thin films: stresse s and mechanical properties...

Thin Films: Stresses and Mechanical Properties II

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Cambridge University Press978-1-107-41011-4 - Materials Research Society Symposium Proceedings: Volume 188:Thin Films: Stresses and Mechanical Properties IIEditors: M. F. Doerner, W. C. Oliver, G. M. Pharr and F. R. BrotzenFrontmatterMore information

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MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS VOLUME 188

Thin Films:Stresses and Mechanical Properties II

Symposium held April 16-19, 1990, San Francisco, California, U.S.A.

EDITORS:

M. F. DoernerIBM General Products Division, San Jose, California, U.S.A.

W. C. OliverOak Ridge National Laboratory, Oak Ridge, Tennessee, U.S.A.

G. M. PharrRice University, Houston, Texas, U.S.A.

F. R. BrotzenRice University, Houston, Texas, U.S.A.

IM1RTSI MATERIALS RESEARCH SOCIETYPittsburgh, Pennsylvania






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Contents

PREFACE xi

ACKNOWLEDGMENTS xiii

MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS xiv

PART I: STRESSES: MEASUREMENT AND THEORY

•STRESSES IN PASSIVATED FILMS 3Paul A. Flinn

FINITE ELEMENT CALCULATIONS OF THERMAL STRESSES INPASSIVATED AND UNPASSIVATED LINES BONDED TO SUBSTRATES 15

Anne I. Sauter and W.D. Nix

DEFLECTION SHAPES DUE TO INTRINSIC STRESS IN THIN FILMS 21Christine B. Masters, N.J. Salamon, andD.E. Fahnline

MEASUREMENT OF STRESSES IN THIN FILMS USING HOLOGRAPHICINTERFEROMETRY: DEPENDENCE ON ATMOSPHERIC CONDITIONS 29

Michele A. Maden, Kun Tong, and Richard J. Farris

A VIBRATIONAL TECHNIQUE FOR STRESS MEASUREMENT IN FILMS 35A. Jagota, S. Mazur, and R.J. Farris

THE IN-SITU MEASUREMENT OF BIAXIAL MODULUS AND RESIDUALSTRESS OF MULTI-LAYER POLYMERIC THIN FILMS 41

Pinyen Lin and Stephen D. Senturia

ANALYSIS OF STRESS VARIATIONS IN EPITAXIAL FILMS USINGCATHODOLUMINESCENCE MICROSCOPY AND SPECTROSCOPY 47

B.G. Yacobi and P. Sheldon

NON-DESTRUCTIVE ASSESSMENT OF THIN FILM STRESSES ANDCRYSTAL QUALITY OF SILICON ON INSULATOR MATERIALSWITH RAMAN SPECTROSCOPY 53

Ingrid De Wolf, Jan Vanhellemont, and Herman E. Maes

PART II: STRESSES: PROCESSING ANDMICROSTRUCTURAL EFFECTS

IN SITU STRESS MEASUREMENTS DURING THE FORMATION OFTiSi2 C49 ON Si WAFERS

J.F. Jongste, G.C.A.M. Janssen, and S, Radelaar

•Invited Paper






IN SITU STUDY OF STRESSES GENERATED DURING THE FORMATIONOF COBALT DISILICIDE AND THE EFFECT OF POST SILICIDEPROCESSING 67

A.R. Sitaram, J.C. Kalb, Jr., and S.P. Murarka

PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION OF DIELECTRICFILMS: CORRELATION OF STRESS TO FILM STRUCTURE ANDPLASMA CHARACTERISTICS 73

