why inhouse pcb prototyping? - fhi, federatie van ... · pcb prototyping by milling: sample board...

Why Inhouse PCB Prototyping?PCB Prototyping by milling or lasering

Content

1. Inhouse PCB Prototyping

2. PCB Prototyping by mechanical process

3. PCB Prototyping by laser process

Summary

4. Through-hole plating

5. Multilayer

6. Post processes and SMT

2© LPKF Laser & Electronics AG




Summary


5. Multilayer


Content


How could a typical workday for a passionate electronic engineer look like?


1. Typical Day for a passionate Electronic Engineer


1. Advantages of Inhouse Prototyping

• Flexibility• It’s your decision when you need a Prototype PCB!

• Independence• Never again waiting time for the Board House!

• Creativity• Be the master of your own ideas!

• Confidentiality• No need to share confidential data!

• Close to reality• Same materials as in mass production

• Environmental friendly• Chemical free process!


Preparing data

Milling/lasering layout

Through-hole plating

Solder mask

Printing solder

paste

Components

assembly

Reflow soldering

Drilling holes

1. Workflow Inhouse PCB Prototyping

Double-

sided PCB

(Gerber,…)





Summary


5. Multilayer


Content


2. PCB prototyping by milling

• Milling layout, drilling and cut out on same system

• Line/space: 100µm/100µm(FR4, Cu 18µm)

• Materials: FR4, RF materials


2. PCB prototyping by milling

Copper

FR4


2. PCB prototyping by milling: Sample Board

Process by ProtoMat S104 Processing Time

Drilling 304 holes 13:40

Structuring top 50:07

Structuring bottom 33:25

Cutting approx. 3min

- Typical double-sided PCB design

- Convenient size: 80 mm x 100 mm x 1 mm

- Contains 304 holes of different sizes, from vias, through-hole connectors to large assembly holes

- Contains SMT components including 0,5 mm pitch QFP





Summary


5. Multilayer


Content


3. PCB prototyping by lasering

• Lasering layout, drilling and cut out on same system

• Line/space: 50µm/20µm (FR4, Cu 18µm)

• Materials: FR4, RF material - PTFE or ceramic filled (Rogers, Taconic,...), flexible materials, ceramics, LTCC, Si, glass,...


3. How the structuring process works on laminated material

First process step: Contour• The copper surface is cut by the laser beam following the conductive

tracks in the layout

Second process step: Hatch• In the areas where the copper must be removed the laser beam cuts the

surface in 160µm thick copper stripes

Third process step: Head• The copper strips are heated up by the defocused laser beam. The

adhesion between substrate and copper decreases and the air knife removes the loosen copper stripes. The vacuum cleaner absorbs them from the substrate

© LPKF Laser & Electronics AG 14

for laminated materials like FR4, Rogers materials,…

3. How the structuring process works on laminated material


3. Structuring and Cutting of Laminated RIGID Materials

Structuring FR4 with CU surface 5 µ - 35 µm

Structuring RO3003 with electroplated CU 20µm


3. Structuring and Cutting of Laminated Flex Materials

Structuring and cutting double sided Pyralux® TK with CU surface 18 µm

Structuring and cutting single sided FR4 with CU surface 18 µm

e.g. for multilayer production


3. PCB prototyping by lasering: Sample Board

Process by ProtoLaser S4 Processing Time

Drilling 304 holes 07:05

Structuring top 11:20

Structuring bottom 12:04

Cutting 5:02

- Typical double-sided PCB design

- Convenient size: 80 mm x 100 mm x 1 mm

- Contains 304 holes of different sizes, from vias, through-hole connectors to large assembly holes

- Contains SMT components including 0,5 mm pitch QFP


3. How the structuring process works on non laminated material

On non laminated material, e.g. thin film metallization on AL²O³, a direct vaporization process could be necessary. The specialized algorithm “x/y parallel” is optimized for the direct vaporization process and is integrated in CircuitPro PL.

X parallel Y parallelContour


3. How the structuring process works on non laminated material


3. Structuring and Cutting of LTCC Materials

Structuring, drilling and cutting of LTCC


3. Structuring and Cutting of Fired Ceramic Materials

Structuring and cutting of fired ceramics e.g. Al2O3 with different metal surfaces

Line/Space 30 µm / 20 µm

© LPKF Laser & Electronics AG

23

3. Structuring and cutting: copper on pure PTFE

• CuFlon: pure PTFE with double-sidedcopper





Summary


5. Multilayer


Content



26

by galvanic copper platingby conductive paste





Summary


5. Multilayer


Content


5. Multilayer Prototyping

28

Multilayer up to 8 layer





Summary


5. Multilayer


Content



• Solder resist

• Solder paste printing

• Semi-automatic pick-and-place

• Reflow oven





Summary


5. Multilayer


Content


Summary Inhouse PCB Prototyping

• Flexibility• It’s your decision when you need a Prototype PCB!

• Independence• Never again waiting time for the Board House!

• Creativity• Be the master of your own ideas!

• Confidentiality• No need to share confidential data!

• Close to reality• Same materials as in mass production

• Environmental friendly• Chemical free process!


Disclaimer

This presentation is intended exclusively for the purpose of providing information to the respective recipient.

Use for personal purposes, publication, duplication and/or forwarding the presentation and its contents is permissible only with the written consent from LPKF Laser & Electronics AG (”LPKF“).

The presentation was composed according to the best knowledge available at the time it was prepared and with the greatest possible care. LPKF is not liable for the completeness, correctness, function or fitness for purpose of the content presented, except in the event of willful intent or gross negligence. The content of the presentation shall become neither a component of a contract nor does it represent warranted properties.

All content is subject to copyright law. Logos, designs and names used may be registered trade marks of LPKF or third parties. Technologies or products can contain or relate to the intellectual property of LPKF or third parties.


Thank you for your attention!

Stephan Krause Sales Director DevelopmentQuipment

LPKF Laser & Electronics AG Osteriede 7 30827 Garbsen Germany

Tel.: +49 (5131) 7095-1580 Mobil: +49 (172) 5150024 Fax: +49 (5131) 7095-90 E-Mail: [email protected]


mailto:[email protected]

why inhouse pcb prototyping? - fhi, federatie van ... · pcb prototyping by milling: sample board...

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