manual protomat h100

Manual ProtoMat H100 English, version 1.1

LPKF Laser & Electronics AGOsteriede 7D-30827 Garbsen

Telephone : ++ 49 - 51 31 - 70 95 - 0 Telefax : ++ 49 - 51 31 - 70 95 - 90eMail : [email protected] : http: //www.lpkf.de

2 Version 1.0 Rev.: 15.1.04 ProtoMat H100

Copyright (C) 2004 LPKF AGNo part of this document may be reproduced or transmitted or used for any purpose without the express written permission of LPKF. The information contained in this document is subject to change without prior notification. LPKF assumes no liability for the use of this document. In particular for damage resulting from information, which is present, not present or erroneous. Trademarks: HP-GL is a trademark of the Hewlett-Packard Corp.All other trademarks are the property of the specific proprietor.

Item number:

ProtoMat H100 Version1.0 Rev.: 15.1.04 3

Notes on this ManualThe information contained in this document is subject to change without previous notice. No part of this document may be reproduced or transmitted for any purposes in any form without express written permission of LPKF AG. All efforts were made to ensure that this document is as accurate as possible and that the information contained therein is complete. Nevertheless, LPKF AG cannot assume any liability for its use or for any violations of patent or other rights held by third parties resulting there from.

The operator of the machine is responsible for ensuring that the following points are observed. Ensure that

• the machine is used only for its intended purpose.

• the machine is operated only in a perfect functional condition and particularly that the safety equipment is checked regularly for proper function.

• required personal protective equipment for the operating, maintenance and repair personnel is available and used.

• the operating instructions are always kept at the location where the machine is operated and are in a legible and complete condition.

• only sufficiently qualified and authorized personnel operate, service and repair the machine.

• this personnel is trained regularly on all questions regarding labor safety and environmental protection as well as is familiar with the operating instructions and particularly the safety precautions contained therein.

• all safety and warning information attached to the machine is not removed and remains legible.


I. OutlineThis Manual is subdivided into the following chapters:

1. Introduction 2. Safety precautions 3. Scope of delivery 4. Layout of machine 5. Initial operation 6. Operating procedures 7. Practical tips 8. Appendix

II. Conventions used in this manual

Bold text is used to emphasize important information.

Illustrations are numbered. Example: Fig. 5

› Prompts for actions are identified with an arrow.

Italic sections are used to indicate the reactions consequent on an action.

Word printed in italics mark proper names.

Key inscriptions and menu terms are printed in BOLD CAPITALS.

III. Notes on the symbols used

Danger! This symbol is used to highlight danger to life or health.

Caution! This symbol is used to identify hazards which may cause damage.

Note! This symbol is used for notes intended to help you avoid faults in operation or to help you improve your procedures.

Machine greenhorn:This symbol indicates important tips and information for those not already familiar with LPKF milling technology.


IV. Terminology

Copper laminate : Special extremely thin base material used for pressing multilayers.

Base material : Circuit board material coated with copper foil

Solder resist foil : Special foil with cutouts for solder connections on a circuit board.

BoardMaster : Machine control software.

CircuitCAM : Software for data processing

V. Target GroupThis manual is intended for personnel who already possess basic knowledge of production of circuit boards for the electronic sector.

VI. Intended UseThe machine described in this manual is intended exclusively for milling and drilling standard commercial circuit board materials in the electronic industry. Any other type of use of the machine is expressly prohibited.


Contents

1.0 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . 9

2.0 Intended Use . . . . . . . . . . . . . . . . . . . . . . . . 10

3.0 Safety Notes . . . . . . . . . . . . . . . . . . . . . . . . 11

4.0 Scope of Delivery . . . . . . . . . . . . . . . . . . . . 13

5.0 Layout of Machine . . . . . . . . . . . . . . . . . . . 14

5.1 Initial Setup. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

5.1.1 Installation of the Frame Grabber Card . . . . . . . . 165.1.1.1 Adjusting the Frame Grabber Card after Installation 18

5.2 Orientation Axis / Positions . . . . . . . . . . . . . . . . . .19

5.3 Machine Components and Connections . . . . . . . .20

5.4 Serial Interface(s) . . . . . . . . . . . . . . . . . . . . . . . . . .23

5.5 Functional Units . . . . . . . . . . . . . . . . . . . . . . . . . . .24

5.5.1 The Machining Head . . . . . . . . . . . . . . . . . . . . . . 245.5.1.1 Machining Spindle with Collet . . . . . . . . . . . . . . . . . 26

5.5.2 Working Depth Limiter . . . . . . . . . . . . . . . . . . . . . 26

6.0 Bringing into Service . . . . . . . . . . . . . . . . . 27

6.1 Switching the circuit board plotter off . . . . . . . . . . .28

7.0 Procedures . . . . . . . . . . . . . . . . . . . . . . . . . 29

7.1 Fastening the Base Material. . . . . . . . . . . . . . . . . .29

7.2 Preparing the tools . . . . . . . . . . . . . . . . . . . . . . . . .31

7.2.1 The spacer ring press. . . . . . . . . . . . . . . . . . . . . . 31


7.3 Drilling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32

7.4 Insulation Milling. . . . . . . . . . . . . . . . . . . . . . . . . . .32

7.5 Contour Milling in Circuit Board Material . . . . . . . .33

7.6 Milling Wide Insulation Channels . . . . . . . . . . . . . .34

7.7 Front Panel Engraving . . . . . . . . . . . . . . . . . . . . . .35

7.8 Milling Layout Films . . . . . . . . . . . . . . . . . . . . . . . .35

7.8.1 Correction Agent . . . . . . . . . . . . . . . . . . . . . . . . . 36 7.8.2 Tinting Milled Films . . . . . . . . . . . . . . . . . . . . . . . 37 7.8.3 Desizing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

7.9 Milling Solder Resist Foils . . . . . . . . . . . . . . . . . . .38

7.10 Cleaning Circuit Boards . . . . . . . . . . . . . . . . . . . .39

8.0 Practical Tips . . . . . . . . . . . . . . . . . . . . . . . 40

9.0 Appendix . . . . . . . . . . . . . . . . . . . . . . . . . . 42

9.1 Switching over the device voltage . . . . . . . . . . . . .42

9.2 Maintenance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42

9.2.1 Maintenance instruction for SF-Spindle. . . . . . . . 43

9.3 ProtoMat Commands . . . . . . . . . . . . . . . . . . . . . . .44

9.3.1 Command Structure . . . . . . . . . . . . . . . . . . . . . . 44 9.3.2 Standard HP-GL Commands. . . . . . . . . . . . . . . . 45 9.3.3 Special Commands . . . . . . . . . . . . . . . . . . . . . . . 46 9.3.4 Special Command for High-Frequency Spindle . 48 9.3.5 Direct Commands . . . . . . . . . . . . . . . . . . . . . . . . 48

10.0 Declaration of Conformity. . . . . . . . . . . . 50

11.0 Technical Data . . . . . . . . . . . . . . . . . . . . . 51


12.0 Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

Introduction


1.0 Introduction

The machine described in this manual is a circuit board plotter suitable for producing circuit board prototypes and engraved films. It consists basically of a base plate, an X/Y motion system and a machining head. This machining head can be moved along both axes with the aid of the X/Y motion system. The machining head can also be lowered. This results in two basic processing possibilities. First, a channel can be milled with a milling cutter in a piece of base material fastened to the base plate by moving the lower machining head. Second, a hole can be drilled in the base material by lowering the machining head when it is standing still and a drill installed.