Radhika Srinivasan, B.C. Nguyen, and A.P. Short

CORRELATION BETWEEN PROCESSING, COMPOSITION, ANDMECHANICAL PROPERTIES OF PECVD-SiNx THIN FILMS 79

D.C.H. Yu and J.A. Taylor

INTRINSIC STRESS OF PECVD SILICON OXYNITRIDE FILMSDEPOSITED IN A HOT-WALL REACTOR 85

K. Aite and R. Koekoek

STRESSES IN AMORPHOUS Gd-Fe ALLOY THIN FILMS DEPOSITEDBY MAGNETRON SPUTTERING 91

Zhi-Feng Zhou, Qi-Gang Zhou, and Yu-Dian Fan

INTERNAL STRESSES AND ADHESION PROPERTIES OF FILM/SUBSTRATE INTERFACES 97

M. Ignat, A. Chouaf, and Ph. Normandon

TEMPERATURE DEPENDENCE OF STRESS FOR COPPER,COPPER-SILVER AND COPPER-TIN FILMS 103

Richard Haynes

PART III: MICROINDENTATION

*THE INFLUENCE OF ION IMPLANTATION ON THE NEAR-SURFACEMECHANICAL PROPERTIES OF CERAMICS 111

C.J. McHargue, M.E. O'Hern, and D.L. Joslin

MECHANICAL PROPERTIES OF CARBON-IMPLANTED NIOBIUM 121S.J. Zinkle and J.S. Huang

MECHANICAL PROPERTIES OF COATINGS AND INTERFACES 127B.D. Fabes and W.C. Oliver

MECHANICAL PROPERTIES OF SILICA COATINGS 133Kenneth D. Cornett, B.D. Fabes, and W.C. Oliver

THE HARDNESS AND ELASTIC MODULUS OF TiN FILMS ASDETERMINED BY ULTRA-LOW LOAD INDENTATION 139

M.E. O'Hern, W.C. Oliver, C.J. McHargue,D.S. Rickerby, and S.J. Bull

PART IV: TIME DEPENDENT DEFORMATION

DETERMINATION OF ELASTIC CONSTANTS AND VISCOSITY OFAMORPHOUS THIN FILMS FROM SUBSTRATE CURVATURE 147

Ann Witvrouw and Frans Spaepen

*Invited Paper






X-RAY STRESS STUDIES OF PASSIVATED AND UNPASSIVATEDNARROW ALUMINUM METALLIZATIONS 153

C.A. Paszkiet, M.A. Korhonen, and Che-Yu Li

MEASUREMENT OF STRESS RELAXATION IN THIN ALUMINUMMETALLIZATIONS BY CONTINUOUS INDENTATION AND X-RAYTECHNIQUES 159

M.A. Korhonen, W.R. LaFontaine, C.A. Paszkiet,R.D. Black, and Che-Yu Li

INDENTATION LOAD RELAXATION EXPERIMENTS ON Al-SiMETALLIZATIONS 165

W.R. LaFontaine, B. Yost, R.D. Black, andChe-Yu Li

CREEP BEHAVIOR OF SPUTTERED TiN FILMS USING INDENTATIONTESTING 171

V. Raman and R. Berriche

MECHANICAL PROPERTIES OF THIN FILM ALUMINUM FIBERS:GRAIN SIZE EFFECTS 177

James E. Steinwall and H.H. Johnson

STUDYING MECHANICAL PROPERTIES OF THIN FILMS UNDER HIGHPRESSURES 183

B.C. Cai, D. Kuhlmann-Wilsdorf, and R.B. Nelson

PART V: TRIBOLOGY

*MICROSCRATCH TEST FOR ULTRA-THIN FILMS 191T.W. Wu

MICROSCRATCH TEST ON CARBON FILMS AS THIN AS 20 nm 207T.W. Wu, A.L. Shull, and J. Lin

MECHANICAL PROPERTIES OF CARBON FILMS FOR THIN FILMDISKS 213

Richard L. White, Mary F. Doerner, andGeorge W. Walker

NANOTRIBOLOGY OF DIAMOND FILMS STUDIED BY ATOMIC FORCEMICROSCOPY 219

Gabi Neubauer, Sidney R. Cohen, Gary M. McClelland,and Hajime Seki

ION BEAM ANNEALING OF VAPOR-DEPOSITED CARBON FILM 225Kazuo Higuchi, Shoji Noda, Sumiko Iritani,Tomoji Ishiguro, and Osami Kamigaito

DIAMOND-LIKE FILMS AS OPTICAL AND PROTECTIVE COATINGS 231D. Das Gupta, F. Demichelis, R. Spagnolo, andA. Tagliaferro

EXPERIMENTS ON, AND A TWO-COMPONENT MODEL FOR, THEBEHAVIOR OF WATER NANO-FILMS ON METALS 237

Chao Gao and D. Kuhlmann-Wilsdorf

•Invited Paper

vii






PART VI: FRACTURE AND ADHESION

MEASUREMENT OF INTERFACE STRENGTH BY LASER PULSEINDUCED SPALLATION 245

V. Gupta and A.S. Argon

COMPRESSIVE STRESSES, BUCKLING AND SPALLING OF TUNGSTENLPD FILMS 251

Aidan Borer and Brian Derby

CRACKING AND DELAMINATION OF VAPOUR-DEPOSITED TANTALUMFILMS 257

R.M. Fisher, J.Z. Duan, and J.B. Liu

INDENTATION FRACTURE OF BRITTLE MATERIALS 263Barry N. Lucas, W.C. Oliver, and J.J. Wert

