00 300 39 User defined 21 2 Custom, written as needed n/a n/a n/a 3 Custom, written as needed n/a n/a n/a 4 Custom, written as needed n/a n/a n/a 5 Pump Down/Idle n/a n/a n/a 6 Vent n/a n/a n/a

6.3.2 Wait for the program to finish and the auto-sequencer to advance to step 69.

6.4 Remove Boat 6.4.1 Using the high temperature gloves, open the furnace door.

6.4.2 Using the high temperature gloves or the quartz handle, remove the boat from the furnace and place on the quartzware rack.

6.4.3 Using the high temperature gloves, close the furnace door.

6.4.4 Allow the boat and wafers to cool at least 5 minutes.

6.5 Select Program and Temperature 6.5.1 Review the pre-defined programs shown in Table 1, Nitride Programs.


Figure 1, Silicon Nitride LPCVD Sys. Gas Controller

MFC Voltage Display Setpoint

Dials

Set/Read Switch

Selection Knob

Setpoint Control Dial

Figure 2, Pressure Controller

6.5.1 Identify the desired program.

6.5.2 If the desired conditions (temperature, gas flows, or pressure) are NOT shown in Table 1, Nitride Programs, contact the Lab Staff before proceeding.

NOTE: The Lab Staff can create custom programs, as needed.

6.6 Set Gas Flows 6.6.1 Using Table 1, Nitride Programs, find

the voltage setpoints for each of the gases.

6.6.2 On the Silicon Nitride LPCVD Sys. gas controller located in the gas jungle (see Figure 1, Silicon Nitride LPCVD Sys. Gas Controller), rotate the selection knob on the gas controller to select the desired gas.

6.6.3 While holding the toggle switch on SET, adjust the setpoint dial until the MFC Voltage Display shows the correct value.

6.6.4 Repeat 6.6.2 through 6.6.3 for each process gas.

6.6.5 Rotate the selection knob to PRESSURE.

6.7 Set Pressure 6.7.1 Using Table 1, Nitride Programs, find the pressure

control setpoint.

6.7.2 Adjust the dial on the controller (see Figure 2, Pressure Controller) to the desired setpoint setting.

6.8 Load Program 6.8.1 Following the procedures in Canary Furnace SOP, load the desired program.

NOTE: The controller will change to the first step of the program and immediately go on hold with 10 seconds on the time display. The READY light will be on.

!! WARNING !!

!! WARNING !!

Do not change any other dial or switch on the controller.


6.8.2 Verify the number of the desired program is shown in the Program Display field of the Auto-Sequence Controller.

6.8.2.1 If the correct number is NOT displayed, repeat 6.8.1 through 6.8.2.1.

6.8.3 Following the procedures in Canary Furnace SOP, release the hold.

NOTE: The RUN light will be on. The program will count down to 0 on the time display and go on hold. The READY light will be on again.

6.9 Set Deposition Time 6.9.1 Following the procedures in Canary Furnace SOP, set the value of the applicable loop counter

step to the desired number. (Refer to Table 1, Nitride Programs to find the correct loop counter step for the program being used.)

NOTE: One loop is one minute of deposition. For example, to get 45 minutes of deposition, set the loop counter to 45.

6.9.2 If you need a deposition step longer than 360 minutes, contact lab staff for approval before proceeding.

6.10 Load Sample Wafers 6.10.1 Ensure all wafers are completely clean, dry, and free of any surface contamination.

6.10.2 Using the vacuum wand, load the wafers as shown in Figure 3, Nitride Boat Loading Diagrams.

6.10.2.1 The polished side of the wafers are to face away from the handle end of the boat.

6.10.2.2 Ensure there are five (5) dummy wafers loaded in consectutive slots at each end of the boat.

6.10.2.3 Include a monitor wafer at the center of the boat.

NOTE: Monitor wafers are provided in a labeled box located on the storage rack. Sample wafers that are bare silicon may also be used as monitor wafers.

6.10.2.4 Load sample wafers from the center of the boat.

!! WARNING !!

!! WARNING !!

