us stavelet update 12th april 2013. ppb2s on serial power side 12 apr 20132 samtec connector...
DESCRIPTION
PPB2s issue In addition to that connection (present in all modules), W-shunt was enabled (missing wire bond) in one of the hybrids of module 2, and the voltages on the 1-wire circuit were not correct the very first time the stavelet was powered The FETs on the PPB2 of module 2 fried, and the PCB itself was damaged (probably acted as a fuse…) Removed undesired wirebonds on all modules, so that the connection was really floating Loaded a new PPB2 and replaced it Everything works fine after that: ΔV = mV across disabled modules 12 Apr ΔV = 117mV All enabledM2 disabledTRANSCRIPT
![Page 1: US stavelet update 12th April 2013. PPB2s on serial power side 12 Apr 20132 SAMTEC connector (floating) Bond pad (connected to EoS through WB + bus tape](https://reader036.vdocuments.mx/reader036/viewer/2022070611/5a4d1bb57f8b9ab0599ce24b/html5/thumbnails/1.jpg)
US stavelet update
12th April 2013
![Page 2: US stavelet update 12th April 2013. PPB2s on serial power side 12 Apr 20132 SAMTEC connector (floating) Bond pad (connected to EoS through WB + bus tape](https://reader036.vdocuments.mx/reader036/viewer/2022070611/5a4d1bb57f8b9ab0599ce24b/html5/thumbnails/2.jpg)
PPB2s on serial power side
12 Apr 2013 2
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SAMTEC connector (floating)
Bond pad (connected to EoS through WB + bus tape conductor)
SAMTEC U2-U2B (irradiated FETs)D1 zenerTrace + WB
![Page 3: US stavelet update 12th April 2013. PPB2s on serial power side 12 Apr 20132 SAMTEC connector (floating) Bond pad (connected to EoS through WB + bus tape](https://reader036.vdocuments.mx/reader036/viewer/2022070611/5a4d1bb57f8b9ab0599ce24b/html5/thumbnails/3.jpg)
PPB2s issue In addition to that connection (present in all modules), W-shunt was enabled (missing
wire bond) in one of the hybrids of module 2, and the voltages on the 1-wire circuit were not correct the very first time the stavelet was powered
The FETs on the PPB2 of module 2 fried, and the PCB itself was damaged (probably acted as a fuse…) Removed undesired wirebonds on all modules, so that the connection was really floating Loaded a new PPB2 and replaced it
Everything works fine after that:
ΔV = 90-120 mV across disabled modules
12 Apr 2013 3
ΔV = 117mV
All enabled M2 disabled
![Page 4: US stavelet update 12th April 2013. PPB2s on serial power side 12 Apr 20132 SAMTEC connector (floating) Bond pad (connected to EoS through WB + bus tape](https://reader036.vdocuments.mx/reader036/viewer/2022070611/5a4d1bb57f8b9ab0599ce24b/html5/thumbnails/4.jpg)
ENC noise @ 1fC (after trimrange)
12 Apr 2013 4
Hybrid 56
Hybrid 55
Hybrid 58
Hybrid 57
Hybrid 60
Hybrid 59
Hybrid 62
Hybrid 61
M3 M2 M1 M0
Comparable (or even better) to CoM with PI filter boards
![Page 5: US stavelet update 12th April 2013. PPB2s on serial power side 12 Apr 20132 SAMTEC connector (floating) Bond pad (connected to EoS through WB + bus tape](https://reader036.vdocuments.mx/reader036/viewer/2022070611/5a4d1bb57f8b9ab0599ce24b/html5/thumbnails/5.jpg)
Double trigger noise
Even hybrids always worse (also true for ENC), but results still quite good, except an ugly hybrid 58
What’s new: Extra 10 μF caps between BCC (hybrid) GND and data
shield (total = 10.1 μF) Al shielded module: Reference between hybrids made
through metal pieces in between hybrids rather than Al shield and Cu square
Pretty fresh result, I still have to look further into this
12 Apr 2013 5
Thr. value Module 3 Module 2 Module 1, Al shielded Module 0
Hybrid 55 56 57 58 59 60 61 62
1 fC 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
0.75 fC 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
0.5 fC 6 3 32 38 10 7 355 647 19 17 82 43 1 5 46 26
![Page 6: US stavelet update 12th April 2013. PPB2s on serial power side 12 Apr 20132 SAMTEC connector (floating) Bond pad (connected to EoS through WB + bus tape](https://reader036.vdocuments.mx/reader036/viewer/2022070611/5a4d1bb57f8b9ab0599ce24b/html5/thumbnails/6.jpg)
Sensor on module 1 (Al shield) Strange behavior (at least for me) on sensor of module 1 of SP side (FZ1, module SC-02,
Al shielded module) Leakage current at 200 V (and chips power ON) stays < 0.26 μA for a couple of minutes, then
starts rising slowly, until it stabilizes at around 4-6 μA After some time (~50 min) it starts going down again very slowly
Cooling is ON all the time It doesn’t happen at all when the chips power is OFF → “thermal runaway”? (although nothing
evident from thermal images) It doesn’t happen while keeping V < 180V Started right after having the PPB2 boards working, before then I ~ 0.25 μA at 200 V (stable)
12 Apr 2013 6
Cur
rent
(μA
)
Time (s)
V=200 VMeasurement taken during strobedelay + 3pointgain + trimrange
![Page 7: US stavelet update 12th April 2013. PPB2s on serial power side 12 Apr 20132 SAMTEC connector (floating) Bond pad (connected to EoS through WB + bus tape](https://reader036.vdocuments.mx/reader036/viewer/2022070611/5a4d1bb57f8b9ab0599ce24b/html5/thumbnails/7.jpg)
New firmware versions Checked Matt’s new firmware versions with top and bottom streams of HSIO-IB
enabled: v4192 (no streams on IDC connector)
• Streams 0-15 (top) → OK• Streams 64-79 (bottom) → OK
v4194 (no streams on IDC connector)• Streams 0-15 (top) → OK• Streams 64-79 (bottom) → OK
v419e (no streams on IDC connector)• Streams 0-15 (top) → OK• Streams 64-79 (bottom) → OK
Firmware is ready for double sided stavelet tests with a single HSIO!
12 Apr 2013 7
![Page 8: US stavelet update 12th April 2013. PPB2s on serial power side 12 Apr 20132 SAMTEC connector (floating) Bond pad (connected to EoS through WB + bus tape](https://reader036.vdocuments.mx/reader036/viewer/2022070611/5a4d1bb57f8b9ab0599ce24b/html5/thumbnails/8.jpg)
Next
HV power with root/sctdaq Get rid of Labview HV controller: requires too many PC resources, slows down
sctdaq significantly
Simultaneous readout of both stavelet sides First with 2 HSIO + 2 PCs + 2 sctdaq, later with single HSIO and PC
Noise injection on pulsing lines (JP14 differential data lines on EoS, Noise-P-M streams on 50 pin SAMTEC, next to BCO lines) An extra macro on sctdaq will do, or do I also need to modified firmware? Also asynchronous noise injection? Shielded vs. shieldless modules: “final” test
12 Apr 2013 8