MOLECULAR DYNAMICS COMPUTER SIMULATION OF THE RUPTUREOF THE TWO-DIMENSIONAL LENNARD-JONES FILM 269

John F. Maguire and Chun-Pok Leung

FRACTURE-EXAFS: A NEW METHOD FOR THE STUDY OF INTERFACESIN THIN FILMS AND POLYCRYSTALLINE MATERIALS 275

E.V. Barrera, Benji Maruyama, and S.M. Heald

PROPERTIES OF A SUBMICRON-HONEYCOMB THIN FILM 281R.C. Furneaux, J.S. Crompton, and D.J. Fitchett

PART VII: MULTILAYERS

MECHANICAL PROPERTIES OF COMPOSITIONALLY MODULATEDAu-Ti THIN FILMS USING INDENTATION AND MICROBEAMDEFLECTION TECHNIQUES 289

Shefford P. Baker, Alan F. Jankowski, Soonil Hong,and William D. Nix

MECHANICAL PROPERTIES OF MULTILAYERED COPPER-NICKELTHIN FILMS MEASURED BY INDENTATION TECHNIQUES 295

T.E. Schlesinger, R.C. Cammarata, C. Kim,S.B. Qadri, and A.S. Edelstein

TRIBOLOGICAL AND MECHANICAL PROPERTIES OF Fe/TiMULTILAYERED FILMS 301

M. Nastasi, J-P. Hirvonen, T.R. Jervis,and S.N. Basu

THE MECHANICAL PROPERTIES OF Cu/TiB2 MULTILAYERSTRUCTURES 307

Kevin M. Hubbard, S.N. Basu, J-P. Hirvonen,T.R. Jervis, and M. Nastasi

PART VIII: MICROSTRUCTURE AND DEFECTS

•MECHANISMS AND KINETICS OF MISFIT DISLOCATION FORMATIONIN HETEROEPITAXIAL THIN FILMS 315

W.D. Nix, D.B. Noble, and J.F. Turlo

*Invited Paper

viii






MECHANICAL PROPERTIES OF NANOCOMPOSITE COATINGSFABRICATED BY SPUTTERING 331

G.M. Chow, R.L. Holtz, C.Cm. Wu, A.S. Edelstein,T.E. Schlesinger, and R.C. Cammarata

*HARD COATINGS 337S.J. Bull and D.S. Rickerby

PHOTOREFLECTANCE CHARACTERIZATION OF SILICON FILMS ONINSULATOR 349

Adriana Giordana, R. Glosser, Joseph G. Pellegrino,S. Qadri, M.E. Twigg, E.D. Richmond, Keith Joyner,and Gordon Pollack

STRUCTURAL DEPENDENCE OF THE ELASTIC CONSTANTS OFPOLYMERIC LANGMUIR-BLODGETT FILMS STUDIED USINGBRILLOUIN SCATTERING 355

Sukmock Lee, J.R. Dutcher, B. Hillebrands,G.I. Stegeman, W. Knoll, G. Duda, G. Wegner,and F. Nizzoli

AUTHOR INDEX 361

SUBJECT INDEX 363

MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS 365

*Invited Paper






Preface

This volume is a compilation of papers presented at the1990 Spring Meeting of the Materials Research Society in asymposium entitled "Thin Films: Stresses and MechanicalProperties II". As indicated by the title, the symposium wasthe second in a series, the first of which was held at the FallMeeting in 1988.

Interest in thin film mechanical properties continues togrow. The symposium was attended by a large internationalaudience representing universities, national laboratories andindustry who presented basic and applied research results infields such as semiconductor technology, magnetic recordingtechnology, and hard coating technology. The importance of thinfilm mechanical properties in these fields is now recognized tothe extent that basic characterization techniques such asmicroindentation and thin film stress measurement are performedroutinely, and new characterization techniques are beingdeveloped on a daily basis. Many of the papers in the symposiumdealt with the developments in these characterization methodsand their application to a broad spectrum of materials such ascompositionally modulated structures, ion implanted materials,optical coatings, and the numerous metals, ceramics and organicsused in semiconductor device manufacture.

The editors are encouraged by the rapidly growing interestin thin film mechanical properties. It is hoped that thisvolume will be useful to newcomers to the field, as well asstimulate new ideas for those who are already familiar with it.