This circuit board plotter offers very high precision in machining and high machining speed. Almost completely automatic processing is possible due to other special functions like fully automatic tool change and the adjustable depth with which the tool penetrates the base material, which can be set via the software. All this helps to minimize the effort required for operation in small series production. Another special feature is the integrated vacuum table which enables the processing of soft and flexible substrates (special PCB materials).

The machine is controlled and operated almost completely by the BoardMaster software. Always read this manual carefully before starting work with the machine. After unpacking, set up your circuit board plotter on a suitable table (see chapter „Initial Setup“ on page 14 for a description) and inspect all of the components described in the following chapters precisely, i.e. familiarize yourself with the mechanical control possibilities. This will make it easier when you then start up the machine in combination with the software with the aid of the quick start instructions or the BoardMaster manual.

In order to ensure that any possible guarantee claims are honored, always follow the instructions in this manual before starting up the machine. Machines exported to other EU countries are subject to the guarantee terms in that country.

Now we hope you enjoy familiarizing yourself with your circuit board plotter.

Intended Use


2.0 Intended UseThe machine described in this manual is exclusively designed and constructed for the machining of commercially approved materials for the production of printed circuit boards or front plates. This comprises especially the following working steps:

Machining of all one-sided and double-sided board types in the usual packing density (FR3,FR4,FR5, G10), flexible substrates, RF substra-tes, drilling test adapters, structuring film patterns, producing solder fra-mes for PCB assembly, SMD fine line technology, contour-milling, engraving of front panels or labels, depth milling of rigid or flexible boards, depaneling and reworking of populated and unpopulated boards, machining of housings and multilayers up to 8 layers in combi-nation with MiniContac III and MultiPress-II.

Any other use is explicitely forbidden! Danger of damage to material or personal injury, and any guarantee claims are excluded!

Safety Notes


3.0 Safety Notes

Danger: To ensure safe work with the circuit board plotter, the user should read this Manual as well as the enclosed documentation and particularly the safety precautions in bold face print!

• Keep your workplace orderly. Disorder at the workplace increases the danger of an accident!

• Take surrounding influences into consideration: Do not subject the electric machine to water or water spray. Do not use the circuit board plotter in moist or wet surroundings. Provide for good illumination. Never use the machine in areas endangered by fire or explosion.

• Keep children away from the working area! Ensure that children cannot touch the machine or connection line!

• Wear suitable work clothing! Do not wear wide clothing or jewelry. This can be caught by moving parts!

• Wear a hair net if you have long hair! Otherwise, your hair can get caught in a rotating tool!

• Care for your machine and the accessories properly and observe the maintenance instructions! Check the plug and cable regularly and if damaged have replaced by an authorized electrician!

• Before any type of maintenance or cleaning work on the machine, disconnect the power plug!

• Always be attentive! Observe your work and proceed rationally. Do not use the machine if you are unconcentrated!

• Always work with the vacuum on! Dusts resulting during operation of the machine may pose a health hazard and must therefore be evacuated!

• Check the machine regularly for damage! Ensure that all parts are installed correctly and that all conditions are fulfilled for proper operation as intended.

• Use only accessories and add-on equipment specified in the operating instructions or recommended or prescribed by the manufacturer! Use of other tools or accessories can cause damage to the machine or pose an injury hazard for the user!

• Have the machine repaired by authorized personnel! The circuit board plotter fulfills all applicable safety regulations. Repair should be performed only by qualified personnel using genuine parts, because improper repairs can pose an injury hazard for the user

• Never reach into the machine while running! • Caution! Machine changes motion speed automatically

during operation! • Change tools only with the machining head spindle stopped!

Injury hazard!

Safety Notes


• When changing tools always insert tool into chuck against stop!

• When performing manipulations on the machine, never operate the controlling PC simultaneously.

• The safety of the machine can no longer be guaranteed if modifications are made to the machine by the user and the guarantee is invalidated!

• Observe that some materials can produce carcinogenic dust or dangerous gases during processing. Obtain information from material suppliers.

• Eating, drinking or smoking while working with the circuit board plotter is prohibited! The danger exists of ingesting toxic substances through the mouth! Never leave food or beverages open in the workroom (dust deposit!).

• When using chemicals, please observe the instructions on the containers or any separate safety data sheets!

• Wear suitable protection gloves during the exchange of honeycomb material of the machine base plate. Danger of cutting due to sharp edges of the metall supports!

Scope of Delivery


4.0 Scope of Delivery

• 1 Machine unit LPKF ProtoMat C60 with integrated electronic circuitry

• 1 Connection cable (Machine - PC)

• 1 Set accessories (adhesive tape, various Allen wrenches, 5 reference hole pins, tweezers, brush, 7 mm socket wrench, 2 red reference hole strips, 2 reference hole drills 2.95 mm, fuse set, distance plate 0,5 mm, distance plate 5 mm)

• 1 Power cable

• 1 Piece base material (fixed on machine base plate)

• 1 pneumatic air supply unit (compl.)

• 1 Manual machine

• 1 Manual software BoardMaster

• 1 Manual software CircuitCam

• 1 FrameGrabber card

• 1 Spacer ring press

• 1 Pre-assembled hood

• 1 Vacuum system with fine mesh filter

• Danger: The fine filter is required particularly for processing materials containing fiber glass such as FR4 base material! Otherwise, the hazard exists of carcinogenic dust particles escaping!!

Layout of Machine


5.0 Layout of Machine

5.1 Initial Setup

› Unpack your circuit board plotter carefully (loosen retaining screws 1), see figure 1 on page 14). Then, loosen the transport retainers. These transport retainers are marked red and are located on:

• Arrest for X axis - 2 aluminum brackets (retainer 2)

• Arrest for Z axis - Allen screw (retainer 3)

Figure 1: Transport retainers

Note: The machine should be positioned on a level and solid surface to prevent malfunctions and erroneous operation!

› Align the circuit board plotter so that the connection cables to the electronic unit are freely movable.

› Remove the protective foil on the machine base plate and then replace the base material as it was previously.

› Then connect the LPKF ProtoMat machine to the computer (COM 1 or COM 2) with the Connection cable (Sub-D to RJ45 Connector). Connect the RJ45 Connector with socket named“RS232/CAN“ and the Sub-D Connector to COM1 or COM2 on the PC.