No photoresist, kapton tape, metals, or other foreign material are allowed in the furnace. Only quartz, silicon, oxide, nitride, and/or Polysilicon are allowed without lab staff approval.

↕ Dummy Wafer ¦ Monitor Wafer | Sample Wafer

┌┬┬┬┬─┬─┬─┬─┬─┬─┬─┬─┬─┬─┬─┬─┬─┬─┬─┬─┬┬┬┬┐ ↕↕↕↕↕ ¦ ↕↕↕↕↕\ ↕↕↕↕↕ ¦ ↕↕↕↕↕ \ ↕↕↕↕↕ ¦ ↕↕↕↕↕ | ↕↕↕↕↕ ¦ ↕↕↕↕↕ / ↕↕↕↕↕ ¦ ↕↕↕↕↕/ └┴┴┴┴─┴─┴─┴─┴─┴─┴─┴─┴─┴─┴─┴─┴─┴─┴─┴─┴┴┴┴┘ Test Run Polished Side Handle ┌┬┬┬┬─┬─┬─┬─┬─┬─┬─┬─┬─┬─┬─┬─┬─┬─┬─┬─┬┬┬┬┐ ↕↕↕↕↕ | | | | | | | ¦ | | | | | | | ↕↕↕↕↕\ ↕↕↕↕↕ | | | | | | | ¦ | | | | | | | ↕↕↕↕↕ \ ↕↕↕↕↕ | | | | | | | ¦ | | | | | | | ↕↕↕↕↕ | ↕↕↕↕↕ | | | | | | | ¦ | | | | | | | ↕↕↕↕↕ / ↕↕↕↕↕ | | | | | | | ¦ | | | | | | | ↕↕↕↕↕/ └┴┴┴┴─┴─┴─┴─┴─┴─┴─┴─┴─┴─┴─┴─┴─┴─┴─┴─┴┴┴┴┘ Sample Run

Figure 3, Nitride Boat Loading Diagrams


Figure 5, Nitride Pressure Display

7 Film Deposition Procedures

7.1 Load Furnace 7.1.1 Using the high temperature gloves, open the

furnace door.

7.1.2 Place the boat at the end of the furnace tube.

7.1.2.1 Samples should face the rear (pump) end of the furnace.

7.1.3 Using the quartz push rod, push the boat into the furnace at 1 inch every 5 seconds (12 inches per minute).

7.1.4 Align the mark on the push rod to the front face of the furnace scavenger (see Figure 4, Push Rod Alignment).

7.1.5 Remove the push rod and place in the storage cylinder.

7.1.6 Using the high temperature gloves, close the furnace door.

7.2 Start Program/Verify Door Closure 7.2.1 Using the high temperature gloves, hold the furnace door closed.


NOTE: The READY light will turn off and the RUN light will turn on. The controller will automatically execute the necessary steps to complete the nitride deposition process. A summary of the programs, steps, and outputs is given in Table 6, Nitride Auto-Sequence Controller Setup.

7.2.3 Hold the door closed for 30 seconds.

7.2.4 Gently pull on the door to ensure it is sealed.

7.2.5 If the door opens, hold the door securely closed for 60 seconds.

7.2.5.1 If the door still does not seal, hold the program and contact the lab staff for assistance.

7.3 Leak Check NOTE: The program will automatically go on hold at the

end of the pump down step (step *2).

7.3.1 Record the Start Pressure as the value shown on the Nitride Pressure Display (see Figure 5, Nitride Pressure Display).

NOTE: The display is shown in millivolts.

Figure 4, Push Rod Alignment

Scavenger Face

Push Rod Mark

Align Mark to Scavenger Face



NOTE: The duration of the leak check step is 1 minute. At the end of the step the program will again go on hold. It is important to be at the controller when the time expires.