Mary F. DoernerWarren C. OliverGeorge M. PharrFranz R. Brotzen

June 1990






Acknowledgments

The editors gratefully acknowledge financial supportprovided by:

Nano Instruments, Inc.Knoxville, Tennessee

IBM General Products DivisionSan Jose, California

UltraTherm, Inc.Kingston, Tennessee

Oak Ridge National LaboratoryOak Ridge, Tennessee

The organizational and typing assistance provided byMs. Gwen Sims, Oak Ridge National Laboratory, is alsoappreciated.

Mary F. DoernerWarren C. OliverGeorge M. PharrFranz R. Brotzen

June 1990

xiii






MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS

Recent Materials Research Society Symposium Proceedings

Volume 157—Beam-Solid Interactions: Physical Phenomena, J.A. Knapp, P. Borgesen,R.A. Zuhr, 1989, ISBN 1-55899-045-3

Volume 158—In-Situ Patterning: Selective Area Deposition and Etching, R. Rosenberg,A.F. Bernhardt, J.G. Black, 1989, ISBN 1-55899-046-1

Volume 159—Atomic Scale Structure of Interfaces, R.D. Bringans, R.M. Feenstra,J.M. Gibson, 1989, ISBN 1-55899-047-X

Volume 160—Layered Structures: Heteroepitaxy, Superlattices, Strain, andMetastability, B.W. Dodson, LJ. Schowalter, J.E. Cunningham,F.H. Pollak, 1989, ISBN 1-55899-048-8

Volume 161—Properties of II-VI Semiconductors: Bulk Crystals, Epitaxial Films,Quantum Well Structures and Dilute Magnetic Systems, J.F. Schetzina,F.J. Bartoli, Jr., H.F. Schaake, 1989, ISBN 1-55899-049-6

Volume 162—Diamond, Boron Nitride, Silicon Carbide and Related Wide BandgapSemiconductors, J.T. Glass, R.F. Messier, N. Fujimori, 1989,ISBN 1-55899-050-X

Volume 163—Impurities, Defects and Diffusion in Semiconductors: Bulk and LayeredStructures, J. Bernholc, E.E. Haller, DJ. Wolford, 1989,ISBN 1-55899-051-8

Volume 164—Materials Issues in Microcrystalline Semiconductors,P.M. Fauchet, C.C. Tsai, K. Tanaka, 1989, ISBN 1-55899-052-6

Volume 165—Characterization of Plasma-Enhanced CVD Processes, G. Lucovsky,D.E. Ibbotson, D.W. Hess, 1989, ISBN 1-55899-053-4

Volume 166—Neutron Scattering for Materials Science, S.M. Shapiro, S.C. Moss,J.D. Jorgensen, 1989, ISBN 1-55899-054-2

Volume 167—Advanced Electronic Packaging Materials, A. Barfknecht, J. Partridge,C-Y. Li, CJ. Chen, 1989, ISBN 1-55899-055-0

Volume 168—Chemical Vapor Deposition of Refractory Metals and Ceramics,T.M. Besmann, B.M. Gallois, 1989, ISBN 1-55899-056-9

Volume 169—High Temperature Superconductors: Fundamental Properties and NovelMaterials Processing, J. Narayan, C.W. Chu, L.F. Schneemeyer,D.K. Christen, 1989, ISBN 1-55899-057-7

Volume 170—Tailored Interfaces in Composite Materials, C.G. Pantano, EJ.H. Chen,1989, ISBN 1-55899-058-5

Volume 171—Polymer Based Molecular Composites, D.W. Schaefer, J.E. Mark, 1989,ISBN 1-55899-059-3

Volume 172—Optical Fiber Materials and Processing, J.W. Fleming, G.H. Sigel,S. Takahashi, P.W. France, 1989, ISBN 1-55899-060-7

Volume 173—Electrical, Optical and Magnetic Properties of Organic Solid-StateMaterials, L.Y. Chiang, D.O. Cowan, P. Chaikin, 1989,ISBN 1-55899-061-5

Volume 174—Materials Synthesis Utilizing Biological Processes, M. Alper, P.D. Calvert,P.C. Rieke, 1989, ISBN 1-55899-062-3

Volume 175—Multi-Functional Materials, D.R. Ulrich, F.E. Karasz, A.J. Buckley,G. Gallagher-Daggitt, 1989, ISBN 1-55899-063-1