› Connect the power cable on the LPKF ProtoMat machine to the line power.

› Attach the vacuum hose to the adapter (figure › on page 15) with hose (1) to the compressor and the hose (2) to air-hose connection

1- Machine mount on transport base 2- Retainer for X axis 3- Retainer for Z axis (machining head)4- Vacuum connection5- Vacuum hose connection

1

2 3

1

4

5

Layout of Machine


of the machine(see figure 10 on page 21). By pulling up and turning the compressed air-regulator (3), you must adjust the pressure to 6 bar.

Figure 2: Air regulation unit

› Attach the vacuum hose to the adapter (to fit retaining hose No. 111124 on Nilfisk industrial vacuum) (see position 4 in figure 1 on page 14).

› Attach the loose vacuum hose over the circuit board plotter to the appropriate connection on the machining head (position 5 in figure 1 on page 14).

The following 3 illustrations show the complete construction.

Figure 3: The following 3 illustrations show the complete construction

Note: Please save all transport retainers as well as the packaging for reuse if the machine is transported again.

1 2

3

Layout of Machine


5.1.1 Installation of the Frame Grabber Card

Figure 4: Frame grabber card

Danger: Make sure that the mains connection of the PC that is to be used is separated from the mains. Otherwise danger of an electrical stroke and danger to life!!

› Open the casing of your PC and insert the card in a free suitable slot. If necessary, read the documentation of your PC!

› Mount the additional slot plate (see figure above) and connect the connector to a free 12 V output of the PC power supply unit.

› Put one end of the green cable in the BNC socket of the slot plate. Use the supplied BNC cinch adaptor to put the other end of the green cable in the camera input of the frame grabber card.

› Having bolted everything professionally, close the PC casing.

› After restart of the computer the new hardware will be installed. Carry out all recommended steps. All drivers required for the operation of the card are on the IDS-CD.

› Following the successful installation of the card, please install the IDS software from the CD. To do this, start the setup.exe from the CD.

› Select the setup type "Standard".

1- BNC - connecting cable 3- Frame grabber card2- BNC-Cinch Adapter 4- Slot plate with 9 Sub-D camera

output and 12V connection

1 2 3

4

Layout of Machine


Figure 5: Frame grabber setup

Layout of Machine


5.1.1.1 Adjusting the Frame Grabber Card after Installation

› Start the programm IdsDemo from the IDS group of programs.

› Select function "Initialize" from the FALCON menu.Now a live image should be visible. If not,select another camera channel.

Setting brightness and contrast:

› Open the „Properties“ dialog in the Falcon menu and set the value for „Brightness“ to 150 and the value for „Contrast“ to 300.

Figure 6: Falcon Properties

› Quit the dialog with OK. Installation and setting of the frame grabber card are then completed.

Possible errors:

Error message during the start of BoardMaster when the cable is at the wrong camera output:

Figure 7: Error message

Solution:Put the green cable in the other cinch socket at the frame grabber card.

Layout of Machine


5.2 Orientation Axis / Positions The machining head can move along 2 axes. These axes are called the X and Y axes. Definition of the axes is important for you during operation so that you always know where the machining head is moving. In the BoardMaster software, the motion paths are described exclusively according to these axis designations.

Figure 8: Orientation axis

1- Pause position: The machine is moved to this point to install or turn the material to be processed 2- Home position: This point is located on the reflection axis of the machine (reference hole system) and

serves as a reference position in the BoardMaster program. 3- Reference hole strips with front pilot pin for reference hole system. 4- Reference pin for front reference hole strip.5- Tool change position. The tool can be changed at this position.

X-Axis

Y-Axis

Z-Axis: Lifting/lowering the machining head

1

2

3

4

5

Layout of Machine


5.3 Machine Components and Connections

Description of the front side view:

Figure 9: Front view LPKF ProtoMat

1- Vacuum hose 8- Online-LED2- Machining spindle 9- USB-Connection socket3- Pneumatic lift Z-Axis 10- RS232/CAN - Connection socket 4- Front reference hole strip 11- CAN Connection socket5- Operating indicator 12- Vacuum connection (left and right)6- Status indicator X-Axis 13- Head supply hose7- Status indicator Y-Axis

1

2

3

4

5 6 8 97 1011

12

13

Layout of Machine


Description of the side view left:

Figure 10: Side view left

Description of right side view:

Figure 11: Side view right

1- Vacuum connection 2- Vacuum connection3- Camera4- Head supply hose 5- Drive motor Y-axis

1

2

34

5

1- Adjustment valve: Head lowering speed 2- Adjustment valve: Head lifting speed3- Camera

1

23

Layout of Machine


Figure 12: Tool magazine

In the following figure you see how tools are to be inserted in the collet. For the order and the exact position of the tools please refer to the corresponding recommendation in the BoardMaster manual:

Figure 13: Tools in tool magazine

1- Tool position 30 4- Tool changing2- Tool magazine 5- Depth sensor3- Tool position 1

1 2 3

4

5

Layout of Machine


5.4 Serial Interface(s)

The SERIAL1 is connected to a serial interface of the computer by means of the supplied null modem cable.

Wiring of the connecting cable is as follows:

The cable screening protection is connected only on the side of the PC (socket).

The following parameters must be observed:

Note: the serial interface at the PC is configured under Windows in the system control.

Baud rate: 57500 Parity: NoneData bit: 8Stop bit: 1Protocol:(Windows 98):Flow control (Windows XP):

Hardware

FIFO-buffer: on (max. speed)

Layout of Machine


5.5 Functional Units

5.5.1 The Machining Head

The machining head has several tasks. It provides the guidance and mounting for

• the spindle

• the stepping motor for the automatic milling depth adjustment

• the active gripper for tool change

• the selector valves for pneumatic compressed-air control

• the camera for fiducial recognition

Moreover, the working depth limiter is located at the bottom of the machining head. It limits to which depth the drilling or milling tool penetrates the base material.

Figure 14: Machining head front view

1- Shock absorber 8- Active gripper (for tool change)

2- Selector valves for pneumatic controls 9- Aperture setting of the camera9a- Focus setting of the camera

3- Valve to set speed (lift head) 10- Compressed-air connection for active gripper

4- Valve to set speed (lower head) 11- Camera for fiducial recognition 5- Mounting plate for exhaust hose and

cable hose 12- Machining spindle

6- Holding block for active gripper and camera

13- Connecting socket for camera

7- Working depth limiter

1

2

3

4

5

6

7

8

9

10

11

12

13

9a

Layout of Machine


Figure 15: Machining head rear view

Figure 16: Machining head top view

1- Connection socket for machining spindle

3- Stepping motor for automatic setting of machining depth

2- Clamping ring for fixing the height of the machining spindle (Do not misad-just!!)