7.3.3 Record the End Pressure as the value shown on the Nitride Pressure Display.

7.3.4 If the Leak Rate is greater than 10 mV/min, do the following:

7.3.4.1 Following the procedures in Canary Furnace SOP, abort the program.

7.3.4.2 Vent the furnace as per paragraph 6.3.

7.3.4.3 Using a clean room wipe, clean the surfaces of the door and the door flange.

7.3.4.4 Repeat 7.2 – 7.3.3.

7.3.4.5 If the Leak Check still fails, contact the lab staff for assistance.


NOTE: The program will continue until complete.

7.4 Verify Burn Box 7.4.1 Ensure the temperature on the burn box is between 400 – 750°C.

7.4.1.1 If it is not, following the procedures in Canary Furnace SOP, place the program on hold.

7.4.1.1.1 Contact the lab staff for assistance.

7.5 Deposition Pressure Check 7.5.1 During deposition verify the voltage readout on the Nitride Pressure Display.

NOTE: This should be done between 3-10 minutes after the start of deposition.

7.5.1.1 If it is not stable, contact the lab staff.

7.5.1.2 If it is not the desired value, adjust the Controller Setpoint as necessary.

7.5.2 Record the deposition pressure.

7.6 Unload 7.6.1 Verify the program is complete.

NOTE: The controller will be on step 69.

7.6.2 Using the high temperature gloves, open the furnace door.

7.6.3 Using the quartz push rod, pull the boat to the door of the furnace at 1 inch every 5 seconds (12 inches per minute).

7.6.4 Place the push rod in the storage cylinder.

7.6.5 Allow the boat to cool a minimum of 2 minutes at the door of the furnace.

7.6.6 Using the high temperature gloves or the quartz handle, remove the boat from the furnace and place on the quartzware rack.

7.6.7 Allow the boat and wafers to cool at least 5 minutes.


7.6.8 Using the vacuum wand, remove the sample and monitor wafers from the quartz boat.

7.7 Process Measurement 7.7.1 Complete all post-processing measurements of the monitor wafers or samples.

7.7.2 Place used monitor wafers in the labeled storage box located on the storage rack.

7.8 Burn Box Off 7.8.1 If no other lab user is using the burn box, follow the procedures in the Ecosys Burn Box

SOP to turn the burn box off.

7.8.2 Erase your name from the Burn Box User white board.

7.9 Place System in Standby NOTE: This section is only necessary if the furnace will be idle for more than 1 hour.

7.9.1 Using the high temperature gloves, open the furnace door.

7.9.2 Place the boat at the end of the furnace tube.

7.9.3 Using the high temperature gloves, hold the furnace door closed.

7.9.4 Follow the procedures in Canary Furnace SOP to load and start the Pump Down/Idle program (see Table 1, Nitride Programs).

7.9.5 Hold the door closed for 30 seconds.

7.9.6 Gently pull on the door to ensure it is sealed.

7.9.6.1 If the door opens, hold the door securely closed for 60 seconds.

7.9.6.1.1 If the door still does not seal, hold the program and contact the lab staff for assistance.

7.10 Disable Furnace 7.10.1 In Coral, disable the furnace and complete all data entry, including process measurement data.

NOTE: Disabling the furnace will activate the interlock and prevent access to the keypad.

8 Process Notes and Characterization

8.1 Typical Film Characteristics 8.1.1 Film deposition parameters

• DCS flow: 60 sccm (3V) • Ammonia flow: 10 sccm (0.25 V) • DCS:Ammonia ratio: 6:1 • Temperature: 825 C • Deposition Pressure 332 mT (166 mV) • Deposition Rate: Approximately 6.5nm/min (65Å/min)

8.1.2 The silicon-rich LPCVD silicon nitride film was analyzed in the XPS on 10 May 2007 (Loren).

• Results of XPS analysis: Si: 48.3% and N: 51.7% • Si1.0N1.07


8.1.3 The silicon-rich LPCVD silicon nitride film was analyzed in the Woollam ellipsometer on 9 May 2007 (Mickey).

Wavelength (nm) Index of Refraction (n) 400 2.244

450 2.221 500 2.205

550 2.193

600 2.1839

650 2.1768 700 2.1711

750 2.167

800 2.163 850 2.16

900 2.157

8.1.4 The stress of the silicon-rich LPCVD silicon nitride film was measured using the wafer bow technique on 6-20-07 (Divesh)

• Results of stress analysis: Film has a residual tensile stress of 300 MPa. 8.1.5 KOH Etch Mask

• You need at least 100 nm of Silicon-rich nitride for a good KOH mask layer • This nitride film is an excellent free-standing membrane layer.


