universal microsystems, 3350 scott blvd. bldg 47, santa, clara, ca 95054 universal microsystems gas...

Universal Microsystems, 3350 Scott Blvd. Bldg 47, Santa, Clara, CA 95054

Universal Microsystems

Gas Flow Restrictors for the Semiconductor Industry

Company founded in 1999

Partnership with TEM Filter

3350 Scott Blvd. Santa Clara, CA


Uses for Gas Flow Restrictors

• Replace MFC in fixed process applications– steady pressure, single flow set point

• Safety — limit flow in case of line failure• Tamperproof needle valve replacement• Flow splitting

• eliminates multiple MFCs

• Back fill a chamber in a fixed time


UMS Gas Flow Restrictors

• Orifice inside 316L SS container

• High accuracy calibration (± 1.0%)

• Three orifice materials available

– SS, & Single crystal sapphire or silicon

• Quick turn production


Orifice Flow vs Pressure

0

100

200

300

400

500

15 17 19 21 23 25 27 29 31 33 35Pressure, Psia

Flo

w,

sccm

Atmosphere Outlet

Sub-sonic

Sonic

Vacuum Outlet


Orifice Characteristics

• Completely stable

• No Particle Generation

• Minimal dry down time

• Precision of flow at specified pressure– +/- 5% standard, +/- 2% available

• Orifice will not clog like a filter


Restrictor body types available

• 1/4 “ Male/Male VCR

• 1/8” Male/Male VCR

• 1/4” Female/Male VCR

• 1/4” BulkHead VCR

• Ni media Filter/Restrictor Combination

• 1 1/8” surface mount sandwich


B-Series M/M VCR Flow Restrictor

1.55” .75”

.625”

22

-16

14

14

-00

• VCR Male Union • Flow Direction Arrow• External Part No. Label


F/M or M/F Versions

•Gland to gland 1.80”

•Diameter 0.75”

•Wrench Flats 5/8”


Filter/Restrictor Combination

•SpecificationsNo more than 1 particle/ft3

Less than 10 ppb THCLess than 10 ppb moisture99.9999999% removal rating at rated flowHe leak check to 10-9 atm sccm/sec

Precise flow at a specified pressure


Surface Mount Sandwich Restrictor

• Restrictor can be inserted into either port• 3 Port version available

2-port IGS configuration1 1/8” body size

Top

Flow¼”


UMS Flow Restrictor Specifications

• Surface finish, 7-8 Ra electropolish

• Base Material, 316L SS,

• Orifice material, Si, Sapphire, or SS

• Seal for Si (Viton or Kalrez)

• He leak check 10-9 atm-cc/sec

• Maximum pressure, 200 psia

• Temperature range, 50 to 250 oF


Sapphire Orifices

Orifice diameters from 0.003” to 0.040”

Variation in diameter is +/- 2.5µm

Different manufacturing runs likely to see different means but tight distribution

-2.5 µm +2.5 µm

Cross-Section

Nozzle side


Silicon Orifices

• Used for diameters < 0.003” – or non-integer .001” units

• Flow from nozzle side 10-15% greater

• Avoid placing downstream from F plasma

• Option: sputter deposit Al203 (both sides)

• Opportunity to enlarge undersized orifices– Oxidation and strip - 50 - 1000 nm

Cross-section nozzle side

50 µm


Stainless Steel Orifices

• Mechanical drill OK down to 0.030”Use EDM down to 0.004”

• EDM precision is +/- 1.5% at .008”

• EDM most expensive of three types

Cross-section

250 µm


Standard Orifices & N2 flow @ 20 psig

• Flow range -15 sccm to 40 slm• Flow steps in ~ 10%• Sapphire orifices designated

with N or R, SS orifices with F and Si orifices with S

• N orifices nozzle side inletR orifices nozzle side outlet


How to find required orifice

• This procedure converts the application gas flow at the application pressure into the equivalent N2 flow at 20 psig

• Match the converted flow to the flow table

universal microsystems, 3350 scott blvd. bldg 47, santa, clara, ca 95054 universal microsystems gas...

Documents

flow slide

santa clara

ca slide

vcr flow restrictor

single flow

orifice flow vs pressure

rated flow

units flow