4- Limit switch for setting of machining depth

5- Compressed air supply for selector valves

1

2

3

4

5

1- Electrical feeding for camera 7- Selector valve (lifting machi-ning head)

2- Camera for fiducial recognition 8- Selctor valve (air cushion of working depth limiter)

3- Active gripper for tool change 9- Selector valve (collet) 4- Machining spindle 10- Exhaust hose 5- Stepping motor for automatic setting of milling depth 11- Protective hose for electrical

wiring6- Electrical feeding for stepping motor

1

2

34

5

6

7

8

910

11

Layout of Machine


5.5.1.1 Machining Spindle with Collet

The machining spindle drives the machining tools, while the collet is responsible for their firm and precise location. The collet is firmly mounted on the machining spindle and from the outside only the tool opening can be seen (see figure 17 on page 26).

With this circuit board plotter the collet of the machining spindle is actua-ted using a selector valve located at the machining head.

5.5.2 Working Depth Limiter

Danger! During work, keep your fingers away from the travel area of the machine!

During the milling of isolation channels in the often slightly bent PCB materials it is of special importance that the milling depth is kept constant. The LPKF ProtoMat H100 achieves this by means of a pneumatic working depth limiter. This has the following positive effects:

• The working depth limiter is of the non-contacting type, as the compressed air escapes at the bottom so that the working depth limiter floats on an air-cushion. Thus sensitive surfaces are treated with care.

Figure 17: Working depth limiter

The milling depth is set automatically via a stepping motor. This stepping motor is triggered via the BoardMaster software (see BoardMaster manual).

1- Exhaust connection2- Compressed-air connection

1

2

Bringing into Service


6.0 Bringing into Service

This chapter describes the switching-on procedure of your circuit board plotter. Some operating steps are explained with the help of the BoardMaster software. Therefore it is necessary that you install this software first on the PC with which the circuit board plotter is to be controlled. Before you continue here, connect the circuit board plotter to the corresponding PC (see „Initial Setup“ on page 14) and install the BoardMaster software on the corresponding PC (see BoardMaster manual)!

Observe the specified temperature range for operation of 15-25°C (59-77°F)!

Before switching-on, remove all objects from the machine and its travel area. Reference pins must not protrude from the base material. Reference pins serve for fixation and as reference point of the axis of reflection when base material is turned.

Danger! Never reach into the machine during switching-on!

The following order of switching-on must be kept: 1. PC 2. LPKF ProtoMat 3. Start of the BoardMaster program

› First switch on the PC.

› Switch on the circuit board plotter at the main switch.

› Start the BoardMaster software by clicking on the corresponding Icon on your desktop.

After the start of BoardMaster the machine moves to the limit switches +z, -x and -y. Then the machine remains in the tool change position.

Note: If the machine does not move after BoardMaster has been started and the machine has been switched on, then check the following:

• Do the light diodes light up as in the representation above? • Are all cables correctly connected? • If necessary, check the fuses at the mains connection.

› The machine is then ready for operation.

Note: If for some reason it should be necessary to switch the machine off and on again, then you must change to the menu CONFIGURATION/PARAMETER in BoardMaster. By clicking on OK all required parameters like speed values, waiting times, positions, and so on, are again transfered to the circuit board plotter.

Other possibilities of operation are described in detail in the BoardMaster manual. But first read this manual completely before you continue working with the BoardMaster manual in order to

Bringing into Service


learn all about the circuit board plotter and the accessories (tools and so on)!

6.1 Switching the circuit board plotter off

When switching off the circuit board plotter, keep to the following order:

1. Close the BoardMaster software 2. Switch off the circuit board plotter 3. Switch off the PC

Procedures


7.0 Procedures

This chapter explains all common operating procedures with the circuit board plotter as well as the tools and their application possibilities. Special applications are also explained, which are not necessarily important immediately for “beginners” and therefore may be confusing at the beginning. As “beginners”, you should, however, always work your way through the following subchapters:

• Fastening the base material

• Drilling

• Insulation milling

• Contour milling in circuit board material

• Cleaning the circuit board

The remaining subchapters in this chapter can be read later if required when you are familiar with the circuit board plotter.

7.1 Fastening the Base Material

When the machine is started up for the first time, you will note that a double-sided piece of base material is already present on the machine base plate. Moreover, a reference hole system is preset at the factory for DIN-A4 format. This can also be used for production of your other circuit boards. If you have to process different sizes of base material, it will be necessary for you to first create a new reference hole system. This procedure is described in detail in the BoardMaster Manual.

The primary preparations are explained in keywords here. If you are working with a LPKF circuit board plotter for the first time, perform this work only when working through the BoardMaster manual. You will be referred to it at the corresponding point in the manual!

› Drill coincidental reference holes in the base material and drilling plate in the X direction (diameter 3 mm). This can also be accomplished with any desired drill press. Note that the diameter is reduced by galvanic throughplating.

› Move the machining head to the PAUSE position. Insert reference hole pins into the front and rear reference hole strips. Always ensure that the front reference hole strip is pushed against the front reference pin in the machine groove!

› Position the base material on the reference hole pins.

Procedures


Figure 18: Fixing the board

The reference hole pins hold the circuit board in position. This is particularly necessary during contour milling. On the other hand, they are also used as a reference when turning double-sided circuit boards.

Danger! Switch on the vacuum before milling/drilling! Remember to replace the vacuum filter as required! Inhaling the material dust poses a health hazard!

Note: It is important that no contamination (adhesive tape residues, drilling or milling chips) is present between the individual layers so that the base material lays perfectly flat. Small particles below the base material would have a negative effect on the uniformity of the milling depths.

7.2 Preparing the tools

7.2.1 The spacer ring press

All tools must be fitted with spacer rings to ensure the precise pick up and set down of tools.

The spacer ring press used to force the spacer rings onto the tools com-prises the following parts:

1- Machine bed (aluminum base plate)2- Reference hole pins, 3 mm diameter 3- Base material approx. 1.6 mm thick

Procedures


Figure 19: Spacer ring press

Note: Before performing the procedure described below you must connect the spacer ring press to a compressed-air supply of at least 6 bar pressure.

The spacer rings are fed into the spacer ring press magazine (1) and the tool (4) is pushed into the pressing tool with the cutting edge towards the spacer ring (5). The cover cap (3) must now be closed to the stop so that pressing can take place. The prepared tool may now be removed.

Caution! The working depth of the tool concerned will be too deep if the tool has not been pressed into the ring as far as the stop.Inserting the tools in the tool magazine is described in detail in the BoardMaster manual. Please work this manual through to the end before continuing with the BoardMaster documentation!!

1- Magazine for spacer rings2- 6 bar compressed air connection3- Cover cap with pneumatic switch4- Pressing tool with drill inserted5- Spacer ring ready for pressing

1 2 3

45

Procedures


7.3 Drilling

In addition to milling, drilling is one of the primary purposes of the circuit board plotter. Circuit boards are drilled with special circuit board drills.