8.2 Gas Flow Setpoint Conversions 8.2.1 Table 2, Nitride Gas Flow Setpoint Conversions shows the voltage settings needed to obtain

the desired gas flows.

Table 2, Nitride Gas Flow Setpoint Conversions

Setpoint Display Setpoint Display Setpoint Display NH3

(sccm) DCS

(sccm) Volts (V)

NH3 (sccm)

DCS (sccm)

Volts (V) NH3

(sccm) DCS

(sccm) Volts (V)

0.0 0.0 0.000 70.0 35.0 1.750 140.0 70.0 3.500 5.0 2.5 0.125 75.0 37.5 1.875 145.0 72.5 3.625

10.0 5.0 0.250 80.0 40.0 2.000 150.0 75.0 3.750 15.0 7.5 0.375 85.0 42.5 2.125 155.0 77.5 3.875 20.0 10.0 0.500 90.0 45.0 2.250 160.0 80.0 4.000 25.0 12.5 0.625 95.0 47.5 2.375 165.0 82.5 4.125 30.0 15.0 0.750 100.0 50.0 2.500 170.0 85.0 4.250 35.0 17.5 0.875 105.0 52.5 2.625 175.0 87.5 4.375 40.0 20.0 1.000 110.0 55.0 2.750 180.0 90.0 4.500 45.0 22.5 1.125 115.0 57.5 2.875 185.0 92.5 4.625 50.0 25.0 1.250 120.0 60.0 3.000 190.0 95.0 4.750 55.0 27.5 1.375 125.0 62.5 3.125 195.0 97.5 4.875 60.0 30.0 1.500 130.0 65.0 3.250 200.0 100.0 5.000 65.0 32.5 1.625 135.0 67.5 3.375 Max flow

NH3: V = 5*sccm/200 DCS: V = 5*sccm/100

8.3 Pressure Controller Setpoints 8.3.1 Table 3, Nitride Pressure Controller Setpoint shows the approximate settings needed to obtain

the desired pressure.

Table 3, Nitride Pressure Controller Setpoint

mTorr mV Setpoint

mTorr mV Setpoint mTorr mV Setpoint mTorr mV Setpoint 100 62 51

230 109 148 360 156 244 490 204 340

110 65 59

240 113 155 370 160 251 500 207 347 120 69 66

250 116 162 380 164 259 510 211 355

130 73 74

260 120 170 390 167 266 520 215 362 140 76 81

270 123 177 400 171 273 530 218 370

150 80 88

280 127 185 410 174 281 540 222 377 160 83 96

290 131 192 420 178 288 550 225 384

170 87 103

300 134 199 430 182 296 560 229 392 180 91 111

310 138 207 440 185 303 570 233 399

190 94 118

320 142 214 450 189 310 580 236 407 200 98 125

330 145 222 460 193 318 590 240 414

210 102 133

340 149 229 470 196 325 600 244 421 220 105 140

350 153 236 480 200 333

The values for Setpoint are only approximate. Adjust the setpoint as necessary to obtain the mV value for the desired pressure. For values not included in the table, the following formulas can be used: Setpoint = 0.7396 * mTorr – 22.4852 mV = 0.3641 * mTorr + 25.1894


8.4 Auto-Sequencer Output Assignments 8.4.1 Table 4, Nitride Auto-Sequencer Output Assignments shows the assignments of the output

connections for the auto-sequencer.