Volume 176—Scientific Basis for Nuclear Waste Management XIII, V.M. Oversby,P.W. Brown, 1989, ISBN 1-55899-064-X

Volume 177—Macromolecular Liquids, C.R. Safinya, S.A. Safran, P.A. Pincus, 1989,ISBN 1-55899-065-8

Volume 178—Fly Ash and Coal Conversion By-Products: Characterization, Utilizationand Disposal VI, F.P. Glasser, R.L. Day, 1989, ISBN 1-55899-066-6






MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS

Volume 179—Specialty Cements with Advanced Properties, H. Jennings, A.G. Landers,B.E. Scheetz, I. Odler, 1989, ISBN 1-55899-067-4

Volume 180—Better Ceramics Through Chemistry IV, C.J. Brinker, D.E. Clark,D.R. Ulrich, B.J.J. Zelinsky, 1990, ISBN: 1-55899-069-0

Volume 181—Advanced Metallizations in Microelectronics, A. Katz, S.P. Murarka,A. Appelbaum, 1990, ISBN: 1-55899-070-4

Volume 182—Polysilicon Thin Films and Interfaces, B. Raicu, T.Kamins,C.V. Thompson, 1990, ISBN: 1-55899-071-2

Volume 183—High-Resolution Electron Microscopy of Defects in Materials, R. Sinclair,DJ. Smith, U. Dahmen, 1990, ISBN: 1-55899-072-0

Volume 184—Degradation Mechanisms in III-V Compound Semiconductor Devices andStructures, V. Swaminathan, SJ. Pearton, O. Manasreh, 1990,ISBN: 1-55899-073-9

Volume 185—Materials Issues in Art and Archaeology II, J.R. Druzik, P.B. Vandiver,G. Wheeler, 1990, ISBN: 1-55899-074-7

Volume 186—Alloy Phase Stability and Design, G.M. Stocks, D.P. Pope, A.F. Giamei,1990, ISBN: 1-55899-075-5

Volume 187—Thin Film Structures and Phase Stability, B.M. Clemens, W.L. Johnson,1990, ISBN: 1-55899-076-3

Volume 188—Thin Films: Stresses and Mechanical Properties II, W.C. Oliver,M. Doerner, G.M. Pharr, F.R. Brotzen, 1990, ISBN: 1-55899-077-1

Volume 189—Microwave Processing of Materials II, W.B. Snyder, W.H. Sutton,D.L. Johnson, M.F. Iskander, 1990, ISBN: 1-55899-078-X

Volume 190—Plasma Processing and Synthesis of Materials III, D. Apelian, J. Szekely,1990, ISBN: 1-55899-079-8

Volume 191—Laser Ablation for Materials Synthesis, D.C. Paine, J.C. Bravman, 1990,ISBN: 1-55899-080-1

Volume 192—Amorphous Silicon Technology, P.C. Taylor, M.J. Thompson,P.G. LeComber, Y. Hamakawa, A. Madan, 1990, ISBN: 1-55899-081-X

Volume 193—Atomic Scale Calculations of Structure in Materials, M.A. Schluter,M.S. Daw, 1990, ISBN: 1-55899-082-8

Volume 194—Intermetallic Matrix Composites, D.L. Anton, R. McMeeking, D. Miracle,P. Martin, 1990, ISBN: 1-55899-083-6

Volume 195—Physical Phenomena in Granular Materials, T.H. Geballe, P. Sheng,G.D. Cody, 1990, ISBN: 1-55899-084-4

Volume 196—Superplasticity in Metals, Ceramics, and Intermetallics, M.J. Mayo,J. Wadsworth, M. Kobayashi, A.K. Mukherjee, 1990, ISBN: 1-55899-085-2

Volume 197—Materials Interactions Relevant to the Pulp, Paper, and Wood Industries,J.D. Passaretti, D. Caulfield, R. Roy, V. Setterholm, 1990,ISBN: 1-55899-086-0

Volume 198—Epitaxial Heterostructures, D.W. Shaw, J.C. Bean, V.G. Keramidas,P.S. Peercy, 1990, ISBN: 1-55899-087-9

Volume 199—Workshop on Specimen Preparation for Transmission ElectronMicroscopy of Materials II, R. Anderson, 1990, ISBN: 1-55899-088-7

Volume 200—Ferroelectric Thin Films, A.I. Kingon, E.R. Myers, 1990,ISBN: 1-55899-089-5

Earlier Materials Research Society Symposium Proceedings listed in the back.






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