It is only possible to drill one circuit board at a time. Never attempt to drill a number of circuit boards on top of one another! A drilling cover plate is not required. All drills have a length of 38 mm. Further instructions are contained in the Chapter „Practical Tips“ on page 40.

Caution! Before drilling, ensure that the base material is seated tightly! Switch on the vacuum!

7.4 Insulation Milling

Insulation milling is the designation for cutting milled tracks around the later conductors. This insulates the conductors from the remaining copper coating. Various types of tools are available for the different materials and applications (see figure 11 on page 21). Each of these tools produces different milling tracks (see figure 21 on page 33).

Figure 20: LPKF Unversal cutter, micro cutter and RF cutter

Before milling, it is necessary to ensure that only sharp LPKF universal milling cutters (36 mm long) are used. The milling width can be adjusted between 0.2 and 0.5 mm according to the thickness of the tool by changing the milling depth.

Note: It is advisable to degrease the base material with a cleaning spray before processing (degreaser for electronic components). This allows the drilling chips to be vacuumed up more easily.

In principle, the milling width should not be smaller than 0.2 mm. If work is accomplished only with the front-most tip of the milling cutter, the tool wears more quickly than at greater milling depths.

1- Universal milling cutter2- Micro milling cutter3- RF milling cutter

1

2

3

Procedures


Finer insulation channels can be produced with the LPKF micro milling cutters, however, the service life of these cutters is approx. 10% of that of the LPKF universal milling cutters mentioned above.

Caution! Do not mix up micro milling cutters and universal milling cutters! The two can only be differentiated under a microscope.

A special cutter which produces a rectangular insulation channel in one cut has been developed specially for RF technology.

Figure 21: Milling track by LPKF Universal cutter, Micro cutter and RF cutter

Further information is given in the Chapter „Practical Tips“ on page 40.

After processing, it is necessary to clean the circuit boards. This can be accomplished with a brush machine or manually with board cleaners (LPKF accessory). In all cases, it is necessary to rinse the circuit boards thoroughly with water to rinse off any copper dust resulting from brushing.

After rinsing, it is necessary to dry the circuit board well (hot air gun) and then protect it against oxidation with soldering varnish.

Caution! Before milling, ensure that the base material is seated tightly! Switch on the vacuum!

7.5 Contour Milling in Circuit Board Material

The contour milling cutters should always be used for cutting out the circuit board after it is completely machined or for drilling holes with a diameter greater than 2.4 mm when the circuit board is to be cut through in the entire material thickness.

Figure 22: Contour cutter (1) end mill (2)

1- Milling track, universal milling cutter

2-Milling track micro milling

cutter

3-Milling track RF milling cutter

1 2 3

1- Contour cutter2-End mill

1

2

Procedures


The motion rate should be reduced for contour milling. The speed varies from material to material. Use only special contour cutters (38 mm long) with a diameter of 1 or 2 mm if possible.

The 1 mm contour cutter should be used for internal cutouts (small inner radius). Due to the lower stability, the feed rate should be reduced to a minimum.

The 2 mm milling cutters are considerably more sturdy, however, remove less material than the 3 mm contour cutters.

With a 3 mm contour cutter, a great deal of material is removed during contour milling. However, the machining spindle can be overloaded if the motion rate is set too high!

So-called “End mill” cutters are used for contour milling on soft RF base materials instead of contour cutters.

Caution! All speeds and feed rates specified in BoardMaster refer to FR4 material. Other materials (in the form of libraries) can be selected in the menu CONFIGURATION/TOOL LIBRARY / MILL/DRILL ... /LOAD. Lower feed rates should be used initially for all other materials.

Danger! Remember that carcinogenic dust (from fiber glass) can occur when machining material such as FR4. Therefore, always work with vacuum switched on. Always use microfilter.

Danger! Vitally hazard gases can occur when machining some materials !

7.6 Milling Wide Insulation Channels

Figure 23: End mill

Wide insulation channels can be cut with a 36 mm long two-tip cutter (End mill). Various diameters are available.

The 3 mm two-top cutter is particularly suited for milling very wide insulation channels (VDE specifications).

7.7 Front Panel Engraving

It is possible to engrave the front panel (e.g. on electronic housings) with the circuit board plotter. Symbols and labels can be created in this manner.

Procedures


Figure 24: End mill and universal-cutter

When engraving it is necessary to adapt the feed rate to the engraving depth and material.

Use LPKF universal milling cutters or LPKF two-tip cutters.

Danger! When engraving always work with vacuum! Danger of unhealthy dust!

It is possible to cut through aluminum front panels with a material thickness of up to 3 mm.

7.8 Milling Layout Films

Another application possibility for the circuit board plotter is the production of layout files, which are required for exposure of circuit boards before etching. In this process a piece of plastic foil coated with lacquer is used as the base material. The upper coat of lacquer on this foil is removed by milling until only the conductor pattern for production of the circuit boards to be produced later remains. The RF cutter can be used for this machinging process.

If you are reading this manual for the first time and are a beginner in the field of circuit board milling, skip this section for the time being. It is sufficient for you to read this in detail later if you are confronted with this application.

Figure 25: RFcutter

Note: The instructions below on creating layout film assume that you are already familiar with operation of the circuit board plotter and also familiar with operation of the BoardMaster software. Instructions for creating layout films (!only after familiarization with BoardMaster!):

› Fasten film base (Plexiglas or glass pane) on the machine table with tape.

› Place film material on base with coated side (dull side) down.

1- Two-tip cutter 2-Universal cutter

1

2

Procedures


› Then rub film material firmly and flat on the film base until no more air is in between.

› Then fasten the film air tight with transparent tape on all 4 sides (tape should not be stretchable). Ensure that no air bubbles are present between the film and base.

The milling depth can then be adjusted at the edge of the film. You can check the depth by milling a frame around the film surface (manual motion).

› The motion rate should be reduced to approx. 15 mm/sec.

Note: The 0.25 mm RF cutter is used for milling layout films.

› Switch on vacuum and reduce vacuum to one half with electronic control. If an electronic control is not present, the vacuum can be reduced to one half by allowing air to be sucked in at the vacuum fitting.

The film milling program can now be started.

Film material is available in DIN A3 and DIN A4 format. (Special sizes on request).

Notes: The film coating is sensitive to scratching and it is water soluble. Therefore, do not allow film to come into contact with water. If desired, the film can be recopied with a tinter. See also additional recommendations in the Chapter „Practical Tips“ on page 40.

7.8.1 Correction Agent

Engraving foils can be repaired with the correction agent “Duroscal“ red correction layer. It is very easy to use. Brush on to faulty points, allow to dry for approx. 5 min and then continue processing the engraving foil as usual.