Table 4, Nitride Auto-Sequencer Output Assignments

Output Description Output Description 1 N2 (0.020 orifice) 9 Temperature Control Bit1 2 NH3 Upstream Valve 10 Temperature Control Bit2 3 NH3 Downstream Valve 11 Temperature Control Bit3 4 DCS Upstream Valve 12 Temperature Control Bit4 5 DCS Downstream Valve 13 Throttle Control Full Open 6 DCS Bypass Valve (capped) 14 Vacuum Soft Start 7 N2 (0.040 orifice) 15 Slow Pump Valve 8 Not used 16 Hard Pump Valve

8.5 Temperature Controller Recipes 8.5.1 Table 5, Nitride Temperature Controller Setup shows the setup of the temperature controller.

Table 5, Nitride Temperature Controller Setup

Recipe Setpoint Auto-Sequencer Outputs

9 10 11 12 0 variable* 1 400 9 2 500 10 3 600 9 10 4 700 11 5 780 9 11 6 800 10 11 7 805 9 10 11 8 810 12 9 815 9 12

10 820 10 12 11 825 9 10 12 12 n/a 11 12 13 n/a 9 11 12 14 n/a 10 11 12 15 n/a 9 10 11 12

*Maximum Allowed Temperature: 825°C Ramp Rate (Slope) for all recipes and zones: 10.00


8.6 Auto-Sequencer Programs 8.6.1 Table 6, Nitride Auto-Sequence Controller Setup shows the defined program steps.

Table 6, Nitride Auto-Sequence Controller Setup

Program Step Instruction Program

Start Alarm Enable

Change Enable

Branch Step

Temp (°C) Time1

Output LED’s # Function # Description 1 2 3 4 5 6 7 9 10 11 12 13 15 16

0 0 Push Load/Close Door 6 HOLD AT END YES 500 10 1 7 10 0 1 Slow Pump/Ramp Up 4 HOLD WITH OUTPUTS 825 5.0 9 10 12 13 15 0 2 Hard Pump/Ramp Up 6 HOLD AT END 825 10.0 9 10 12 13 16 0 3 Leak Check 6 HOLD AT END 825 1.0 9 10 12 0 4 Ramp and Stabilize 4 HOLD WITH OUTPUTS 825 25.0 9 10 12 13 16 0 5 NH3 Presoak 4 HOLD WITH OUTPUTS 825 3.0 2 3 9 10 12 16 0 6 Start Loop 1 SET LOOP Counter YES *** 0 7 Deposition 4 HOLD WITH OUTPUTS 825 1.0 2 3 4 5 9 10 12 16 0 8 End Loop 2 LOOP BACK 7 0.0 0 9 Purge and Vent 7 BRANCH AT END 56 0.0 1 10 Push Load/Close Door 6 HOLD AT END YES 500 10 1 7 10 1 11 Slow Pump/Ramp Up 4 HOLD WITH OUTPUTS 780 5.0 9 11 13 15 1 12 Hard Pump/Ramp Up 6 HOLD AT END 780 10.0 9 11 13 16 1 13 Leak Check 6 HOLD AT END 780 1.0 9 11 1 14 Ramp and Stabilize 4 HOLD WITH OUTPUTS 780 20.0 9 11 13 16 1 15 NH3 Presoak 4 HOLD WITH OUTPUTS 780 3.0 2 3 9 11 16 1 16 Start Loop 1 SET LOOP Counter YES *** 1 17 Deposition 4 HOLD WITH OUTPUTS 780 1.0 2 3 4 5 9 11 16 1 18 End Loop 2 LOOP BACK 17 0.0 1 19 Purge and Vent 7 BRANCH AT END 56 0.0 2 20 none 0 No operation YES 0.0 2 21 none 0 No operation 0.0 2 22 none 0 No operation 0.0 2 23 none 0 No operation 0.0 2 24 none 0 No operation 0.0 2 25 none 0 No operation 0.0 2 26 none 0 No operation 0.0 2 27 none 0 No operation 0.0 2 28 none 0 No operation 0.0 2 29 none 0 No operation 0.0 3 30 none 0 No operation YES 0.0 3 31 none 0 No operation 0.0 3 32 none 0 No operation 0.0 3 33 none 0 No operation 0.0 3 34 none 0 No operation 0.0 3 35 none 0 No operation 0.0 3 36 none 0 No operation 0.0 3 37 none 0 No operation 0.0 3 38 none 0 No operation 0.0 3 39 none 0 No operation 0.0