The corrected points can only be desized with rapid desizer.

Caution! Observe safety precautions on correction agent container!

Procedures


7.8.2 Tinting Milled Films

Black “Duroscal“ tinter is available for milled negative foils for creating positives. The completely milled engraved foil can be tinted with “Duroscal“ tinter by pouring the liquid onto a SAFIR tampon and distributing it uniformly over the entire foil. Wash off excess tinter with cellulose. Hold tinted foil up to light to check in order to find any weakly covered points and retint them. Then desize immediately. The tinter should not be allowed to dry.

Caution! Observe safety precautions on tinter container! Do not allow tinter to get on the back of the film, because it cannot be removed! It is also very difficult to remove the tinter from other surfaces (textiles, skin) (wear apron and rubber gloves)!

7.8.3 Desizing

Caution! Observe safety precautions on quick desizer container!

When desizing, process only one film per container, so that the rear of the second film is not damaged if the surface is still moist with tinter.

There are two possibilities for desizing:

Quick desizing. Pour quick desizer onto foil and wipe off the dissolved protective layer immediately with cellulose under slight pressure. Then dry foil with cellulose, blotting paper or rag.

Water desizing.

Place foil in a tray with luke-warm water (containing small quantity of dishwashing detergent). The protective layer dissolves after approx. 30 minutes. Remove any remaining coating residues with a fine hand brush. This method is more economical and environmentally sound! The film can remain in the water bath for any desired length of time.

7.9 Milling Solder Resist FoilsSo-called solder resist foils such as are frequently used in circuit board production, can be completed with the circuit board plotter. The following description assumes complete knowledge of the operation of the circuit board plotter including the BoardMaster software. This chapter can be skipped by beginners for the time being during initial familiarization and read later as required.

Settings:

Tool: Micro cutterTool diameter: 0.15 mmRotary speed: 40,000 (20,000) rpmFeed rate: 10 (5) mm/s

Values in parenthesis apply for circuit board plotters with DC motor!

Adjust the milling depths in the unused marginal area of the solder resist foil as follows:

Procedures


› Mill a square with dimensions of 2 x 2 mm with the GO TO button in BoardMaster with motor and vacuum switched on to determine the milling depth.

› Measure the current milling depth (width), correct as required and mill another square to check.

› Then start the milling operation with the data prepared with the data edited with CircuitCAM.

› After completion of the milling operation, check whether all pads have been cut out. If not, start the milling operation a second time.

Procedures


7.10 Cleaning Circuit Boards Before installing the equipment, it is necessary to carefully clean the completely milled circuit boards. This can be accomplished with a circuit board brushing machine or by hand.

To clean by hand, place the circuit board on a level surface. Brush the circuit board in the primary direction of the conductors with a wet circuit board cleaner (e.g. LPKF board cleaner PAD). Brushing is required to remove the oxidation layer and also remove chips in the insulation channel. After brushing, the circuit board should be metallically bright. From now on, the circuit board should only be touched at the edges with gloves. Then rinse off the circuit board preferably under hot flowing water to remove any brushing chips from the insulation channels and then dry with a hot air gun.

Caution! Never blow off with compressed air, because the oil particles contained in the compressed air can cause problems during further processing.

After drying, spray the circuit board with solder varnish on both sides.

Practical Tips


8.0 Practical Tips

This chapter contains tips gained from practical experience on various aspects of circuit board production with your circuit board plotter. We recommend reading these tips before operating the circuit board plotter to familiarize yourself with a few possible sources of error and exclude them.

Milling depth: Adjust the milling depth so that engraving is too deep rather than too shallow. If the engraving is too shallow, the milling tool wear more quickly.

Evacuation of the milling and drilling chips with the vacuum attachment is also important for precise milling depth.

Milling depth irregular:

Is the machine bed really clean? Adhesive tape residues or similar can have a high effect on the milling depth. Milling chips between the machine bed, drilling plate and base material can also reduce the accuracy.

Deformed based material:

Bend highly deformed material so that the sag points downward; then fasten the edges well with adhesive tape.

Loops between milling tracks:

Loops between the milling tracks can occur from incorrect milling sequence, particularly with circles. When a circle is milled counterclockwise with a tool which rotates clockwise, overlapping milling tracks can lead to fine loops between the copper sur-faces. The cause is a reduction of the cutting speed at the outer edges. The solution here is to define the correct milling sequence in LPKF CircuitCAM. The LPKF CircuitCAM standard processing already contains the correct milling directions (see LPKF CircuitCAM Manual).

Milling burr: A milling burr can be caused by dull tools or incorrect feed rate. If the structure to be milled allows, this can be corrected by setting deeper. Otherwise, replace tool.

Burr during contour milling:

Burrs during contour milling or unclean cut edges result either from a dull tool or incorrect feed rate.

Color of milled channel:

The color of the milled channel provides information on the condition of the tool with some materials. With epoxy materials, dark insulation tracks indicate that the tool is sharp, light tracks that the tool is dull.

Drill burrs: Drill burrs occur with dull tools: In this case, replace the tool (drill).

Practical Tips


Deviation of drill: Deviation of the drill occurs particularly with thin tools which are no longer fully sharp. However, it also depends on the surface structure of the material. For example, when the fiber glass structure on FR4 materials is pressed through by the copper, deviation of the drill is unavoidable even with a sharp tool. On materials with additional, removable copper foil (FR4 material with 9 µm or 5 µm Cu coating), deviation of the drill is very low. The holes can be center-punched first in an additional step. This also prevents deviation of the drill.

Glazing of hole: The hole tends to become glazed by the base material melting when the drill remains in the hole too long after drilling through. These holes then present problems for through-contacting. If necessary, reduce drilling times.

Drills break: Drills tend to break when the drilling plate has already been used numerous times. The drilling plate should be changed with each new circuit board: If a drill hits against the edge of a hole already present in the base plate, breakage can hardly be avoided. Always remove broken tools from circuit boards and drilling plates.

Uneven milling channels:

Milling channels when milling foil become uneven when air is present below the film. If the film is fastened with stretchable adhesive tape, the film can become wavy after a time. Particularly important here is the evenness of the milling base (LPKF engraving foil base).

Burr with foil milling:

Burrs during foil milling occur either as a result of a dull tool or milling too deeply.

Offsets between top and bottom sides:

Offset between the top and bottom side occurs when the HOME position has not been programmed precisely, the reference hole pins are positioned at an angle or loose.

Appendix


9.0 Appendix

9.1 Switching over the device voltage

This machine does not offer the possibility to manually switch over the device voltage. The device voltage between 100V and 250 V is automatically recogized and correspondingly ajusted. There are no further measures required.

9.2 Maintenance

In order to gurantee a long-term and reliable operation of the circuit board plotter, it es necessary to perform some maintenance work within certain time intervals. This maintenance is limited to actions that are simple and easy to execute and hardly need any time. The maintenance intervals given refer to a plotter that is in use on a daily basis.