Table 6, Nitride Auto-Sequence Controller Setup

Program Step Instruction Program

Start Alarm Enable

Change Enable

Branch Step

Temp (°C) Time1

Output LED’s # Function # Description 1 2 3 4 5 6 7 9 10 11 12 13 15 16

4 40 none 0 No operation YES 0.0 4 41 none 0 No operation 0.0 4 42 none 0 No operation 0.0 4 43 none 0 No operation 0.0 4 44 none 0 No operation 0.0 4 45 none 0 No operation 0.0 4 46 none 0 No operation 0.0 4 47 none 0 No operation 0.0 4 48 none 0 No operation 0.0 4 49 none 0 No operation 0.0 4 50 none 0 No operation 0.0 4 51 none 0 No operation 0.0 4 52 none 0 No operation 0.0 4 53 none 0 No operation 0.0 4 54 none 0 No operation 0.0 4 55 none 0 No operation 0.0 4 56 Post Dep NH3 Purge 4 HOLD WITH OUTPUTS 500 3.0 2 3 10 13 16 4 57 NH3 Evacuation 4 HOLD WITH OUTPUTS 500 3.0 10 13 16 4 58 N2 Post Purge 4 HOLD WITH OUTPUTS 500 5.0 1 10 13 16 4 59 N2 Evacuation 4 HOLD WITH OUTPUTS 500 5.0 10 13 16 4 60 Vent 7 BRANCH AT END 69 500 5.0 1 7 10 5 61 Slow Pump/Ramp Up 4 HOLD WITH OUTPUTS YES 500 2.0 10 13 15 5 62 Hard Pump/Ramp Up 6 HOLD AT END 500 0.1 10 13 16 6 63 Vent 7 BRANCH AT END YES 69 500 5.0 1 7 10 6 64 Power out Program 0 6 HOLD AT END YES 500 10 10 13 16 6 65 Power out Program 1 6 HOLD AT END YES 500 10 10 13 16 6 66 Power out Program 2 6 HOLD AT END YES 500 10 10 13 16 6 67 Power out Program 3-9 6 HOLD AT END YES 500 10 10 13 16 6 68 Abort 6 HOLD AT END YES 500 10 10 6 69 Idle Step 6 HOLD AT END 500 10

10

*** This value is adjusted as necessary between 000 – 999. 1Time values with a decimal are in minutes; values without a decimal are in seconds.


9 Revision History

Rev Date Orginator Description of Changes 7 12 May 2011 T. Olsen Update gas flow setting, leak check, and deposition

pressure check instructions (sections 6.6, 7.3, and 7.5) to reflect the replacement of portable multi-meters with a permanently mounted voltage display, including Figure 1, Figure 5, and Table 2.

6 23 Mar 2011 T. Olsen Replace references to log sheets with Enable/Disable in Coral and required data entry. Clarify use and availability of monitor wafers. Update Figure 3, Nitride Boat Loading Diagrams to match the new nitride boat style.

5 20 Jul 2010 T. Olsen Change length of push rod mark from 30” to 26”. Update Table 2, Nitride Programs to include gas flows (move table to Table 1). Update Loading Diagram and instructions include dummy wafers and wafer spacing. Updated Table 1, Nitride Programs and Table 6, Nitride Auto-Sequence Controller Setup to remove unused programs. Add instructions to store boat in furnace when not in use.

4 26 Mar 2010 T. Olsen Clarified some autosequence terminology. Added Pre- Post-Dep times to Table 3. Added “polished side” to boat loading diagram.

3 08 Feb 2010 T. Olsen Updated procedures to change from Manual operation of controller to Auto mode with pre-defined programs.

2 28 Sep 2009 T. Olsen Updated some cross-references for temperature setpoint entry and added an approximate deposition rate for standard process.

1 31 Aug 2009 T. Olsen Conversion of original document to Word. Updated most procedures for better usability and process control.