Um einen langfristigen und zuverlässigen Betrieb des Fräsbohrplotters zu gewährleisten ist es notwendig, in gewissen Zeitabständen einige Wartungsarbeiten durchzuführen. Diese beschränken sich allerdings auf einfache und schnell auszuführende Tätigkeiten, welche kaum Zeit erfordern. Die angegebenen Wartungsintervalle beziehen sich auf eine tägliche Benutzung des Fräsbohrplotters.

General checks (every 6 months):

Appendix


9.2.1 Maintenance instruction for SF-Spindle

Depending on the use of the machine the collet of the SF-Spindle should be cleaned from time to time at a ProtoMat H100 system.

› Ensure, that the holding force degreases and tools slip out of the collet.

› Demontieren Sie die Fräsbohrspindel von dem Halteblock. Lösen Sie dazu die 2 Schrauben wie in folgender Abbildung gezeigt:

› Dismounting the spindle from the holder. Loosen but do not remove both M4 screws like shown in the following picture.

Figure 26: Machining head

› Unplug the power plug and the air supply connection.

› Pull the spindle out of the holder.

Cleaning the collet:For the cleaning of the collet we recommend a special pipe brush like shown in the following pictures.

Figure 27: Cleaning brush

› After successful cleaning assemble all parts together in reverse order.

Appendix


9.3 ProtoMat Commands

This chapter is not intended for beginners in LPKF machining technology. Commands are described here, for which beginners do not require precise knowledge. This chapter is intended exclusively for specialists for circuit board plotters to help in troubleshooting and eliminating problems.

9.3.1 Command Structure

The SMCU control (Signal Motion Control Unit) for the machine interprets the HP-GL commands described below and converts them to defined reactions.

The resolution of the machine is 0.0079375 mm. It therefore deviates from the resolution of standard HP-GL plotters. When original com-mands are used, output is therefore smaller.

Syntax:

The SMCU expects a separator between the parameters for the com-mands which is not a number or capital letter. A new command can fol-low a parameter without a separator. The last character in the transmitted command file must be a semicolon or line feed symbol (0A Hex).

Unfamiliar commands are ignored by the control. However, their para-meters can lead to undesired “Plot absolute” or “Plot relative” com-mands.

Symbol Meaning{...} Contents can be repeated as frequently as required.() The parameters for the command are located between these

parenthesis.[] The contents of these brackets is optional and can be

eliminated.

Appendix


9.3.2 Standard HP-GL Commands

AA (x,y,a{,}){;} Arc Absolute Draws an arc around the absolute coordinates (x,y) starting from the current position with arc angle a=[degrees]. For negative arc angle a, drawing is accomplished clockwise, otherwise vice versa.

AR (x,y,a{,}){;} Arc Relative Draws an arc around the relative coordinates (x,y) starting from the current position with arc angle a=[degrees]. For negative arc angle a, drawing is accomplished clockwise, otherwise vice versa.

CI (r{,}){;} Circle Draws a full circle around the current position with radius r. The resolution is ignored, because it always draws with maximum resolution. EA (x,y){;} Edge Rectangle Absolute Draws a rectangle defined by two diagonally opposing corner points. The first corner point is determined by the current position, the second by the absolute coordinates (x,y).

ER (x,y){;} Edge Rectangle Relative Draws a rectangle defined by two diagonally opposing corner points. The first corner point is determined by the current position, the second by the relative coordinates (x,y).

IN {;} Initialize Sets control to same status as after switch on. All standard settings are therefore valid.

IW (x0,y0,x1,y1){;} Input Windows Limits the operating range XY axis to a window with the specified corner coordinates.

OH {;} Output Hard Clip Limits The control automatically determines its maximum motion range within the limit switches and sends the coordinates determined in this manner as an ASCII string in the form (“W Xmin,Ymin,Zmin,Xmax,Ymax,Zmax <cr>“) to the PC.

OS {;} Output Status The control sends its status line as ASCII-Hex („S xxxx <cr>“) to the PC.

PA (x1,y1{,...xn,yn}){;} Plot Absolute Draws a line from the current position to the absolute coordinates entered one after another. The commands PU and PD can be specified as parameters between the coordinate pairs. If other coordinate pairs are transmitted, the command word PA can be eliminated. All coordinate pairs without command word are related to the last PA or PR commands sent and executed accordingly.

Appendix


PD {;} Pen Down Lowers the tool.

PR (x1,y1{,...xn,yn}){;} Plot Relative Draws a line from the current position to the relative coordinates entered one after another. The commands PU and PD can be specified as parameters between the coordinate pairs. If other coordinate pairs are transmitted, the command word PA can be eliminated. All coordinate pairs without command word are related to the last PA or PR commands sent and executed accordingly.

PU {;} Pen Up Lifts the tool.

VS (v{,n}){;} Velocity Select Defines the path speed in the XY plane v=[m/s] with lowered tool and assigns this speed to a tool with the number in.

9.3.3 Special Commands

All special commands start with an “!“ mark and the further syntax corresponds to the HP-GL standard commands.

!AS (a){;}Acceleration SetDefines a new acceleration constant a=mm/s².The valid value range is 10...50000.

!CC {;} Close Channel Ends data transmission started with !OC.

!CM (n){;} Change Mode Changes between the working modes Drilling (n=0) and Milling (n=1).

!CT (n){;} Command Counter Changes between Echo mode (n=1) and Non-echo mode (n=0). In the Echo mode, the machine acknowledges each correctly executed command with the message “C<cr>“.

!EM (n){;} External Motor Switches the machining motor ON (n=1) or OFF (n=0)

!ES (n){;}Enable Stop Enable (n=1) and disable (n=0) for external Stop function: After switching on, the external stop function is disabled.

!FP {;} Full Power Switches the motors for the XYZ axis to full power.

Appendix


!HP {;} Half Power Switches the motor for the XYZ axis to half power.

!OC {;} Open Channel Opens direct data transfer from serial data channel SER1 to serial data channel SER2. All characters received on data channel SER1 are transmitted to data channel SER2 until the character string !CC is received

!ON (a){;} Output Nominal Position The control sends the nominal position (set position) for the motor access addressed with the parameter a. The motor axes are assigned the following addresses

• 0 = X,Y,Z axis

• 1 = X axis

• 2 = Y axis

• 3 = Z axis

!RD (a){;} Read Port Reads import port with address a=<0..15>. The data is output via the serial port from which the command came as ASCII numbers.

!RS (r){;} Resolution Set Sets the increment (r=m/step) for the machine in the control. The valid value range is 1...32000.

!TA (x,y,z){;} Plot Three-D Absolute Completes a spatial motion from the current position to the absolute coordinates (x,y,z).

!TD (t1,t2,t3,t4){;} Time for Drilling Sets the new drilling times t=[ms].

!TM (t1,t2,t3,t4){;} Time for Milling Sets the new milling time t=[ms].

!TR (x,y,z){;} Plot Three-D Relative Completes a spatial motion from the current position to the relative coordinates (x,y,z).

!TS (t){;} Time to Stabilize Sets the stabilizing time t=[ms] between the individual commands.

!TW (t){;} Time to Wait The subsequent command is processed only after expiration of the waiting time t=[ms].

!VU (v){;}

Appendix


Velocity if Pen Up Defines the track speed v=[m/s) for motion in the XY plane when the tool is up.

!VZ (v){;} Velocity Z Axis Defines the speed v=[m/s] for motion along the Z axis.

!WR (a,d{,m}){;}Write Port Writes the data word d to the port address a=<0..15>, whereby assignment of a bit mask is possible.

!ZA (z){;} Plot Z Axis Absolute Moves the Z axis from the current position to the absolute coordinate (z).

!ZR (z){;} Plot Z Axis Relative Moves the Z axis from the current position to the relative coordinate (z).

9.3.4 Special Command for High-Frequency Spindle

Before communicating with the high-frequency spindle, it is necessary for the command to open the SERIAL2 port to be set (!OC;), then SERIAL2 port must be closed again (!CC;)

!RM (r){;} Revolutions Motor, r=0...60. Sets the rotary speed (r)*1000 for the high-frequency spindle.

9.3.5 Direct Commands

The direct commands are special commands which are processed immediately after their interpretation bypassing the command buffer.

!CB{;} Clear Buffer Deletes all commands in the command buffer.

!GO{;} Go On Deactivates the Stop command and continues processing of the commands.

!RC{;} Repeat Command Repeats the last command processed.

!ST{;} Stop Interrupts processing of the commands after completion of the current command.

The implemented commands represent a subset of the HP-GL commands. If the machine is to be controlled by a desired CAD system,

Appendix


it is necessary to note for the HP-GL commands that the increments are significantly less than with normal pin plotters.The increment width is 7.9375 m/step. (6,35 mm/800 Steps).

Declaration of Conformity


10.0 Declaration of Conformity

EC Declaration of Conformity

according to EU Machine Guidelines 98/37 EC.

We hereby confirm that the machine

ProtoMat H100

is a machine according to EU Machine Guideline 98/37 EC.Any modification to the designated machine not coordinated with us invalidates this declaration for this machine.

We maintain a quality assurance system certified by Daimler-Chrysler according to ISO 9001 and have therefore observe the following EC Guidelines and EN Standards in development and production of the machine:

EC Guidelines:

• EC Machine Guidelines 98/37 EC

• Low voltage operating equipment 73/23 EEC

• EMC 89/336 EEC

Harmonized Standards:

CE approval symbol was attached to the machine in accordance with Guideline 97/37 EC.

Manufactured by LPKF Laser & Electronics AGOsteriede 7D-30827 GarbsenGermany

Garbsen, 1.9.2003 Bernd Hackmann (CEO)

This Declaration confirms conformance with the specified guidelines, however, is not a guarantee of properties. The safety precautions in the product documentation supplied are to be observed..

• EN 292-1 • EN 292-2• EN 294 • EN 349• EN 547-2 • EN 614-1• EN 626-1 • EN 1050• EN 1873 • EN 4871• EN 11203 • EN 60204-1

Technical Data


11.0 Technical Data

Machine operating voltage: ............200-240V (switchable: 100-120V)Compressed air:.............................6 bar; 100 l/min.Power consumption: ......................300 VASpeed of machining spindle: ..........10.000 - 100.000 rpm. Permissible humidity: .....................max. 60%Operating temperature:..................15-25°C (59-77°F)Weight: ...........................................approx. 50 kgDimensions (WxHxD):....................650 x 430 x 750 mmAirborne noise at workplace:..........71dB (A) without vacuum

Minimum conductor width: .............0.1 mmMinimum conductor interval: ..........0.1 mmMinimum hole diameter:.................0.15 mmMotion range: .................................420 mm x 380 mmRepetition accuracy: ......................+/- 0.001 mmAccuracy of reference hole system:+/- 0.02 mmMachining spindle: .........................3-Phase-Motor 10,000-100,000/min.

(variable)Tool change:...................................AutomaticTool mount: ....................................1/8“ clamping colletDrilling capacity: .............................max. 120 strokes/min.Resolution (minimum motion step):0.001 mmMotion rate: ....................................100 mm /sec.Milling depth adjustment: ...............air cushioned, non-contactX/Y drive: .......................................Incremental motors, precision .......................................................spindleZ drive: ...........................................Pneumatic Applications: All 1 and 2-sided types of circuit

board with usual equipment density (FR3, FR4,FR5, G10), flexiblesubstrates, RF-substrates,millingcut-outs in front-panels, drilling testadapters, structuring film layouts,solder frames for PCB assembly, aswell as SMD fine conductortechnology, contour milling, frontpanel/plate engraving,multilayer upto 8 layers incombination withMiniContac-II and MultiPress-II.

Index


12.0 Index

A

Airborne noise ................................................................................................................51

B

Base material .............................................................................................................5, 29Baudrate ...........................................................................................................................23BoardMaster .................................................................................................................5, 9

C

C40 Commands ............................................................................................................44Caution ................................................................................................................................4CircuitCAM ........................................................................................................................5Cleaning ............................................................................................................................39Command Structure ....................................................................................................44Conventions ......................................................................................................................4Copper laminate .............................................................................................................5

D

Danger .................................................................................................................................4Dimensions ......................................................................................................................51Drilling ................................................................................................................................32

E

Engraving .........................................................................................................................35

F

FIFO ....................................................................................................................................23Framegrabber card .....................................................................................................16

H

High-Frequency Spindle ...........................................................................................48HP-GL Commands ......................................................................................................45

I

Intended Use ....................................................................................................................5

L

Loops ..................................................................................................................................40

M

Machine greenhorn .......................................................................................................4Milling ...............................................................................................................32, 33, 35, 38Milling depth ....................................................................................................................40

Index


N

Note .......................................................................................................................................4

O

Operating temperature ..............................................................................................51

P

Permissible humidity ..................................................................................................51Power consumption ....................................................................................................51

S

Safety Notes ...................................................................................................................11SMCU .................................................................................................................................44Solder resist foil ..............................................................................................................5Solder resist foils ..........................................................................................................38Sources of error ............................................................................................................40Spacer ring ......................................................................................................................31Special Commands .....................................................................................................46symbols ...............................................................................................................................4

T

Target Group .....................................................................................................................5Terminology .......................................................................................................................5

V

Vacuum ..............................................................................................................................30Vacuum system .............................................................................................................13

W

Weight ................................................................................................................................51workplace .........................................................................................................................11

Index


manual protomat h100

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